SG10201408674PA - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
SG10201408674PA
SG10201408674PA SG10201408674PA SG10201408674PA SG10201408674PA SG 10201408674P A SG10201408674P A SG 10201408674PA SG 10201408674P A SG10201408674P A SG 10201408674PA SG 10201408674P A SG10201408674P A SG 10201408674PA SG 10201408674P A SG10201408674P A SG 10201408674PA
Authority
SG
Singapore
Prior art keywords
cutting apparatus
cutting
Prior art date
Application number
SG10201408674PA
Inventor
Michael Gadd
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201408674PA publication Critical patent/SG10201408674PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/22—Safety devices specially adapted for cutting machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/202—With product handling means
    • Y10T83/2066—By fluid current
    • Y10T83/207—By suction means
SG10201408674PA 2013-12-27 2014-12-24 Cutting apparatus SG10201408674PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013271760A JP6255238B2 (en) 2013-12-27 2013-12-27 Cutting equipment

Publications (1)

Publication Number Publication Date
SG10201408674PA true SG10201408674PA (en) 2015-07-30

Family

ID=53372317

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201408674PA SG10201408674PA (en) 2013-12-27 2014-12-24 Cutting apparatus

Country Status (7)

Country Link
US (1) US10183419B2 (en)
JP (1) JP6255238B2 (en)
KR (1) KR102210285B1 (en)
CN (1) CN104752187B (en)
DE (1) DE102014226793A1 (en)
SG (1) SG10201408674PA (en)
TW (1) TWI630976B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9999986B2 (en) * 2014-07-29 2018-06-19 Bettcher Industries, Inc. Power operated rotary knife with vacuum attachment assembly
US9452541B2 (en) * 2014-07-29 2016-09-27 Bettcher Industries, Inc. Power operated rotary knife with vacuum attachment assembly
US9579810B2 (en) * 2014-07-29 2017-02-28 Bettcher Industries, Inc. Power operated rotary knife with vacuum attachment assembly
KR101663997B1 (en) * 2016-05-11 2016-10-11 대양이엔지 주식회사 Curved surface machining method of smartphone side key
JP2017213628A (en) * 2016-05-31 2017-12-07 株式会社ディスコ Cutting device
JP6808292B2 (en) * 2017-04-19 2021-01-06 株式会社ディスコ Diagnosis method of processing equipment
JP6866217B2 (en) * 2017-04-21 2021-04-28 株式会社ディスコ Cutting equipment
JP6955971B2 (en) * 2017-11-10 2021-10-27 株式会社ディスコ Cleaning nozzle
JP7266398B2 (en) * 2018-12-11 2023-04-28 株式会社ディスコ Wafer processing method using cutting device and cutting device
JP7203712B2 (en) * 2019-11-18 2023-01-13 Ｔｏｗａ株式会社 CUTTING DEVICE AND METHOD FOR MANUFACTURING CUTTING GOODS
CN112620688B (en) * 2020-11-17 2023-01-24 江苏悦达兴业汽车配件有限公司 A high-efficient type drilling equipment for auto-parts processing
CN112792899B (en) * 2021-04-15 2021-06-25 苏州维嘉科技股份有限公司 Board separator
JP2022184119A (en) * 2021-05-31 2022-12-13 株式会社ディスコ Sheet sticking apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022182A (en) * 1976-01-12 1977-05-10 Lenkevich Steve T Dust and water confinement unit for portable circular saw
US4619081A (en) * 1985-02-28 1986-10-28 General Signal Corporation Combined nozzle with air foil
KR100225909B1 (en) * 1997-05-29 1999-10-15 윤종용 Wafer sawing apparatus
SG70097A1 (en) * 1997-08-15 2000-01-25 Disio Corp Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface
JP4700225B2 (en) * 2001-06-01 2011-06-15 株式会社ディスコ Cutting method of semiconductor wafer
SE528265C2 (en) * 2005-02-18 2006-10-10 Mats Johansson Cutting and dust collection units and work machine with such units
JP2006231474A (en) 2005-02-25 2006-09-07 Disco Abrasive Syst Ltd Cutting device
JP2007216377A (en) * 2006-01-20 2007-08-30 Tokyo Seimitsu Co Ltd Dicing device and dicing method
WO2008004365A1 (en) * 2006-07-07 2008-01-10 Tokyo Seimitsu Co., Ltd. Dicing apparatus and dicing method
US7521338B2 (en) * 2006-12-22 2009-04-21 Texas Instruments Incorporated Method for sawing semiconductor wafer
JP5446027B2 (en) * 2007-09-25 2014-03-19 株式会社東京精密 Dicing machine
JP5415184B2 (en) * 2009-08-21 2014-02-12 株式会社ディスコ Cutting equipment
JP5511325B2 (en) * 2009-11-18 2014-06-04 株式会社ディスコ Cutting equipment
JP5528245B2 (en) * 2010-07-26 2014-06-25 株式会社ディスコ Cutting method
JP6101140B2 (en) * 2013-04-18 2017-03-22 株式会社ディスコ Cutting equipment

Also Published As

Publication number Publication date
US10183419B2 (en) 2019-01-22
TWI630976B (en) 2018-08-01
CN104752187B (en) 2019-08-16
DE102014226793A1 (en) 2015-07-02
TW201532727A (en) 2015-09-01
JP2015123568A (en) 2015-07-06
US20150183130A1 (en) 2015-07-02
JP6255238B2 (en) 2017-12-27
KR20150077293A (en) 2015-07-07
KR102210285B1 (en) 2021-01-29
CN104752187A (en) 2015-07-01

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