JPS6454762A - Insulated gate field effect transistor - Google Patents

Insulated gate field effect transistor

Info

Publication number
JPS6454762A
JPS6454762A JP21029387A JP21029387A JPS6454762A JP S6454762 A JPS6454762 A JP S6454762A JP 21029387 A JP21029387 A JP 21029387A JP 21029387 A JP21029387 A JP 21029387A JP S6454762 A JPS6454762 A JP S6454762A
Authority
JP
Japan
Prior art keywords
fet
channel
thickness
region
regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21029387A
Other languages
Japanese (ja)
Inventor
Akira Chokai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21029387A priority Critical patent/JPS6454762A/en
Publication of JPS6454762A publication Critical patent/JPS6454762A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent a transistor from deteriorating due to hot carrier in semiconductor by making the thickness of an insulating film connected to source, drain thinner than that of a gate insulating film. CONSTITUTION:An insulating silicon oxide film 2 of a FET provided on a silicon semiconductor substrate 1 is in contact with a source region 5, a drain region 6, and the thickness of a region covering them without 0.2mum is made thinner than that of the film 2 along a central channel of the gate electrode of the FET. A gate voltage of the part is effectively enhanced due to the reduced thickness, the high electric field region near the regions 5, 6 are intruded to the depth side of the regions 5, 6 to suppress the influence to a channel. As a result, it can prevent the channel from damaging due to a hot carrier effect to enhance the reliability of the FET.
JP21029387A 1987-08-26 1987-08-26 Insulated gate field effect transistor Pending JPS6454762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21029387A JPS6454762A (en) 1987-08-26 1987-08-26 Insulated gate field effect transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21029387A JPS6454762A (en) 1987-08-26 1987-08-26 Insulated gate field effect transistor

Publications (1)

Publication Number Publication Date
JPS6454762A true JPS6454762A (en) 1989-03-02

Family

ID=16586999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21029387A Pending JPS6454762A (en) 1987-08-26 1987-08-26 Insulated gate field effect transistor

Country Status (1)

Country Link
JP (1) JPS6454762A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115268U (en) * 1990-03-10 1991-11-28
EP0856892A2 (en) * 1997-01-30 1998-08-05 Oki Electric Industry Co., Ltd. MOSFET and manufacturing method thereof
US8835271B2 (en) 2002-04-09 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US9105727B2 (en) 2002-04-09 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10133139B2 (en) 2002-05-17 2018-11-20 Semiconductor Energy Laboratory Co., Ltd. Display device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115268U (en) * 1990-03-10 1991-11-28
EP0856892A2 (en) * 1997-01-30 1998-08-05 Oki Electric Industry Co., Ltd. MOSFET and manufacturing method thereof
EP0856892A3 (en) * 1997-01-30 1999-07-14 Oki Electric Industry Co., Ltd. MOSFET and manufacturing method thereof
US9666614B2 (en) 2002-04-09 2017-05-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US9105727B2 (en) 2002-04-09 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US9406806B2 (en) 2002-04-09 2016-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US8835271B2 (en) 2002-04-09 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US10050065B2 (en) 2002-04-09 2018-08-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10083995B2 (en) 2002-04-09 2018-09-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US10700106B2 (en) 2002-04-09 2020-06-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US10854642B2 (en) 2002-04-09 2020-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US11101299B2 (en) 2002-04-09 2021-08-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US10133139B2 (en) 2002-05-17 2018-11-20 Semiconductor Energy Laboratory Co., Ltd. Display device
US10527903B2 (en) 2002-05-17 2020-01-07 Semiconductor Energy Laboratory Co., Ltd. Display device
US11422423B2 (en) 2002-05-17 2022-08-23 Semiconductor Energy Laboratory Co., Ltd. Display device

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