KR101013473B1 - 반도체 표시장치 및 그의 제작방법 - Google Patents
반도체 표시장치 및 그의 제작방법 Download PDFInfo
- Publication number
- KR101013473B1 KR101013473B1 KR1020030021881A KR20030021881A KR101013473B1 KR 101013473 B1 KR101013473 B1 KR 101013473B1 KR 1020030021881 A KR1020030021881 A KR 1020030021881A KR 20030021881 A KR20030021881 A KR 20030021881A KR 101013473 B1 KR101013473 B1 KR 101013473B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- insulating film
- opening
- organic resin
- inorganic insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
- H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133357—Planarisation layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2002-00107216 | 2002-04-09 | ||
| JP2002107216A JP3989761B2 (ja) | 2002-04-09 | 2002-04-09 | 半導体表示装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100037619A Division KR101013487B1 (ko) | 2002-04-09 | 2010-04-22 | 표시장치 |
| KR1020100104026A Division KR101035346B1 (ko) | 2002-04-09 | 2010-10-25 | 승압 회로 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030082385A KR20030082385A (ko) | 2003-10-22 |
| KR101013473B1 true KR101013473B1 (ko) | 2011-02-14 |
Family
ID=28672472
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030021881A Expired - Fee Related KR101013473B1 (ko) | 2002-04-09 | 2003-04-08 | 반도체 표시장치 및 그의 제작방법 |
| KR1020100037619A Expired - Fee Related KR101013487B1 (ko) | 2002-04-09 | 2010-04-22 | 표시장치 |
| KR1020100104026A Expired - Fee Related KR101035346B1 (ko) | 2002-04-09 | 2010-10-25 | 승압 회로 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100037619A Expired - Fee Related KR101013487B1 (ko) | 2002-04-09 | 2010-04-22 | 표시장치 |
| KR1020100104026A Expired - Fee Related KR101035346B1 (ko) | 2002-04-09 | 2010-10-25 | 승압 회로 |
Country Status (5)
| Country | Link |
|---|---|
| US (8) | US7671369B2 (https=) |
| JP (1) | JP3989761B2 (https=) |
| KR (3) | KR101013473B1 (https=) |
| CN (1) | CN100350632C (https=) |
| TW (1) | TWI264822B (https=) |
Families Citing this family (82)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5719065A (en) | 1993-10-01 | 1998-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device with removable spacers |
| US7038239B2 (en) | 2002-04-09 | 2006-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| JP3989761B2 (ja) * | 2002-04-09 | 2007-10-10 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
| JP4463493B2 (ja) | 2002-04-15 | 2010-05-19 | 株式会社半導体エネルギー研究所 | 表示装置及びその作製方法 |
| JP3989763B2 (ja) * | 2002-04-15 | 2007-10-10 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
| US7242021B2 (en) * | 2002-04-23 | 2007-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display element using semiconductor device |
| TWI272556B (en) | 2002-05-13 | 2007-02-01 | Semiconductor Energy Lab | Display device |
| TWI263339B (en) | 2002-05-15 | 2006-10-01 | Semiconductor Energy Lab | Light emitting device and method for manufacturing the same |
| US7256421B2 (en) | 2002-05-17 | 2007-08-14 | Semiconductor Energy Laboratory, Co., Ltd. | Display device having a structure for preventing the deterioration of a light emitting device |
| US6680130B2 (en) * | 2002-05-28 | 2004-01-20 | Agere Systems, Inc. | High K dielectric material and method of making a high K dielectric material |
| EP1388903B1 (en) * | 2002-08-09 | 2016-03-16 | Semiconductor Energy Laboratory Co., Ltd. | Organic electroluminescent device |
| US7452257B2 (en) * | 2002-12-27 | 2008-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a display device |
| JP4144436B2 (ja) | 2003-06-02 | 2008-09-03 | セイコーエプソン株式会社 | 電気光学モジュール及び電子機器 |
| JP4278499B2 (ja) * | 2003-12-01 | 2009-06-17 | 三菱電機株式会社 | 表示装置 |
| US8217396B2 (en) | 2004-07-30 | 2012-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising electrode layer contacting wiring in the connection region and extending to pixel region |
| US7859606B2 (en) | 2004-09-15 | 2010-12-28 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
| US8350466B2 (en) * | 2004-09-17 | 2013-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| CN1819300B (zh) | 2004-09-17 | 2010-06-16 | 株式会社半导体能源研究所 | 发光器件 |
| US7753751B2 (en) | 2004-09-29 | 2010-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating the display device |
| JP2006138960A (ja) * | 2004-11-10 | 2006-06-01 | Nec Corp | 液晶表示装置及びその製造方法並びに投射表示装置 |
| CN100444429C (zh) * | 2004-12-14 | 2008-12-17 | 中华映管股份有限公司 | 主动式有机电激发光组件数组及其制造方法 |
| US8305507B2 (en) | 2005-02-25 | 2012-11-06 | Samsung Display Co., Ltd. | Thin film transistor array panel having improved storage capacitance and manufacturing method thereof |
| KR101119186B1 (ko) * | 2005-04-06 | 2012-03-20 | 삼성전자주식회사 | 표시패널, 이를 갖는 표시장치 및 이의 제조 방법 |
| TWI517378B (zh) | 2005-10-17 | 2016-01-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| JP4946003B2 (ja) * | 2005-10-26 | 2012-06-06 | セイコーエプソン株式会社 | 電気光学装置、および電気光学装置の製造方法 |
| CN102331638B (zh) * | 2005-12-05 | 2015-11-25 | 株式会社半导体能源研究所 | 液晶显示器 |
| JP5512931B2 (ja) * | 2007-03-26 | 2014-06-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5512930B2 (ja) * | 2007-03-26 | 2014-06-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN101681578B (zh) * | 2007-06-08 | 2012-04-11 | 株式会社半导体能源研究所 | 显示装置 |
| KR101411677B1 (ko) * | 2007-11-27 | 2014-06-25 | 엘지디스플레이 주식회사 | 유기전계발광소자 |
| JP5292066B2 (ja) | 2007-12-05 | 2013-09-18 | 株式会社半導体エネルギー研究所 | 表示装置 |
| WO2010038514A1 (ja) | 2008-10-02 | 2010-04-08 | シャープ株式会社 | 表示装置用基板、表示装置用基板の製造方法、表示装置、液晶表示装置、液晶表示装置の製造方法及び有機エレクトロルミネセンス表示装置 |
| JP5468018B2 (ja) * | 2008-12-26 | 2014-04-09 | パナソニック株式会社 | 有機el素子、有機el表示装置および有機el素子の製造方法 |
| KR101147428B1 (ko) * | 2009-02-09 | 2012-05-23 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
| KR101182445B1 (ko) * | 2010-04-01 | 2012-09-12 | 삼성디스플레이 주식회사 | 평판 표시 장치 및 그 제조방법 |
| KR101233348B1 (ko) * | 2010-06-09 | 2013-02-14 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| CN101969045A (zh) * | 2010-09-07 | 2011-02-09 | 华映光电股份有限公司 | 数组基板及其制作方法 |
| TWI843078B (zh) | 2011-05-05 | 2024-05-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| US20120298998A1 (en) * | 2011-05-25 | 2012-11-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming oxide semiconductor film, semiconductor device, and method for manufacturing semiconductor device |
| JP5613635B2 (ja) * | 2011-07-21 | 2014-10-29 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102644240B1 (ko) | 2012-07-20 | 2024-03-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| KR20250154556A (ko) | 2012-07-20 | 2025-10-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 및 표시 장치를 포함하는 전자 장치 |
| KR20150040873A (ko) | 2012-08-03 | 2015-04-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| DE102013216824B4 (de) | 2012-08-28 | 2024-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| TWI611511B (zh) | 2012-08-31 | 2018-01-11 | Semiconductor Energy Laboratory Co., Ltd. | 半導體裝置 |
| KR102679509B1 (ko) | 2012-09-13 | 2024-07-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102459007B1 (ko) | 2012-12-25 | 2022-10-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| TWI607510B (zh) * | 2012-12-28 | 2017-12-01 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| JP6138501B2 (ja) * | 2013-01-31 | 2017-05-31 | 株式会社ジャパンディスプレイ | 液晶表示装置の製造方法および液晶表示装置 |
| JP6198434B2 (ja) | 2013-04-11 | 2017-09-20 | 株式会社半導体エネルギー研究所 | 表示装置及び電子機器 |
| CN104282844B (zh) * | 2013-07-08 | 2017-02-08 | 上海和辉光电有限公司 | 有机发光结构及其制造方法及有机发光组件 |
| US9818763B2 (en) | 2013-07-12 | 2017-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing display device |
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2003
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- 2003-04-07 TW TW092107910A patent/TWI264822B/zh not_active IP Right Cessation
- 2003-04-08 KR KR1020030021881A patent/KR101013473B1/ko not_active Expired - Fee Related
- 2003-04-09 CN CNB031103537A patent/CN100350632C/zh not_active Expired - Lifetime
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2010
- 2010-02-24 US US12/711,611 patent/US8008666B2/en not_active Expired - Fee Related
- 2010-04-22 KR KR1020100037619A patent/KR101013487B1/ko not_active Expired - Fee Related
- 2010-10-25 KR KR1020100104026A patent/KR101035346B1/ko not_active Expired - Fee Related
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2011
- 2011-08-25 US US13/217,322 patent/US8415669B2/en not_active Expired - Fee Related
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2013
- 2013-04-05 US US13/857,659 patent/US8835271B2/en not_active Expired - Lifetime
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- 2014-09-09 US US14/481,458 patent/US9666614B2/en not_active Expired - Fee Related
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- 2017-05-18 US US15/598,651 patent/US10083995B2/en not_active Expired - Lifetime
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- 2018-08-21 US US16/107,536 patent/US11101299B2/en not_active Expired - Fee Related
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2021
- 2021-08-13 US US17/401,360 patent/US20220077199A1/en not_active Abandoned
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| JP2001223267A (ja) | 2000-02-07 | 2001-08-17 | Canon Sales Co Inc | 半導体装置の製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20110049522A1 (en) | 2011-03-03 |
| US8835271B2 (en) | 2014-09-16 |
| US20170256570A1 (en) | 2017-09-07 |
| KR101035346B1 (ko) | 2011-05-20 |
| JP3989761B2 (ja) | 2007-10-10 |
| US7671369B2 (en) | 2010-03-02 |
| JP2003302917A (ja) | 2003-10-24 |
| US20220077199A1 (en) | 2022-03-10 |
| US8008666B2 (en) | 2011-08-30 |
| US10083995B2 (en) | 2018-09-25 |
| US8415669B2 (en) | 2013-04-09 |
| US20150001545A1 (en) | 2015-01-01 |
| US11101299B2 (en) | 2021-08-24 |
| TWI264822B (en) | 2006-10-21 |
| KR20100061420A (ko) | 2010-06-07 |
| CN1450665A (zh) | 2003-10-22 |
| TW200306451A (en) | 2003-11-16 |
| KR101013487B1 (ko) | 2011-02-10 |
| US20190067336A1 (en) | 2019-02-28 |
| US9666614B2 (en) | 2017-05-30 |
| CN100350632C (zh) | 2007-11-21 |
| US20030189210A1 (en) | 2003-10-09 |
| KR20030082385A (ko) | 2003-10-22 |
| US20110309364A1 (en) | 2011-12-22 |
| KR20100121455A (ko) | 2010-11-17 |
| US20130221361A1 (en) | 2013-08-29 |
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