TW200519535A - Hardenable resin composition, hardened body thereof, and printed circuit board - Google Patents

Hardenable resin composition, hardened body thereof, and printed circuit board

Info

Publication number
TW200519535A
TW200519535A TW093135867A TW93135867A TW200519535A TW 200519535 A TW200519535 A TW 200519535A TW 093135867 A TW093135867 A TW 093135867A TW 93135867 A TW93135867 A TW 93135867A TW 200519535 A TW200519535 A TW 200519535A
Authority
TW
Taiwan
Prior art keywords
resin composition
hardenable resin
circuit board
printed circuit
hardened body
Prior art date
Application number
TW093135867A
Inventor
Kenji Kato
Gen Itokawa
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2003398088 priority Critical
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200519535A publication Critical patent/TW200519535A/en

Links

Abstract

The purpose of the present invention is to provide a hardenable resin composition which can have superior surface hardenable property by irradiation with an active energy beam of 350 to 420 nm in wavelength. The hardenable resin composition contains: a compound (A) having at least one unsaturated double bond; a compound (B) having an oxime ester group; and a benzophenone compound (C ) containing sulfur atoms and hardened with an active energy beam of 350 to 420 nm in wavelength.
TW093135867A 2003-11-27 2004-11-22 Hardenable resin composition, hardened body thereof, and printed circuit board TW200519535A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003398088 2003-11-27

Publications (1)

Publication Number Publication Date
TW200519535A true TW200519535A (en) 2005-06-16

Family

ID=36769928

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093135867A TW200519535A (en) 2003-11-27 2004-11-22 Hardenable resin composition, hardened body thereof, and printed circuit board

Country Status (4)

Country Link
JP (1) JP4865044B2 (en)
KR (1) KR101048940B1 (en)
CN (1) CN1779568B (en)
TW (1) TW200519535A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402619B (en) * 2007-03-29 2013-07-21 Tokyo Ohka Kogyo Co Ltd

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4849860B2 (en) * 2005-10-04 2012-01-11 太陽ホールディングス株式会社 Photocurable and thermosetting resin composition and its cured product and a printed wiring board obtained by using the
KR100781873B1 (en) * 2006-01-02 2007-12-05 주식회사 엘지화학 Photoactive oxime ester based compounds and photosensitive composition comprising the same
JP4864545B2 (en) * 2006-05-26 2012-02-01 太陽ホールディングス株式会社 Thermosetting solder resist composition for a flexible substrate, method of manufacturing a flexible substrate and a flexible substrate
KR100904348B1 (en) * 2006-10-24 2009-06-23 다이요 잉키 세이조 가부시키가이샤 Photocurable thermosetting resin composition and printed wiring board using same
JP5079310B2 (en) 2006-11-15 2012-11-21 太陽ホールディングス株式会社 Method of forming a solder resist pattern exposure process using a photo-tool and for it the solder resist exposure
TW200844660A (en) 2006-11-15 2008-11-16 Taiyo Ink Mfg Co Ltd Alkali development type paste composition, method for conductive pattern and black matrix pattern formation using the same, and the conductive pattern and the black matrix pattern
KR101277020B1 (en) * 2010-09-30 2013-06-24 다이요 홀딩스 가부시키가이샤 Photosensitive conductive paste
JP5744528B2 (en) * 2011-01-11 2015-07-08 東京応化工業株式会社 The colored photosensitive resin composition for a touch panel, a touch panel, and a display device
JP2012163735A (en) * 2011-02-07 2012-08-30 Toyo Ink Sc Holdings Co Ltd Photosensitive resin composition, and protective film and insulating film for touch panel using the composition
KR101692003B1 (en) * 2013-12-24 2017-01-03 코오롱인더스트리 주식회사 The photosensitive resin composition for dry film photoresist

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG77689A1 (en) 1998-06-26 2001-01-16 Ciba Sc Holding Ag New o-acyloxime photoinitiators
KR100563019B1 (en) * 1998-06-26 2006-03-22 시바 스페셜티 케미칼스 홀딩 인크. Photopolymerizable photosensitive thermosetting liquid compositions
MY121423A (en) 1998-06-26 2006-01-28 Ciba Sc Holding Ag Photopolymerizable thermosetting resin compositions
JP4033428B2 (en) 1999-03-31 2008-01-16 日本化薬株式会社 New unsaturated group-containing polycarboxylic acid resin, a resin composition and a cured product thereof
SG97168A1 (en) 1999-12-15 2003-07-18 Ciba Sc Holding Ag Photosensitive resin composition
NL1016815C2 (en) 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester photoinitiators.
JP2001302871A (en) 2000-04-25 2001-10-31 Taiyo Ink Mfg Ltd Photocurable/thermosetting resin composition and printed wiring board having solder resist coating film and resin insulating layer formed by using the same
US7189489B2 (en) 2001-06-11 2007-03-13 Ciba Specialty Chemicals Corporation Oxime ester photoiniators having a combined structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402619B (en) * 2007-03-29 2013-07-21 Tokyo Ohka Kogyo Co Ltd

Also Published As

Publication number Publication date
CN1779568B (en) 2010-10-06
CN1779568A (en) 2006-05-31
KR101048940B1 (en) 2011-07-12
KR20050051574A (en) 2005-06-01
JP4865044B2 (en) 2012-02-01
JP2010160495A (en) 2010-07-22

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