JPS5681973A - Manufacture of mos type semiconductor device - Google Patents

Manufacture of mos type semiconductor device

Info

Publication number
JPS5681973A
JPS5681973A JP15834179A JP15834179A JPS5681973A JP S5681973 A JPS5681973 A JP S5681973A JP 15834179 A JP15834179 A JP 15834179A JP 15834179 A JP15834179 A JP 15834179A JP S5681973 A JPS5681973 A JP S5681973A
Authority
JP
Japan
Prior art keywords
layer
mos transistor
subsequently
insular
sio2 film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15834179A
Other languages
Japanese (ja)
Inventor
Kenji Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15834179A priority Critical patent/JPS5681973A/en
Publication of JPS5681973A publication Critical patent/JPS5681973A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

PURPOSE:To compensate the deterioration in the characteristics of an MOS transistor due to the crystal defect by irradiating beforehand energy beam in parallel with the longitudinal channel direction of the transistor in the semiconductor layer when providing the MOS transistor in the semiconductor layer formed on an insulating substrate. CONSTITUTION:An n<-> type monocrystalline Si layer 2 is epitaxially grown on a sapphire substrate 1, is etched to form the layer in an insular state. Subsequently, phosphorus ions are implanted to the insular layer 2 to the extent of dosage of 5X 10<11>cm<-2>, and subsequently Nd: YAG laser beam is scanned and irradiated thereto along the channel longitudinal direction of the MOS transistor formed later with energy density of 500mJ/cm. Thereafter, a gate electrode 4 is formed through a gate SiO2 film 3 at the center on the surface of the layer 2, and with the electrode as a mask, n<+> type source and drain regions 5 and 6 are diffused in self-matching manner. Then, an SiO2 film 7 is accumulated in an ordinalry manner, a window is opened thereat, and aluminum electrodes 8, 9 are mounted thereon.
JP15834179A 1979-12-06 1979-12-06 Manufacture of mos type semiconductor device Pending JPS5681973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15834179A JPS5681973A (en) 1979-12-06 1979-12-06 Manufacture of mos type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15834179A JPS5681973A (en) 1979-12-06 1979-12-06 Manufacture of mos type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5681973A true JPS5681973A (en) 1981-07-04

Family

ID=15669515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15834179A Pending JPS5681973A (en) 1979-12-06 1979-12-06 Manufacture of mos type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5681973A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595624A (en) * 1982-07-01 1984-01-12 Fujitsu Ltd Manufacture of semiconductor device
US6544825B1 (en) 1992-12-26 2003-04-08 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating a MIS transistor
US6835607B2 (en) 1993-10-01 2004-12-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method for manufacturing the same
US8835271B2 (en) 2002-04-09 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US9105727B2 (en) 2002-04-09 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10133139B2 (en) 2002-05-17 2018-11-20 Semiconductor Energy Laboratory Co., Ltd. Display device

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595624A (en) * 1982-07-01 1984-01-12 Fujitsu Ltd Manufacture of semiconductor device
US6544825B1 (en) 1992-12-26 2003-04-08 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating a MIS transistor
US7351615B2 (en) 1992-12-26 2008-04-01 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating a MIS transistor
US6835607B2 (en) 1993-10-01 2004-12-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method for manufacturing the same
US7170138B2 (en) 1993-10-01 2007-01-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7301209B2 (en) 1993-10-01 2007-11-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9406806B2 (en) 2002-04-09 2016-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US9105727B2 (en) 2002-04-09 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US8835271B2 (en) 2002-04-09 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US9666614B2 (en) 2002-04-09 2017-05-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US10050065B2 (en) 2002-04-09 2018-08-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10083995B2 (en) 2002-04-09 2018-09-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US10700106B2 (en) 2002-04-09 2020-06-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10854642B2 (en) 2002-04-09 2020-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US11101299B2 (en) 2002-04-09 2021-08-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US10133139B2 (en) 2002-05-17 2018-11-20 Semiconductor Energy Laboratory Co., Ltd. Display device
US10527903B2 (en) 2002-05-17 2020-01-07 Semiconductor Energy Laboratory Co., Ltd. Display device
US11422423B2 (en) 2002-05-17 2022-08-23 Semiconductor Energy Laboratory Co., Ltd. Display device

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