JPH0310760A - Wire saw for cutting crystalline brittle material - Google Patents
Wire saw for cutting crystalline brittle materialInfo
- Publication number
- JPH0310760A JPH0310760A JP14735289A JP14735289A JPH0310760A JP H0310760 A JPH0310760 A JP H0310760A JP 14735289 A JP14735289 A JP 14735289A JP 14735289 A JP14735289 A JP 14735289A JP H0310760 A JPH0310760 A JP H0310760A
- Authority
- JP
- Japan
- Prior art keywords
- gonio
- cut
- wire saw
- setting device
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 27
- 238000005520 cutting process Methods 0.000 title claims abstract description 22
- 239000013078 crystal Substances 0.000 claims abstract description 23
- 238000005259 measurement Methods 0.000 claims abstract description 3
- 238000003754 machining Methods 0.000 claims description 4
- 239000006061 abrasive grain Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000002050 diffraction method Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/043—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being angularly adjustable
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は半導体材料、磁性材料、セラミックス等のい
わゆる脆性材料を、砥粒を含む加工液を供給しつつワイ
ヤを摺動させいわゆるラッピング作用によりウェハ状に
切断または切込むワイヤソーに係り、特に結晶質の被切
断部材を切断する場合に、ワイヤによる切断面が所定の
結晶方位（ゴニオ角）になるよう切断または切込むため
の結晶方位設定機能付きワイヤソーに関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention processes so-called brittle materials such as semiconductor materials, magnetic materials, and ceramics into wafers by sliding a wire while supplying a machining fluid containing abrasive grains. A wire saw with a crystal orientation setting function that cuts or cuts so that the cut surface by the wire has a predetermined crystal orientation (gonio angle), especially when cutting a crystalline workpiece. Regarding.
従来の技術
従来、結晶質の被切断部材、例えばシリコン単結晶等は
ＩＤソー〈内周刃ソー〉で試し切りを行ない、当該材料
の結晶方位をいわゆるゴニオ角測定装置によって確認し
ている。また、外周式や内周式切断刃を使った切断装置
にゴニオメータ（実公昭５５−４８４２２号公報参照）
を設け、被切断部材を試し切りすることで所定の結晶方
位になっている否かを確認して切断作業に入る方式もあ
る。2. Description of the Related Art Conventionally, a crystalline material to be cut, such as a silicon single crystal, is trial-cut using an ID saw (internal blade saw), and the crystal orientation of the material is confirmed using a so-called gonio-angle measuring device. In addition, a goniometer (see Japanese Utility Model Publication No. 55-48422) is used for cutting devices using external or internal cutting blades.
There is also a method in which a test cut is made on the member to be cut to confirm whether or not the crystal orientation is a predetermined one, and then the cutting operation is started.
しかし、ワイヤソーの場合は被切断部材を一度に多数同
時切断する切断方式のため、試し切りして結晶方位を確
認すると能率の低下をきたす。このため、ワイヤソーに
試し切り方式を適用した例はなく、また結晶質の被切断
部材を所定の結晶方位に切断あるいは切込むためのゴニ
オ角設定機能を有するワイヤソーもないのが実情である
。However, in the case of a wire saw, since the cutting method involves cutting a large number of parts at once, efficiency decreases when test cutting is performed to check the crystal orientation. For this reason, there is no example of a test cutting method being applied to a wire saw, and the reality is that there is no wire saw that has a gonio angle setting function for cutting or incising a crystalline workpiece in a predetermined crystal orientation.
発明が解決しようとする課題
この発明は前に述べたような実情よりみて、所定の結晶
方位に切断または切込みを必要とする結晶質の被切断部
材を、所定の結晶方位に切断または切込むことが可能な
ゴニオ角設定機能付きワイヤソーを提案しようとするも
のでる。Problems to be Solved by the Invention In view of the above-mentioned circumstances, the present invention provides a method for cutting or incising a crystalline member to be cut in a predetermined crystal orientation, which requires cutting or incision in a predetermined crystal orientation. This paper attempts to propose a wire saw with a gonio angle setting function that allows for gonio angle setting.
課題を解決すたるための手段
この発明はワイヤソーに取付けられた結晶質の被切断部
材を所定の結晶方位に切断または切込むことができるよ
うにゴニオ角設定機能を持たしたワイヤソーを提案する
ものであり、その要旨は被切断部材をワイヤ列に押し当
てる材料押上台に被切断部材を所定の結晶方位に設定す
るためのゴニオ角設定装置を設け、該ゴニオ角設定装置
に被切断部材を取付ける構造とし、被切断部材のゴニオ
角測定装置とゴニオ角設定装置調節機構を備えたもので
ある。Means for Solving the Problems This invention proposes a wire saw having a gonio angle setting function so that a crystalline workpiece attached to the wire saw can be cut or incised in a predetermined crystal orientation. , the gist is that a gonio angle setting device for setting the cut material in a predetermined crystal orientation is provided on the material pushing table that presses the cut material against the wire row, and the cut material is attached to the gonio angle setting device. , which is equipped with a gonio-angle measuring device for a member to be cut and a gonio-angle setting device adjustment mechanism.
すなわち、この発明は被切断部材を所定の結晶方位に設
定するためのゴニオ角設定装置とゴニオ角測定装置をワ
イヤソーに設置することによって、ワイヤソー上で被切
断部材の結晶方位を自動的に設定できるようにしたもの
である。That is, the present invention is capable of automatically setting the crystal orientation of a cut member on the wire saw by installing a gonio angle setting device and a gonio angle measuring device for setting the cut member in a predetermined crystal orientation on the wire saw. This is how it was done.
また、他のゴニオ角設定手段として、ワイヤソーにゴニ
オ角設定装置のみを設置し、これと同じゴニオ角設定装
置とゴニオ角測定装置をワイヤソー外に設け、このワイ
ヤソー外に別設のゴニオ角設定装置とゴニオ角測定装置
にて設定した被切断部材の結晶方位になるよう、ワイヤ
ソーに設置したゴニオ角設定装置を調節するごとく構成
したもので、ワイヤソー外で設定した被切断部材のゴニ
オ角に合せてワイヤソーに設置したゴニオ角設定装置を
調節する方式である。In addition, as another gonio angle setting means, only a gonio angle setting device is installed on the wire saw, the same gonio angle setting device and a gonio angle measuring device are installed outside the wire saw, and a separate gonio angle setting device is installed outside the wire saw. This device is configured to adjust the gonio angle setting device installed on the wire saw so that the crystal orientation of the workpiece is set by the gonioangle measuring device. This method adjusts the gonio angle setting device installed on the wire saw.
作 用
被切断部材の結晶方位を設定するゴニオ角設定装置は、
ワイヤソーの材料押上台上に設置され、その構造は例え
ば、水平面上を回動するターンテーブルと、該テーブル
に傾動可能に取付けられた傾動台と、この傾動台上面に
摺動可能に載置した摺動台とから構成され、前記摺動台
に被切断部材取付はベースが取付けられており、ターン
テーブル、傾動台および摺動台はそれぞれラック・ビニ
オン機構を介してモータ駆動される仕組みとなしたもの
を用いることが、できる。The gonio angle setting device that sets the crystal orientation of the workpiece is
It is installed on the material pushing table of the wire saw, and its structure includes, for example, a turntable that rotates on a horizontal plane, a tilting table that is tiltably attached to the table, and a sliding table that is slidably mounted on the top surface of the tilting table. A base is attached to the slide table for mounting the workpiece to be cut, and the turntable, tilt table, and slide table are each driven by a motor via a rack and pinion mechanism. It is possible to use the
ターンテーブル、傾動台およびベースは、それぞれ回動
角制御装置、傾動角制御装置および位置制御装置により
遠隔操作される仕組みとなす。The turntable, tilting table, and base are each remotely controlled by a rotation angle control device, a tilting angle control device, and a position control device.
被切断部材のゴニオ角測定装置は、例えばχ線回折法を
用い、χ線投射装置とχ線検出装置がそれぞれ入射角お
よび反射角可変に、かつモータ駆動にて同一垂直面内を
回動可能に取付けられ、ざらにχ線照射点の位置を設定
するための位置設定器を備えたものを用いることができ
る。The goniometer angle measuring device for the workpiece to be cut uses, for example, the chi-ray diffraction method, and the chi-ray projection device and chi-ray detection device have variable incident and reflection angles, and can be rotated within the same vertical plane by motor drive. It is possible to use a device that is attached to a device and equipped with a position setting device for roughly setting the position of the chi-ray irradiation point.
被切断部材の切断に先立ち、材料押上台上の摺動台に取
付けられたベースに固定した被切断部材のゴニオ角を該
ゴニオ角測定装置にて測定する。Prior to cutting the member to be cut, the gonio angle of the member to be cut fixed to the base attached to the sliding table on the material pushing table is measured using the gonio angle measuring device.
ゴニオ角測定装置とゴニオ角設定装置はオンラインで接
続されており、検出された結晶方位に切断あるいは切込
まれるようにゴニオ角設定装置の回動角、傾動角および
位置が自動的に調節される。The gonio angle measuring device and the gonio angle setting device are connected online, and the rotation angle, tilt angle, and position of the gonio angle setting device are automatically adjusted so that the cut or incision is made in the detected crystal orientation. .
被切断部材のゴニオ角の測定をワイヤソー外で行なう場
合は、被切断部材と同じものをワイヤソー外のゴニオ角
設定装置に取付けてゴニオ角を検出する。When measuring the gonio angle of a member to be cut outside the wire saw, the gonio angle is detected by attaching the same device as the member to be cut to a gonio angle setting device outside the wire saw.
別設のゴニオ角測定装置およびゴニオ角設定装置と、ワ
イヤソーに設置されたゴニオ角設定装置はオンラインで
接続されており、別設のゴニオ角設定装置に合せてワイ
ヤソーに設置したゴニオ角設定装置が自動的に調節され
る。The separately installed gonio angle measuring device and gonio angle setting device and the gonio angle setting device installed on the wire saw are connected online, and the gonio angle setting device installed on the wire saw is automatically adjusted.
被切断部材のゴニオ角を設定すると、ワイヤソーの材料
押上台を押上げて被切断部材をワイヤ列に接触させつつ
加工液を供給して切断動作に入る。Once the goniometric angle of the workpiece is set, the material pusher of the wire saw is pushed up to bring the workpiece into contact with the wire row, and machining fluid is supplied to begin the cutting operation.
被切断部材はゴニオ角設定装置に固定された状態で切断
されるので、所定の結晶方位に切断される。Since the member to be cut is cut while being fixed to the gonio-angle setting device, it is cut in a predetermined crystal orientation.
ワイヤソーとしては、ワイヤを往復させて切断する方式
の往復型ワイヤソーと、ワイヤを一方向に高速で走行さ
せて切断する方式の一方向高速走行型ワイヤソーの二種
が知られているが、いずれのワイヤソーにおいても所定
の結晶方位に切断することができる。Two types of wire saws are known: a reciprocating wire saw that cuts the wire by moving it back and forth, and a unidirectional high-speed wire saw that cuts the wire by running it at high speed in one direction. It is also possible to cut in a predetermined crystal orientation using a wire saw.
実 施 例
第１図はこの発明に係るゴニオ角設定装置の一例を示す
概略図、第２図は同じくゴニオ角測定装置の一例を示す
概略図、第３図はワイヤソー本体に同上装置を設置した
ワイヤソーを示す概略正面図、第４図は同上ワイヤソー
の概略側面図、第５図はワイヤソー外でゴニオ角を設定
する場合のゴニオ角設定装置とゴニオ角測定装置を示す
概略正面図である。Embodiment Fig. 1 is a schematic diagram showing an example of a gonio angle setting device according to the present invention, Fig. 2 is a schematic diagram showing an example of a gonio angle measuring device, and Fig. 3 is a schematic diagram showing an example of the gonio angle measuring device. FIG. 4 is a schematic side view of the same wire saw, and FIG. 5 is a schematic front view showing a gonio angle setting device and a gonio angle measuring device when setting the gonio angle outside the wire saw.
第１図に示すゴニオ角設定装置は、固定台（１）に連結
ピン（２）を中心に回動可能に取付けたターンテーブル
（３）、該ターンテーブルに支軸（５）を支点に上下方
向に傾動可能に取付けた傾動台（４）、該傾動台に摺動
可能に取付けた摺動台（６）とから構成され、ターンテ
ーブル（３）は固定台（１）に設置したモータ（Ｍｌ）
によりピニオン（３−１）および当該テーブル側面に設
【ブたラック（３−２）を介して連結ピン（２）を中心
に回動する機構となし、傾動台（４）はターンテーブル
（３）の側端部に突設した円弧状ラック（３−３）に噛
合するピニオン（４−１）を当該傾動台（４）に設置し
たモータ（Ｍ２）にて駆動することによって、支軸（５
）を支点に上下方向に傾動する機構となし、摺動台（６
）は下面に設けたラック（６−１）と噛合するピニオン
（４−２）を介して、傾動台（４）に設置したモータ（
Ｍ３）により傾動台上面を摺動する機構となっている。The gonio angle setting device shown in Fig. 1 consists of a turntable (3) attached to a fixed base (1) so as to be rotatable around a connecting pin (2), and a turntable (3) that is mounted on a fixed base (1) so as to be rotatable about a connecting pin (2), and the turntable is mounted up and down about a support shaft (5). The turntable (3) is composed of a tilting table (4) mounted so as to be tiltable in a direction, and a sliding table (6) slidably mounted on the tilting table. Ml)
The mechanism is such that it rotates around the connecting pin (2) via the pinion (3-1) and the rack (3-2) on the side of the table. ) by driving the pinion (4-1) that meshes with the arcuate rack (3-3) protruding from the side end of the support shaft ( 5
) as a fulcrum to tilt vertically, and a sliding table (6
) is connected to the motor (
M3) is a mechanism that slides on the top surface of the tilting table.
被切断部材Ｗの取付はベース（７）は１言動台（６）に
凹凸嵌合されてボルト（８）にて着脱可能に取付けられ
ている。The member W to be cut is attached by fitting the base (7) to the base (6) in a recessed and recessed manner and detachably attaching it with a bolt (8).
モータ（Ｍ＋ ＞（Ｍ２ ）（Ｍ３ ）はそれぞれ回転
角制御装置（１３） 、傾動角制御装置（１４） 、位
置制御装置（１６）にて制御される仕組みとなっており
、回転角制御装置（１３）および傾動角制御装置（１６
）はゴニオ角設定器（１８）からの信号を受けて制御さ
れる機構となっている。The motors (M+ > (M2) (M3) are each controlled by a rotation angle control device (13), a tilting angle control device (14), and a position control device (16), and the rotation angle control device ( 13) and tilting angle control device (16)
) is a mechanism controlled by receiving a signal from a gonio angle setting device (18).
このゴニオ角設定装置はワイヤソーの材料押上台（３３
）上に着脱可能に固定される。This gonio angle setting device is a wire saw material push-up table (33
) is removably fixed on the top.
一方、第２図に示すゴニオ角測定装置はχ線回折法を採
用したもので、円筒体（２０）にベアリング（２１）を
介して回動自在に装着されかつ当該円筒体に設置したモ
ータ（Ｍ４）にてピニオン（２３−１）（２３−２）を
介して回転駆動される２本のアーム（２２−１）（２２
−２）に、χ線投射装置（２５）とχ線検出装置（２６
〉が円筒体（２０）の中心線（Ｙ軸）上の点０−に対し
円弧状をなすガイド（２４−１）（２４−２）に移動可
能に装着された構造となっており、モータ（Ｍ４）は測
定装置角度設定器（２７）により制御される仕組みとな
っている。On the other hand, the goniogonal angle measuring device shown in Fig. 2 employs the chi-ray diffraction method, and is rotatably attached to a cylindrical body (20) via a bearing (21), and a motor ( M4), two arms (22-1) (22
-2), a chi-ray projection device (25) and a chi-ray detection device (26).
> is movably attached to the guides (24-1) and (24-2) that form an arc with respect to point 0- on the center line (Y-axis) of the cylindrical body (20), and the motor (M4) is controlled by a measuring device angle setting device (27).
このゴニオ角測定装置はワイヤソー本体に取付けられ、
χ線投射装置（２５）の照射点〇−の位置に前記ゴニオ
角設定装置上の被切断部材Ｗの端面０が一致するように
ゴニオ角設定装置の摺動台（６）を移動させて調整する
。この調整方法は例えばゴニオ角測定装置の円筒体（２
０）内に設けた棒スケール（２８）によって行なうこと
ができる。This gonio angle measuring device is attached to the wire saw body,
Adjust by moving the sliding base (6) of the gonio angle setting device so that the end face 0 of the workpiece W to be cut on the gonio angle setting device coincides with the irradiation point 〇- of the chi-ray projection device (25). do. This adjustment method can be applied, for example, to the cylindrical body (2
This can be done by means of a rod scale (28) provided in the 0).
ゴニオ角測定値はゴニオ角設定器（１８）に入力され、
ワイヤ切断面（Ｚ軸平面）に対する回動角度および傾動
角度がゴニオ角設定装置（１１１）の回転角制御装置（
１３）および傾動角制御装置（１６）に入力されてゴニ
オ角が設定されるようになっている。The gonio angle measurement value is input to the gonio angle setting device (18),
The rotation angle and tilt angle with respect to the wire cutting plane (Z-axis plane) are determined by the rotation angle control device (
13) and a tilting angle control device (16) to set the gonio angle.
第３図および第４図において、（３０）はワイヤソーで
あり、（３１）は溝ローラ、（３２）はワイヤ列、（１
１１）はゴニオ角設定装置、（１１２）はゴニオ角測定
装置である。In FIGS. 3 and 4, (30) is a wire saw, (31) is a groove roller, (32) is a wire row, and (1) is a wire saw.
11) is a gonio angle setting device, and (112) is a gonio angle measuring device.
被切断部材Ｗを切断する際は、位置制御装置（１６）に
て当該被切断部材の端面Ｏをゴニオ角測定装置（１１２
）のＯ′に一致させてゴニオ角を測定し、ゴニオ角設定
装置（１１１）にて所定のゴニオ角になるように被切断
部材のゴニオ角が設定される。When cutting the member W to be cut, the end face O of the member to be cut is measured by the position control device (16) using the gonio-angle measuring device (112).
), and the gonio angle of the workpiece to be cut is set to a predetermined gonio angle using a gonio angle setting device (111).
しかる後、材料押上台（３３）を上昇させて切断を開始
する。After that, the material pushing table (33) is raised to start cutting.
被切断部材Ｗのゴニオ角設定をワイヤソー外で行なう場
合は、第５図に示すごとく別設の材料押上台（３３３）
上に第１図および第２図に示すものと同じゴニオ角設定
装置（１１１）とゴニオ角測定装置（１１２）を設置し
１．前記と同様の操作にてゴニオ角を設定すると、別設
のゴニオ角設定装置とワイヤソー本体に設置されている
ゴニオ角設定装置とがオンラインで接続されているので
、その測定値がワイヤソー側のゴニオ角設定器（１８）
に入力されて自動的にゴニオ角が設定される。When setting the goniometer angle of the workpiece W to be cut outside the wire saw, use a separate material push-up table (333) as shown in Fig. 5.
The same gonio angle setting device (111) and gonio angle measuring device (112) as shown in FIGS. 1 and 2 are installed above.1. When you set the gonio angle using the same operation as above, the separately installed gonio angle setting device and the gonio angle setting device installed on the wire saw body are connected online, so the measured value is transferred to the gonio angle setting device on the wire saw side. Angle setter (18)
is entered and the gonio angle is automatically set.
発明の詳細
な説明したごとく、この発明に係るワイヤソーは被切断
部材のゴニオ角設定機能を有するので、シリコン単結品
等の結晶質の脆性材料でも所定の方位に多数同時切断す
ることが可能であるとともに、既設のワイヤソーにも容
易に適用できるので、結晶質脆性材料の切断に大なる効
果を奏する。As described in detail, the wire saw according to the present invention has the function of setting the gonio angle of the member to be cut, so it is possible to simultaneously cut a large number of crystalline brittle materials such as single silicon products in a predetermined direction. In addition, it can be easily applied to existing wire saws, so it is very effective in cutting crystalline brittle materials.
第１図はこの発明に係るゴニオ角設定装置の一例を示す
概略図、第２図は同じくゴニオ角測定装置の一例を示す
概略図、第３図はワイヤソー本体に同上装置を設置した
ワイヤソーを示す概略正面図、第４図は同上ワイヤソー
の概略側面図、第５図はこの発明の他の実施例で、ワイ
ヤソー外でゴニオ角を設定する場合のゴニオ角設定装置
とゴニオ角測定装置を示す概略正面図である。
１・・・固定台 ２・・・ターンテーブル４
・・・傾動台 ６・・・摺動台１３・・・回
転角制御装置 １４・・・傾動角制御装置１６・・・
位置制御装置 １８・・・ゴニオ角設定器２５・・
・χ線投射装置 ２６・・・χ線検出装置１１１・
・・ゴニオ角設定装置
１１２・・・ゴニオ角測定装置
事件の表示
発明の名称
自発手続補正書
平成
１年
特許願
第１４７３５２号
１、本願明細書第９頁５行「傾動角制御装置（１４）
Ｊを［傾動角制御装置（１６） Ｊと、同６行「置制御
装置（１６） Ｊを「置制御装置（１７） Ｊと、それ
ぞれ補正する。
２、同明細書第１２頁１５行［１４・・・傾動角制御装
置」を「１６・・・傾動角制御装置ｊと、同１６行「１
６・・・位置制御装置」を「１７・・・位置制御装置」
と、それぞれ補正する。
結晶質脆性材料切断用ワイヤソー
以上
補正をする者
事件との関係Fig. 1 is a schematic diagram showing an example of a gonio angle setting device according to the present invention, Fig. 2 is a schematic diagram showing an example of a gonio angle measuring device, and Fig. 3 shows a wire saw in which the above device is installed on the wire saw body. 4 is a schematic side view of the same wire saw as above, and FIG. 5 is another embodiment of the present invention, which schematically shows a gonio angle setting device and a gonio angle measuring device when setting the gonio angle outside the wire saw. It is a front view. 1...Fixed stand 2...Turntable 4
...Tilt table 6...Sliding table 13...Rotation angle control device 14...Tilt angle control device 16...
Position control device 18...gonio angle setting device 25...
・Chi-ray projection device 26...Chi-ray detection device 111・
...Gonio angle setting device 112...Gonio angle measuring device case Display name of invention Voluntary procedure amendment 1999 Patent Application No. 147352 1, Specification of the present application, page 9, line 5 "Tilt angle control device (14)
Correct J to "Tilt angle control device (16) J" and "Position control device (16) J" to "Position control device (17) J", respectively. 14...Tilt angle control device" is replaced with "16...Tilt angle control device j" and the same line 16 "1
6...Position control device" to "17...Position control device"
and correct them respectively. Relationship with the case involving a person who corrects wire saws for cutting crystalline brittle materials
Claims (1)
加工液を供給して被切断部材を多数同時に切断または切
込み加工するワイヤソーにおいて、被切断部材をワイヤ
列に押し当てる材料押上台に被切断部材を所定の結晶方
位に設定するためのゴニオ角設定装置を設け、該ゴニオ
角設定装置に被切断部材を取付ける構造となし、被切断
部材のゴニオ角測定装置とゴニオ角設定装置調節機構を
備えたことを特徴とする結晶質脆性材料切断用ワイヤソ
ー。 ２ ワイヤと被切断部材とを相互に接触させつつ砥粒を含む
加工液を供給して被切断部材を多数同時に切断または切
込み加工するワイヤソーにおいて、被切断部材をワイヤ
列に押し当てる材料押上台に被切断部材を所定の結晶方
位に設定するためのゴニオ角設定装置を設け、該ゴニオ
角設定装置に被切断部材を取付ける構造となし、当該ワ
イヤソー外に別設のゴニオ角設定装置とゴニオ角測定装
置にて設定した被切断部材の結晶方位になるよう、ワイ
ヤソーに設置した前記ゴニオ角設定装置を調節するごと
く構成したことを特徴とする結晶質脆性材料切断用ワイ
ヤソー。[Scope of Claims] 1. In a wire saw that simultaneously cuts or cuts a large number of workpieces by supplying a machining fluid containing abrasive grains while bringing the wire and workpiece into contact with each other, the workpieces are arranged in a wire row. A gonio angle setting device for setting the material to be cut in a predetermined crystal orientation is provided on the material pushing table, and the material to be cut is attached to the gonio angle setting device, and a gonio angle measuring device for the material to be cut is provided. A wire saw for cutting crystalline brittle materials characterized by being equipped with a gonio angle setting device adjustment mechanism. 2. In a wire saw that simultaneously cuts or inclines a large number of workpieces by supplying a machining liquid containing abrasive grains while bringing the wire and workpiece into contact with each other, a material pushing table that presses the workpiece against the wire row is used. A gonio angle setting device is provided to set the cut member in a predetermined crystal orientation, and the structure is such that the cut member is attached to the gonio angle setting device, and a separate gonio angle setting device and gonio angle measurement are installed outside the wire saw. A wire saw for cutting crystalline brittle materials, characterized in that the gonio angle setting device installed on the wire saw is configured to adjust the gonio angle setting device so that the crystal orientation of the workpiece is set by the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14735289A JPH0310760A (en) | 1989-06-09 | 1989-06-09 | Wire saw for cutting crystalline brittle material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14735289A JPH0310760A (en) | 1989-06-09 | 1989-06-09 | Wire saw for cutting crystalline brittle material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310760A true JPH0310760A (en) | 1991-01-18 |
Family
ID=15428247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14735289A Pending JPH0310760A (en) | 1989-06-09 | 1989-06-09 | Wire saw for cutting crystalline brittle material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310760A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5077295A (en) * | 1988-09-16 | 1991-12-31 | Pfizer Inc. | Antipsychoic 4-(4-(3-benzisothiazolyl)-1-piperazinyl)buytl bridged bicycle imides |
| JPH0516133A (en) * | 1991-07-10 | 1993-01-26 | Daiwa Kikai Seisakusho:Kk | Stone processing machine |
| DE19517107A1 (en) * | 1994-05-19 | 1995-11-23 | Tokyo Seimitsu Co Ltd | Workpiece positioning method for e.g. semiconductor wafer cutting process |
| EP0798092A2 (en) * | 1996-03-29 | 1997-10-01 | Shin-Etsu Handotai Co., Ltd | Method of slicing semiconductor single crystal ingot |
| WO2002100619A1 (en) * | 2001-06-13 | 2002-12-19 | Freiberger Compound Materials Gmbh | Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine |
| JP2007245340A (en) * | 2007-04-09 | 2007-09-27 | Dowa Holdings Co Ltd | Cutting method of sintered rare earth magnetic alloy |
| CN102189612A (en) * | 2011-04-25 | 2011-09-21 | 唐山晶玉科技有限公司 | Multi-wire cutter special for sapphire |
| WO2015097985A1 (en) * | 2013-12-24 | 2015-07-02 | 信越半導体株式会社 | Workpiece cutting method and workpiece holding tool |
| CN105922466A (en) * | 2016-04-28 | 2016-09-07 | 中国电子科技集团公司第四十五研究所 | Multi-line cutting material swinging device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63318128A (en) * | 1987-06-19 | 1988-12-27 | Sumitomo Electric Ind Ltd | Angle adjustment of semiconductor single crystal ingot and device therefor |
-
1989
- 1989-06-09 JP JP14735289A patent/JPH0310760A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63318128A (en) * | 1987-06-19 | 1988-12-27 | Sumitomo Electric Ind Ltd | Angle adjustment of semiconductor single crystal ingot and device therefor |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5077295A (en) * | 1988-09-16 | 1991-12-31 | Pfizer Inc. | Antipsychoic 4-(4-(3-benzisothiazolyl)-1-piperazinyl)buytl bridged bicycle imides |
| JPH0516133A (en) * | 1991-07-10 | 1993-01-26 | Daiwa Kikai Seisakusho:Kk | Stone processing machine |
| US5893308A (en) * | 1994-05-19 | 1999-04-13 | Tokyo Seimitsu Co., Ltd. | Method of positioning work piece and system therefor |
| DE19517107A1 (en) * | 1994-05-19 | 1995-11-23 | Tokyo Seimitsu Co Ltd | Workpiece positioning method for e.g. semiconductor wafer cutting process |
| US6145422A (en) * | 1994-05-19 | 2000-11-14 | Tokyo Seimitsu Co., Ltd. | Method of positioning work piece and system therefor |
| DE19517107C2 (en) * | 1994-05-19 | 1998-11-12 | Tokyo Seimitsu Co Ltd | Method for positioning a workpiece such as a rod-shaped single crystal material and device therefor |
| EP0798092A3 (en) * | 1996-03-29 | 1998-04-01 | Shin-Etsu Handotai Co., Ltd | Method of slicing semiconductor single crystal ingot |
| US5875769A (en) * | 1996-03-29 | 1999-03-02 | Shin-Etsu Handotai Co., Ltd. | Method of slicing semiconductor single crystal ingot |
| EP0798092A2 (en) * | 1996-03-29 | 1997-10-01 | Shin-Etsu Handotai Co., Ltd | Method of slicing semiconductor single crystal ingot |
| WO2002100619A1 (en) * | 2001-06-13 | 2002-12-19 | Freiberger Compound Materials Gmbh | Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine |
| US6923171B2 (en) | 2001-06-13 | 2005-08-02 | Freiberger Compound Materials Gmbh | Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine |
| EP1568457A1 (en) * | 2001-06-13 | 2005-08-31 | Freiberger Compound Materials GmbH | Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface |
| JP2007245340A (en) * | 2007-04-09 | 2007-09-27 | Dowa Holdings Co Ltd | Cutting method of sintered rare earth magnetic alloy |
| CN102189612A (en) * | 2011-04-25 | 2011-09-21 | 唐山晶玉科技有限公司 | Multi-wire cutter special for sapphire |
| WO2015097985A1 (en) * | 2013-12-24 | 2015-07-02 | 信越半導体株式会社 | Workpiece cutting method and workpiece holding tool |
| JP2015122424A (en) * | 2013-12-24 | 2015-07-02 | 信越半導体株式会社 | Workpiece cutting method and workpiece holding jig |
| US10350788B2 (en) | 2013-12-24 | 2019-07-16 | Shin-Etsu Handotai Co., Ltd. | Method for slicing workpiece and workpiece holder |
| CN105922466A (en) * | 2016-04-28 | 2016-09-07 | 中国电子科技集团公司第四十五研究所 | Multi-line cutting material swinging device |
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