JP3860170B2 - 組み合わされた構造を有するオキシムエステルの光開始剤 - Google Patents

組み合わされた構造を有するオキシムエステルの光開始剤 Download PDF

Info

Publication number
JP3860170B2
JP3860170B2 JP2003503669A JP2003503669A JP3860170B2 JP 3860170 B2 JP3860170 B2 JP 3860170B2 JP 2003503669 A JP2003503669 A JP 2003503669A JP 2003503669 A JP2003503669 A JP 2003503669A JP 3860170 B2 JP3860170 B2 JP 3860170B2
Authority
JP
Japan
Prior art keywords
alkyl
phenyl
substituted
sub
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003503669A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004534797A5 (https=
JP2004534797A (ja
Inventor
和彦 国本
潤一 田辺
久稔 倉
英隆 岡
真樹 大和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Schweiz AG
Original Assignee
Ciba Spezialitaetenchemie Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Spezialitaetenchemie Holding AG filed Critical Ciba Spezialitaetenchemie Holding AG
Publication of JP2004534797A publication Critical patent/JP2004534797A/ja
Publication of JP2004534797A5 publication Critical patent/JP2004534797A5/ja
Application granted granted Critical
Publication of JP3860170B2 publication Critical patent/JP3860170B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
    • C07C251/32—Oximes
    • C07C251/62—Oximes having oxygen atoms of oxyimino groups esterified
    • C07C251/64—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids
    • C07C251/66—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids with the esterifying carboxyl groups bound to hydrogen atoms, to acyclic carbon atoms or to carbon atoms of rings other than six-membered aromatic rings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymerisation Methods In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Materials For Photolithography (AREA)
  • Indole Compounds (AREA)
  • Pyrane Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Holo Graphy (AREA)
JP2003503669A 2001-06-11 2002-06-04 組み合わされた構造を有するオキシムエステルの光開始剤 Expired - Lifetime JP3860170B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01810559 2001-06-11
PCT/EP2002/006107 WO2002100903A1 (en) 2001-06-11 2002-06-04 Oxime ester photoinitiators having a combined structure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006164492A Division JP2006342166A (ja) 2001-06-11 2006-06-14 組み合わされた構造を有するオキシムエステルの光開始剤

Publications (3)

Publication Number Publication Date
JP2004534797A JP2004534797A (ja) 2004-11-18
JP2004534797A5 JP2004534797A5 (https=) 2006-01-19
JP3860170B2 true JP3860170B2 (ja) 2006-12-20

Family

ID=8183958

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003503669A Expired - Lifetime JP3860170B2 (ja) 2001-06-11 2002-06-04 組み合わされた構造を有するオキシムエステルの光開始剤
JP2006164492A Pending JP2006342166A (ja) 2001-06-11 2006-06-14 組み合わされた構造を有するオキシムエステルの光開始剤

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006164492A Pending JP2006342166A (ja) 2001-06-11 2006-06-14 組み合わされた構造を有するオキシムエステルの光開始剤

Country Status (10)

Country Link
US (1) US7189489B2 (https=)
EP (1) EP1395615B1 (https=)
JP (2) JP3860170B2 (https=)
KR (1) KR100801457B1 (https=)
CN (1) CN100528838C (https=)
AT (1) ATE446322T1 (https=)
CA (1) CA2446722A1 (https=)
DE (1) DE60234095D1 (https=)
TW (1) TW593357B (https=)
WO (1) WO2002100903A1 (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008139924A1 (ja) 2007-05-09 2008-11-20 Adeka Corporation 新規エポキシ化合物、アルカリ現像性樹脂組成物およびアルカリ現像性感光性樹脂組成物
WO2009017064A1 (ja) 2007-08-01 2009-02-05 Adeka Corporation アルカリ現像性感光性樹脂組成物及びβ－ジケトン化合物
WO2009104468A1 (ja) 2008-02-22 2009-08-27 株式会社Adeka 重合性化合物を含有する液晶組成物及び該液晶組成物を用いた液晶表示素子
WO2009122868A1 (ja) 2008-04-01 2009-10-08 株式会社Adeka 三官能（メタ）アクリレート化合物及び該化合物を含有する重合性組成物
WO2011062017A1 (ja) 2009-11-18 2011-05-26 株式会社Adeka 重合性化合物を含有する液晶組成物及び該液晶組成物を用いた液晶表示素子
JP2013042096A (ja) * 2011-08-19 2013-02-28 Dainippon Printing Co Ltd 光インプリント用感光性樹脂組成物、硬化物、レジスト基板及び半導体装置の製造方法
WO2022131346A1 (ja) 2020-12-17 2022-06-23 株式会社Adeka 化合物及び組成物
WO2023002928A1 (ja) 2021-07-20 2023-01-26 株式会社Adeka 半導体用膜形成材料、半導体用部材形成材料、半導体用工程部材形成材料、下層膜形成材料、下層膜及び半導体デバイス
WO2024090369A1 (ja) 2022-10-26 2024-05-02 株式会社Adeka 化合物、組成物、硬化物、硬化物の製造方法及び電子部品の製造方法

Families Citing this family (523)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4233853B2 (ja) * 2002-11-25 2009-03-04 株式会社メニコン 眼用レンズのマーキング方法
EP1595182B1 (en) * 2003-02-19 2015-09-30 Basf Se Halogenated oxime derivatives and the use thereof as latent acids
ATE515493T1 (de) * 2003-03-31 2011-07-15 Council Scient Ind Res Mercaptophenylnaphthylmethan-derivate und deren herstellung
JP3754065B2 (ja) * 2003-06-10 2006-03-08 三菱化学株式会社 光重合性組成物及びこれを用いたカラーフィルター
JP4437651B2 (ja) 2003-08-28 2010-03-24 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
JP4565824B2 (ja) * 2003-09-24 2010-10-20 株式会社Adeka 二量体オキシムエステル化合物及び該化合物を有効成分とする光重合開始剤
JP4484482B2 (ja) * 2003-09-25 2010-06-16 東洋インキ製造株式会社 感光性着色組成物およびカラーフィルタ
TWI344976B (en) * 2003-10-27 2011-07-11 Sumitomo Chemical Co Stained sensitization resin
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board
JP2005202252A (ja) * 2004-01-16 2005-07-28 Dainippon Printing Co Ltd 固体撮像素子カラーフィルター用感光性着色組成物、固体撮像素子カラーフィルター、固体撮像素子、及び固体撮像素子カラーフィルターの製造方法
TWI285297B (en) * 2004-02-09 2007-08-11 Chi Mei Corp Light-sensitive resin composition for black matrix
JP2005258398A (ja) * 2004-02-12 2005-09-22 Jsr Corp プラズマディスプレイパネルの製造方法および転写フィルム
JP4639770B2 (ja) * 2004-02-20 2011-02-23 Ｊｓｒ株式会社 無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネルの製造方法
JP4830310B2 (ja) * 2004-02-23 2011-12-07 三菱化学株式会社 オキシムエステル系化合物、光重合性組成物及びこれを用いたカラーフィルター
JP2005300994A (ja) * 2004-04-13 2005-10-27 Jsr Corp 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル
US7642296B2 (en) 2004-04-19 2010-01-05 Ciba Specialty Chemicals Corporation Photoinitiators
JP4448381B2 (ja) * 2004-05-26 2010-04-07 東京応化工業株式会社 感光性組成物
WO2006008250A2 (en) * 2004-07-20 2006-01-26 Ciba Specialty Chemicals Holding Inc. Oxime derivatives and the use therof as latent acids
JP4419736B2 (ja) 2004-07-20 2010-02-24 Ｊｓｒ株式会社 感光性樹脂組成物、表示パネル用スペーサーおよび表示パネル
JP4492238B2 (ja) * 2004-07-26 2010-06-30 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル
JP4766235B2 (ja) * 2004-08-12 2011-09-07 Ｊｓｒ株式会社 感放射線性樹脂組成物および液晶表示素子用スペーサー
WO2006018405A1 (en) * 2004-08-18 2006-02-23 Ciba Specialty Chemicals Holding Inc. Oxime ester photoinitiators
JP3992725B2 (ja) * 2004-08-20 2007-10-17 株式会社Ａｄｅｋａ オキシムエステル化合物及び該化合物を含有する光重合開始剤
TWI385485B (zh) * 2004-11-17 2013-02-11 Jsr股份有限公司 A photosensitive resin composition, a display panel spacer, and a display panel
JP3798008B2 (ja) 2004-12-03 2006-07-19 旭電化工業株式会社 オキシムエステル化合物及び該化合物を含有する光重合開始剤
JP4493487B2 (ja) * 2004-12-03 2010-06-30 凸版印刷株式会社 感光性着色組成物、及びそれを用いたカラーフィルタ
KR101134297B1 (ko) * 2004-12-09 2012-04-13 코오롱인더스트리 주식회사 감광성 수지 조성물
JP2006195425A (ja) * 2004-12-15 2006-07-27 Jsr Corp 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル
TW200625002A (en) * 2005-01-12 2006-07-16 Chi Mei Corp Photosensitive resin composition for color filter
JP4526964B2 (ja) * 2005-01-27 2010-08-18 旭化成イーマテリアルズ株式会社 光重合性樹脂積層体、並びにそれを用いたブラックマトリックス付きガラス基板、及びカラーフィルタの製造方法
US7294657B2 (en) * 2005-03-07 2007-11-13 General Electric Company Curable acrylate compositions, methods of making the compositions and articles made therefrom
TWI347499B (en) * 2005-05-12 2011-08-21 Tokyo Ohka Kogyo Co Ltd A method for increasing optical stability of three-dimensional micro moldings
JP4627227B2 (ja) * 2005-06-22 2011-02-09 東京応化工業株式会社 感光性組成物およびブラックマトリクス
KR100989744B1 (ko) * 2005-07-13 2010-10-26 다이요 잉키 세이조 가부시키가이샤 은 페이스트 조성물, 및 그것을 이용한 도전성 패턴의 형성방법 및 그의 도전성 패턴
CN101223478B (zh) 2005-07-13 2011-10-12 太阳控股株式会社 黑色糊剂组合物及使用其的黑色矩阵图案的形成方法、以及该黑色矩阵图案
JP4631594B2 (ja) * 2005-08-16 2011-02-16 Ｊｓｒ株式会社 感光性樹脂組成物、表示パネル用スペーサーおよび表示パネル
JP4633582B2 (ja) * 2005-09-06 2011-02-16 東京応化工業株式会社 感光性組成物
TW200728379A (en) * 2005-09-06 2007-08-01 Taiyo Ink Mfg Co Ltd Resin composition, cured product of the same, and printed circuit board made of the same
JP4650212B2 (ja) * 2005-10-31 2011-03-16 東洋インキ製造株式会社 光重合性組成物
JP4650211B2 (ja) * 2005-10-31 2011-03-16 東洋インキ製造株式会社 光重合性組成物
KR100763744B1 (ko) 2005-11-07 2007-10-04 주식회사 엘지화학 옥심 에스테르를 포함하는 트리아진계 광활성 화합물
US8940464B2 (en) * 2005-12-01 2015-01-27 Basf Se Oxime ester photoinitiators
KR100814231B1 (ko) * 2005-12-01 2008-03-17 주식회사 엘지화학 옥심 에스테르를 포함하는 트리아진계 광활성 화합물을포함하는 투명한 감광성 조성물
US7896650B2 (en) * 2005-12-20 2011-03-01 3M Innovative Properties Company Dental compositions including radiation-to-heat converters, and the use thereof
KR101351286B1 (ko) * 2005-12-20 2014-02-17 시바 홀딩 인크 옥심 에스테르 광개시제
US8026296B2 (en) * 2005-12-20 2011-09-27 3M Innovative Properties Company Dental compositions including a thermally labile component, and the use thereof
JP4874659B2 (ja) * 2006-01-24 2012-02-15 富士フイルム株式会社 アニリン化合物及びその製造方法、並びに、感光性組成物
JP4882396B2 (ja) 2006-01-31 2012-02-22 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよび液晶表示素子
US8293436B2 (en) 2006-02-24 2012-10-23 Fujifilm Corporation Oxime derivative, photopolymerizable composition, color filter, and process for producing the same
CN101024624B (zh) * 2006-02-24 2013-09-11 富士胶片株式会社 肟衍生物、可光聚合的组合物、滤色片及其制造方法
JP4584164B2 (ja) * 2006-03-08 2010-11-17 富士フイルム株式会社 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
JP4835835B2 (ja) * 2006-03-13 2011-12-14 Ｊｓｒ株式会社 側鎖不飽和重合体、感放射線性樹脂組成物および液晶表示素子用スペーサー
JP5171005B2 (ja) 2006-03-17 2013-03-27 富士フイルム株式会社 高分子化合物およびその製造方法、並びに顔料分散剤
US20080220372A1 (en) * 2006-03-23 2008-09-11 Chun-Hsien Lee Photosensitive resin composition for black matrix
WO2007119651A1 (ja) 2006-04-13 2007-10-25 Taiyo Ink Mfg. Co., Ltd. アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板
JP4827088B2 (ja) * 2006-04-13 2011-11-30 太陽ホールディングス株式会社 アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板
TWI403840B (zh) 2006-04-26 2013-08-01 Fujifilm Corp 含染料之負型硬化性組成物、彩色濾光片及其製法
KR101320894B1 (ko) * 2006-07-05 2013-10-24 삼성디스플레이 주식회사 포토레지스트 조성물 및 이를 이용한 컬러 필터 기판의제조방법
KR100781690B1 (ko) * 2006-08-24 2007-12-03 한국화학연구원 다가의 옥심 에스테르 기를 갖는 광 개시제 및 이의 제조방법
US7838197B2 (en) * 2006-11-15 2010-11-23 Taiyo Ink Mfg. Co., Ltd. Photosensitive composition
CN101183216B (zh) * 2006-11-15 2011-11-02 太阳控股株式会社 感光性组合物
TW200844652A (en) * 2006-11-15 2008-11-16 Taiyo Ink Mfg Co Ltd Process for forming solder resist film and photosensitive composition
CN101528682B (zh) * 2006-12-27 2012-08-08 株式会社艾迪科 肟酯化合物和含有该化合物的光聚合引发剂
US20090292039A1 (en) * 2006-12-27 2009-11-26 Adeka Corporation Oxime ester compound and photopolymerization initiator containing the same
JP4885014B2 (ja) * 2007-02-28 2012-02-29 株式会社リコー 像担持体、それを用いた画像形成方法、画像形成装置及びプロセスカートリッジ
EP1975702B1 (en) 2007-03-29 2013-07-24 FUJIFILM Corporation Colored photocurable composition for solid state image pick-up device, color filter and method for production thereof, and solid state image pick-up device
JP5030638B2 (ja) 2007-03-29 2012-09-19 富士フイルム株式会社 カラーフィルタ及びその製造方法
JP4663679B2 (ja) * 2007-05-08 2011-04-06 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板
WO2008138733A1 (en) * 2007-05-11 2008-11-20 Basf Se Oxime ester photoinitiators
US8911921B2 (en) 2007-05-11 2014-12-16 Ciba Corporation Oxime ester photoinitiators
JP5535064B2 (ja) 2007-05-11 2014-07-02 ビーエーエスエフ ソシエタス・ヨーロピア オキシムエステル光重合開始剤
JP5213375B2 (ja) 2007-07-13 2013-06-19 富士フイルム株式会社 顔料分散液、硬化性組成物、それを用いるカラーフィルタ及び固体撮像素子
TWI436163B (zh) 2007-07-17 2014-05-01 Fujifilm Corp 混合物、可光聚合的組成物、彩色濾鏡以及平版印刷的印刷板前驅物
KR101007440B1 (ko) 2007-07-18 2011-01-12 주식회사 엘지화학 옥심 에스테르를 포함하는 수지상 광활성 화합물 및 이의제조방법
JP2009040762A (ja) * 2007-08-09 2009-02-26 Ciba Holding Inc オキシムエステル光開始剤
JP4890388B2 (ja) * 2007-08-22 2012-03-07 富士フイルム株式会社 着色感光性組成物、カラーフィルタ及びその製造方法
JP5496482B2 (ja) * 2007-08-27 2014-05-21 富士フイルム株式会社 新規化合物、光重合性組成物、カラーフィルタ用光重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、並びに、平版印刷版原版
ATE526366T1 (de) * 2007-10-31 2011-10-15 Fujifilm Corp Farbige härtbare zusammensetzung, farbfilter, herstellungsverfahren dafür und festzustand- bildaufnahmevorrichtung
US8449635B2 (en) * 2007-12-06 2013-05-28 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for making same
KR101418735B1 (ko) 2007-12-25 2014-07-11 가부시키가이샤 아데카 옥심에스테르 화합물 및 상기 화합물을 함유하는 광중합 개시제
JP5176076B2 (ja) * 2008-01-16 2013-04-03 日立化成株式会社 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法
JP5371449B2 (ja) 2008-01-31 2013-12-18 富士フイルム株式会社 樹脂、顔料分散液、着色硬化性組成物、これを用いたカラーフィルタ及びその製造方法
JP5334624B2 (ja) 2008-03-17 2013-11-06 富士フイルム株式会社 着色硬化性組成物、カラーフィルタ、及びカラーフィルタの製造方法
JP5305704B2 (ja) 2008-03-24 2013-10-02 富士フイルム株式会社 新規化合物、光重合性組成物、カラーフィルタ用光重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、並びに、平版印刷版原版
JP2009258705A (ja) 2008-03-25 2009-11-05 Fujifilm Corp 平版印刷版原版
JP5173528B2 (ja) 2008-03-28 2013-04-03 富士フイルム株式会社 感光性樹脂組成物、遮光性カラーフィルター及びその製造方法、並びに、固体撮像素子
JP5535444B2 (ja) 2008-03-28 2014-07-02 富士フイルム株式会社 固体撮像素子用緑色硬化性組成物、固体撮像素子用カラーフィルタ及びその製造方法
JP5528677B2 (ja) 2008-03-31 2014-06-25 富士フイルム株式会社 重合性組成物、固体撮像素子用遮光性カラーフィルタ、固体撮像素子および固体撮像素子用遮光性カラーフィルタの製造方法
JP5137662B2 (ja) 2008-03-31 2013-02-06 富士フイルム株式会社 硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子
KR101441998B1 (ko) 2008-04-25 2014-09-18 후지필름 가부시키가이샤 중합성 조성물, 차광성 컬러필터, 흑색 경화성 조성물, 고체촬상소자용 차광성 컬러필터와 그 제조 방법, 및 고체촬상소자
WO2009131189A1 (ja) 2008-04-25 2009-10-29 三菱化学株式会社 ケトオキシムエステル系化合物及びその利用
WO2009145073A1 (ja) 2008-05-30 2009-12-03 アドバンスト・ソフトマテリアルズ株式会社 ポリロタキサン、水系ポリロタキサン分散組成物、及びポリロタキサンとポリマーとの架橋体、並びにこれらの製造方法
JP5553827B2 (ja) * 2008-06-06 2014-07-16 ビーエーエスエフ ソシエタス・ヨーロピア 光開始剤混合物
JP5566378B2 (ja) * 2008-06-06 2014-08-06 ビーエーエスエフ ソシエタス・ヨーロピア オキシムエステル光開始剤
JP5171506B2 (ja) 2008-06-30 2013-03-27 富士フイルム株式会社 新規化合物、重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、並びに、平版印刷版原版
KR101121038B1 (ko) * 2008-07-01 2012-03-15 주식회사 엘지화학 복수의 광개시제를 포함한 감광성 수지 조성물, 이를 이용한 투명 박막층 및 액정 표시 장치
WO2010002129A2 (ko) * 2008-07-01 2010-01-07 주식회사 엘지화학 복수의 광개시제를 포함한 감광성 수지 조성물, 이를 이용한 투명 박막층 및 액정 표시 장치
TW201009498A (en) * 2008-07-07 2010-03-01 Fujifilm Corp Colored photosensitive resin composition, method of forming pattern using ultraviolet laser, method of producing color filter using the pattern forming method, color filter, and display device
JP2010044273A (ja) 2008-08-14 2010-02-25 Fujifilm Corp カラーフィルタ及びその形成方法、並びに固体撮像素子
JP5274151B2 (ja) 2008-08-21 2013-08-28 富士フイルム株式会社 感光性樹脂組成物、カラーフィルタ及びその製造方法、並びに、固体撮像素子
JP5284735B2 (ja) 2008-09-18 2013-09-11 株式会社Ａｄｅｋａ 重合性光学活性イミド化合物及び該化合物を含有する重合性組成物
JP5079653B2 (ja) 2008-09-29 2012-11-21 富士フイルム株式会社 着色硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子
JP5171514B2 (ja) 2008-09-29 2013-03-27 富士フイルム株式会社 着色硬化性組成物、カラーフィルタ、及びカラーフィルタの製造方法
JP5127651B2 (ja) 2008-09-30 2013-01-23 富士フイルム株式会社 着色硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子
JP5340102B2 (ja) 2008-10-03 2013-11-13 富士フイルム株式会社 分散組成物、重合性組成物、遮光性カラーフィルタ、固体撮像素子、液晶表示装置、ウェハレベルレンズ、及び撮像ユニット
JP5623416B2 (ja) * 2008-11-03 2014-11-12 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 光開始剤混合物
KR101082489B1 (ko) * 2008-11-05 2011-11-11 주식회사 엘지화학 불포화 이중 결합을 가진 옥심 에스테르를 함유한 광중합 개시제 및 이를 포함한 감광성 수지 조성물
JP5344892B2 (ja) 2008-11-27 2013-11-20 富士フイルム株式会社 インクジェット用インク組成物、及びインクジェット記録方法
JP5669386B2 (ja) 2009-01-15 2015-02-12 富士フイルム株式会社 新規化合物、重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、並びに、平版印刷版原版
JP5371824B2 (ja) 2009-02-19 2013-12-18 富士フイルム株式会社 分散組成物の製造方法、遮光性カラーフィルタ用感光性樹脂組成物の製造方法、遮光性カラーフィルタの製造方法
JP5340198B2 (ja) 2009-02-26 2013-11-13 富士フイルム株式会社 分散組成物
CN101508744B (zh) * 2009-03-11 2011-04-06 常州强力电子新材料有限公司 咔唑肟酯类光引发剂
US8004078B1 (en) * 2009-03-17 2011-08-23 Amkor Technology, Inc. Adhesive composition for semiconductor device
JP5383288B2 (ja) * 2009-03-31 2014-01-08 富士フイルム株式会社 感光性組成物、感光性樹脂転写フイルム、樹脂パターン及び樹脂パターンの製造方法、並びに液晶表示装置用基板及び液晶表示装置
US8754533B2 (en) 2009-04-14 2014-06-17 Monolithic 3D Inc. Monolithic three-dimensional semiconductor device and structure
US8669778B1 (en) 2009-04-14 2014-03-11 Monolithic 3D Inc. Method for design and manufacturing of a 3D semiconductor device
US8373439B2 (en) 2009-04-14 2013-02-12 Monolithic 3D Inc. 3D semiconductor device
US8384426B2 (en) 2009-04-14 2013-02-26 Monolithic 3D Inc. Semiconductor device and structure
US9509313B2 (en) 2009-04-14 2016-11-29 Monolithic 3D Inc. 3D semiconductor device
US8362482B2 (en) 2009-04-14 2013-01-29 Monolithic 3D Inc. Semiconductor device and structure
US7986042B2 (en) 2009-04-14 2011-07-26 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US8427200B2 (en) 2009-04-14 2013-04-23 Monolithic 3D Inc. 3D semiconductor device
US8395191B2 (en) 2009-10-12 2013-03-12 Monolithic 3D Inc. Semiconductor device and structure
US8258810B2 (en) 2010-09-30 2012-09-04 Monolithic 3D Inc. 3D semiconductor device
US8378715B2 (en) 2009-04-14 2013-02-19 Monolithic 3D Inc. Method to construct systems
US8405420B2 (en) 2009-04-14 2013-03-26 Monolithic 3D Inc. System comprising a semiconductor device and structure
US20110031997A1 (en) * 2009-04-14 2011-02-10 NuPGA Corporation Method for fabrication of a semiconductor device and structure
US8362800B2 (en) 2010-10-13 2013-01-29 Monolithic 3D Inc. 3D semiconductor device including field repairable logics
US8058137B1 (en) 2009-04-14 2011-11-15 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US9711407B2 (en) 2009-04-14 2017-07-18 Monolithic 3D Inc. Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer
US9577642B2 (en) 2009-04-14 2017-02-21 Monolithic 3D Inc. Method to form a 3D semiconductor device
WO2010119924A1 (ja) 2009-04-16 2010-10-21 富士フイルム株式会社 カラーフィルタ用重合性組成物、カラーフィルタ、及び固体撮像素子
JP5317809B2 (ja) * 2009-04-20 2013-10-16 富士フイルム株式会社 着色硬化性組成物、着色パターンの形成方法、カラーフィルタ、および液晶表示装置
KR101146182B1 (ko) * 2009-05-11 2012-05-24 주식회사 이그잭스 엘시디 스페이서 제조용 감광성 수지 조성물
KR101678028B1 (ko) * 2009-06-17 2016-11-21 토요잉크Sc홀딩스주식회사 옥심에스테르 화합물, 라디칼 중합개시제, 중합성 조성물, 네가티브형 레지스트 및 화상 패턴
JP4999891B2 (ja) * 2009-07-13 2012-08-15 東洋インキＳｃホールディングス株式会社 感光性着色組成物およびカラーフィルタ
JP4833324B2 (ja) * 2009-08-03 2011-12-07 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
JP5535814B2 (ja) 2009-09-14 2014-07-02 富士フイルム株式会社 光重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、液晶表示装置、平版印刷版原版、並びに、新規化合物
JP5501175B2 (ja) 2009-09-28 2014-05-21 富士フイルム株式会社 分散組成物及びその製造方法、遮光性カラーフィルタ用感光性樹脂組成物及びその製造方法、遮光性カラーフィルタ及びその製造方法、並びに固体撮像素子
US8742476B1 (en) 2012-11-27 2014-06-03 Monolithic 3D Inc. Semiconductor device and structure
US12027518B1 (en) 2009-10-12 2024-07-02 Monolithic 3D Inc. 3D semiconductor devices and structures with metal layers
US8536023B2 (en) 2010-11-22 2013-09-17 Monolithic 3D Inc. Method of manufacturing a semiconductor device and structure
US10366970B2 (en) 2009-10-12 2019-07-30 Monolithic 3D Inc. 3D semiconductor device and structure
US8294159B2 (en) 2009-10-12 2012-10-23 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US11018133B2 (en) 2009-10-12 2021-05-25 Monolithic 3D Inc. 3D integrated circuit
US10388863B2 (en) 2009-10-12 2019-08-20 Monolithic 3D Inc. 3D memory device and structure
US8450804B2 (en) 2011-03-06 2013-05-28 Monolithic 3D Inc. Semiconductor device and structure for heat removal
US10354995B2 (en) 2009-10-12 2019-07-16 Monolithic 3D Inc. Semiconductor memory device and structure
US8476145B2 (en) 2010-10-13 2013-07-02 Monolithic 3D Inc. Method of fabricating a semiconductor device and structure
US9099424B1 (en) 2012-08-10 2015-08-04 Monolithic 3D Inc. Semiconductor system, device and structure with heat removal
US10157909B2 (en) 2009-10-12 2018-12-18 Monolithic 3D Inc. 3D semiconductor device and structure
US8581349B1 (en) 2011-05-02 2013-11-12 Monolithic 3D Inc. 3D memory semiconductor device and structure
US10043781B2 (en) 2009-10-12 2018-08-07 Monolithic 3D Inc. 3D semiconductor device and structure
US11374118B2 (en) 2009-10-12 2022-06-28 Monolithic 3D Inc. Method to form a 3D integrated circuit
US11984445B2 (en) 2009-10-12 2024-05-14 Monolithic 3D Inc. 3D semiconductor devices and structures with metal layers
US10910364B2 (en) 2009-10-12 2021-02-02 Monolitaic 3D Inc. 3D semiconductor device
JP5701576B2 (ja) 2009-11-20 2015-04-15 富士フイルム株式会社 分散組成物及び感光性樹脂組成物、並びに固体撮像素子
JP4818458B2 (ja) 2009-11-27 2011-11-16 株式会社Ａｄｅｋａ オキシムエステル化合物及び該化合物を含有する光重合開始剤
JP2010102346A (ja) * 2009-12-04 2010-05-06 Toyo Ink Mfg Co Ltd 感光性着色組成物およびカラーフィルタ
JP5162565B2 (ja) * 2009-12-04 2013-03-13 東洋インキＳｃホールディングス株式会社 感光性着色組成物およびカラーフィルタ
AU2010330040B2 (en) * 2009-12-07 2013-12-19 Agfa Nv UV-LED curable compositions and inks
CN102639501B (zh) * 2009-12-07 2015-04-29 爱克发印艺公司 用于uv-led可固化组合物和墨水的光引发剂
JP2012003225A (ja) 2010-01-27 2012-01-05 Fujifilm Corp ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法
JP2011158655A (ja) 2010-01-29 2011-08-18 Fujifilm Corp 重合性組成物、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子
JP5640722B2 (ja) * 2010-02-05 2014-12-17 Jsr株式会社 新規化合物及びそれを含有する感放射線性組成物
US8492886B2 (en) 2010-02-16 2013-07-23 Monolithic 3D Inc 3D integrated circuit with logic
US8298875B1 (en) 2011-03-06 2012-10-30 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US8026521B1 (en) 2010-10-11 2011-09-27 Monolithic 3D Inc. Semiconductor device and structure
US8541819B1 (en) 2010-12-09 2013-09-24 Monolithic 3D Inc. Semiconductor device and structure
US8373230B1 (en) 2010-10-13 2013-02-12 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US9099526B2 (en) 2010-02-16 2015-08-04 Monolithic 3D Inc. Integrated circuit device and structure
US8461035B1 (en) 2010-09-30 2013-06-11 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
KR20110098638A (ko) 2010-02-26 2011-09-01 후지필름 가부시키가이샤 착색 경화성 조성물, 컬러필터와 그 제조방법, 고체촬상소자 및 액정표시장치
JP5533184B2 (ja) * 2010-04-20 2014-06-25 Ｊｓｒ株式会社 新規化合物、感放射線性組成物、硬化膜及びその形成方法
JP5638285B2 (ja) 2010-05-31 2014-12-10 富士フイルム株式会社 重合性組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、および固体撮像素子
US8152863B2 (en) 2010-06-01 2012-04-10 Fujifilm Corporation Pigment dispersion composition, red colored composition, colored curable composition, color filter for a solid state imaging device and method for producing the same, and solid state imaging device
JP5622564B2 (ja) 2010-06-30 2014-11-12 富士フイルム株式会社 感光性組成物、パターン形成材料、並びに、これを用いた感光性膜、パターン形成方法、パターン膜、低屈折率膜、光学デバイス、及び、固体撮像素子
JP5306291B2 (ja) * 2010-07-12 2013-10-02 富士フイルム株式会社 シアン色カラーフィルタ及びそれを用いた固体撮像素子
JP5544239B2 (ja) 2010-07-29 2014-07-09 富士フイルム株式会社 重合性組成物
US9219005B2 (en) 2011-06-28 2015-12-22 Monolithic 3D Inc. Semiconductor system and device
US8901613B2 (en) 2011-03-06 2014-12-02 Monolithic 3D Inc. Semiconductor device and structure for heat removal
US9953925B2 (en) 2011-06-28 2018-04-24 Monolithic 3D Inc. Semiconductor system and device
US10217667B2 (en) 2011-06-28 2019-02-26 Monolithic 3D Inc. 3D semiconductor device, fabrication method and system
US8642416B2 (en) 2010-07-30 2014-02-04 Monolithic 3D Inc. Method of forming three dimensional integrated circuit devices using layer transfer technique
JP2012058728A (ja) * 2010-08-10 2012-03-22 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2013539072A (ja) * 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
CN103153952B (zh) * 2010-10-05 2016-07-13 巴斯夫欧洲公司 苯并咔唑化合物的肟酯衍生物及其在可光聚合组合物中作为光敏引发剂的用途
US9051397B2 (en) 2010-10-05 2015-06-09 Basf Se Oxime ester
US8273610B2 (en) 2010-11-18 2012-09-25 Monolithic 3D Inc. Method of constructing a semiconductor device and structure
US12362219B2 (en) 2010-11-18 2025-07-15 Monolithic 3D Inc. 3D semiconductor memory device and structure
US10497713B2 (en) 2010-11-18 2019-12-03 Monolithic 3D Inc. 3D semiconductor memory device and structure
US8163581B1 (en) 2010-10-13 2012-04-24 Monolith IC 3D Semiconductor and optoelectronic devices
US11482440B2 (en) 2010-12-16 2022-10-25 Monolithic 3D Inc. 3D semiconductor device and structure with a built-in test circuit for repairing faulty circuits
US11257867B1 (en) 2010-10-11 2022-02-22 Monolithic 3D Inc. 3D semiconductor device and structure with oxide bonds
US11315980B1 (en) 2010-10-11 2022-04-26 Monolithic 3D Inc. 3D semiconductor device and structure with transistors
US11469271B2 (en) 2010-10-11 2022-10-11 Monolithic 3D Inc. Method to produce 3D semiconductor devices and structures with memory
US11227897B2 (en) 2010-10-11 2022-01-18 Monolithic 3D Inc. Method for producing a 3D semiconductor memory device and structure
US10290682B2 (en) 2010-10-11 2019-05-14 Monolithic 3D Inc. 3D IC semiconductor device and structure with stacked memory
US11024673B1 (en) 2010-10-11 2021-06-01 Monolithic 3D Inc. 3D semiconductor device and structure
US11158674B2 (en) 2010-10-11 2021-10-26 Monolithic 3D Inc. Method to produce a 3D semiconductor device and structure
US11600667B1 (en) 2010-10-11 2023-03-07 Monolithic 3D Inc. Method to produce 3D semiconductor devices and structures with memory
US10896931B1 (en) 2010-10-11 2021-01-19 Monolithic 3D Inc. 3D semiconductor device and structure
US11018191B1 (en) 2010-10-11 2021-05-25 Monolithic 3D Inc. 3D semiconductor device and structure
US8114757B1 (en) 2010-10-11 2012-02-14 Monolithic 3D Inc. Semiconductor device and structure
US12360310B2 (en) 2010-10-13 2025-07-15 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US11163112B2 (en) 2010-10-13 2021-11-02 Monolithic 3D Inc. Multilevel semiconductor device and structure with electromagnetic modulators
US10833108B2 (en) 2010-10-13 2020-11-10 Monolithic 3D Inc. 3D microdisplay device and structure
US11984438B2 (en) 2010-10-13 2024-05-14 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US10679977B2 (en) 2010-10-13 2020-06-09 Monolithic 3D Inc. 3D microdisplay device and structure
US11327227B2 (en) 2010-10-13 2022-05-10 Monolithic 3D Inc. Multilevel semiconductor device and structure with electromagnetic modulators
US10943934B2 (en) 2010-10-13 2021-03-09 Monolithic 3D Inc. Multilevel semiconductor device and structure
US11855100B2 (en) 2010-10-13 2023-12-26 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US11855114B2 (en) 2010-10-13 2023-12-26 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US12080743B2 (en) 2010-10-13 2024-09-03 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US10978501B1 (en) 2010-10-13 2021-04-13 Monolithic 3D Inc. Multilevel semiconductor device and structure with waveguides
US11133344B2 (en) 2010-10-13 2021-09-28 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US8283215B2 (en) 2010-10-13 2012-10-09 Monolithic 3D Inc. Semiconductor and optoelectronic devices
US11605663B2 (en) 2010-10-13 2023-03-14 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US10998374B1 (en) 2010-10-13 2021-05-04 Monolithic 3D Inc. Multilevel semiconductor device and structure
US9197804B1 (en) 2011-10-14 2015-11-24 Monolithic 3D Inc. Semiconductor and optoelectronic devices
US11043523B1 (en) 2010-10-13 2021-06-22 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US11437368B2 (en) 2010-10-13 2022-09-06 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US11063071B1 (en) 2010-10-13 2021-07-13 Monolithic 3D Inc. Multilevel semiconductor device and structure with waveguides
US11164898B2 (en) 2010-10-13 2021-11-02 Monolithic 3D Inc. Multilevel semiconductor device and structure
US11869915B2 (en) 2010-10-13 2024-01-09 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US8379458B1 (en) 2010-10-13 2013-02-19 Monolithic 3D Inc. Semiconductor device and structure
US11404466B2 (en) 2010-10-13 2022-08-02 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US11694922B2 (en) 2010-10-13 2023-07-04 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US12094892B2 (en) 2010-10-13 2024-09-17 Monolithic 3D Inc. 3D micro display device and structure
US11929372B2 (en) 2010-10-13 2024-03-12 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US11482439B2 (en) 2010-11-18 2022-10-25 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors
US12068187B2 (en) 2010-11-18 2024-08-20 Monolithic 3D Inc. 3D semiconductor device and structure with bonding and DRAM memory cells
US11355381B2 (en) 2010-11-18 2022-06-07 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11610802B2 (en) 2010-11-18 2023-03-21 Monolithic 3D Inc. Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes
US11164770B1 (en) 2010-11-18 2021-11-02 Monolithic 3D Inc. Method for producing a 3D semiconductor memory device and structure
US12243765B2 (en) 2010-11-18 2025-03-04 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US11018042B1 (en) 2010-11-18 2021-05-25 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11482438B2 (en) 2010-11-18 2022-10-25 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11031275B2 (en) 2010-11-18 2021-06-08 Monolithic 3D Inc. 3D semiconductor device and structure with memory
US12272586B2 (en) 2010-11-18 2025-04-08 Monolithic 3D Inc. 3D semiconductor memory device and structure with memory and metal layers
US11615977B2 (en) 2010-11-18 2023-03-28 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11854857B1 (en) 2010-11-18 2023-12-26 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US12033884B2 (en) 2010-11-18 2024-07-09 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11784082B2 (en) 2010-11-18 2023-10-10 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US12154817B1 (en) 2010-11-18 2024-11-26 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11121021B2 (en) 2010-11-18 2021-09-14 Monolithic 3D Inc. 3D semiconductor device and structure
US11862503B2 (en) 2010-11-18 2024-01-02 Monolithic 3D Inc. Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11521888B2 (en) 2010-11-18 2022-12-06 Monolithic 3D Inc. 3D semiconductor device and structure with high-k metal gate transistors
US12125737B1 (en) 2010-11-18 2024-10-22 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US11495484B2 (en) 2010-11-18 2022-11-08 Monolithic 3D Inc. 3D semiconductor devices and structures with at least two single-crystal layers
US11004719B1 (en) 2010-11-18 2021-05-11 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US12136562B2 (en) 2010-11-18 2024-11-05 Monolithic 3D Inc. 3D semiconductor device and structure with single-crystal layers
US11355380B2 (en) 2010-11-18 2022-06-07 Monolithic 3D Inc. Methods for producing 3D semiconductor memory device and structure utilizing alignment marks
US11735462B2 (en) 2010-11-18 2023-08-22 Monolithic 3D Inc. 3D semiconductor device and structure with single-crystal layers
US11923230B1 (en) 2010-11-18 2024-03-05 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US11804396B2 (en) 2010-11-18 2023-10-31 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11569117B2 (en) 2010-11-18 2023-01-31 Monolithic 3D Inc. 3D semiconductor device and structure with single-crystal layers
US11094576B1 (en) 2010-11-18 2021-08-17 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11443971B2 (en) 2010-11-18 2022-09-13 Monolithic 3D Inc. 3D semiconductor device and structure with memory
US12100611B2 (en) 2010-11-18 2024-09-24 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11211279B2 (en) 2010-11-18 2021-12-28 Monolithic 3D Inc. Method for processing a 3D integrated circuit and structure
US11107721B2 (en) 2010-11-18 2021-08-31 Monolithic 3D Inc. 3D semiconductor device and structure with NAND logic
US11508605B2 (en) 2010-11-18 2022-11-22 Monolithic 3D Inc. 3D semiconductor memory device and structure
US12144190B2 (en) 2010-11-18 2024-11-12 Monolithic 3D Inc. 3D semiconductor device and structure with bonding and memory cells preliminary class
US11901210B2 (en) 2010-11-18 2024-02-13 Monolithic 3D Inc. 3D semiconductor device and structure with memory
CN102020727B (zh) * 2010-11-23 2013-01-23 常州强力先端电子材料有限公司 一种高感光度咔唑肟酯类光引发剂、其制备方法及应用
JP5121912B2 (ja) * 2010-11-24 2013-01-16 富士フイルム株式会社 着色感光性樹脂組成物、パターン形成方法、カラーフィルタの製造方法、カラーフィルタ及びそれを備えた表示装置
US12463076B2 (en) 2010-12-16 2025-11-04 Monolithic 3D Inc. 3D semiconductor device and structure
KR101830206B1 (ko) 2010-12-28 2018-02-20 후지필름 가부시키가이샤 차광막 형성용 티타늄 블랙 분산 조성물과 그 제조방법, 흑색 감방사선성 조성물, 흑색 경화막, 고체촬상소자, 및 흑색 경화막의 제조방법
US8816211B2 (en) * 2011-02-14 2014-08-26 Eastman Kodak Company Articles with photocurable and photocured compositions
US8632858B2 (en) * 2011-02-14 2014-01-21 Eastman Kodak Company Methods of photocuring and imaging
US8975670B2 (en) 2011-03-06 2015-03-10 Monolithic 3D Inc. Semiconductor device and structure for heat removal
CN102681343A (zh) * 2011-03-08 2012-09-19 住友化学株式会社 着色感光性树脂组合物
US9127017B2 (en) 2011-05-25 2015-09-08 American Dye Source, Inc. Compounds with oxime ester and/or acyl groups
US10388568B2 (en) 2011-06-28 2019-08-20 Monolithic 3D Inc. 3D semiconductor device and system
KR101339916B1 (ko) 2011-06-30 2013-12-10 타코마테크놀러지 주식회사 옥시이미노 디치오카보네이트 화합물，이를 포함하는 감광성 조성물 및 용도
US8963104B2 (en) 2011-08-05 2015-02-24 Nitto Denko Corporation Optical element for correcting color blindness
EP2715416B1 (en) 2011-09-14 2019-10-30 FUJIFILM Corporation Colored radiation-sensitive composition for color filter, pattern forming method, color filter and method of producing the same, and solid-state image sensor
US8687399B2 (en) 2011-10-02 2014-04-01 Monolithic 3D Inc. Semiconductor device and structure
US9029173B2 (en) 2011-10-18 2015-05-12 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
EP2788325B1 (en) * 2011-12-07 2016-08-10 Basf Se Oxime ester photoinitiators
JP5976523B2 (ja) 2011-12-28 2016-08-23 富士フイルム株式会社 光学部材セット及びこれを用いた固体撮像素子
JP5922013B2 (ja) 2011-12-28 2016-05-24 富士フイルム株式会社 光学部材セット及びこれを用いた固体撮像素子
KR101406317B1 (ko) * 2012-01-12 2014-06-13 타코마테크놀러지 주식회사 고감도 옥심에스테르 광중합개시제 및 이 화합물을 포함하는 광중합 조성물
US9000557B2 (en) 2012-03-17 2015-04-07 Zvi Or-Bach Semiconductor device and structure
JP5934664B2 (ja) 2012-03-19 2016-06-15 富士フイルム株式会社 着色感放射線性組成物、着色硬化膜、カラーフィルタ、着色パターン形成方法、カラーフィルタの製造方法、固体撮像素子、及び画像表示装置
JP5775479B2 (ja) 2012-03-21 2015-09-09 富士フイルム株式会社 着色感放射線性組成物、着色硬化膜、カラーフィルタ、パターン形成方法、カラーフィルタの製造方法、固体撮像素子、及び画像表示装置
CN103044581B (zh) * 2012-04-05 2014-10-29 常州强力电子新材料股份有限公司 一种大分子光引发剂及其制备方法和应用
US11088050B2 (en) 2012-04-09 2021-08-10 Monolithic 3D Inc. 3D semiconductor device with isolation layers
US11164811B2 (en) 2012-04-09 2021-11-02 Monolithic 3D Inc. 3D semiconductor device with isolation layers and oxide-to-oxide bonding
US8557632B1 (en) 2012-04-09 2013-10-15 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US11476181B1 (en) 2012-04-09 2022-10-18 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US10600888B2 (en) 2012-04-09 2020-03-24 Monolithic 3D Inc. 3D semiconductor device
US11594473B2 (en) 2012-04-09 2023-02-28 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11410912B2 (en) 2012-04-09 2022-08-09 Monolithic 3D Inc. 3D semiconductor device with vias and isolation layers
US11694944B1 (en) 2012-04-09 2023-07-04 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11616004B1 (en) 2012-04-09 2023-03-28 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11735501B1 (en) 2012-04-09 2023-08-22 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11881443B2 (en) 2012-04-09 2024-01-23 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
KR102013541B1 (ko) 2012-05-09 2019-08-22 바스프 에스이 옥심 에스테르 광개시제
JP5950682B2 (ja) * 2012-05-09 2016-07-13 株式会社日本化学工業所 オキシム系光重合開始剤及びその使用方法
WO2013184090A1 (en) 2012-06-04 2013-12-12 L'oreal S.A. Fast curing cosmetic compositions for tack free surface photocuring of radically polymerizable resins with uv-led
JP5903164B2 (ja) 2012-08-08 2016-04-13 旭化成イーマテリアルズ株式会社 感光性フィルム積層体、及び、フレキシブルプリント配線の製造方法
JP5909468B2 (ja) 2012-08-31 2016-04-26 富士フイルム株式会社 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、及び固体撮像素子
JP5894943B2 (ja) 2012-08-31 2016-03-30 富士フイルム株式会社 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、マイクロレンズの製造方法、及び固体撮像素子
JP5934682B2 (ja) 2012-08-31 2016-06-15 富士フイルム株式会社 マイクロレンズ形成用又はカラーフィルターの下塗り膜形成用硬化性組成物、透明膜、マイクロレンズ、固体撮像素子、及び、硬化性組成物の製造方法
KR101563473B1 (ko) 2012-09-28 2015-10-26 다이토 케믹스 코포레이션 플루오렌계 화합물, 상기 플루오렌계 화합물을 포함하는 광중합 개시제, 및 상기 광중합 개시제를 포함하는 감광성 조성물
US8574929B1 (en) 2012-11-16 2013-11-05 Monolithic 3D Inc. Method to form a 3D semiconductor device and structure
US8686428B1 (en) 2012-11-16 2014-04-01 Monolithic 3D Inc. Semiconductor device and structure
SG11201504205WA (en) 2012-11-30 2015-07-30 Fujifilm Corp Curable resin composition, production method of image sensor chip using the same, and image sensor chip
SG11201504182RA (en) 2012-11-30 2015-06-29 Fujifilm Corp Curable resin composition, production method of image sensor chip using the same, and image sensor chip
US11784169B2 (en) 2012-12-22 2023-10-10 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11961827B1 (en) 2012-12-22 2024-04-16 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11018116B2 (en) 2012-12-22 2021-05-25 Monolithic 3D Inc. Method to form a 3D semiconductor device and structure
US11967583B2 (en) 2012-12-22 2024-04-23 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US12051674B2 (en) 2012-12-22 2024-07-30 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11309292B2 (en) 2012-12-22 2022-04-19 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US8674470B1 (en) 2012-12-22 2014-03-18 Monolithic 3D Inc. Semiconductor device and structure
US11063024B1 (en) 2012-12-22 2021-07-13 Monlithic 3D Inc. Method to form a 3D semiconductor device and structure
US11217565B2 (en) 2012-12-22 2022-01-04 Monolithic 3D Inc. Method to form a 3D semiconductor device and structure
US11916045B2 (en) 2012-12-22 2024-02-27 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
KR101609634B1 (ko) 2012-12-26 2016-04-06 제일모직 주식회사 감광성 수지 조성물 및 이를 이용한 차광층
JP6170673B2 (ja) 2012-12-27 2017-07-26 富士フイルム株式会社 カラーフィルタ用組成物、赤外線透過フィルタ及びその製造方法、並びに赤外線センサー
SG11201505047WA (en) 2012-12-28 2015-08-28 Fujifilm Corp Curable resin composition for forming infrared reflective film, infrared reflective film and manufacturing method thereof, infrared ray cutoff filter and solid-state imaging device using the same
JP6343446B2 (ja) 2012-12-28 2018-06-13 富士フイルム株式会社 硬化性樹脂組成物、赤外線カットフィルタ及びこれを用いた固体撮像素子
US9385058B1 (en) 2012-12-29 2016-07-05 Monolithic 3D Inc. Semiconductor device and structure
US11430667B2 (en) 2012-12-29 2022-08-30 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US10600657B2 (en) 2012-12-29 2020-03-24 Monolithic 3D Inc 3D semiconductor device and structure
US11087995B1 (en) 2012-12-29 2021-08-10 Monolithic 3D Inc. 3D semiconductor device and structure
US10892169B2 (en) 2012-12-29 2021-01-12 Monolithic 3D Inc. 3D semiconductor device and structure
US10115663B2 (en) 2012-12-29 2018-10-30 Monolithic 3D Inc. 3D semiconductor device and structure
US9871034B1 (en) 2012-12-29 2018-01-16 Monolithic 3D Inc. Semiconductor device and structure
US11430668B2 (en) 2012-12-29 2022-08-30 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US12249538B2 (en) 2012-12-29 2025-03-11 Monolithic 3D Inc. 3D semiconductor device and structure including power distribution grids
US11004694B1 (en) 2012-12-29 2021-05-11 Monolithic 3D Inc. 3D semiconductor device and structure
US10903089B1 (en) 2012-12-29 2021-01-26 Monolithic 3D Inc. 3D semiconductor device and structure
US11177140B2 (en) 2012-12-29 2021-11-16 Monolithic 3D Inc. 3D semiconductor device and structure
US10651054B2 (en) 2012-12-29 2020-05-12 Monolithic 3D Inc. 3D semiconductor device and structure
US8931930B2 (en) 2013-01-29 2015-01-13 Nitto Denko Corporation Optical element for correcting color blindness
US10325651B2 (en) 2013-03-11 2019-06-18 Monolithic 3D Inc. 3D semiconductor device with stacked memory
US11935949B1 (en) 2013-03-11 2024-03-19 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US12094965B2 (en) 2013-03-11 2024-09-17 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US11869965B2 (en) 2013-03-11 2024-01-09 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US8902663B1 (en) 2013-03-11 2014-12-02 Monolithic 3D Inc. Method of maintaining a memory state
US11088130B2 (en) 2014-01-28 2021-08-10 Monolithic 3D Inc. 3D semiconductor device and structure
US11398569B2 (en) 2013-03-12 2022-07-26 Monolithic 3D Inc. 3D semiconductor device and structure
US8994404B1 (en) 2013-03-12 2015-03-31 Monolithic 3D Inc. Semiconductor device and structure
US10840239B2 (en) 2014-08-26 2020-11-17 Monolithic 3D Inc. 3D semiconductor device and structure
US12100646B2 (en) 2013-03-12 2024-09-24 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11923374B2 (en) 2013-03-12 2024-03-05 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US9117749B1 (en) 2013-03-15 2015-08-25 Monolithic 3D Inc. Semiconductor device and structure
US10224279B2 (en) 2013-03-15 2019-03-05 Monolithic 3D Inc. Semiconductor device and structure
JP6097128B2 (ja) 2013-04-12 2017-03-15 富士フイルム株式会社 遠赤外線遮光層形成用組成物
US11341309B1 (en) 2013-04-15 2022-05-24 Monolithic 3D Inc. Automation for monolithic 3D devices
US9021414B1 (en) 2013-04-15 2015-04-28 Monolithic 3D Inc. Automation for monolithic 3D devices
US11270055B1 (en) 2013-04-15 2022-03-08 Monolithic 3D Inc. Automation for monolithic 3D devices
US11574109B1 (en) 2013-04-15 2023-02-07 Monolithic 3D Inc Automation methods for 3D integrated circuits and devices
US11487928B2 (en) 2013-04-15 2022-11-01 Monolithic 3D Inc. Automation for monolithic 3D devices
US11030371B2 (en) 2013-04-15 2021-06-08 Monolithic 3D Inc. Automation for monolithic 3D devices
US11720736B2 (en) 2013-04-15 2023-08-08 Monolithic 3D Inc. Automation methods for 3D integrated circuits and devices
JP6469669B2 (ja) 2013-07-08 2019-02-13 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ オキシムエステル光開始剤
KR101414547B1 (ko) * 2013-07-08 2014-07-03 타코마테크놀러지 주식회사 광개시제용 화합물
JP2015038979A (ja) * 2013-07-18 2015-02-26 富士フイルム株式会社 イメージセンサー及びその製造方法
JP6162084B2 (ja) 2013-09-06 2017-07-12 富士フイルム株式会社 着色組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子、画像表示装置、ポリマー、キサンテン色素
CN105531260B (zh) * 2013-09-10 2019-05-31 巴斯夫欧洲公司 肟酯光引发剂
KR101478292B1 (ko) * 2013-11-05 2015-01-05 한국화학연구원 신규한 β-옥심에스테르 비페닐 화합물, 이를 포함하는 광개시제 및 감광성 수지 조성물
WO2015064958A1 (ko) * 2013-11-04 2015-05-07 한국화학연구원 신규한 옥심에스테르 비페닐 화합물, 이를 포함하는 광개시제 및 감광성 수지 조성물
KR101457172B1 (ko) * 2013-11-28 2014-10-31 타코마테크놀러지 주식회사 광개시제 및 이를 포함한 감광성 조성물
TWI668210B (zh) 2013-11-28 2019-08-11 塔可馬科技股份有限公司 光起始劑及包括該光起始劑之光敏性組合物
KR101435652B1 (ko) 2014-01-17 2014-08-28 주식회사 삼양사 신규한 β-옥심에스테르 플루오렌 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
US10297586B2 (en) 2015-03-09 2019-05-21 Monolithic 3D Inc. Methods for processing a 3D semiconductor device
US11107808B1 (en) 2014-01-28 2021-08-31 Monolithic 3D Inc. 3D semiconductor device and structure
US12094829B2 (en) 2014-01-28 2024-09-17 Monolithic 3D Inc. 3D semiconductor device and structure
US11031394B1 (en) 2014-01-28 2021-06-08 Monolithic 3D Inc. 3D semiconductor device and structure
CN103833872B (zh) * 2014-03-18 2016-04-06 常州强力先端电子材料有限公司 一种双肟酯类光引发剂及其制备方法和应用
CN103819583B (zh) 2014-03-18 2016-05-18 常州强力电子新材料股份有限公司 一种含硝基双肟酯类光引发剂及其制备方法和应用
CN104910053B (zh) * 2014-06-09 2017-09-12 北京英力科技发展有限公司 不对称二肟酯化合物及其制造方法与应用
CN104076606B (zh) * 2014-07-15 2019-12-03 常州强力电子新材料股份有限公司 一种含肟酯类光引发剂的感光性组合物及其应用
CN106662811A (zh) * 2014-07-24 2017-05-10 日立化成株式会社 感光性树脂组合物、感光性膜、图案基板、感光性导电膜及导电图案基板
JP6169545B2 (ja) 2014-09-09 2017-07-26 富士フイルム株式会社 重合性組成物、インクジェット記録用インク組成物、インクジェット記録方法、及び記録物
JP6086888B2 (ja) 2014-09-26 2017-03-01 富士フイルム株式会社 インクジェット記録用インク組成物、インクジェット記録方法、及び記録物
JP6169548B2 (ja) 2014-09-26 2017-07-26 富士フイルム株式会社 重合性組成物、インクジェット記録用インク組成物、インクジェット記録方法、及び記録物
KR101824429B1 (ko) 2015-01-26 2018-02-06 주식회사 삼양사 신규한 디옥심에스테르 화합물 및 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
CN104672354A (zh) * 2015-02-04 2015-06-03 天津墨森科技有限公司 一种双肟酯类光引发剂及其制备方法和应用
KR101824443B1 (ko) 2015-04-09 2018-02-05 주식회사 삼양사 신규한 플루오렌일 옥심 에스테르 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
KR101828927B1 (ko) 2015-02-06 2018-02-14 주식회사 삼양사 신규한 옥심에스테르 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
US11011507B1 (en) 2015-04-19 2021-05-18 Monolithic 3D Inc. 3D semiconductor device and structure
US10418369B2 (en) 2015-10-24 2019-09-17 Monolithic 3D Inc. Multi-level semiconductor memory device and structure
US12477752B2 (en) 2015-09-21 2025-11-18 Monolithic 3D Inc. 3D semiconductor memory devices and structures
US12035531B2 (en) 2015-10-24 2024-07-09 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US12219769B2 (en) 2015-10-24 2025-02-04 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US11056468B1 (en) 2015-04-19 2021-07-06 Monolithic 3D Inc. 3D semiconductor device and structure
US11978731B2 (en) 2015-09-21 2024-05-07 Monolithic 3D Inc. Method to produce a multi-level semiconductor memory device and structure
US10381328B2 (en) 2015-04-19 2019-08-13 Monolithic 3D Inc. Semiconductor device and structure
US11114464B2 (en) 2015-10-24 2021-09-07 Monolithic 3D Inc. 3D semiconductor device and structure
US11937422B2 (en) 2015-11-07 2024-03-19 Monolithic 3D Inc. Semiconductor memory device and structure
US12016181B2 (en) 2015-10-24 2024-06-18 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US11114427B2 (en) 2015-11-07 2021-09-07 Monolithic 3D Inc. 3D semiconductor processor and memory device and structure
US10825779B2 (en) 2015-04-19 2020-11-03 Monolithic 3D Inc. 3D semiconductor device and structure
US10847540B2 (en) 2015-10-24 2020-11-24 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11296115B1 (en) 2015-10-24 2022-04-05 Monolithic 3D Inc. 3D semiconductor device and structure
CN104817653B (zh) * 2015-04-22 2016-08-24 江南大学 一种香豆素肟酯类光引发剂及其制备方法
CN106278967B (zh) * 2015-06-03 2020-08-07 江苏和成新材料有限公司 用于uv固化材料的酰基肟酯类化合物及其合成方法及应用
KR101777845B1 (ko) 2015-06-08 2017-09-12 주식회사 삼양사 신규한 플루오란텐 옥심 에스테르 유도체, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
KR102613079B1 (ko) 2015-07-17 2023-12-12 타코마테크놀러지 주식회사 옥심에스테르 화합물 및 이를 포함하는 감광성 수지 조성물
KR101796993B1 (ko) 2015-08-24 2017-11-13 (주)켐이 플루오렌 유도체, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
KR101744197B1 (ko) 2015-07-31 2017-06-09 (주)켐이 플루오렌 유도체, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
US11956952B2 (en) 2015-08-23 2024-04-09 Monolithic 3D Inc. Semiconductor memory device and structure
WO2017033880A1 (ja) * 2015-08-24 2017-03-02 株式会社Adeka オキシムエステル化合物及び該化合物を含有する重合開始剤
US12178055B2 (en) 2015-09-21 2024-12-24 Monolithic 3D Inc. 3D semiconductor memory devices and structures
US12250830B2 (en) 2015-09-21 2025-03-11 Monolithic 3D Inc. 3D semiconductor memory devices and structures
DE112016004265T5 (de) 2015-09-21 2018-06-07 Monolithic 3D Inc. 3d halbleitervorrichtung und -struktur
US12100658B2 (en) 2015-09-21 2024-09-24 Monolithic 3D Inc. Method to produce a 3D multilayer semiconductor device and structure
US10522225B1 (en) 2015-10-02 2019-12-31 Monolithic 3D Inc. Semiconductor device with non-volatile memory
US11991884B1 (en) 2015-10-24 2024-05-21 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US12120880B1 (en) 2015-10-24 2024-10-15 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
KR102509606B1 (ko) 2015-10-30 2023-03-14 주식회사 삼양사 신규한 퀴놀리닐 베타 옥심에스테르 유도체 화합물, 이를 포함하는 광중합 개시제, 및 포토레지스트 조성물
CN105199018B (zh) * 2015-11-06 2017-03-22 常州久日化学有限公司 肟酯类光引发剂及其制备和应用
TWI634135B (zh) 2015-12-25 2018-09-01 日商富士軟片股份有限公司 樹脂、組成物、硬化膜、硬化膜的製造方法及半導體元件
JP6688087B2 (ja) * 2016-01-15 2020-04-28 株式会社Adeka 化合物、組成物及び光重合開始剤
WO2017158914A1 (ja) 2016-03-14 2017-09-21 富士フイルム株式会社 組成物、膜、硬化膜、光学センサおよび膜の製造方法
WO2017183428A1 (ja) 2016-04-21 2017-10-26 富士フイルム株式会社 画像表示機能付きミラーおよびハーフミラー
KR101892086B1 (ko) 2016-05-19 2018-08-27 주식회사 삼양사 옥심에스테르 유도체 화합물, 이를 포함하는 광중합 개시제, 및 감광성 조성물
TWI810158B (zh) 2016-08-01 2023-08-01 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、 積層體的製造方法及半導體元件
KR20180014982A (ko) * 2016-08-02 2018-02-12 동우 화인켐 주식회사 카바졸 유도체 및 이를 포함하는 광경화성 조성물
TW201821280A (zh) 2016-09-30 2018-06-16 日商富士軟片股份有限公司 積層體以及半導體元件的製造方法
US11329059B1 (en) 2016-10-10 2022-05-10 Monolithic 3D Inc. 3D memory devices and structures with thinned single crystal substrates
US11869591B2 (en) 2016-10-10 2024-01-09 Monolithic 3D Inc. 3D memory devices and structures with control circuits
US12225704B2 (en) 2016-10-10 2025-02-11 Monolithic 3D Inc. 3D memory devices and structures with memory arrays and metal layers
US11930648B1 (en) 2016-10-10 2024-03-12 Monolithic 3D Inc. 3D memory devices and structures with metal layers
US11251149B2 (en) 2016-10-10 2022-02-15 Monolithic 3D Inc. 3D memory device and structure
US11812620B2 (en) 2016-10-10 2023-11-07 Monolithic 3D Inc. 3D DRAM memory devices and structures with control circuits
US11711928B2 (en) 2016-10-10 2023-07-25 Monolithic 3D Inc. 3D memory devices and structures with control circuits
WO2018084076A1 (ja) 2016-11-04 2018-05-11 富士フイルム株式会社 ウインドシールドガラス、ヘッドアップディスプレイシステム、およびハーフミラーフィルム
KR101991838B1 (ko) 2016-12-28 2019-06-24 주식회사 삼양사 신규 1,3-벤조디아졸 베타-옥심 에스테르 화합물 및 이를 포함하는 조성물
KR102799810B1 (ko) 2017-02-02 2025-04-28 주식회사 삼양사 신규한 옥심에스테르 비페닐 화합물, 이를 포함하는 광중합 개시제 및 감광성 조성물
JP6867416B2 (ja) 2017-02-09 2021-04-28 富士フイルム株式会社 ハーフミラー、ハーフミラーの製造方法、および画像表示機能付きミラー
WO2018198559A1 (ja) 2017-04-28 2018-11-01 富士フイルム株式会社 画像表示機能付き防眩ミラー
CN110692018B (zh) 2017-05-31 2023-11-03 富士胶片株式会社 感光性树脂组合物、聚合物前体、固化膜、层叠体、固化膜的制造方法及半导体器件
CA3067711A1 (fr) * 2017-06-22 2018-12-27 Elkem Silicones France Sas Photoamorceurs radicalaires et leurs utilisations dans les compositions silicones
CN109305951A (zh) * 2017-07-26 2019-02-05 湖北固润科技股份有限公司 香豆素肟酯类化合物及其制备和应用
CN107599661B (zh) * 2017-08-30 2019-04-12 华中科技大学 一种可直接印刷的图像记录材料、制备方法
CN111051961B (zh) 2017-09-07 2021-12-24 富士胶片株式会社 投影图像显示用半反射镜膜、投影图像显示用夹层玻璃及图像显示系统
WO2019054281A1 (ja) 2017-09-15 2019-03-21 富士フイルム株式会社 組成物、膜、積層体、赤外線透過フィルタ、固体撮像素子および赤外線センサ
JP7163673B2 (ja) * 2017-10-02 2022-11-01 東洋インキＳｃホールディングス株式会社 カラーフィルタ用感光性着色組成物及びカラーフィルタ
CN109666088A (zh) * 2017-10-16 2019-04-23 北京英力科技发展有限公司 一种双酮肟酯化合物及其制造方法与应用
KR101991903B1 (ko) 2017-12-07 2019-10-01 주식회사 삼양사 카바졸 옥심에스테르 유도체 화합물 및 이를 포함하는 광중합 개시제와 감광성 조성물
JP6934101B2 (ja) 2018-02-23 2021-09-08 富士フイルム株式会社 画像表示用合わせガラスの製造方法、画像表示用合わせガラス、および、画像表示システム
JP7016403B2 (ja) 2018-03-13 2022-02-04 富士フイルム株式会社 硬化膜の製造方法、固体撮像素子の製造方法
KR102335614B1 (ko) * 2018-03-21 2021-12-03 동우 화인켐 주식회사 착색 감광성 수지 조성물, 이를 포함하는 컬러필터 및 화상표시장치
WO2020032167A1 (ja) 2018-08-09 2020-02-13 三菱ケミカル株式会社 ホログラム記録媒体用組成物及びホログラム記録媒体
KR20200024024A (ko) 2018-08-27 2020-03-06 동우 화인켐 주식회사 파이렌 유도체 및 이를 포함하는 광경화성 조성물
CN112601912A (zh) 2018-09-07 2021-04-02 富士胶片株式会社 车辆用前照灯单元、前照灯用遮光膜、前照灯用遮光膜的制造方法
JP7114724B2 (ja) 2018-09-20 2022-08-08 富士フイルム株式会社 硬化性組成物、硬化膜、赤外線透過フィルタ、積層体、固体撮像素子、センサ、及び、パターン形成方法
KR102571972B1 (ko) 2018-09-28 2023-08-29 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 및 반도체 디바이스
JP7177176B2 (ja) 2018-10-17 2022-11-22 富士フイルム株式会社 投映像表示用部材、ウインドシールドガラスおよびヘッドアップディスプレイシステム
SG11202105559WA (en) 2018-12-05 2021-06-29 Fujifilm Corp Photosensitive resin composition, pattern forming method, cured film, laminate, and device
JP7261818B2 (ja) 2018-12-05 2023-04-20 富士フイルム株式会社 パターン形成方法、感光性樹脂組成物、硬化膜、積層体、及び、デバイス
JP7299920B2 (ja) 2018-12-10 2023-06-28 富士フイルム株式会社 投映像表示用部材、ウインドシールドガラスおよびヘッドアップディスプレイシステム
KR102125820B1 (ko) 2018-12-24 2020-06-23 (주)경인양행 옥심 화합물을 포함하는 광중합 개시제 및 광경화형 잉크 조성물
KR102228630B1 (ko) 2018-12-28 2021-03-16 주식회사 삼양사 카바졸 멀티 베타 옥심에스테르 유도체 화합물 및 이를 포함하는 광중합 개시제와 포토레지스트 조성물
US20220121113A1 (en) 2019-01-23 2022-04-21 Basf Se Oxime ester photoinitiators having a special aroyl chromophore
JP6677330B2 (ja) * 2019-02-21 2020-04-08 三菱ケミカル株式会社 カルバゾール化合物
CN113498487B (zh) 2019-03-06 2023-07-04 富士胶片株式会社 投影图像显示用层叠膜、投影图像显示用的夹层玻璃及图像显示系统
KR102647598B1 (ko) 2019-03-15 2024-03-14 후지필름 가부시키가이샤 경화성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 반도체 디바이스, 및, 폴리머 전구체
WO2020203277A1 (ja) 2019-03-29 2020-10-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、インダクタ、アンテナ
US10892016B1 (en) 2019-04-08 2021-01-12 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11018156B2 (en) 2019-04-08 2021-05-25 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11296106B2 (en) 2019-04-08 2022-04-05 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11158652B1 (en) 2019-04-08 2021-10-26 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11763864B2 (en) 2019-04-08 2023-09-19 Monolithic 3D Inc. 3D memory semiconductor devices and structures with bit-line pillars
JP2020200272A (ja) * 2019-06-11 2020-12-17 株式会社Adeka カルバモイルオキシム化合物並びに該化合物を含有する重合開始剤及び重合性組成物
US12172962B2 (en) 2019-06-21 2024-12-24 IGM (Anqing) High Technology Development Co., Ltd. Diaroyl carbazole compound and use thereof as sensitising agent
CN112111028A (zh) 2019-06-21 2020-12-22 江苏英力科技发展有限公司 一种含有酰基咔唑衍生物和咔唑基肟酯的光引发剂组合物及其在光固化组合物中的应用
TWI842917B (zh) 2019-06-27 2024-05-21 日商富士軟片股份有限公司 組成物、膜及光感測器
WO2021039205A1 (ja) 2019-08-29 2021-03-04 富士フイルム株式会社 組成物、膜、近赤外線カットフィルタ、パターン形成方法、積層体、固体撮像素子、赤外線センサ、画像表示装置、カメラモジュール、及び、化合物
KR102838505B1 (ko) 2019-08-30 2025-07-25 후지필름 가부시키가이샤 조성물, 막, 광학 필터 및 그 제조 방법, 고체 촬상 소자, 적외선 센서, 및, 센서 모듈
TWI851818B (zh) 2019-09-26 2024-08-11 日商富士軟片股份有限公司 導熱層的製造方法、積層體的製造方法及半導體器件的製造方法
EP4036644B1 (en) 2019-09-27 2025-04-23 FUJIFILM Corporation Projector for head-up display
TWI859361B (zh) 2019-11-21 2024-10-21 日商富士軟片股份有限公司 圖案形成方法、光硬化性樹脂組成物、積層體的製造方法及電子元件的製造方法
CN114867790B (zh) 2019-12-25 2025-08-19 富士胶片株式会社 树脂组合物、固化物、紫外线吸收剂、紫外线截止滤波器、透镜、保护材料、化合物及化合物的合成方法
TWI894219B (zh) 2020-03-04 2025-08-21 德商巴地斯顏料化工廠 肟酯光起始劑
WO2021199748A1 (ja) 2020-03-30 2021-10-07 富士フイルム株式会社 組成物、膜及び光センサ
WO2021200655A1 (ja) 2020-03-30 2021-10-07 富士フイルム株式会社 反射フィルム、ウインドシールドガラスおよびヘッドアップディスプレイシステム
TWI881096B (zh) 2020-03-30 2025-04-21 日商艾迪科股份有限公司 自由基聚合起始劑、組合物、硬化物及硬化物之製造方法
CN115698783A (zh) 2020-06-03 2023-02-03 富士胶片株式会社 反射膜、夹层玻璃的制造方法及夹层玻璃
CN115776992B (zh) 2020-08-21 2024-10-22 富士胶片株式会社 聚合性组合物、聚合物、紫外线遮蔽材料、层叠体、化合物、紫外线吸收剂及化合物的制造方法
WO2022059706A1 (ja) 2020-09-18 2022-03-24 富士フイルム株式会社 組成物、磁性粒子含有膜、及び、電子部品
JPWO2022065183A1 (https=) 2020-09-24 2022-03-31
EP4220859A4 (en) 2020-09-28 2024-03-27 FUJIFILM Corporation LAMINATE PRODUCTION PROCESS, ANTENNA-IN-PACKAGE PRODUCTION PROCESS, LAMINATE AND COMPOSITION
WO2022123946A1 (ja) 2020-12-09 2022-06-16 富士フイルム株式会社 反射フィルム、ウインドシールドガラスおよびヘッドアップディスプレイシステム
WO2022131191A1 (ja) 2020-12-16 2022-06-23 富士フイルム株式会社 組成物、膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
WO2022130773A1 (ja) 2020-12-17 2022-06-23 富士フイルム株式会社 組成物、膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
KR102547857B1 (ko) 2020-12-31 2023-06-28 (주)켐이 페노티아진 화합물, 이를 포함하는 광중합 개시제 및 이를 포함하는 전자재료용 조성물
JPWO2022196599A1 (https=) 2021-03-19 2022-09-22
TW202248755A (zh) 2021-03-22 2022-12-16 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化物、積層體、硬化物的製造方法以及半導體元件
KR102925447B1 (ko) 2021-03-22 2026-02-12 후지필름 가부시키가이샤 조성물, 자성 입자 함유 경화물, 자성 입자 도입 기판, 전자 재료
EP4318057A4 (en) 2021-03-29 2024-11-06 FUJIFILM Corporation BLACK PHOTOSENSITIVE COMPOSITION, METHOD FOR MANUFACTURING BLACK PHOTOSENSITIVE COMPOSITION, CURED FILM, COLOR FILTER, LIGHT-SHIELDING FILM, OPTICAL ELEMENT, SOLID-STATE IMAGE PICK-UP ELEMENT, AND HEADLIGHT UNIT
EP4357375A4 (en) * 2021-06-15 2025-06-25 Mitsubishi Gas Chemical Company, Inc. RESIN COMPOSITION, RESIN FILM, MULTILAYER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
JP7259141B1 (ja) 2021-08-31 2023-04-17 富士フイルム株式会社 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法、並びに、処理液
JP7789513B2 (ja) * 2021-08-31 2025-12-22 富士フイルム株式会社 組成物、遮光膜、固体撮像素子、画像表示装置、硬化膜の製造方法
EP4410855A4 (en) 2021-09-29 2024-12-18 FUJIFILM Corporation COMPOSITION, RESIN, FILM AND OPTICAL SENSOR
EP4411452A4 (en) 2021-09-30 2025-02-05 FUJIFILM Corporation Head-up display system and transport
EP4410902A4 (en) 2021-09-30 2025-01-22 FUJIFILM Corporation METHOD FOR PRODUCING A COMPOSITION CONTAINING MAGNETIC PARTICLES, CURED PRODUCT CONTAINING MAGNETIC PARTICLES, SUBSTRATE CONTAINING MAGNETIC PARTICLES AND ELECTRONIC MATERIAL
EP4428599A4 (en) 2021-11-05 2025-03-05 FUJIFILM Corporation VIRTUAL IMAGE DISPLAY DEVICE, HEAD-UP DISPLAY SYSTEM, AND TRANSPORTATION VEHICLE
JP7354479B1 (ja) 2021-12-23 2023-10-02 富士フイルム株式会社 接合体の製造方法、接合体、積層体の製造方法、積層体、デバイスの製造方法、及び、デバイス、並びに、ポリイミド含有前駆体部形成用組成物
KR102927378B1 (ko) 2022-02-24 2026-02-13 후지필름 가부시키가이샤 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 적층체의 제조 방법, 반도체 디바이스의 제조 방법, 및, 반도체 디바이스
KR20240156619A (ko) 2022-03-29 2024-10-30 후지필름 가부시키가이샤 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 적층체의 제조 방법, 반도체 디바이스의 제조 방법, 및, 반도체 디바이스
EP4509887A4 (en) 2022-04-15 2025-10-08 Fujifilm Corp REFLECTIVE FILM, MULTILAYER BODY, WINDSHIELD GLASS AND IMAGE DISPLAY SYSTEM
EP4535432A4 (en) 2022-06-01 2025-10-29 Fujifilm Corp PHOTOSENSING ELEMENT, IMAGE SENSOR AND METHOD FOR MANUFACTURING PHOTOSENSING ELEMENT
EP4535047A4 (en) 2022-06-01 2025-10-08 Fujifilm Corp LIGHT DETECTION ELEMENT, IMAGE SENSOR, AND METHOD FOR PRODUCING LIGHT DETECTION ELEMENT
WO2023234094A1 (ja) 2022-06-01 2023-12-07 富士フイルム株式会社 光検出素子、イメージセンサおよび光検出素子の製造方法
EP4597225A4 (en) 2022-09-30 2026-01-21 Fujifilm Corp FILM PRODUCTION PROCESS, PHOTOSENSITIVE RESIN COMPOSITION, HARDENED PRODUCT PROCESS, HARDENED AND LAMINATED PRODUCT
CN120051506A (zh) 2022-09-30 2025-05-27 富士胶片株式会社 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件
TW202424051A (zh) 2022-09-30 2024-06-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法及半導體元件
WO2024181097A1 (ja) * 2023-02-27 2024-09-06 富士フイルム株式会社 光硬化性組成物、硬化物の製造方法、膜、光学素子、イメージセンサ、固体撮像素子、画像表示装置、及び、ラジカル重合開始剤
JPWO2024203080A1 (https=) 2023-03-31 2024-10-03
KR20260035964A (ko) 2023-07-10 2026-03-13 바스프 에스이 저온 경화에 적합한 광경화성 및 열 경화성 조성물
WO2025063284A1 (ja) * 2023-09-22 2025-03-27 ミヨシ油脂株式会社 重合開始剤又は光増感剤、重合開始組成物及び樹脂の製造方法
KR20250165188A (ko) 2024-05-17 2025-11-25 동우 화인켐 주식회사 옥심 에스테르 화합물 및 이를 포함하는 광 개시제
CN118184557B (zh) * 2024-05-17 2024-08-06 上海交通大学 一种基于查尔酮的肟酯类光引发剂及其制备方法和应用
KR20250176507A (ko) 2024-06-12 2025-12-19 동우 화인켐 주식회사 옥심 에스테르 화합물 및 이를 포함하는 광 개시제

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180846A (en) * 1967-08-08 1970-02-11 Agfa Gevaert Nv Photopolymerisation of Ethylenically Unsaturated Organic Compounds
FR2393345A1 (fr) * 1977-06-01 1978-12-29 Agfa Gevaert Nv Fabrication d'elements modifies sous forme d'images
GB2029423A (en) * 1978-08-25 1980-03-19 Agfa Gevaert Nv Photo-polymerisable materials and recording method
US4590145A (en) * 1985-06-28 1986-05-20 Daicel Chemical Industries, Ltd. Photopolymerization initiator comprised of thioxanthones and oxime esters
US5019482A (en) * 1987-08-12 1991-05-28 Asahi Kasei Kogyo Kabushiki Kaisha Polymer/oxime ester/coumarin compound photosensitive composition
KR0147207B1 (ko) 1993-07-28 1998-08-17 단노 다께시 광개시제 조성물 및 그를 사용한 감광성 물질
JPH07278214A (ja) 1994-02-15 1995-10-24 Hitachi Chem Co Ltd 光開始剤、感光性組成物、感光材料およびパターンの製造法
JPH0990627A (ja) * 1995-09-27 1997-04-04 Toray Ind Inc 感光性ポリイミド前駆体組成物
US20010037037A1 (en) * 1995-10-31 2001-11-01 Kurt Dietliker Oximesulfonic acid esters and the use thereof as latent sulfonic acids
JP3672126B2 (ja) 1996-03-18 2005-07-13 富士写真フイルム株式会社 光重合性組成物
US6770420B2 (en) * 1996-09-02 2004-08-03 Ciba Specialty Chemicals Corporation Alkylsulfonyloximes for high-resolution i-line photoresists of high sensitivity
SG77689A1 (en) 1998-06-26 2001-01-16 Ciba Sc Holding Ag New o-acyloxime photoinitiators
MY121423A (en) 1998-06-26 2006-01-28 Ciba Sc Holding Ag Photopolymerizable thermosetting resin compositions
AU4102100A (en) * 1999-03-03 2000-09-21 Ciba Specialty Chemicals Holding Inc. Oxime derivatives and the use thereof as photoinitiators
NL1014545C2 (nl) * 1999-03-31 2002-02-26 Ciba Sc Holding Ag Oxim-derivaten en de toepassing daarvan als latente zuren.
NL1016815C2 (nl) * 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester-fotoinitiatoren.
SG97168A1 (en) * 1999-12-15 2003-07-18 Ciba Sc Holding Ag Photosensitive resin composition
TWI272451B (en) * 2000-09-25 2007-02-01 Ciba Sc Holding Ag Chemically amplified photoresist composition, process for preparation of a photoresist, and use of said chemically amplified photoresist composition
DK1392675T3 (da) * 2001-06-01 2005-04-04 Ciba Sc Holding Ag Substituerede oximderivater og anvendelsen deraf som latente syrer
JP4337481B2 (ja) * 2002-09-17 2009-09-30 東レ株式会社 ネガ型感光性樹脂前駆体組成物およびそれを用いた電子部品ならびに表示装置
CN1241562C (zh) * 2004-08-05 2006-02-15 陕西师范大学 连翘苷在制备治疗肥胖病口服药物和保健食品中的应用

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008139924A1 (ja) 2007-05-09 2008-11-20 Adeka Corporation 新規エポキシ化合物、アルカリ現像性樹脂組成物およびアルカリ現像性感光性樹脂組成物
WO2009017064A1 (ja) 2007-08-01 2009-02-05 Adeka Corporation アルカリ現像性感光性樹脂組成物及びβ－ジケトン化合物
WO2009104468A1 (ja) 2008-02-22 2009-08-27 株式会社Adeka 重合性化合物を含有する液晶組成物及び該液晶組成物を用いた液晶表示素子
WO2009122868A1 (ja) 2008-04-01 2009-10-08 株式会社Adeka 三官能（メタ）アクリレート化合物及び該化合物を含有する重合性組成物
WO2011062017A1 (ja) 2009-11-18 2011-05-26 株式会社Adeka 重合性化合物を含有する液晶組成物及び該液晶組成物を用いた液晶表示素子
JP2013042096A (ja) * 2011-08-19 2013-02-28 Dainippon Printing Co Ltd 光インプリント用感光性樹脂組成物、硬化物、レジスト基板及び半導体装置の製造方法
WO2022131346A1 (ja) 2020-12-17 2022-06-23 株式会社Adeka 化合物及び組成物
WO2023002928A1 (ja) 2021-07-20 2023-01-26 株式会社Adeka 半導体用膜形成材料、半導体用部材形成材料、半導体用工程部材形成材料、下層膜形成材料、下層膜及び半導体デバイス
WO2024090369A1 (ja) 2022-10-26 2024-05-02 株式会社Adeka 化合物、組成物、硬化物、硬化物の製造方法及び電子部品の製造方法

Also Published As

Publication number Publication date
WO2002100903A1 (en) 2002-12-19
KR100801457B1 (ko) 2008-02-11
US20040170924A1 (en) 2004-09-02
DE60234095D1 (de) 2009-12-03
US7189489B2 (en) 2007-03-13
JP2004534797A (ja) 2004-11-18
CN100528838C (zh) 2009-08-19
TW593357B (en) 2004-06-21
CN1514845A (zh) 2004-07-21
CA2446722A1 (en) 2002-12-19
KR20040007700A (ko) 2004-01-24
ATE446322T1 (de) 2009-11-15
JP2006342166A (ja) 2006-12-21
EP1395615B1 (en) 2009-10-21
EP1395615A1 (en) 2004-03-10

Similar Documents

Publication Publication Date Title
JP3860170B2 (ja) 組み合わされた構造を有するオキシムエステルの光開始剤
JP5289649B2 (ja) オキシムエステルの光開始剤
JP4532726B2 (ja) 感光性樹脂組成物
JP5312743B2 (ja) オキシム化合物及びそれを含む感光性組成物
JP4312598B2 (ja) 感光性樹脂組成物
JP4878028B2 (ja) オキシムエステル光開始剤
KR101402636B1 (ko) 옥심 에스테르 광개시제
JP4769461B2 (ja) ヘテロ芳香族基を有するオキシムエステル光開始剤
KR101351286B1 (ko) 옥심 에스테르 광개시제
JP6008822B2 (ja) オキシムエステル光重合開始剤
JP5535065B2 (ja) オキシムエステル光重合開始剤
JP5535064B2 (ja) オキシムエステル光重合開始剤
KR101626172B1 (ko) 옥심 에스테르 광개시제
JP2009040762A (ja) オキシムエステル光開始剤
JP2014500852A (ja) ベンゾカルバゾール化合物のオキシムエステル誘導体ならびに前記誘導体の光重合性の組成物における光開始剤としての使用
JP4874659B2 (ja) アニリン化合物及びその製造方法、並びに、感光性組成物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050518

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050518

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050602

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20050602

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20050602

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20050610

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20050728

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050816

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051116

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20060214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20060515

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060614

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20060814

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060912

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060920

R150 Certificate of patent or registration of utility model

Ref document number: 3860170

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100929

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100929

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110929

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120929

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130929

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

Free format text: JAPANESE INTERMEDIATE CODE: R313113

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term