WO2016167892A1 - Polysiloxane formulations and coatings for optoelectronic applications - Google Patents

Polysiloxane formulations and coatings for optoelectronic applications Download PDF

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Publication number
WO2016167892A1
WO2016167892A1 PCT/US2016/020373 US2016020373W WO2016167892A1 WO 2016167892 A1 WO2016167892 A1 WO 2016167892A1 US 2016020373 W US2016020373 W US 2016020373W WO 2016167892 A1 WO2016167892 A1 WO 2016167892A1
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Prior art keywords
silicon
amu
formulation
containing resin
coating
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PCT/US2016/020373
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English (en)
French (fr)
Inventor
Desaraju Varaprasad
Sudip Mukhopadhyay
Songyuan Xie
Amanuel H. GEBREHRHAN
Hai BIEN
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Honeywell International Inc
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Honeywell International Inc
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Priority to US15/522,419 priority Critical patent/US10544329B2/en
Priority to EP16780418.6A priority patent/EP3194502A4/en
Priority to JP2017536545A priority patent/JP6803842B2/ja
Publication of WO2016167892A1 publication Critical patent/WO2016167892A1/en
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Definitions

  • the present disclosure relates generally to polysiloxane formulations and coatings made from those compositions, and more particularly to polysiloxane
  • the coating is formed from a hydrolysis and condensation reaction ofsilicon-based compounds, such as siloxane monomers or oligomers, often with the use of a condensation catalyst.
  • Such coating formulations may be associated with certain limitations, including one or more of limited shelf life, lower pH, the presence of water in the formulation, and limited film thickness.
  • film thickness is limited due to restrictions on the solid content of the formulation. At too high of a solid content, the polymerization reaction has a tendency to react until the formulation becomes gelled, rendering it unsuitable for forming an electronic or optoelectronic coating. In some typical devices, the polysiloxane coating is applied to a substrate or coating that is sensitive to moisture.
  • a formulation containing water to the substrate or coating may damage the moisture sensitive material, such as siloxane materials that contain Si-H entities, which are sensitive to moisture.
  • the polysiloxane coating is applied to a substrate or coating that is sensitive to pH.
  • Application of a formulation to the substrate or coating may damage the pH sensitive material, such as metallic patterns of interconnects that may be sensitive to acidic or basic media.
  • touch-enabled high pixel density (pixel per inch or ppi) displays with increasing battery life and higher viewing pleasure require increasing individual pixel operation by minimizing power consumption at the thin film transistor (TFT) level.
  • TFT thin film transistor
  • For touch-enabled advanced displays with higher resolution individual pixels are connected to multiple thin film transistors (TFTs) to achieve maximum resolution and maximum pleasure of viewing for consumers.
  • TFTs thin film transistors Building thermally-stable oxide TFTs on a smooth substrate by applying a thermally stable planarization layer on the solid substrate, preferably glass, decreases leakage during TFT operation and lowers power consumption during switching on and off of the device.
  • Oxide TFTs such as indium gallium zinc oxide (IGZO) have low off current, providing long battery life for a display device compared to amorphous and low temperature polysilicon TFTs.
  • Copper, aluminum, or molybdenum interconnects require a thermally stable (350oC-400oC, preferably 380oC) planarizing dielectric material for oxide TFT with low out gassing.
  • interconnects of copper, aluminum, or molybdenum require a relatively thicker barrier material, such as silicon nitride, to prevent diffusion, which generally adds to the fabrication costs.However, typical planarization materials do not meet the requirements to be an effective diffusion barrier or a supplementary diffusion barrier.
  • the present disclosure provides polysiloxane formulationsincluding one or more solvents and one or more silicon-based compounds.
  • the present disclosure further provides coatings formed from such formulations.
  • a composition in one exemplary embodiment, includes at least one silicon-based material, wherein the at least one silicon-based material comprises a percentage of carbon atoms contained in alkyl groups from greater than 20% to 100% based on the total number of carbon atoms in the silicon-based material; and at least one solvent.
  • the at least one silicon-based material comprises a first silicon-containing resin comprising alkyl groups and aryl groups and a second silicon-containing resincomprising aryl groups.
  • the first silicon-containing resin comprises methylsiloxane and phenylsiloxane and the second silicon-containing resin comprises phenylsiloxane.
  • a composition in one exemplary embodiment, includes at least one silicon-based material, wherein the at least one silicon-based material comprises a first siloxane resin comprising at least one of alkyl groups and aryl groups and a second siloxane resin comprising aryl groups; and at least one solvent.
  • the first silicon-containing resin has a weight average molecular weight from 1000 AMU to 10, 000 AMU and the second silicon-containing resin has a weight average molecular weight from 900 AMU to 5000 AMU.
  • the alkyl groups of the first siloxane resin comprise methyl groups.
  • the first siloxane resin comprises dimethyl siloxane.
  • the aryl groups of the first siloxane resin comprise phenyl groups.
  • the aryl groups of the second siloxane resin comprise phenyl groups.
  • the first silicon-containing resin comprises methylsiloxane and phenylsiloxane and the second silicon-containing resin comprises phenylsiloxane.
  • a composition in one exemplary embodiment, includesat least one silicon-based material, wherein the at least one silicon-based material comprises a difunctional siloxane; and at least one solvent.
  • the difunctional siloxane in dimethylsiloxane.
  • the silicon-based material comprises at least 0.1 mol.% difunctional siloxane, as a percent of the total moles of siloxane in the silicon-based material.
  • the at least one silicon-based material comprises a first silicon-containing resin comprising alkyl groups and aryl groups and a second silicon-containing resincomprising aryl groups, and wherein the first silicon-containing resin comprises the difunctional siloxane.
  • the first silicon-containing resin comprises methylsiloxane, dimethylsilxoane and phenylsiloxane and the second silicon-containing resin comprises phenylsiloxane.
  • a composition is provided.
  • the composition is a crosslinkable composition comprising a first silicon-containing resin comprising alkyl groups and aryl groups and a second silicon-containing resin comprising aryl groups; at least one solvent; and at least one heat-activated catalyst.
  • a crosslinkable composition comprising a first silicon-containing resin comprising alkyl groups and aryl groups and a second silicon-containing resin comprising aryl groups; at least one solvent; and at least one heat-activated catalyst.
  • the composition further includes at least one surfactant. In a more particular embodiment of either of the above embodiments, the composition further includes at least one adhesion promoter.In a more particular embodiment of any of the above embodiments the first silicon-containing resin comprises methylsiloxane and phenylsiloxane and the second silicon-containing resin comprises phenylsiloxane.In a more particular
  • the first silicon-containing resin further comprises a difunctional siloxane, such as dimethyl siloxane.
  • the difunctional siloxane comprises at least 0.1 mol.% as a percent of the total moles of siloxane in the first silicon-containing resin.
  • a percentage of carbon atoms contained in alkyl groups from greater than 10% to 100% based on the total number of carbon atoms in the first and second silicon-containing resins, or even more particularly from greater than 20% to 100%.
  • a composition is provided.
  • the composition is a crosslinkable composition comprising at least one silicon-based materialhaving a weight average molecular weight from 1000 AMU to 10,000 AMU, wherein the at least one silicon-based material comprises a percentage of carbon atoms contained in alkyl groups from greater than 20% to 100% based on the total number of carbon atoms in the silicon- based material; at least one solvent; and at least one heat-activated catalyst.
  • the composition further includes one or more surfactants.
  • the composition further includes one or more adhesion promoters.
  • the composition further includes at least one heat-activated catalyst, such as a quaternary ammonium salts selected from tetramethylammonium acetate (TMAA),
  • TMAA tetramethylammonium acetate
  • the composition further includes at least one surfactant.
  • the composition further includes at least one adhesion promoter.
  • the composition further includes at least one plasticizer.
  • the composition further includes at least one organic acid.
  • the composition further includes at least one monofunctional silane.
  • the composition is water-free.
  • a composition in one exemplary embodiment, includes at least one silicon-based material, wherein the at least one silicon-based material comprises at least one of alkyl groups and aryl groups; at least one solvent; at least one heat-activated catalyst; and at least one surfactant, wherein the composition is water free.
  • the at least one solvent consists of water-free anhydrous solvents.
  • the composition has less than 0.2 wt.% water.
  • the composition has 0 wt.% water.
  • the composition includes no external water.
  • the composition further includes one or more additives selected from the group consisting of: adhesion promoters, endcapping agents, and organic acids.
  • the composition is a crosslinkable composition.
  • a crosslinked film is provided.
  • the crosslinked film is formed from a composition according to any of the above
  • the crosslinked film has a thickness of 1.5 ⁇ m or greater. In another more particular embodiment, the crosslinked film has a thickness of 3.0 ⁇ m or greater. In a more particular embodiment of any of the above embodiments, the crosslinked film is cured at a temperature of 350oC or greater. In a more particular embodiment of any of the above embodiments, the crosslinked film is cured at a temperature of 390oC or greater.In a more particular embodiment of any of the above embodiments, the crosslinked film has a transmittance to light in the visible optical wavelength range from 400 to 1000 nm of 95% or greater.
  • a device having a surface includes a crosslinked film according to any of the above embodiments, or includes a crosslinked film formed from any of the above embodiments.
  • the device is selected from the group consisting of a transistor, a light-emitting diode, a color filter, a photovoltaic cell, a flat-panel display, a curved display, a touch-screen display, an x-ray detector, an active or passive matrix OLED display, an active matrix think film liquid crystal display, an electrophoretic display, a CMOS image sensor, and combinations thereof.
  • the crosslinked film forms a passivation layer, a planarization layer, a barrier layer, or a combination thereof.
  • a method of forming a composition includes combining a first siloxane resin, a second siloxane resin, and at least one solvent to form a crosslinkable composition, wherein the first siloxane resin comprises at least one of alkyl groups and aryl groups and the second siloxane resin comprises aryl groups.
  • the alkyl groups of the first siloxane resin comprise methyl groups.
  • the first siloxane resin comprise dimethyl siloxane.
  • the aryl groups of the first siloxane resin comprise phenyl groups.
  • the aryl groups of the second siloxane resin comprise phenyl groups.
  • the composition further a total percentage of carbon atoms contained in alkyl groups from greater than 20% to 100% based on the total number of carbon atoms in alkyl and aryl groups.
  • a method of forming a composition includes reacting a first organoalkoxysilane in a first solvent in the presence of a catatlyst to produce a first silicon-based material, wherein the first silicon- based material includes at least one of alkyl groups and aryl groups; reacting a second organoalkoxysilane in a second solvent in the present of a catalyst to produce a second silicon-based material, wherein the second silicon-based material includes aryl groups; and combining the first and second silicon-based material to form a composition, wherein the composition comprises a percentage of carbon atoms contained in alkyl groups from greater than 20% to 100% based on the total number of carbon atoms in the first and second silicon-based materials.
  • the first and second organoalkoxysilanes are independently selected from the group consisting of: methyltrimethoxysilane (MTMOS), methyltriethoxysilane (M
  • DMDEOS dimethyldiethoxysilane
  • PTEOS phenyl triethoxysilane
  • dimethyldimethoxysilane dimethyldimethoxysilane, phenyltrimethoxysilane, and combinations thereof.
  • a method of forming a composition includes combining a first siloxane resin comprising alkyl groups and aryl groups, a second siloxane resin comprising aryl groups, a solvent, and a heat activated catalyst to form a crosslinkable composition; depositing the composition on a substrate; andcuring the crosslinkable composition at a temperature of 350oC or greater to form a crosslinked film, wherein the crosslinked film has a thickness of 1.5 ⁇ m or greater.
  • the first siloxane resin comprises methylsiloxane and phenylsiloxane and the second silicon-containing resin comprises phenylsiloxane.
  • the first siloxane resin further comprises dimethyl siloxane.
  • the composition further comprises at least one heat-activated catalyst and at least one surfactant.
  • the crosslinkable composition includes no water.
  • the at least one solvent consists of PGMEA and PGPE.
  • the composition is a crosslinkable composition.
  • the method according any of the above embodiments further includes depositing the composition on a surface; andcuring the composition to form a film.
  • the film has a thickness of 1.5 ⁇ m or greater.
  • the crosslinked film has a thickness of 3.0 ⁇ m or greater.
  • curing the crosslinkable composition including curing at a temperature of 350oC or greater.
  • curing the crosslinkable composition including curing at a temperature of 390oC or greater.
  • the first silicon-containing resin comprises methylsiloxane and phenylsiloxane and the second silicon-containing resin comprises phenylsiloxane
  • the method further comprising reacting a phenyl TEOS-based polymer having a molecular weight of at least 1000 AMU in a solvent in the presence of a catalyst to form the second silicon-containing resin.
  • the catalyst is a basic catalyst, such as a
  • Fig.1 is related to Example 4 and shows the absolute transmittance (350-800 nm) of the coatings.
  • Fig.2A is related to Example 4 and shows the reflectivity of the control coating at 400 nm to 1050 nm.
  • Fig.2B is related to Example 4 and shows the reflectivity of an
  • Fig.3A is related to Example 6 and shows the residual stress in MPa for the control coating during a heating and cooling cycle.
  • Fig.3B is related to Example 6 and shows the residual stress in MPa for an exemplary coating during a heating and cooling cycle.
  • Fig.4A is related to Example 6 and shows the coefficient of thermal expansion for the coatings as a function of temperature.
  • Fig.4B is related to Example 6 and shows the difference in coefficient of thermal expansion for the coatings as a function of temperature.
  • Fig.5 is related to Example 7 and shows the thermal gravimetric analysis results for the coatings.
  • Fig.6A is related to Example 9 and shows the nanohardness in MPa for the coatings.
  • Fig.6B is related to Example 9 and shows the Reduced Elastic Modulus in GPa for the coatings.
  • Fig.7A is related to Example 9 and shows the depth vs. load profile for the control coating.
  • Fig.7B is related to Example 9 and shows a scanning probe microscope image of the indentation for the control coating.
  • Fig.8A is related to Example 9 and shows the depth vs. load profile for an exemplary coating.
  • Fig.8B is related to Example 9 and shows a scanning probe microscope image of the indentation for an exemplary coating.
  • the polysiloxane formulation includes one or more solvents and one or more silicon-based compounds.
  • the polysiloxane formulation includes one or more solvents and one or more silicon-based compounds.
  • the formulation further includes one or more catalysts. In some exemplary embodiments, the formulation further includes one or more surfactants. In some exemplary embodiments, the formulation further includes one or more additional additives, such as adhesion promoters, plasticizers, organic acids, and monofunctional silanes.
  • the formulation includes one or more solvents.
  • solvents include suitable pure organic molecules or mixturesthereof that are volatilized at a desired temperature and/or easily solvate the components discussed herein.
  • the solvents may also comprise suitable pure polar and non-polar compoundsor mixtures thereof.
  • the term“pure” means a component that has a constant composition. For example, pure water is composed solely of H 2 O.
  • the term“mixture” means a component that is not pure, including salt water.
  • the term“polar” means that characteristic of a molecule or compound that creates an unequal charge, partial charge or spontaneous charge distribution at one point of or along the molecule or compound.
  • non-polar means that characteristic of a molecule or compound that creates an equal charge, partial charge or spontaneous charge distribution at one point of or along the molecule or compound.
  • exemplary solvents include solvents that can, alone or in combination, modify the viscosity, intermolecular forces and surface energy of the solution in order to, in some cases, improve the gap-filling and planarization properties of the composition. It should be understood, however, that suitable solvents may also include solvents that influence the profile of the composition in other ways, such as by influencing the crosslinking efficiency, influencing the thermal stability, influencing the viscosity, and/or influencing the adhesion of the resulting layer or film to other layers, substrates or surfaces.
  • Exemplary solvents also include solvents that are not part of the hydrocarbon solvent family of compounds, such as ketones, including acetone, diethyl ketone, methyl ethyl ketone and the like, alcohols, esters, ethers and amines.
  • Additional exemplary solvents include ethyl lactate, propylene glycol propylether (PGPE), propylene glycol monomethyl ether acetate (PGMEA) or a combination thereof.
  • the solvent comprises propylene glycol monomethyl ether acetate.
  • formulation comprises as little as 50 wt.%, 55 wt.%, 60 wt.%, as great as 80 wt.%, 85 wt.%, 90 wt.% of the one or more solvents, or within any range defined between any two of the foregoing values, such as 50 wt.% to 90 wt.%, 55 wt.% to 85 wt.%, or 65 wt.% to 85 wt.%.
  • the determination of the appropriate amount of solvent to add to composition depends on a number of factors, including: a) thicknesses of the desired layers or films, b) desired concentration and molecular weightof the solids in the composition, c) application technique of the composition and/or d) spin speeds, when spin-coating techniques are utilized.
  • the higher the solid concentration (or the resin or polymer) is in the formulation the higher the viscosity.
  • the solid content may be increased (or the solvent amount reduced) to increase the viscosity as desired for a specific coating application technique.
  • the viscous formulation or formulation with higher solid content will typically provide a thicker film thickness such as greater than 2 ⁇ m.
  • the solvents used herein may comprise any suitable impurity level.
  • the solvents utilized have a relatively low level of impurities, such as less than about 1 ppm, less than about 100 ppb, less than about 10 ppb, less than about 1 ppb, less than about 100 ppt, less than about 10 ppt and in some cases, less than about 1 ppt.
  • These solvents may be purchased having impurity levels that are appropriate for use in these contemplated applications or may need to be further purified to remove additional impurities and to reach the less than about 10 ppb, less than about 1 ppb, less than about 100 ppt or lower levels that suitable and/or desired.
  • the formulation includes no water.
  • the solvent is an anhydrous solvent
  • the silicon-based compounds, and any catalysts, surfactants, adhesion promoters, cross-linkers, initiators, or other additives are provided in a water-free anhydrous solvent.
  • “water-free” refers to a composition having less than 0.2 wt.%, 0.1 wt.%, 0.05 wt.%, 0.01 wt.% water, or 0 wt.% water.
  • “water- free” refers to a composition have no water.
  • “water- free” refers to a composition in which no external water is added, although some water may be formed from the hydrolysis-condensation reaction of the silicon-based compounds.
  • the formulation includes one or more silicon-based compounds that can be crosslinked to form the polysiloxane.
  • silicon-based compounds comprise siloxane, silsesquioxane, polysiloxane, or polysilsesquioxane, such as methylsiloxane, methylsilsesquioxane, phenylsiloxane, phenylsilsesquioxane, methylphenylsiloxane, methylphenylsilsesquioxane, dimethylsiloxane, diphenylsiloxane, methylphenylsiloxane, polyphenylsilsesquioxane, polyphenylsiloxane, polymethylphenylsiloxane, polymethylphenylsiloxane, polymethylphenylsiloxane, polymethylphenylsiloxane,
  • the at least one silicon-based compound comprises polyphenylsilsesquioxane, polyphenylsiloxane, phenylsiloxane,
  • polymethylphenylsiloxane polymethylphenylsiloxane, polymethylphenylsilsesquioxane, polymethylsiloxane, polymethylsilsesquioxane or a combination thereof.
  • the silicon-based compounds comprise a total amount of carbon atoms divided between carbon atoms in alkyl groups, such as methyl and ethyl groups, and carbon atoms in aryl groups, such as phenyl groups.
  • the number of carbon atoms contained in the alkyl groups is greater than 10%, 12,%, 15% 20%, 21%, 25%, or greater than 30%, 31%, 40%, 50%, 60%, 70%, 75%, 80%, 85%, 90%, 95%, 99%, and less than 100%, or is 100%, based on the total number of carbon atoms contained in the alkyl and aryl groups, or may be between any range defined between any two of the foregoing values, such as from greater than 10% to less than 100%, from 12% to less than 100%, from greater than 20% to 100% or greater than 30% to less than 100%.
  • the silicon-based compounds include a plasticizer or other suitable material to increase the flexibility of the formed polysiloxane.
  • Some contemplated silicon-based compounds include compositions formed from hydrolysis-condensation reactions of at least one reactant having the formula:
  • R 1 is an alkyl, alkenyl, aryl, or aralkyl group
  • x is an integer between 0 and 2
  • R 2 is a alkyl group or acyl group and y is an integer between 1 and 4.
  • Materials also contemplated include silsesquioxane polymers of the general formula:
  • x is an integer greater than about 4.
  • the silicon-based material includes one or more polysiloxane resins, such as the Glass Resin polysiloxane resins available from Techneglas Technical Products, Perrysburg, Ohio.
  • polysiloxane resins are silicon-based oligomers formed from a limited hydrolysis and condensation reaction of one or more silicon-based monomers.
  • Exemplary suitable silicon-based monomers include organoalkoxysilanes having a Si-C bond, such as methyltrimethoxysilane (MTMOS), methyltriethoxysilane (MTEOS),
  • DMDEOS dimethyldiethoxysilane
  • PTEOS phenyl triethoxysilane
  • TEOS tetraethylorthosilicate
  • resin materials include glass resins derived from organoalkoxysilanes such as methylsiloxane, dimethylsiloxane, phenylsiloxane, methylphenylsiloxane, tetraethoxysilane, and mixtures thereof.
  • the polysiloxane resins have a structure selected from the group consisting of a linear structure, a cyclic structure, a cage-type structure, a ladder-type structure, and a partial-ladder/partial-cage type structure.
  • the polysiloxane resins have a partial-ladder/partial-cage type structure.
  • the polysiloxane resins include one or more alkyl groups and/or one or more aryl groups.
  • Exemplary polysiloxane resins containing alkyl groups include methylsiloxane and dimethylsiloxane.
  • Exemplary polysiloxane resins containing aryl groups include phenylsiloxane.
  • Exemplary polysiloxane resins containing both alkyl and aryl groups include methylphenylsiloxane.
  • each polysiloxane resin has a weight average molecular weight as little as 900 atomic mass unit (AMU), 950 AMU, 1000 AMU, 1100 AMU, 1150 AMU, as great as 2000 AMU,3000 AMU,4000 AMU, 5000 AMU,10,000 AMU , or within any range defined between any two of the foregoing values, such as 900 AMU to 10,000 AMU, 1000 AMU to 10,000 AMU, or900 AMU to 5000 AMU.
  • AMU atomic mass unit
  • the polysiloxane resin include a first polysiloxane resin containing alkyl groups such as methylsiloxane and/or dimethylsiloxane and a second polysiloxane resin containing aryl groups such as phenylsiloxane.
  • the first polysiloxane resin further contains aryl groups such as phenylsiloxane.
  • the first polysiloxane resin has a weight average molecular weight as little as 1000 atomic mass unit (AMU), 2000 AMU,2200 AMU, 3000 AMU, 3800 AMU, 4000 AMU, as great as 4500 AMU, 4800 AMU,5000 AMU,7500 AMU, 10,000 AMU or within any range defined between any two of the foregoing values, such as 1000 AMU to 10,000 AMU, 2000 AMU to 5000 AMU, or 3800 AMU to 4800 AMU and the second polysiloxane resin has a weight average molecular weight as little as 900 atomic mass unit (AMU), 950 AMU,1000 AMU, as great as 1150 AMU,2000 AMU,2500 AMU, 5000 AMU or within any range defined between any two of the foregoing values, such as 900 AMU to 5000 AMU, 900 AMU to 2000 AMU, or 950 AMU to 1150 AMU.
  • AMU atomic mass unit
  • the silicon-based material includes or is formed from one or more organoalkoxysilanes.
  • organoalkoxysilanes include methyltrimethoxysilane (MTMOS), methyltriethoxysilane (MTEOS),
  • DMDEOS dimethyldiethoxysilane
  • PTEOS phenyl triethoxysilane
  • the silicon-based material includes a blend of two or more pre-formed polysiloxane resins.
  • two or more polysiloxane resins may be combined to provide a total number of carbon atoms contained in the alkyl groups from greater than 10%, 12%, greater than 20%, 21%, 25%, greater than 30%, 31%, 40%, 50%, 60%, 70%, 75%, 80%, 85%, 90%, 95%, 99%, less than 100%, 100%, based on the total number of carbon atoms contained in the alkyl and aryl groups, or between any range defined between any two of the foregoing values, such as from greater than 10% to 100%, from 12% to 100% from greater than 20% to 100%, or greater than 30% to less than 100%.
  • the silicon-based material may include one or more polysiloxane resins each including a difunctional silane.
  • An exemplary difunctional silane is dimethylsiloxane.
  • the silicon-based material may include as little as 0%, 0.1%, 0.5%, 1%, 2%, as high as 5%, 10%, 15%, 20% difunctional siloxane, as a molar percentage of the total moles of siloxane, or between any range defined between any two of the foregoing values, such as from 0% to 20% or from 0.1% to 2%.
  • the formulation includes one or more catalysts.
  • the catalyst is a heat-activated catalyst.
  • a heat-activated catalyst refers to a catalyst that is activated at or above a particular temperature, such as an elevated temperature. For example, at one temperature (such as room temperature) the composition maintains a low molecular weight, thus enabling good planarization ability over a surface.
  • the temperature is elevated (such as to greater than 50° C.)
  • the heat-activated catalyst catalyzes a condensation reaction between two Si- OH functional groups, which results in a more dense structure and, in some cases, improved performance overall.
  • Suitable condensation catalysts comprise those catalysts that can aid in maintaining a stable silicate solution.
  • Exemplary metal-ion-free catalysts may comprise onium compounds and nucleophiles, such as an ammonium compound (such as quaternary ammonium salts), an amine, a phosphonium compound or a phosphine compound.
  • the catalyst is not a photoacid , a photoacid generator, or a metal-based catalyst.
  • the catalyst is relatively molecularly“small” or is a catalyst that produces relatively small cations, such as quaternary ammonium salts.
  • the one or more catalysts is selected from tetramethylammonium acetate (TMAA), tetramethylammonium hydroxide (TMAH), tetrabutylammonium hydroxide (TBAH), tetrabutylammonium acetate (TBAA), cetyltrimethylammonium acetate (CTAA), tetramethylammonium nitrate (TMAN), other ammonium-based catalysts, amine-based and/or amine-generating catalysts, and combinations thereof.
  • TMAA tetramethylammonium acetate
  • TMAH tetramethylammonium hydroxide
  • TBAH tetrabutylammonium hydroxide
  • TBAA tetrabutylammonium acetate
  • CAA cetyltrimethylammonium acetate
  • TMAN tetramethylammonium nitrate
  • exemplary catalysts include (2-hydroxyethyl)trimethylammonium chloride, (2- hydroxyethyl)trimethylammonium hydroxide, (2-hydroxyethyl)trimethylammonium acetate, (2-hydroxyethyl)trimethylammonium formate, (2- hydroxyethyl)trimethylammonium nitrate, (2-hydroxyethyl)trimethylammonium benzoate, tetramethylammonium formate and combinations thereof.
  • Other exemplary catalysts include (carboxymethyl)trimethylammonium chloride,
  • the formulation comprises as little as 0.001 wt.%, 0.004 wt.%, 0.01 wt.%, 0.1 wt.%, 0.3 wt.%, as great as 0.5 wt.%, 1 wt.%, 2 wt.%, 5 wt.%, or 10 wt.% of the one or more catalysts, or within any range defined between any two of the foregoing values, such as 0.1 wt.% to 10 wt.% or 1 wt.% to 2 wt.%.
  • the one or more catalysts comprise TMAN.
  • TMAN may be provided by either dissolving TMAN in water or in an organic solvent such as ethanol, propylene glycol propyl ether (PGPE), or by converting TMAA or TMAH to TMAN by using nitric acid.
  • PGPE propylene glycol propyl ether
  • the formulation includes one or more surfactants.
  • Surfactants may be added to lower surface tension.
  • the term “surfactant” means any compound that reduces the surface tension when dissolved in H 2 O or other liquids, or which reduces interfacial tension between two liquids, or between a liquid and a solid.
  • Contemplated surfactants may include at least one anionic surfactant, cationic surfactant, non-ionic surfactant, Zwitterionic surfactant or a combination thereof.
  • the surfactant may be dissolved directly into the composition or may be added with one of the compositions components (the at least one silicon-based compound, the at least one catalyst, the at least one solvent) before forming the final composition.
  • Contemplated surfactants may include: polyether modified polydimethylsiloxanes such as BYK 307 (polyether modified poly-dimethyl-siloxane, BYK-Chemie), sulfonates such as dodecylbenzene sulfonate, tetrapropylenebenzene sulfonate, dodecylbenzene sulfonate, a fluorinated anionic surfactant such as Fluorad FC-93, and L-18691 (3M), fluorinated nonionic surfactants such as FC-4430 (3M), FC-4432 (3M), and L-18242 (3M), quaternary amines, such as dodecyltrimethyl-ammonium bromide or
  • cetyltrimethylammonium bromide alkyl phenoxy polyethylene oxide alcohols, alkyl phenoxy polyglycidols, acetylinic alcohols, polyglycol ethers such as Tergitol TMN-6 (Dow) and Tergitol minifoam 2 ⁇ (Dow), polyoxyethylene fatty ethers such as Brij-30 (Aldrich), Brij-35 (Aldrich), Brij-58 (Aldrich), Brij-72 (Aldrich), Brij-76 (Aldrich), Brij- 78 (Aldrich), Brij-98 (Aldrich), and Brij-700 (Aldrich), betaines, sulfobetaines, such as cocoamidopropyl betaine, and synthetic phospholipids, such as
  • dioctanoylphosphatidylcholine and lecithin and combinations thereof are dioctanoylphosphatidylcholine and lecithin and combinations thereof.
  • the formulation comprises as little as 0.001 wt.%, 0.005 wt.%, 0.01 wt.%, 0.05 wt.%, as great as 0.1 wt.%, 0.25 wt.%, 0.5 wt.%, 1 wt.% of the one or more surfactants, or within any range defined between any two of the foregoing values, such as 0.001 wt.% to 1 wt.% or 0.001 wt.% to 0.25 wt.%.
  • the determination of the appropriate amount of a composition-modifying constituent to add to the composition depends on a number of factors, including: a) minimizing defects in the film, and/or b) balancing the film between good adhesion and desirable film properties.
  • the formulation may include one or more additional additives, such as adhesion promoters, endcapping agents, and organic acids.
  • the formulation includes one or more adhesion promoters in order to influence the ability of the layer, coating or film to adhere to surrounding substrates, layers, coatings, films and/or surfaces.
  • the adhesion promoter may be at least one of: a) thermally stable after heat treatment, such as baking, at temperatures generally used for optoelectronic component manufacture, and/or b) promotes electrostatic and coulombic interactions between layers of materials, as well as promoting understood Van derWaals interactions in some embodiments.
  • adhesion promoters include aminopropyl triethoxysilane (APTEOS) and salts of APTEOS, vinyltriethoxy silane (VTEOS), glycidoxypropyltrimethoxy silane (GLYMO), and
  • methacryloxypropyltriethoxy silane MPTEOS
  • Other exemplary adhesion promoters include 3-(triethoxysilyl)propylsuccininc anhydride, dimethyldihydroxy silane, methylphenyl dihydroxysilane or combinations thereof.
  • the formulation comprises as little as 0.001 wt.%, 0.01 wt.%, 0.1 wt.%, 0.26 wt.% as great as 1 wt.%, 2.6 wt.%, 5 wt.%, 10 wt.%, 20 wt.% of the one or more adhesion promoters, or within any range defined between any two of the foregoing values, such as 0.001 wt.% to 20 wt.% or 0.26 wt.% to 2.6 wt.%.
  • the formulation includes one or more endcapping agents such as monofunctional silanes that include a single reactive functionality that is capable of reacting with silanol groups on polysiloxane molecules.
  • endcapping agents include trialkylsilanes such as trimethylethoxy silane, triethylmethoxy silane, trimethylacetoxy silane, trimethylsilane.
  • the formulation comprises as little as 0.1%, 0.5%, 1%, 2%, as great as 5%, 10%, 15%, 20%, or 25% of the one or more endcapping agents as a percentage of total moles of polysiloxane, or within any range defined between any two of the foregoing values, such as 2% to 20% or 5% to 10%.
  • the formulation includes one or more organic acids.
  • the organic acid additives are volatile or decompose at high temperatures and help stabilize the formulation.
  • Exemplary organic acids include p- toluenesulfonic acid, citric acid, formic acid, acetic acid, and trifluoroacetic acid.
  • the formulation comprises as little as 0.1 wt.%, 0.5 wt.%, 1 wt.%, 2 wt.%, as great as 5 wt.%, 10 wt.%, 15 wt.%, 20 wt.%, or 25 wt.% of the one or more organic acids, or within any range defined between any two of the foregoing values, such as 2 wt.% to 20 wt.% or 5 wt.% to 10 wt.%.
  • the polysiloxane formulation forms a polysiloxane coating on a surface located in or on an electronic, optoelectronic, or display device.
  • the polysiloxane formulation forms a light- transmissive coating.
  • the light-transmissive coating has a transmittance to light in the visible optical wavelength range from 400 to 1000 nm.
  • the optical transmittance is as high as 80%, 85%, 90%, 95%, 97%, 98%, 99%, or higher, or within any range defined between any two of the foregoing values.
  • one or polymer resins are selected to provide a desired refractive index.
  • the relative molar percentage of a resin having a relatively low refractive index such as 100%
  • methyltriethoxysilane resin is relatively high to produce a polysiloxane coating having a relatively low refractive index.
  • the relative molar percentage of a resin having a relatively high refractive index such as 100% phenyl triethoxysilane, is relatively high to produce a polysiloxane coating having a relatively high refractive index.
  • the relative molar proportions of a first resin having a relatively high refractive index and a second resin having a relatively low refractive index are selected to produce a polysiloxane coating having a desired refractive index between the refractive index of the first and second resins.
  • the polysiloxane formulation forms a coating having a refractive index that is as little as less than 1.4, 1.4, 1.45, as great as 1.5, 1.55, 1.56, 1.6, or within any range defined between any two of the foregoing values, such as from less than 1.4 to 1.6 or from 1.4 to 1.56.
  • Exemplary devicesto which coatings of the present disclosure may be provided include CMOS Image Sensors, transistors, light-emitting diodes, color filters, photovoltaic cells, flat-panel displays, curved displays, touch-screen displays, x-ray detectors, active or passive matrix OLED displays, active matrix thin film liquid crystal displays, electrophoretic displays, and combinations thereof.
  • the polysiloxane coating forms a passivation layer, a barrier layer, a planarization layer, or a combination thereof.
  • the polysiloxane coating has a thickness as little as 0.1 ⁇ m, 0.3 ⁇ m, 0.5 ⁇ m, 1 ⁇ m, 1.5 ⁇ m, as great as 2 ⁇ m, 2.5 ⁇ m, 3 ⁇ m, 3.5 ⁇ m, 4 ⁇ m, or greater, or within any range defined between any two of the foregoing values.
  • the polysiloxane coating is formed by applying the formulation to a substrate, followed by curing the formulation.
  • exemplary methods of applying the formulation includespin coating, spray coating, slot-die coating techniques.
  • Curing refers to a polymerization process in which the silicon-based materials, such as silicon-based oligomers, react in in the presence of a catalyst to hydrolyze and condense with other oligomers to form a higher molecular weight polymer or matrix.
  • a baking step is provided to remove at least part or all of the solvent.
  • the baking step is as short as 1 minute, 5 minutes, 10 minutes, 15 minutes, as long as 20 minutes, 30 minutes, 45 minutes, 60 minutes, or longer, at a temperature as low as 100oC, 200oC, 220oC, as high as 250oC, 275oC, 300oC, 320oC, 350oC, or higher.
  • a curing step is provided to polymerize the at least one silicon-based material such as by activating a heat- activated catalyst.
  • the curing step is as short as 10 minutes, 15 minutes, 20 minutes, as long as 30 minutes, 45 minutes, 60 minutes, or longer, at a temperature as low as 250oC, 275oC, 300oC, as high as 320oC, 350oC, 375oC, 380oC, 400oC or higher.
  • multiple layers of the formulation are subsequently applied and cured to form a multilayer coating.
  • the multilayer coating includes two, three, or more polysiloxane coating layers.
  • the polysiloxane coating is resistant to multiple heating steps, such as curing or deposition of additional coatings or layers on the formed polysiloxane coating.
  • the silicon-based compound may be formed from two or more polymerization steps.
  • a first silicon-based resin such as an oligomeric resin, is formed from a first polymerization step of one or more
  • organoalkoxysilanes include methyltrimethoxysilane (MTMOS), methyltriethoxysilane (MTEOS), dimethyldiethoxysilane (DMDEOS), phenyl triethoxysilane (PTEOS), dimethyldimethoxysilane, phenyltrimethoxysilane, and combinations of the foregoing.
  • MTMOS methyltrimethoxysilane
  • MTEOS methyltriethoxysilane
  • DMDEOS dimethyldiethoxysilane
  • PTEOS phenyl triethoxysilane
  • dimethyldimethoxysilane phenyltrimethoxysilane, and combinations of the foregoing.
  • Exemplary first polymerization steps include acidic catalyzed polymerization, such as polymerization catalyzed with a mineral or organic acid, or a base catalyzed polymerization, such as polymerization catalyzed with an ammonium compound, an amine, a phosphonium compound or a phosphine compound.
  • Example mineral acids include nitric acid, hydrochloric acid, sulfuric acid, and hydrofluoric acid.
  • Exemplary organic acids include sulfonic acid, trifluorosulfonic acids, and carboxylic acids, as well as thermal acid generators (TAG) capable of generating a sulfonic acid upon exposure to an elevated temperature.
  • TAG thermal acid generators
  • tetraorganoammonium compounds and tetraorganophosphonium compounds such as tetramethylammonium acetate (TMAA), tetramethylammonium hydroxide (TMAH), tetrabutylammonium hydroxide (TBAH), tetrabutylammonium acetate (TBAA), cetyltrimethylammonium acetate (CTAA), tetramethylammonium nitrate (TMAN), triphenylamine, trioctylamine, tridodecylamine, triethanolamine, tetramethylphosphonium acetate, tetramethylphosphonium hydroxide, triphenylphosphine, trimethylphosphine, trioctylphosphine, and combinations thereof.
  • the catalyst is a mineral acid, such as nitric acid.
  • the first silicon-based resin has a weight average molecular weight as little as 900 atomic mass unit (AMU), 950 AMU, 1000 AMU, 1100 AMU, 1150 AMU, as great as 2000 AMU,3000 AMU,4000 AMU, 5000 AMU, 10,000 AMU , or within any range defined between any two of the foregoing values, such as 900 AMU to 10,000 AMU, 1000 AMU to 10,000 AMU, or 900 AMU to 5000 AMU.
  • AMU atomic mass unit
  • a second silicon-based resin is formed from a second polymerization of the first polymer resin.
  • Exemplary second polymerization steps include acidic catalyzed polymerization and base catalyzed polymerization, as described with respect to the first polymerization step. , such as polymerization catalyzed with an ammonium compound, an amine, a phosphonium compound or a phosphine compound.
  • Exemplary mineral acids include nitric acid, hydrochloric acid, sulfuric acid, and hydrofluoric acid.
  • Exemplary organic acids include sulfonic acid, trifluorosulfonic acids, and carboxylic acids, as well as thermal acid generators (TAG) capable of generating a sulfonic acid upon exposure to an elevated temperature.
  • Exemplary basic catalysts include tetraorganoammonium compounds and tetraorganophosphonium compounds, such as tetramethylammonium acetate (TMAA), tetramethylammonium hydroxide (TMAH), tetrabutylammonium hydroxide (TBAH), tetrabutylammonium acetate (TBAA), cetyltrimethylammonium acetate (CTAA), tetramethylammonium nitrate (TMAN), triphenylamine, trioctylamine, tridodecylamine, triethanolamine, tetramethylphosphonium acetate, tetramethylphosphonium hydroxide, triphenylphosphine, trimethylphosphine, trio
  • the second silicon-based resin has a weight average molecular weight greater than the first silicon-based resin.
  • the second silicon-based resin has a weight average molecular weight as little as 1000 AMU, 1100 AMU, 1150 AMU, as great as 2000 AMU,3000 AMU,4000 AMU, 5000 AMU,10,000 AMU , or within any range defined between any two of the foregoing values, such as 1000 AMU to 5000 AMU, 2000 AMU to 5000 AMU, or 2000 AMU to 4000 AMU.
  • the second polymerization is performed in a solvent, such ethyl lactate, propylene glycol propylether (PGPE), propylene glycol monomethyl ether acetate (PGMEA) or a combination thereof.
  • a solvent such ethyl lactate, propylene glycol propylether (PGPE), propylene glycol monomethyl ether acetate (PGMEA) or a combination thereof.
  • the first silicon-based resin is added at a concentration as little as 10 wt.%, 20 wt.%, 30 wt.% 40 wt.%, as great as 45 wt.%, 50 wt.%, 60wt. % or within any range defined between any two of the foregoing values, such as 10 wt.% to 60 wt.% or 30 wt.% to 45 wt.%.
  • the basic catalyst is added at a concentration as little as 100 ppm, 200 ppm, 250 ppm, as great as 300 ppm, 400 ppm, 500 ppm, or greater, or within any range defined between any two of the foregoing values, such as 100 ppm to 500 ppm or 200 ppm to 300 ppm.
  • the second polymerization is performed at a temperature as little as 60oC, 65oC, 70oC, 75oC, as high as 80oC, 90oC, 100oC, or within any range defined between any two of the forgoing values, such as 60oC to 100oC or 70oC to 100oC.
  • the second polymerization mixture is held at the temperature for as little as 1 hour, 2 hours, 3 hours, as great as 5 hours, 8 hours, 10 hours, or within any range defined between any two of the foregoing values, such as 1 hour to 10 hours, 2 hours to 10 hours, 2 hours to 8 hours, or 2 to 3 hours.
  • a polysiloxane formulation as described above includes the second silicon-based resin, and one or more solvents.
  • the formulation further includes one or more additional silicon-based material as described above.
  • the formulation further includes one or more catalysts.
  • the formulation further includes one or more surfactants.
  • the formulation further includes one or more additional additives, such as adhesion promoters, plasticizers, organic acids, and monofunctional silanes.
  • a coating formed from the polysiloxane formulation including the second silicon-based resin is formed by applying the
  • the coating is formed by curing the polysiloxane formulation at a temperature of as little as 350oC, 360oC, 370o, as high as 375oC, 380oC, 385oC, 390oC or higher.
  • the polysiloxane coating is formed by applying the formulation to a substrate, such as a glass or Si 3 N 4 coated or capped substrate and curing the formulation.
  • the coating is formed by curing the polysiloxane formulation at a temperature of as little as 350oC, 360oC, 370o, as high as 375oC, 380oC, 385oC, 390oC or higher.
  • the polysiloxane coating has a thickness as little as 0.1 ⁇ m, 0.2 ⁇ m, 0.5 ⁇ m, 0.8 ⁇ m, 1 ⁇ m, 1.2 ⁇ m 1.5 ⁇ m, 2 ⁇ m, as great as, 3 ⁇ m, 4 ⁇ m, 5 ⁇ m, 10 ⁇ m or greater, or within any range defined between any two of the foregoing values, such as0.1 ⁇ m to 10 ⁇ m, 1 ⁇ m to 5 ⁇ m, 1.2 ⁇ m to 5 ⁇ m, or 4 ⁇ m or greater.
  • the polysiloxane coating has a dielectric constant as little as about 2.8, 2.9, 3.0, as great as about 3.1, 3.2, or within any range defined between any two of the foregoing values, such as 2.8 to 3.2 or 3.0 to 3.2.
  • Example 1 Formulationshavingdiffering contents of alkyl carbon
  • Polymer A phenyl TEOS was reacted in an isopropyl alcohol solvent in the presence of an acid catalyst and water for 24 h at 100oC. After the reaction, the solvent was distilled out to obtain solid polymer. The polymer then dissolved and reprecipitated from an appropriate solvent system and vacuum dried at 50oC overnight and ground to powder.
  • Polymer B predetermined amounts of phenyl TEOS and methyl TEOS were reacted in an isopropyl alcohol solvent in the presence of an acid catalyst and water and 0.5% DMDEOS for 24 hours at 100oC. After the reaction the solvent was distilled out to obtain solid polymer. The polymer was then dissolved and reprecipitated from an appropriate solvent system and vacuum dried at 50oC overnight and ground to powder.
  • Formulation 1 90% of polymer B and 10% of polymer A by weight in PGMEA in the presence of 1-5% by weight surfactant and catalysts 1-5% by weight of final solution weight. The formulation obtained is diluted with PGMEA to obtain a desired thickness to be deposited by slit, roller, spray or spin coating process.
  • Formulation 2 The formulation was prepared as in Formulation 1, except that 95% polymer B and 5% polymer A were used.
  • Formulation 3 The formulation was prepared as in Formulation 1, except that 85% polymer B and 15% polymer A were used.
  • Formulation 4 The formulation was prepared as in Formulation 1, except that 50% polymer B and 50% polymer A were used. This formulation was found to have adhesion problems and was not resistant to chemicals.
  • Comparative Formulation C A polysiloxane resin comprising equimolar proportions of MTEOS and PTEOS and about 0.3 mole% of DMDEOS, GR-150F available from Techneglas Technical Products, Perrysburg, Ohio, was dissolved in PGMEA solvent at desired % resin solids loading. Coating formulations were formed by adding PGMEA solvent, a small amount of dilute aqueous TMAN solution and BYK surfactant. Each coating was spun on a substrate at 1000-2500 rpm to deposit films of desired thicknesses and cured under similar conditions. Coatings were inspected for any micro cracks under optical microscope immediately after completely curing and after several days for any latent cracking.
  • Exemplary Formulations 5-7 A polysiloxane resin GR-950F, derived from PTEOS, was combined with a polysiloxane resin GR-150F, comprising equimolar proportions of MTEOS and PTEOS and about 0.3 mole% of DMDEOS. Both resins, available from Techneglas Technical Products, Perrysburg, Ohio, were dissolved in PGMEA solvent at desired weight ratios and desired % solids loading. For formulation 5, the ratio of GR-950:GR-150F was 1:9, for formulation 6, the ratio was 1:4, and for formulation 7, the ratio was 1:1.
  • Coating formulations were formed by adding PGMEA solvent, a small amount of dilute aqueous TMAN solution and BYK surfactant. Each coating was spun on a substrate at 1000-2500 rpm to deposit films of desired thicknesses and cured under similar conditions. Coatings were inspected for any micro cracks under optical microscope immediately after completely curing and after several days for any latent cracking.
  • Exemplary Formulations 8-10 Polysiloxane resins comprising equimolar proportions of MTEOS and PTEOS and about 5 mol.% (Formulation 8), 10 mol.% (Formulation 9), or 15 mol.% (Formulation 10) of DMDEOS, obtained from Techneglas Technical Products, Perrysburg, Ohio, were dissolved in PGMEA solvent at desired % resin solids loading. Coating formulations of each resin were formed by adding PGMEA solvent, a small amount of dilute aqueous TMAN solution and BYK surfactant. Each coating was spun on a substrate at 1000-2500 rpm to deposit films of desired thicknesses and cured under similar conditions. Coatings were inspected for any micro cracks under optical microscope immediately after completely curing and after several days for any latent cracking.
  • Exemplary Formulations 11 and 12 Polysiloxane resins GR-150F was combined with the second polysiloxane resin GR-950F and a third polysiloxane resin comprising equimolar proportions of MTEOS and PTEOS and about 10 mol.% of DMDEOS, in 95/2.5/2.5 (Form.11) and 90/5/5 (Form.12) ratios and dissolved in PGMEA solvent at desired % resin solids loading. Coating formulations of each resin combination were formed by adding PGMEA solvent, a small amount of dilute aqueous TMAN solution and BYK surfactant.
  • Formulation 12 remained crack-free at up to 2.8 ⁇ m after curing at 400C for 30min.
  • compositions having greater than 20% alkyl carbon were produced. Also as shown in Table 1, compositions having varying levels ofdifunctional siloxane content were produced.
  • Example 2 Effect of blends of polysiloxane resins on crack-free film thickness
  • Samples of Comparative Formulation C (“Comp. Form. C”) and Formulation 5 (“Form.5) as produced in Example 1 were deposited on a silicon substrate at various thicknesses as shown in Table 2 below. Duplicate samples were then cured at 380oC for 30 minutes in a nitrogen atmosphere, followed by a second cure at 380oC for 10 minutes in air. Following each cure, the film was inspected to determine whether the film had cracked. The results are provided in Table 2 below.
  • the comparative formulation C sample had a crack threshold on silicon about 2.3 ⁇ m.
  • the formulation 5 sample had a crack threshold of about 3.1 ⁇ m.
  • Samples of the comparative formulation C and formulation 5as produced in Example 1 were next deposited on a copper/silicon nitride substrate at various thicknesses as shown in Table 3 below. Duplicate samples were then cured at 380oC for 30 minutes in a nitrogen atmosphere followed by a second cure at 380oC for 10 minutes in air.
  • the comparative formulation C sample had a crack threshold on Cu/SiN about 2.3 ⁇ m.
  • the formulation 5sample had a crack threshold less than 3.1 ⁇ m.
  • formulation 5 did not crack over 21 days after cure at a thickness as high as 3.4 ⁇ m on either silicon or glass.
  • Example 2 As shown in Example 2, the formulations 5, 6, and 7 were able to form films of substantially greater thickness than the comparative formulation C without cracking on various substrates and cured under different conditions.
  • Theformulation 5 films were stable at thickness up to 3 ⁇ m or greater at cure temperatures of 380oC, and up to 3.6 ⁇ m or greater at lower cure temperatures.
  • formulations 8, 9, and 10 were able to form films of substantially greater thickness than the comparative formulation C without cracking when cured under different conditions.
  • a 6000 ⁇ sample of the comparative formulation C and formulation 5 as produced in Example 1 were each deposited on aglass substrate and cured for 1 hour at 350oC. The results are provided in Figure 1 and Table 10 below.
  • both the comparative formulation C and formulation 5 had a higher transmittance than uncoated glass.
  • the substantially thicker 3.1- 3.4 ⁇ m samples of formulation 5 had similar transmittance to the relatively thin 1.1 ⁇ m samples of the comparative formulation C.
  • the control comparative formulation C and formulation 5 films had similar transmittance results.
  • a sample of the comparative formulation C and formulation 5 were deposited on asubstrate, based at 230oC for 30 minutes in air, followed by cure for 390oC for 30 minutes in nitrogen.
  • the reflectance from 400 nm to 1050 nm was determined.
  • the results are provided for the comparative formulation C in Figure 2Aand formulation 5 in Figure 2B. As can be seen in the figures, the coatings had almost identical reflectance profiles.
  • Example 4 As shown in Example 4, the comparative formulation C and formulation 5 films had similar optical properties,which suggests that modifications by using resin blends and/or using higher content of dialkylsiloxane will not impact optical design considerations.
  • each of the three formulations had similar viscosities, which suggests that modifications by using resin blends and/or using higher content of dialkylsiloxane will not impact processability of coating formulations by spin coating, spray coating, slot-die coating techniques.
  • a sample of the comparative formulation C and formulation 5 formulationsas produced in Example 1 were deposited on a substrate at 1.9 ⁇ m and cured at 390oC for 30 minutes in nitrogen. The coatings were subjected to a heating and cooling cycle between room temperature and 400oC.
  • the residual stress as a function of temperature for the comparative formulation C coating is provided in Figure 3A and for the formulation 5 in Figure 3B.
  • a linear regression of the cooling line for each coating is also provided. As shown in Figure 3, the slope of the cooling line for the formulation 5coating (-0.0947 Mpa/oC) is less than that for the comparative formulation C coating (-0.0989 Mpa/oC).
  • CTE coefficient of thermal expansion
  • a sample of the comparative formulation C and formulation 5 formulationsas produced in Example 1 were deposited on a substrate, baked for 30 minutes in air at 230oC, followed by curing for 1 hour in air at 380oC. The thickness of each coating was measured after the baking step and the curing step, and a percent shrinkage during the cure was determined. The results are provided in Table 13 below.
  • Example 6-8 As shown in Example 6-8, the comparative formulation C and formulation 5 formulations had similar properties, which suggests that modifications by using resin blends and/or using higher content of dialkylsiloxane will not impact outgassing performance during downstream thermal exposure.
  • a sample of the comparative formulation C and formulation 5 formulationsas produced in Example 1 were deposited on a substrate at 1.9 ⁇ m and cured at 390oC for 30 minutes in nitrogen. Coating thickness was measured by ellipsometery using an N&K tool or a Nanometrics tool.
  • Formulation 5 was deposited on a silicon substrate and cured for 1 hour at 350oC in either nitrogen or air.
  • a tape test was performed according to ASTM D3359- 09E2, Standard Test methods for Measuring Adhesion by Tape Test to evaluate the adhesion of the coating to the base.
  • the substrate was then heated to 85oC and cooled in 15 minutes to -20oC three times. After each cycle, the coating was checked for cracks. After the final cycle, the tape test was again performed. The results are provided in Table 14 below.
  • the formulation 5 coating had no cracking due to thermal cycling, and showed excellent adhesion both before and after the thermal cycling, which suggests that modifications by using resin blends and/or using higher content of dialkylsiloxane will not impact adhesion.
  • a sample of the comparative formulation C, formulation 5, and formulation 8 formulationsas produced in Example 1 were deposited on a substrate and cured at 230oC. Each sample was exposed to either TOK-106 for 10 minutes at 70oC or 2.38% TMAH for 10 minutes at room temperature. The results are provided in Table 15 below. Negative etch rates are the result of film swelling.
  • a sample of the formulation 5 formulation as produced in Example 1 was deposited on silicon and cured as indicated for 1 hour. The initial thickness was measured, followed by exposing the coating to NMP solution at 70oC for 10 minutes. The coating was again measured, and an etch rate ( ⁇ /min) was determined. The coating was next exposed to Piranha solution, a 3:1 mixture of concentrated sulfuric acid and hydrogen peroxide, at 70oC for 10 minutes. The coating was again measured, and an etch rate ( ⁇ /min) was determined. The coating was then exposed to 2.38% TMAH solution at room temperature for 10 minutes. The coating was again measured, and an etch rate ( ⁇ /min) was determined. The results of the wet etch testing are provided in Table 16 below. Negative etch values are due to film swelling.
  • a sample of the formulation 5 formulationas produced in Example 1 was deposited was deposited a substrate and cured in air.
  • the coating was visually inspected with an optical microscope, an initial thickness was measured, along with an initial % transmittance, and the tape test to measure adhesion.
  • the coating was then exposed to TOK-106 photoresist stripper at 70oC for 10 minutes.
  • the TOK-106 solution is an amine- based photoresist stripper comprising monoethanolamine and DMSO solvent available from Tokyo Ohka Kogyo America, Inc., Hillsboro, Oregon.
  • the coating was again visually inspected under an optical microscope, the thickness was again measured, and an etch rate ( ⁇ /min) was determined.
  • An after transmittance, tape adhesion, and OM inspection were performed. The results are provided in Table 17 below.
  • Example 10 As shown in Example 10, the comparative formulation C, formulation 5, and formulation 8 formulations have similar chemical resilience.
  • Formulation 13 a polysiloxane resin GR-650F, derived from MTEOS, available from Techneglas Technical Products, Perrysburg, Ohio, was dissolved in PGMEA solvent at desired % solids loading and divided into two samples. To the first sample, a small amount of dilute aqueous TMAN solution was added. To the second sample, an equal amount of TMAN dissolved in PGPE solvent was added. Coating formulations were formed from each sample by adding PGMEA solvent and BYK surfactant. Each coating was spun on a substrate at 1000-1500 rpm to deposit films of desired thicknesses and cured under similar conditions. The refractive index (1.4) and adhesion performance by tape test (100% pass) were identical for the two coatings, which suggests that coating formulations can be formulated without using any external water without impacting optical or physical properties of coatings.
  • Formulation 14 a polysiloxane resin GR-650F, derived from MTEOS, available from Techneglas Technical Products, Perrysburg, Ohio, was dissolved in PGMEA solvent at desired % solids loading. A small amount of dilute aqueous TMAN solution, PGMEA solvent, BYK surfactant, and VTEOS were added. Coating was spun on a substrate at 1000-1500 rpm to deposit films of desired thicknesses and cured under similar conditions.
  • Example 14 Increase of molecular weight of existing polysiloxane resins
  • Formulation 15 - a 45 wt.% solution of a phenyl TEOS based polymer with a molecular weight of 1100 AMU in PGMEA was reacted in the presence of 250 ppm of the basic catalyst TBAH for 2 hours at 100oC. Following the reaction, the resulting resin had a molecular weight of 5000 AMU. Formulation 15 was spun on a silicon substrate and cured for 1 hour at 380oC. The resulting coating had a crack threshold greater than 4 ⁇ m.
  • Formulation 16 a mixture of Formulation 15 and a second polymer having a molecular weight of 4200 AMU and formed of about 50% phenyl TEOS and about 50% methyl TEOS was applied by slot die coating and cured on patterned thin film transistor (FTF) and interconnect dielectric substrate.
  • FFF thin film transistor
  • the resulting coating was tested for planarization and chemical resistance.
  • the coating was perfectly planarized, and had complete resistance to NMP (70oC for 10 minutes), 2.38 wt.% TMAH (room temperature for 10 minutes), TOK-106 (70oC for 10 minutes), DHF (room temperature for 5 minutes), and Piranha (70oC for 10 minutes) solvents.
  • Thermal gravimetric analysis at 350oC for 4 hours (isothermal) determined that the coating had outgassing at or below 0.09 wt.%.
  • Formulation 17 a 45 wt.% solution of a phenyl TEOS based polymer with a molecular weight of 1100 AMU in PGMEA was reacted in the presence of 250 ppm of the basic catalyst TBAH for 2-3 hours at 70oC. Following the reaction, the resulting resin had a molecular weight of 2500 AMU. Formulation 15 was spun on a silicon substrate and cured for 1 hour at 380oC. The resulting coating had a crack threshold greater than 4 ⁇ m.
  • Formulation 18 - a mixture of Formulation 17 and a second polymer having a molecular weight of 4200 AMU and formed of about 50% phenyl TEOS and about 50% methyl TEOS was applied by slot die coating and cured on patterned thin film transistor (FTF) and interconnect dielectric substrate. The resulting coating was tested for planarization and chemical resistance. The coating was perfectly planarized, and had complete resistance to NMP (70oC for 10 minutes), 2.38 wt.% TMAH (room temperature for 10 minutes), TOK-106 (70oC for 10 minutes), DHF (room temperature for 5 minutes), and Piranha (70oC for 10 minutes) solvents.
  • NMP 70oC for 10 minutes
  • 2.38 wt.% TMAH room temperature for 10 minutes
  • TOK-106 70oC for 10 minutes
  • DHF room temperature for 5 minutes
  • Piranha 70oC for 10 minutes
  • Formulation 20– a 30 wt.% solution of a phenyl TEOS based polymer with a molecular weight of 1100 AMU in PGMEA was reacted in the presence of 300 ppm of the basic catalyst TBAH for 8 hours at 100oC. Following the reaction, the resulting resin had a molecular weight of 8000 AMU.
  • Formulation 21– a 30 wt.% solution of a phenyl TEOS based polymer with a molecular weight of 1100 AMU in PGMEA was reacted in the presence of 400 ppm of the basic catalyst TBAH for 8 hours at 100oC. Following the reaction, the resulting resin gelled and precipitated out of solution.
  • Formulation 22– a 30 wt.% solution of a phenyl TEOS based polymer with a molecular weight of 1100 AMU and a second polymer having a molecular weight of 4200 AMU and formed of about 50% phenyl TEOS and about 50% methyl TEOS in PGMEA was reacted in the presence of 200 ppm of the basic catalyst TBAH for 8 hours at 100oC. Following the reaction, the resulting resin gelled and precipitated out of solution at room temperature.

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