SG11201909172UA - Method for slicing workpiece - Google Patents
Method for slicing workpieceInfo
- Publication number
- SG11201909172UA SG11201909172UA SG11201909172UA SG11201909172UA SG 11201909172U A SG11201909172U A SG 11201909172UA SG 11201909172U A SG11201909172U A SG 11201909172UA SG 11201909172U A SG11201909172U A SG 11201909172UA
- Authority
- SG
- Singapore
- Prior art keywords
- slicing
- workpiece
- slicing workpiece
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017074779A JP6693460B2 (en) | 2017-04-04 | 2017-04-04 | Work cutting method |
PCT/JP2018/008451 WO2018186087A1 (en) | 2017-04-04 | 2018-03-06 | Workpiece cutting method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201909172UA true SG11201909172UA (en) | 2019-11-28 |
Family
ID=63712585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201909172U SG11201909172UA (en) | 2017-04-04 | 2018-03-06 | Method for slicing workpiece |
Country Status (8)
Country | Link |
---|---|
US (1) | US11389991B2 (en) |
JP (1) | JP6693460B2 (en) |
KR (1) | KR102471435B1 (en) |
CN (1) | CN110461543B (en) |
DE (1) | DE112018001286T5 (en) |
SG (1) | SG11201909172UA (en) |
TW (1) | TWI753128B (en) |
WO (1) | WO2018186087A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019117796A1 (en) * | 2019-07-02 | 2021-01-07 | WIKUS-Sägenfabrik Wilhelm H. Kullmann GmbH & Co. KG | Cutting tool with buffer particles |
US11717930B2 (en) * | 2021-05-31 | 2023-08-08 | Siltronic Corporation | Method for simultaneously cutting a plurality of disks from a workpiece |
CN113352154B (en) * | 2021-07-04 | 2022-04-26 | 兴化市富翔不锈钢制品有限公司 | Novel terrace die blade repairing and forming device |
JP2023089451A (en) * | 2021-12-16 | 2023-06-28 | 信越半導体株式会社 | Workpiece cutting method and wire saw |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53114583A (en) * | 1977-03-17 | 1978-10-06 | Sony Corp | Method of cutting ingot |
JPH029186A (en) * | 1988-06-28 | 1990-01-12 | Tanaka Kikinzoku Kogyo Kk | Manufacture of square type block |
JPH1128654A (en) | 1997-07-04 | 1999-02-02 | Tokyo Seimitsu Co Ltd | Dressing method and device of fixed abrasive grain wire saw |
JP3593451B2 (en) * | 1998-04-01 | 2004-11-24 | 株式会社日平トヤマ | Ingot slicing method |
JP2000158319A (en) * | 1998-11-27 | 2000-06-13 | Fujikoshi Mach Corp | Diamond wire saw and cutting method |
JP2005095993A (en) | 2003-09-22 | 2005-04-14 | Kanai Hiroaki | Method and device for dressing abrasive grain stuck wire in fixed abrasive grain type wire saw |
JP4991229B2 (en) * | 2006-09-22 | 2012-08-01 | 信越半導体株式会社 | Cutting method and epitaxial wafer manufacturing method |
KR20090038502A (en) * | 2007-10-16 | 2009-04-21 | 주식회사 실트론 | Method for polishing of wafer |
JP5263536B2 (en) * | 2009-07-14 | 2013-08-14 | 信越半導体株式会社 | Work cutting method |
KR101625709B1 (en) * | 2010-02-08 | 2016-05-30 | 토요 어드밴스드 테크놀로지스 컴퍼니 리미티드 | Method of cutting workpiece with wire saw and wire saw |
DE102011082366B3 (en) | 2011-09-08 | 2013-02-28 | Siltronic Ag | Single-layer winding of saw wire with fixed cutting grain for wire saws for separating slices from a workpiece |
TWI583468B (en) | 2012-12-04 | 2017-05-21 | 梅耶博格(瑞士)股份有限公司 | Wire management system,wire saw and cutting method |
KR20140090906A (en) * | 2013-01-10 | 2014-07-18 | 주식회사 엘지실트론 | Wire saw and method for slicing ingot using the same |
JP5791642B2 (en) * | 2013-01-10 | 2015-10-07 | 信越半導体株式会社 | How to resume wire saw operation |
JP6235295B2 (en) * | 2013-10-07 | 2017-11-22 | 株式会社安永 | Fixed abrasive wire saw apparatus and wafer manufacturing method using the same |
KR101551764B1 (en) * | 2014-05-13 | 2015-09-10 | 한국생산기술연구원 | Apparatus for dressing wire |
JP6172053B2 (en) * | 2014-05-28 | 2017-08-02 | 信越半導体株式会社 | Fixed abrasive wire, wire saw and workpiece cutting method |
EP3357642A4 (en) * | 2015-09-30 | 2019-05-29 | Furukawa Electric Co. Ltd. | Abrasive diamond grain for wire tool and wire tool |
JP6270796B2 (en) * | 2015-10-28 | 2018-01-31 | 株式会社リード | Fixed abrasive wire saw and fixed abrasive wire dressing method |
CN107775828B (en) * | 2017-10-31 | 2019-04-12 | 南通皋鑫电子股份有限公司 | A kind of folded technique of Buddha's warrior attendant wire cutting silicon |
-
2017
- 2017-04-04 JP JP2017074779A patent/JP6693460B2/en active Active
-
2018
- 2018-03-06 CN CN201880021867.1A patent/CN110461543B/en active Active
- 2018-03-06 DE DE112018001286.7T patent/DE112018001286T5/en active Pending
- 2018-03-06 US US16/495,632 patent/US11389991B2/en active Active
- 2018-03-06 SG SG11201909172U patent/SG11201909172UA/en unknown
- 2018-03-06 KR KR1020197028959A patent/KR102471435B1/en active IP Right Grant
- 2018-03-06 WO PCT/JP2018/008451 patent/WO2018186087A1/en active Application Filing
- 2018-03-09 TW TW107107973A patent/TWI753128B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI753128B (en) | 2022-01-21 |
US20200016791A1 (en) | 2020-01-16 |
CN110461543B (en) | 2021-07-16 |
JP2018176301A (en) | 2018-11-15 |
KR20190136006A (en) | 2019-12-09 |
JP6693460B2 (en) | 2020-05-13 |
CN110461543A (en) | 2019-11-15 |
TW201836745A (en) | 2018-10-16 |
US11389991B2 (en) | 2022-07-19 |
DE112018001286T5 (en) | 2020-01-16 |
WO2018186087A1 (en) | 2018-10-11 |
KR102471435B1 (en) | 2022-11-28 |
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