CN1514845A - 具有复合结构的肟酯光引发剂 - Google Patents
具有复合结构的肟酯光引发剂 Download PDFInfo
- Publication number
- CN1514845A CN1514845A CNA028116755A CN02811675A CN1514845A CN 1514845 A CN1514845 A CN 1514845A CN A028116755 A CNA028116755 A CN A028116755A CN 02811675 A CN02811675 A CN 02811675A CN 1514845 A CN1514845 A CN 1514845A
- Authority
- CN
- China
- Prior art keywords
- alkyl
- phenyl
- group
- replace
- halogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 Oxime ester Chemical class 0.000 title claims description 225
- 239000002131 composite material Substances 0.000 title claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 229
- 150000001875 compounds Chemical class 0.000 claims abstract description 80
- 239000001257 hydrogen Substances 0.000 claims abstract description 65
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 65
- 150000002431 hydrogen Chemical class 0.000 claims abstract description 47
- 125000006552 (C3-C8) cycloalkyl group Chemical group 0.000 claims abstract description 24
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims abstract description 19
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 11
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 157
- 229910052736 halogen Inorganic materials 0.000 claims description 145
- 150000002367 halogens Chemical class 0.000 claims description 144
- 125000001624 naphthyl group Chemical group 0.000 claims description 82
- 239000000463 material Substances 0.000 claims description 78
- 239000000049 pigment Substances 0.000 claims description 70
- 239000010410 layer Substances 0.000 claims description 65
- 238000000576 coating method Methods 0.000 claims description 58
- 239000011248 coating agent Substances 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 49
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims description 44
- 229920005989 resin Polymers 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 43
- 229910052799 carbon Inorganic materials 0.000 claims description 39
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 32
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 claims description 31
- 229910052760 oxygen Inorganic materials 0.000 claims description 31
- 239000003795 chemical substances by application Substances 0.000 claims description 29
- 239000001301 oxygen Substances 0.000 claims description 28
- 238000005516 engineering process Methods 0.000 claims description 24
- 239000000178 monomer Substances 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 23
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 22
- 150000001721 carbon Chemical group 0.000 claims description 22
- 239000000843 powder Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 16
- 238000003384 imaging method Methods 0.000 claims description 16
- 239000000654 additive Substances 0.000 claims description 14
- 125000004414 alkyl thio group Chemical group 0.000 claims description 14
- 125000004642 (C1-C12) alkoxy group Chemical group 0.000 claims description 13
- 230000000996 additive effect Effects 0.000 claims description 13
- 125000001038 naphthoyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 claims description 12
- 239000003504 photosensitizing agent Substances 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 12
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 11
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 11
- 125000006710 (C2-C12) alkenyl group Chemical group 0.000 claims description 10
- 239000012965 benzophenone Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 125000006729 (C2-C5) alkenyl group Chemical group 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 9
- 239000011230 binding agent Substances 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 9
- 239000003999 initiator Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 9
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 claims description 8
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 claims description 8
- 239000003973 paint Substances 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000499 gel Substances 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- 239000002491 polymer binding agent Substances 0.000 claims description 6
- 125000001118 alkylidene group Chemical group 0.000 claims description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 5
- 238000010894 electron beam technology Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 125000005913 (C3-C6) cycloalkyl group Chemical group 0.000 claims description 4
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 4
- 150000004056 anthraquinones Chemical class 0.000 claims description 4
- 125000001231 benzoyloxy group Chemical group C(C1=CC=CC=C1)(=O)O* 0.000 claims description 4
- 125000000051 benzyloxy group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])O* 0.000 claims description 4
- 125000004956 cyclohexylene group Chemical group 0.000 claims description 4
- 239000003094 microcapsule Substances 0.000 claims description 4
- 229920000620 organic polymer Polymers 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 239000002966 varnish Substances 0.000 claims description 4
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 238000004377 microelectronic Methods 0.000 claims description 3
- 238000010186 staining Methods 0.000 claims description 3
- 125000004765 (C1-C4) haloalkyl group Chemical group 0.000 claims description 2
- 125000004423 acyloxy group Chemical group 0.000 claims description 2
- 230000005670 electromagnetic radiation Effects 0.000 claims description 2
- 238000009825 accumulation Methods 0.000 claims 2
- 238000005253 cladding Methods 0.000 claims 2
- 235000003642 hunger Nutrition 0.000 claims 2
- FNIATMYXUPOJRW-UHFFFAOYSA-N cyclohexylidene Chemical group [C]1CCCCC1 FNIATMYXUPOJRW-UHFFFAOYSA-N 0.000 claims 1
- 235000015110 jellies Nutrition 0.000 claims 1
- 239000008274 jelly Substances 0.000 claims 1
- 150000003254 radicals Chemical class 0.000 abstract description 25
- 238000006243 chemical reaction Methods 0.000 abstract description 19
- 125000002947 alkylene group Chemical group 0.000 abstract 1
- 239000002585 base Substances 0.000 description 77
- 239000010408 film Substances 0.000 description 34
- 150000002148 esters Chemical class 0.000 description 29
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 27
- 239000000126 substance Substances 0.000 description 26
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 25
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical group COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 24
- 239000007787 solid Substances 0.000 description 24
- 239000000243 solution Substances 0.000 description 24
- 239000002904 solvent Substances 0.000 description 24
- 239000004973 liquid crystal related substance Substances 0.000 description 21
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 20
- 239000002253 acid Substances 0.000 description 20
- 239000011342 resin composition Substances 0.000 description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 17
- 238000002360 preparation method Methods 0.000 description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 16
- 239000011521 glass Substances 0.000 description 16
- 229920002554 vinyl polymer Polymers 0.000 description 16
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 15
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- 229910052757 nitrogen Inorganic materials 0.000 description 15
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000007639 printing Methods 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 12
- 230000005855 radiation Effects 0.000 description 12
- 238000011161 development Methods 0.000 description 11
- 230000018109 developmental process Effects 0.000 description 11
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 11
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 11
- 150000001412 amines Chemical class 0.000 description 10
- 125000003118 aryl group Chemical group 0.000 description 10
- 150000002576 ketones Chemical class 0.000 description 10
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 10
- 229920003002 synthetic resin Polymers 0.000 description 10
- 239000000057 synthetic resin Substances 0.000 description 10
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 230000002378 acidificating effect Effects 0.000 description 9
- 239000003513 alkali Substances 0.000 description 9
- 239000000975 dye Substances 0.000 description 9
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 8
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 8
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 8
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 8
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 8
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 8
- LDHQCZJRKDOVOX-UHFFFAOYSA-N 2-butenoic acid Chemical compound CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 7
- 241000790917 Dioxys <bee> Species 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 7
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 7
- 239000000460 chlorine Substances 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 230000032050 esterification Effects 0.000 description 7
- 238000005886 esterification reaction Methods 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 6
- 206010034960 Photophobia Diseases 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 150000001408 amides Chemical class 0.000 description 6
- 239000011324 bead Substances 0.000 description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 6
- 229920002678 cellulose Polymers 0.000 description 6
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 208000013469 light sensitivity Diseases 0.000 description 6
- 125000004430 oxygen atom Chemical group O* 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 229940059574 pentaerithrityl Drugs 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- 239000011541 reaction mixture Substances 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- 238000007669 thermal treatment Methods 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- PZBQVZFITSVHAW-UHFFFAOYSA-N 5-chloro-2h-benzotriazole Chemical compound C1=C(Cl)C=CC2=NNN=C21 PZBQVZFITSVHAW-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000012964 benzotriazole Substances 0.000 description 5
- NCPTYZLUYHXITE-UHFFFAOYSA-N benzyl but-2-enoate Chemical compound CC=CC(=O)OCC1=CC=CC=C1 NCPTYZLUYHXITE-UHFFFAOYSA-N 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 239000001913 cellulose Substances 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 239000007859 condensation product Substances 0.000 description 5
- 238000007334 copolymerization reaction Methods 0.000 description 5
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 5
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 5
- 239000011976 maleic acid Substances 0.000 description 5
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 5
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 5
- 150000002923 oximes Chemical class 0.000 description 5
- 238000000016 photochemical curing Methods 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
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- 230000008569 process Effects 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 4
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 4
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 4
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 description 4
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
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- CHDKQNHKDMEASZ-UHFFFAOYSA-N n-prop-2-enoylprop-2-enamide Chemical compound C=CC(=O)NC(=O)C=C CHDKQNHKDMEASZ-UHFFFAOYSA-N 0.000 description 1
- IIJAWKYEJBPVLP-UHFFFAOYSA-N naphthalen-1-yl but-2-enoate Chemical compound C1=CC=C2C(OC(=O)C=CC)=CC=CC2=C1 IIJAWKYEJBPVLP-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 125000006501 nitrophenyl group Chemical group 0.000 description 1
- 125000001402 nonanoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CSWFWSPPZMEYAY-UHFFFAOYSA-N octadecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(O)O CSWFWSPPZMEYAY-UHFFFAOYSA-N 0.000 description 1
- BWJNKHVUFMTHNX-UHFFFAOYSA-N octan-3-yl but-2-enoate Chemical compound CCCCCC(CC)OC(=O)C=CC BWJNKHVUFMTHNX-UHFFFAOYSA-N 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 125000002801 octanoyl group Chemical group C(CCCCCCC)(=O)* 0.000 description 1
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- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical compound O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 description 1
- CFHIDWOYWUOIHU-UHFFFAOYSA-N oxomethyl Chemical compound O=[CH] CFHIDWOYWUOIHU-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 125000001312 palmitoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 229940023462 paste product Drugs 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-M pent-4-enoate Chemical compound [O-]C(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-M 0.000 description 1
- 150000002976 peresters Chemical class 0.000 description 1
- ZXZQTFMZNDZRQU-UHFFFAOYSA-N perylene pyren-1-amine Chemical group C1=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45.NC4=CC=C5C=CC2=CC=CC3=CC=C4C5=C23 ZXZQTFMZNDZRQU-UHFFFAOYSA-N 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- VCAFTIGPOYBOIC-UHFFFAOYSA-N phenyl dihydrogen phosphite Chemical compound OP(O)OC1=CC=CC=C1 VCAFTIGPOYBOIC-UHFFFAOYSA-N 0.000 description 1
- WSDQIHATCCOMLH-UHFFFAOYSA-N phenyl n-(3,5-dichlorophenyl)carbamate Chemical compound ClC1=CC(Cl)=CC(NC(=O)OC=2C=CC=CC=2)=C1 WSDQIHATCCOMLH-UHFFFAOYSA-N 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical compound OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 238000009700 powder processing Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- ZQMAPKVSTSACQB-UHFFFAOYSA-N prop-2-enyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCC=C ZQMAPKVSTSACQB-UHFFFAOYSA-N 0.000 description 1
- HPCIWDZYMSZAEZ-UHFFFAOYSA-N prop-2-enyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC=C HPCIWDZYMSZAEZ-UHFFFAOYSA-N 0.000 description 1
- AABBHSMFGKYLKE-UHFFFAOYSA-N propan-2-yl but-2-enoate Chemical class CC=CC(=O)OC(C)C AABBHSMFGKYLKE-UHFFFAOYSA-N 0.000 description 1
- VVWRJUBEIPHGQF-UHFFFAOYSA-N propan-2-yl n-propan-2-yloxycarbonyliminocarbamate Chemical compound CC(C)OC(=O)N=NC(=O)OC(C)C VVWRJUBEIPHGQF-UHFFFAOYSA-N 0.000 description 1
- FAIDIRVMPHBRLT-UHFFFAOYSA-N propane-1,2,3-triol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OCC(O)CO FAIDIRVMPHBRLT-UHFFFAOYSA-N 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006233 propoxy propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000006225 propoxyethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000005767 propoxymethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])[#8]C([H])([H])* 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000010106 rotational casting Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical compound [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 235000010288 sodium nitrite Nutrition 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000003696 stearoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- QHSPZGZEUDEIQM-UHFFFAOYSA-N tert-butyl but-2-enoate Chemical compound CC=CC(=O)OC(C)(C)C QHSPZGZEUDEIQM-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical compound C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- AYNNSCRYTDRFCP-UHFFFAOYSA-N triazene Chemical compound NN=N AYNNSCRYTDRFCP-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
- ORHBXUUXSCNDEV-UHFFFAOYSA-N umbelliferone Chemical compound C1=CC(=O)OC2=CC(O)=CC=C21 ORHBXUUXSCNDEV-UHFFFAOYSA-N 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 125000003774 valeryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
- C07C251/32—Oximes
- C07C251/62—Oximes having oxygen atoms of oxyimino groups esterified
- C07C251/64—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids
- C07C251/66—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids with the esterifying carboxyl groups bound to hydrogen atoms, to acyclic carbon atoms or to carbon atoms of rings other than six-membered aromatic rings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymerisation Methods In General (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Materials For Photolithography (AREA)
- Indole Compounds (AREA)
- Pyrane Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Holo Graphy (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
实施例的光引发剂 | 光引发剂浓度 | 光敏剂 | 曝光后再生产步骤数 | ||
40秒 | 80秒 | 160秒 | |||
2 | 2.0% | - | 13 | 15 | 17 |
3 | 2.0% | - | 12 | 15 | 16 |
3 | 2.0% | S-2 | 13 | 15 | 17 |
4 | 2.0% | - | 12 | 14 | 16 |
5 | 0.5% | - | 11 | 13 | 15 |
1 | 2.0% | - | 14 | 17 | 19 |
8 | 2.0% | S-2 | 12 | 15 | 16 |
9 | 0.5% | - | 13 | 16 | 17 |
14 | 2.0% | - | 14 | 17 | 18 |
10 | 2.0% | - | 14 | 16 | 18 |
11 | 2.0% | - | 12 | 14 | 16 |
12 | 0.5% | - | 11 | 13 | 15 |
13 | 0.5% | - | 15 | 18 | 20 |
实施例的光引发剂 | 光引发剂浓度 | 光敏剂 | 曝光后再生产步骤数 | ||
40秒 | 80秒 | 160秒 | |||
18 | 2.0% | - | 8 | 11 | 13 |
16 | 2.0% | - | 11 | 13 | 15 |
17 | 2.0% | - | 8 | 10 | 12 |
19 | 2.0% | - | 6 | 8 | 10 |
14 | 2.0% | - | 13 | 15 | 17 |
21 | 2.0% | - | 7 | 10 | 12 |
20 | 2.0% | - | 5 | 8 | 9 |
24 | 2.0% | - | 9 | 12 | 14 |
22 | 2.0% | - | 10 | 13 | 14 |
25 | 2.0% | - | 14 | 16 | 17 |
23 | 2.0% | - | 11 | 13 | 14 |
15 | 2.0% | - | 11 | 14 | 15 |
26 | 2.0% | - | 13 | 16 | 17 |
27 | 2.0% | - | 13 | 15 | 17 |
28 | 2.0% | - | 13 | 16 | 17 |
29 | 2.0% | - | 13 | 16 | 17 |
30 | 2.0% | - | 13 | 16 | 17 |
31 | 2.0% | - | 10 | 13 | 14 |
实施例的光引发剂 | 曝光后再生产步骤数1000mJ/cm2 | ||
无光敏剂 | S-1(EAB) | S-2(ITX) | |
2 | 17 | - | - |
3 | 14 | 15 | 15 |
4 | 14 | - | - |
5 | 15 | - | - |
1 | 20 | - | - |
7 | 15 | - | - |
9 | 14 | - | - |
14 | 18 | - | - |
10 | 18 | - | - |
12 | 16 | - | |
18 | - | 13 | 13 |
16 | 13 | 14 | 14 |
17 | - | - | 12 |
实施例的光引发剂 | 曝光后再生产步骤数1000mJ/cm2 | ||
无光敏剂 | S-1(EAB) | S-2(ITX) | |
14 | 18 | - | 19 |
21 | 16 | - | - |
20 | - | - | 12 |
24 | 18 | - | - |
22 | 15 | - | 16 |
25 | 20 | - | - |
23 | 15 | - | - |
15 | 18 | - | |
26 | 20 | - | - |
27 | 19 | - | - |
28 | 19 | - | - |
29 | 20 | - | - |
30 | 19 | - | - |
31 | 17 | - | - |
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01810559.3 | 2001-06-11 | ||
EP01810559 | 2001-06-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1514845A true CN1514845A (zh) | 2004-07-21 |
CN100528838C CN100528838C (zh) | 2009-08-19 |
Family
ID=8183958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028116755A Expired - Lifetime CN100528838C (zh) | 2001-06-11 | 2002-06-04 | 具有复合结构的肟酯光引发剂 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7189489B2 (zh) |
EP (1) | EP1395615B1 (zh) |
JP (2) | JP3860170B2 (zh) |
KR (1) | KR100801457B1 (zh) |
CN (1) | CN100528838C (zh) |
AT (1) | ATE446322T1 (zh) |
CA (1) | CA2446722A1 (zh) |
DE (1) | DE60234095D1 (zh) |
TW (1) | TW593357B (zh) |
WO (1) | WO2002100903A1 (zh) |
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JP5137662B2 (ja) | 2008-03-31 | 2013-02-06 | 富士フイルム株式会社 | 硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子 |
JP5528677B2 (ja) | 2008-03-31 | 2014-06-25 | 富士フイルム株式会社 | 重合性組成物、固体撮像素子用遮光性カラーフィルタ、固体撮像素子および固体撮像素子用遮光性カラーフィルタの製造方法 |
KR20110003312A (ko) | 2008-04-01 | 2011-01-11 | 가부시키가이샤 아데카 | 3관능 (메타)아크릴레이트 화합물 및 상기 화합물을 함유하는 중합성 조성물 |
WO2009131189A1 (ja) | 2008-04-25 | 2009-10-29 | 三菱化学株式会社 | ケトオキシムエステル系化合物及びその利用 |
KR101441998B1 (ko) | 2008-04-25 | 2014-09-18 | 후지필름 가부시키가이샤 | 중합성 조성물, 차광성 컬러필터, 흑색 경화성 조성물, 고체촬상소자용 차광성 컬러필터와 그 제조 방법, 및 고체촬상소자 |
CN102046662B (zh) | 2008-05-30 | 2013-08-28 | 高级软质材料株式会社 | 聚轮烷、水系聚轮烷分散组合物、聚轮烷与聚合物的交联体以及它们的制造方法 |
WO2009147033A1 (en) * | 2008-06-06 | 2009-12-10 | Basf Se | Photoinitiator mixtures |
JP5171506B2 (ja) | 2008-06-30 | 2013-03-27 | 富士フイルム株式会社 | 新規化合物、重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、並びに、平版印刷版原版 |
WO2010002129A2 (ko) * | 2008-07-01 | 2010-01-07 | 주식회사 엘지화학 | 복수의 광개시제를 포함한 감광성 수지 조성물, 이를 이용한 투명 박막층 및 액정 표시 장치 |
KR101121038B1 (ko) | 2008-07-01 | 2012-03-15 | 주식회사 엘지화학 | 복수의 광개시제를 포함한 감광성 수지 조성물, 이를 이용한 투명 박막층 및 액정 표시 장치 |
KR20100005682A (ko) * | 2008-07-07 | 2010-01-15 | 후지필름 가부시키가이샤 | 자외광 레이저용 착색 감광성 수지 조성물, 자외광 레이저 노광에 의한 패턴형성방법, 그 패턴형성방법을 사용한 컬러필터를 제조하는 방법, 컬러필터, 및 표시장치 |
JP2010044273A (ja) | 2008-08-14 | 2010-02-25 | Fujifilm Corp | カラーフィルタ及びその形成方法、並びに固体撮像素子 |
JP5274151B2 (ja) | 2008-08-21 | 2013-08-28 | 富士フイルム株式会社 | 感光性樹脂組成物、カラーフィルタ及びその製造方法、並びに、固体撮像素子 |
JP5284735B2 (ja) | 2008-09-18 | 2013-09-11 | 株式会社Adeka | 重合性光学活性イミド化合物及び該化合物を含有する重合性組成物 |
JP5079653B2 (ja) | 2008-09-29 | 2012-11-21 | 富士フイルム株式会社 | 着色硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子 |
JP5171514B2 (ja) | 2008-09-29 | 2013-03-27 | 富士フイルム株式会社 | 着色硬化性組成物、カラーフィルタ、及びカラーフィルタの製造方法 |
JP5127651B2 (ja) | 2008-09-30 | 2013-01-23 | 富士フイルム株式会社 | 着色硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子 |
JP5340102B2 (ja) | 2008-10-03 | 2013-11-13 | 富士フイルム株式会社 | 分散組成物、重合性組成物、遮光性カラーフィルタ、固体撮像素子、液晶表示装置、ウェハレベルレンズ、及び撮像ユニット |
WO2010060702A1 (en) | 2008-11-03 | 2010-06-03 | Basf Se | Photoinitiator mixtures |
KR101082489B1 (ko) * | 2008-11-05 | 2011-11-11 | 주식회사 엘지화학 | 불포화 이중 결합을 가진 옥심 에스테르를 함유한 광중합 개시제 및 이를 포함한 감광성 수지 조성물 |
JP5344892B2 (ja) | 2008-11-27 | 2013-11-20 | 富士フイルム株式会社 | インクジェット用インク組成物、及びインクジェット記録方法 |
JP5669386B2 (ja) | 2009-01-15 | 2015-02-12 | 富士フイルム株式会社 | 新規化合物、重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、並びに、平版印刷版原版 |
KR101793114B1 (ko) | 2009-02-19 | 2017-11-02 | 후지필름 가부시키가이샤 | 분산 조성물 및 그 제조 방법, 차광성 컬러 필터용 감광성 수지 조성물 및 그 제조 방법, 차광성 컬러 필터 및 그 제조 방법, 및 상기 차광성 컬러 필터를 구비한 고체 촬상 소자 |
JP5340198B2 (ja) | 2009-02-26 | 2013-11-13 | 富士フイルム株式会社 | 分散組成物 |
US8004078B1 (en) * | 2009-03-17 | 2011-08-23 | Amkor Technology, Inc. | Adhesive composition for semiconductor device |
US9577642B2 (en) | 2009-04-14 | 2017-02-21 | Monolithic 3D Inc. | Method to form a 3D semiconductor device |
US8373439B2 (en) | 2009-04-14 | 2013-02-12 | Monolithic 3D Inc. | 3D semiconductor device |
US8754533B2 (en) | 2009-04-14 | 2014-06-17 | Monolithic 3D Inc. | Monolithic three-dimensional semiconductor device and structure |
US8378715B2 (en) | 2009-04-14 | 2013-02-19 | Monolithic 3D Inc. | Method to construct systems |
US9711407B2 (en) | 2009-04-14 | 2017-07-18 | Monolithic 3D Inc. | Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer |
US9509313B2 (en) | 2009-04-14 | 2016-11-29 | Monolithic 3D Inc. | 3D semiconductor device |
US8427200B2 (en) | 2009-04-14 | 2013-04-23 | Monolithic 3D Inc. | 3D semiconductor device |
US8384426B2 (en) | 2009-04-14 | 2013-02-26 | Monolithic 3D Inc. | Semiconductor device and structure |
US20110031997A1 (en) * | 2009-04-14 | 2011-02-10 | NuPGA Corporation | Method for fabrication of a semiconductor device and structure |
US8362800B2 (en) | 2010-10-13 | 2013-01-29 | Monolithic 3D Inc. | 3D semiconductor device including field repairable logics |
US7986042B2 (en) | 2009-04-14 | 2011-07-26 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8362482B2 (en) | 2009-04-14 | 2013-01-29 | Monolithic 3D Inc. | Semiconductor device and structure |
US8405420B2 (en) | 2009-04-14 | 2013-03-26 | Monolithic 3D Inc. | System comprising a semiconductor device and structure |
US8058137B1 (en) | 2009-04-14 | 2011-11-15 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8258810B2 (en) | 2010-09-30 | 2012-09-04 | Monolithic 3D Inc. | 3D semiconductor device |
US8395191B2 (en) | 2009-10-12 | 2013-03-12 | Monolithic 3D Inc. | Semiconductor device and structure |
US8669778B1 (en) | 2009-04-14 | 2014-03-11 | Monolithic 3D Inc. | Method for design and manufacturing of a 3D semiconductor device |
US8663880B2 (en) | 2009-04-16 | 2014-03-04 | Fujifilm Corporation | Polymerizable composition for color filter, color filter, and solid-state imaging device |
KR101146182B1 (ko) * | 2009-05-11 | 2012-05-24 | 주식회사 이그잭스 | 엘시디 스페이서 제조용 감광성 수지 조성물 |
WO2010146883A1 (ja) * | 2009-06-17 | 2010-12-23 | 東洋インキ製造株式会社 | オキシムエステル化合物、ラジカル重合開始剤、重合性組成物、ネガ型レジストおよび画像パターン |
JP4999891B2 (ja) * | 2009-07-13 | 2012-08-15 | 東洋インキScホールディングス株式会社 | 感光性着色組成物およびカラーフィルタ |
JP4833324B2 (ja) * | 2009-08-03 | 2011-12-07 | 新日鐵化学株式会社 | 感光性樹脂組成物及びそれを用いたカラーフィルター |
JP5535814B2 (ja) | 2009-09-14 | 2014-07-02 | 富士フイルム株式会社 | 光重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、液晶表示装置、平版印刷版原版、並びに、新規化合物 |
JP5501175B2 (ja) | 2009-09-28 | 2014-05-21 | 富士フイルム株式会社 | 分散組成物及びその製造方法、遮光性カラーフィルタ用感光性樹脂組成物及びその製造方法、遮光性カラーフィルタ及びその製造方法、並びに固体撮像素子 |
US8742476B1 (en) | 2012-11-27 | 2014-06-03 | Monolithic 3D Inc. | Semiconductor device and structure |
US11018133B2 (en) | 2009-10-12 | 2021-05-25 | Monolithic 3D Inc. | 3D integrated circuit |
US10910364B2 (en) | 2009-10-12 | 2021-02-02 | Monolitaic 3D Inc. | 3D semiconductor device |
US10354995B2 (en) | 2009-10-12 | 2019-07-16 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US10388863B2 (en) | 2009-10-12 | 2019-08-20 | Monolithic 3D Inc. | 3D memory device and structure |
US12027518B1 (en) | 2009-10-12 | 2024-07-02 | Monolithic 3D Inc. | 3D semiconductor devices and structures with metal layers |
US11984445B2 (en) | 2009-10-12 | 2024-05-14 | Monolithic 3D Inc. | 3D semiconductor devices and structures with metal layers |
US10043781B2 (en) | 2009-10-12 | 2018-08-07 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US8476145B2 (en) | 2010-10-13 | 2013-07-02 | Monolithic 3D Inc. | Method of fabricating a semiconductor device and structure |
US9099424B1 (en) | 2012-08-10 | 2015-08-04 | Monolithic 3D Inc. | Semiconductor system, device and structure with heat removal |
US8536023B2 (en) | 2010-11-22 | 2013-09-17 | Monolithic 3D Inc. | Method of manufacturing a semiconductor device and structure |
US8581349B1 (en) | 2011-05-02 | 2013-11-12 | Monolithic 3D Inc. | 3D memory semiconductor device and structure |
US10366970B2 (en) | 2009-10-12 | 2019-07-30 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10157909B2 (en) | 2009-10-12 | 2018-12-18 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11374118B2 (en) | 2009-10-12 | 2022-06-28 | Monolithic 3D Inc. | Method to form a 3D integrated circuit |
US8450804B2 (en) | 2011-03-06 | 2013-05-28 | Monolithic 3D Inc. | Semiconductor device and structure for heat removal |
US8294159B2 (en) | 2009-10-12 | 2012-10-23 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
KR20120120117A (ko) | 2009-11-18 | 2012-11-01 | 가부시키가이샤 아데카 | 중합성 화합물을 함유하는 액정 조성물 및 상기 액정 조성물을 이용한 액정 표시 소자 |
JP5701576B2 (ja) | 2009-11-20 | 2015-04-15 | 富士フイルム株式会社 | 分散組成物及び感光性樹脂組成物、並びに固体撮像素子 |
JP4818458B2 (ja) | 2009-11-27 | 2011-11-16 | 株式会社Adeka | オキシムエステル化合物及び該化合物を含有する光重合開始剤 |
JP2010102346A (ja) * | 2009-12-04 | 2010-05-06 | Toyo Ink Mfg Co Ltd | 感光性着色組成物およびカラーフィルタ |
JP5162565B2 (ja) * | 2009-12-04 | 2013-03-13 | 東洋インキScホールディングス株式会社 | 感光性着色組成物およびカラーフィルタ |
AU2010330044B2 (en) * | 2009-12-07 | 2014-08-28 | Agfa Graphics N.V. | Photoinitiators for UV-LED curable compositions and inks |
JP2012003225A (ja) | 2010-01-27 | 2012-01-05 | Fujifilm Corp | ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法 |
JP2011158655A (ja) | 2010-01-29 | 2011-08-18 | Fujifilm Corp | 重合性組成物、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子 |
US8373230B1 (en) | 2010-10-13 | 2013-02-12 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8026521B1 (en) | 2010-10-11 | 2011-09-27 | Monolithic 3D Inc. | Semiconductor device and structure |
US9099526B2 (en) | 2010-02-16 | 2015-08-04 | Monolithic 3D Inc. | Integrated circuit device and structure |
US8298875B1 (en) | 2011-03-06 | 2012-10-30 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8541819B1 (en) | 2010-12-09 | 2013-09-24 | Monolithic 3D Inc. | Semiconductor device and structure |
US8461035B1 (en) | 2010-09-30 | 2013-06-11 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8492886B2 (en) | 2010-02-16 | 2013-07-23 | Monolithic 3D Inc | 3D integrated circuit with logic |
KR20110098638A (ko) | 2010-02-26 | 2011-09-01 | 후지필름 가부시키가이샤 | 착색 경화성 조성물, 컬러필터와 그 제조방법, 고체촬상소자 및 액정표시장치 |
JP5533184B2 (ja) * | 2010-04-20 | 2014-06-25 | Jsr株式会社 | 新規化合物、感放射線性組成物、硬化膜及びその形成方法 |
JP5638285B2 (ja) | 2010-05-31 | 2014-12-10 | 富士フイルム株式会社 | 重合性組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、および固体撮像素子 |
KR101882714B1 (ko) | 2010-06-01 | 2018-07-27 | 후지필름 가부시키가이샤 | 안료 분산 조성물, 적색 착색 조성물, 착색 경화성 조성물, 고체 촬상 소자용 컬러필터와 그 제조 방법, 및 고체 촬상 소자 |
JP5622564B2 (ja) | 2010-06-30 | 2014-11-12 | 富士フイルム株式会社 | 感光性組成物、パターン形成材料、並びに、これを用いた感光性膜、パターン形成方法、パターン膜、低屈折率膜、光学デバイス、及び、固体撮像素子 |
JP5306291B2 (ja) * | 2010-07-12 | 2013-10-02 | 富士フイルム株式会社 | シアン色カラーフィルタ及びそれを用いた固体撮像素子 |
JP5544239B2 (ja) | 2010-07-29 | 2014-07-09 | 富士フイルム株式会社 | 重合性組成物 |
US9953925B2 (en) | 2011-06-28 | 2018-04-24 | Monolithic 3D Inc. | Semiconductor system and device |
US8642416B2 (en) | 2010-07-30 | 2014-02-04 | Monolithic 3D Inc. | Method of forming three dimensional integrated circuit devices using layer transfer technique |
US9219005B2 (en) | 2011-06-28 | 2015-12-22 | Monolithic 3D Inc. | Semiconductor system and device |
US10217667B2 (en) | 2011-06-28 | 2019-02-26 | Monolithic 3D Inc. | 3D semiconductor device, fabrication method and system |
US8901613B2 (en) | 2011-03-06 | 2014-12-02 | Monolithic 3D Inc. | Semiconductor device and structure for heat removal |
JP2012058728A (ja) * | 2010-08-10 | 2012-03-22 | Sumitomo Chemical Co Ltd | 感光性樹脂組成物 |
JP2013539072A (ja) * | 2010-09-16 | 2013-10-17 | エルジー・ケム・リミテッド | 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板 |
US8163581B1 (en) | 2010-10-13 | 2012-04-24 | Monolith IC 3D | Semiconductor and optoelectronic devices |
US8273610B2 (en) | 2010-11-18 | 2012-09-25 | Monolithic 3D Inc. | Method of constructing a semiconductor device and structure |
US10497713B2 (en) | 2010-11-18 | 2019-12-03 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11482440B2 (en) | 2010-12-16 | 2022-10-25 | Monolithic 3D Inc. | 3D semiconductor device and structure with a built-in test circuit for repairing faulty circuits |
US11315980B1 (en) | 2010-10-11 | 2022-04-26 | Monolithic 3D Inc. | 3D semiconductor device and structure with transistors |
US10290682B2 (en) | 2010-10-11 | 2019-05-14 | Monolithic 3D Inc. | 3D IC semiconductor device and structure with stacked memory |
US11227897B2 (en) | 2010-10-11 | 2022-01-18 | Monolithic 3D Inc. | Method for producing a 3D semiconductor memory device and structure |
US11024673B1 (en) | 2010-10-11 | 2021-06-01 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10896931B1 (en) | 2010-10-11 | 2021-01-19 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11257867B1 (en) | 2010-10-11 | 2022-02-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with oxide bonds |
US11469271B2 (en) | 2010-10-11 | 2022-10-11 | Monolithic 3D Inc. | Method to produce 3D semiconductor devices and structures with memory |
US11600667B1 (en) | 2010-10-11 | 2023-03-07 | Monolithic 3D Inc. | Method to produce 3D semiconductor devices and structures with memory |
US8114757B1 (en) | 2010-10-11 | 2012-02-14 | Monolithic 3D Inc. | Semiconductor device and structure |
US11018191B1 (en) | 2010-10-11 | 2021-05-25 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11158674B2 (en) | 2010-10-11 | 2021-10-26 | Monolithic 3D Inc. | Method to produce a 3D semiconductor device and structure |
US11133344B2 (en) | 2010-10-13 | 2021-09-28 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11929372B2 (en) | 2010-10-13 | 2024-03-12 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11043523B1 (en) | 2010-10-13 | 2021-06-22 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11869915B2 (en) | 2010-10-13 | 2024-01-09 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US12080743B2 (en) | 2010-10-13 | 2024-09-03 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US10679977B2 (en) | 2010-10-13 | 2020-06-09 | Monolithic 3D Inc. | 3D microdisplay device and structure |
US11164898B2 (en) | 2010-10-13 | 2021-11-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US11694922B2 (en) | 2010-10-13 | 2023-07-04 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US11404466B2 (en) | 2010-10-13 | 2022-08-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US8379458B1 (en) | 2010-10-13 | 2013-02-19 | Monolithic 3D Inc. | Semiconductor device and structure |
US11327227B2 (en) | 2010-10-13 | 2022-05-10 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with electromagnetic modulators |
US11855100B2 (en) | 2010-10-13 | 2023-12-26 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US11163112B2 (en) | 2010-10-13 | 2021-11-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with electromagnetic modulators |
US10943934B2 (en) | 2010-10-13 | 2021-03-09 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US11437368B2 (en) | 2010-10-13 | 2022-09-06 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US10978501B1 (en) | 2010-10-13 | 2021-04-13 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with waveguides |
US12094892B2 (en) | 2010-10-13 | 2024-09-17 | Monolithic 3D Inc. | 3D micro display device and structure |
US9197804B1 (en) | 2011-10-14 | 2015-11-24 | Monolithic 3D Inc. | Semiconductor and optoelectronic devices |
US8283215B2 (en) | 2010-10-13 | 2012-10-09 | Monolithic 3D Inc. | Semiconductor and optoelectronic devices |
US10833108B2 (en) | 2010-10-13 | 2020-11-10 | Monolithic 3D Inc. | 3D microdisplay device and structure |
US11984438B2 (en) | 2010-10-13 | 2024-05-14 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US10998374B1 (en) | 2010-10-13 | 2021-05-04 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US11855114B2 (en) | 2010-10-13 | 2023-12-26 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11063071B1 (en) | 2010-10-13 | 2021-07-13 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with waveguides |
US11605663B2 (en) | 2010-10-13 | 2023-03-14 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11443971B2 (en) | 2010-11-18 | 2022-09-13 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11735462B2 (en) | 2010-11-18 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with single-crystal layers |
US11508605B2 (en) | 2010-11-18 | 2022-11-22 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11901210B2 (en) | 2010-11-18 | 2024-02-13 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US12068187B2 (en) | 2010-11-18 | 2024-08-20 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding and DRAM memory cells |
US11482438B2 (en) | 2010-11-18 | 2022-10-25 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11107721B2 (en) | 2010-11-18 | 2021-08-31 | Monolithic 3D Inc. | 3D semiconductor device and structure with NAND logic |
US11482439B2 (en) | 2010-11-18 | 2022-10-25 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors |
US11862503B2 (en) | 2010-11-18 | 2024-01-02 | Monolithic 3D Inc. | Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11923230B1 (en) | 2010-11-18 | 2024-03-05 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11355380B2 (en) | 2010-11-18 | 2022-06-07 | Monolithic 3D Inc. | Methods for producing 3D semiconductor memory device and structure utilizing alignment marks |
US11121021B2 (en) | 2010-11-18 | 2021-09-14 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11804396B2 (en) | 2010-11-18 | 2023-10-31 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11355381B2 (en) | 2010-11-18 | 2022-06-07 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11211279B2 (en) | 2010-11-18 | 2021-12-28 | Monolithic 3D Inc. | Method for processing a 3D integrated circuit and structure |
US11004719B1 (en) | 2010-11-18 | 2021-05-11 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11495484B2 (en) | 2010-11-18 | 2022-11-08 | Monolithic 3D Inc. | 3D semiconductor devices and structures with at least two single-crystal layers |
US12100611B2 (en) | 2010-11-18 | 2024-09-24 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11610802B2 (en) | 2010-11-18 | 2023-03-21 | Monolithic 3D Inc. | Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes |
US11569117B2 (en) | 2010-11-18 | 2023-01-31 | Monolithic 3D Inc. | 3D semiconductor device and structure with single-crystal layers |
US11018042B1 (en) | 2010-11-18 | 2021-05-25 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11784082B2 (en) | 2010-11-18 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11164770B1 (en) | 2010-11-18 | 2021-11-02 | Monolithic 3D Inc. | Method for producing a 3D semiconductor memory device and structure |
US12033884B2 (en) | 2010-11-18 | 2024-07-09 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11854857B1 (en) | 2010-11-18 | 2023-12-26 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11521888B2 (en) | 2010-11-18 | 2022-12-06 | Monolithic 3D Inc. | 3D semiconductor device and structure with high-k metal gate transistors |
US11031275B2 (en) | 2010-11-18 | 2021-06-08 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11615977B2 (en) | 2010-11-18 | 2023-03-28 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11094576B1 (en) | 2010-11-18 | 2021-08-17 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
JP5121912B2 (ja) * | 2010-11-24 | 2013-01-16 | 富士フイルム株式会社 | 着色感光性樹脂組成物、パターン形成方法、カラーフィルタの製造方法、カラーフィルタ及びそれを備えた表示装置 |
EP2472330B1 (en) | 2010-12-28 | 2017-01-25 | Fujifilm Corporation | Black radiation-sensitive composition, black cured film, solid-state imaging element, and method of producing black cured film |
US8816211B2 (en) * | 2011-02-14 | 2014-08-26 | Eastman Kodak Company | Articles with photocurable and photocured compositions |
US8632858B2 (en) * | 2011-02-14 | 2014-01-21 | Eastman Kodak Company | Methods of photocuring and imaging |
US8975670B2 (en) | 2011-03-06 | 2015-03-10 | Monolithic 3D Inc. | Semiconductor device and structure for heat removal |
US9127017B2 (en) | 2011-05-25 | 2015-09-08 | American Dye Source, Inc. | Compounds with oxime ester and/or acyl groups |
US10388568B2 (en) | 2011-06-28 | 2019-08-20 | Monolithic 3D Inc. | 3D semiconductor device and system |
KR101339916B1 (ko) | 2011-06-30 | 2013-12-10 | 타코마테크놀러지 주식회사 | 옥시이미노 디치오카보네이트 화합물,이를 포함하는 감광성 조성물 및 용도 |
US9022562B2 (en) | 2011-08-05 | 2015-05-05 | Nitto Denko Corporation | Optical element for correcting color blindness |
JP5821401B2 (ja) * | 2011-08-19 | 2015-11-24 | 大日本印刷株式会社 | 光インプリント用感光性樹脂組成物、硬化物、レジスト基板及び半導体装置の製造方法 |
TWI548701B (zh) | 2011-09-14 | 2016-09-11 | 富士軟片股份有限公司 | 用於彩色濾光片的著色感放射線性組成物、著色膜、圖案形成方法、彩色濾光片及其製造方法以及固態影像感測裝置 |
US8687399B2 (en) | 2011-10-02 | 2014-04-01 | Monolithic 3D Inc. | Semiconductor device and structure |
US9029173B2 (en) | 2011-10-18 | 2015-05-12 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
JP5922013B2 (ja) | 2011-12-28 | 2016-05-24 | 富士フイルム株式会社 | 光学部材セット及びこれを用いた固体撮像素子 |
JP5976523B2 (ja) | 2011-12-28 | 2016-08-23 | 富士フイルム株式会社 | 光学部材セット及びこれを用いた固体撮像素子 |
KR101406317B1 (ko) * | 2012-01-12 | 2014-06-13 | 타코마테크놀러지 주식회사 | 고감도 옥심에스테르 광중합개시제 및 이 화합물을 포함하는 광중합 조성물 |
US9000557B2 (en) | 2012-03-17 | 2015-04-07 | Zvi Or-Bach | Semiconductor device and structure |
JP5934664B2 (ja) | 2012-03-19 | 2016-06-15 | 富士フイルム株式会社 | 着色感放射線性組成物、着色硬化膜、カラーフィルタ、着色パターン形成方法、カラーフィルタの製造方法、固体撮像素子、及び画像表示装置 |
JP5775479B2 (ja) | 2012-03-21 | 2015-09-09 | 富士フイルム株式会社 | 着色感放射線性組成物、着色硬化膜、カラーフィルタ、パターン形成方法、カラーフィルタの製造方法、固体撮像素子、及び画像表示装置 |
US8557632B1 (en) | 2012-04-09 | 2013-10-15 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US11594473B2 (en) | 2012-04-09 | 2023-02-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11694944B1 (en) | 2012-04-09 | 2023-07-04 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11735501B1 (en) | 2012-04-09 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US10600888B2 (en) | 2012-04-09 | 2020-03-24 | Monolithic 3D Inc. | 3D semiconductor device |
US11881443B2 (en) | 2012-04-09 | 2024-01-23 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11476181B1 (en) | 2012-04-09 | 2022-10-18 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11410912B2 (en) | 2012-04-09 | 2022-08-09 | Monolithic 3D Inc. | 3D semiconductor device with vias and isolation layers |
US11164811B2 (en) | 2012-04-09 | 2021-11-02 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers and oxide-to-oxide bonding |
US11088050B2 (en) | 2012-04-09 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers |
US11616004B1 (en) | 2012-04-09 | 2023-03-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
JP5950682B2 (ja) * | 2012-05-09 | 2016-07-13 | 株式会社日本化学工業所 | オキシム系光重合開始剤及びその使用方法 |
JP6095771B2 (ja) * | 2012-05-09 | 2017-03-15 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | オキシムエステル光開始剤 |
ES2738010T3 (es) | 2012-06-04 | 2020-01-17 | Oreal | Composiciones cosméticas de curado rápido para fotocurado superficial exento de pegajosidad de resinas polimerizables radicalariamente con LED UV |
CN104583867B (zh) | 2012-08-08 | 2020-03-17 | 旭化成株式会社 | 感光性膜层积体、柔性印刷布线板及其制造方法 |
JP5909468B2 (ja) | 2012-08-31 | 2016-04-26 | 富士フイルム株式会社 | 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、及び固体撮像素子 |
JP5934682B2 (ja) | 2012-08-31 | 2016-06-15 | 富士フイルム株式会社 | マイクロレンズ形成用又はカラーフィルターの下塗り膜形成用硬化性組成物、透明膜、マイクロレンズ、固体撮像素子、及び、硬化性組成物の製造方法 |
JP5894943B2 (ja) | 2012-08-31 | 2016-03-30 | 富士フイルム株式会社 | 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、マイクロレンズの製造方法、及び固体撮像素子 |
CN107266334B (zh) | 2012-09-28 | 2020-04-24 | 大东凯米克斯株式会社 | 芴系化合物、含有该芴系化合物的光聚合引发剂、以及含有该光聚合引发剂的光敏性组合物 |
US8686428B1 (en) | 2012-11-16 | 2014-04-01 | Monolithic 3D Inc. | Semiconductor device and structure |
US8574929B1 (en) | 2012-11-16 | 2013-11-05 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
KR20150081315A (ko) | 2012-11-30 | 2015-07-13 | 후지필름 가부시키가이샤 | 경화성 수지 조성물, 이것을 사용한 이미지 센서칩의 제조방법 및 이미지 센서칩 |
JP6302650B2 (ja) | 2012-11-30 | 2018-03-28 | 富士フイルム株式会社 | 硬化性樹脂組成物、これを用いた、色素含有層の形成方法、イメージセンサチップの製造方法及びイメージセンサチップ |
US11784169B2 (en) | 2012-12-22 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US12051674B2 (en) | 2012-12-22 | 2024-07-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11018116B2 (en) | 2012-12-22 | 2021-05-25 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11916045B2 (en) | 2012-12-22 | 2024-02-27 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11961827B1 (en) | 2012-12-22 | 2024-04-16 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US8674470B1 (en) | 2012-12-22 | 2014-03-18 | Monolithic 3D Inc. | Semiconductor device and structure |
US11063024B1 (en) | 2012-12-22 | 2021-07-13 | Monlithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11217565B2 (en) | 2012-12-22 | 2022-01-04 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11309292B2 (en) | 2012-12-22 | 2022-04-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11967583B2 (en) | 2012-12-22 | 2024-04-23 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
KR101609634B1 (ko) | 2012-12-26 | 2016-04-06 | 제일모직 주식회사 | 감광성 수지 조성물 및 이를 이용한 차광층 |
JP6170673B2 (ja) | 2012-12-27 | 2017-07-26 | 富士フイルム株式会社 | カラーフィルタ用組成物、赤外線透過フィルタ及びその製造方法、並びに赤外線センサー |
JP6140604B2 (ja) | 2012-12-28 | 2017-05-31 | 富士フイルム株式会社 | 赤外線反射膜形成用の硬化性樹脂組成物、赤外線反射膜及びその製造方法、並びに赤外線カットフィルタ及びこれを用いた固体撮像素子 |
EP2940081A4 (en) | 2012-12-28 | 2016-01-06 | Fujifilm Corp | CURABLE RESIN COMPOSITION, INFRARED RADIATION FILTER, AND SEMICONDUCTOR IMAGING ELEMENT USING THE FILTER |
US10600657B2 (en) | 2012-12-29 | 2020-03-24 | Monolithic 3D Inc | 3D semiconductor device and structure |
US10651054B2 (en) | 2012-12-29 | 2020-05-12 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11087995B1 (en) | 2012-12-29 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US9385058B1 (en) | 2012-12-29 | 2016-07-05 | Monolithic 3D Inc. | Semiconductor device and structure |
US9871034B1 (en) | 2012-12-29 | 2018-01-16 | Monolithic 3D Inc. | Semiconductor device and structure |
US10115663B2 (en) | 2012-12-29 | 2018-10-30 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10903089B1 (en) | 2012-12-29 | 2021-01-26 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11430668B2 (en) | 2012-12-29 | 2022-08-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US10892169B2 (en) | 2012-12-29 | 2021-01-12 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11430667B2 (en) | 2012-12-29 | 2022-08-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11177140B2 (en) | 2012-12-29 | 2021-11-16 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11004694B1 (en) | 2012-12-29 | 2021-05-11 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US8931930B2 (en) | 2013-01-29 | 2015-01-13 | Nitto Denko Corporation | Optical element for correcting color blindness |
US11935949B1 (en) | 2013-03-11 | 2024-03-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US10325651B2 (en) | 2013-03-11 | 2019-06-18 | Monolithic 3D Inc. | 3D semiconductor device with stacked memory |
US12094965B2 (en) | 2013-03-11 | 2024-09-17 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US8902663B1 (en) | 2013-03-11 | 2014-12-02 | Monolithic 3D Inc. | Method of maintaining a memory state |
US11869965B2 (en) | 2013-03-11 | 2024-01-09 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US12100646B2 (en) | 2013-03-12 | 2024-09-24 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US10840239B2 (en) | 2014-08-26 | 2020-11-17 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11923374B2 (en) | 2013-03-12 | 2024-03-05 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11398569B2 (en) | 2013-03-12 | 2022-07-26 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11088130B2 (en) | 2014-01-28 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US8994404B1 (en) | 2013-03-12 | 2015-03-31 | Monolithic 3D Inc. | Semiconductor device and structure |
US9117749B1 (en) | 2013-03-15 | 2015-08-25 | Monolithic 3D Inc. | Semiconductor device and structure |
US10224279B2 (en) | 2013-03-15 | 2019-03-05 | Monolithic 3D Inc. | Semiconductor device and structure |
JP6097128B2 (ja) | 2013-04-12 | 2017-03-15 | 富士フイルム株式会社 | 遠赤外線遮光層形成用組成物 |
US9021414B1 (en) | 2013-04-15 | 2015-04-28 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11270055B1 (en) | 2013-04-15 | 2022-03-08 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11341309B1 (en) | 2013-04-15 | 2022-05-24 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11030371B2 (en) | 2013-04-15 | 2021-06-08 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11574109B1 (en) | 2013-04-15 | 2023-02-07 | Monolithic 3D Inc | Automation methods for 3D integrated circuits and devices |
US11487928B2 (en) | 2013-04-15 | 2022-11-01 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11720736B2 (en) | 2013-04-15 | 2023-08-08 | Monolithic 3D Inc. | Automation methods for 3D integrated circuits and devices |
US10234761B2 (en) | 2013-07-08 | 2019-03-19 | Basf Se | Oxime ester photoinitiators |
KR101414547B1 (ko) * | 2013-07-08 | 2014-07-03 | 타코마테크놀러지 주식회사 | 광개시제용 화합물 |
JP2015038979A (ja) * | 2013-07-18 | 2015-02-26 | 富士フイルム株式会社 | イメージセンサー及びその製造方法 |
JP6162084B2 (ja) | 2013-09-06 | 2017-07-12 | 富士フイルム株式会社 | 着色組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子、画像表示装置、ポリマー、キサンテン色素 |
WO2015064958A1 (ko) * | 2013-11-04 | 2015-05-07 | 한국화학연구원 | 신규한 옥심에스테르 비페닐 화합물, 이를 포함하는 광개시제 및 감광성 수지 조성물 |
KR101478292B1 (ko) * | 2013-11-05 | 2015-01-05 | 한국화학연구원 | 신규한 β-옥심에스테르 비페닐 화합물, 이를 포함하는 광개시제 및 감광성 수지 조성물 |
TWI668210B (zh) * | 2013-11-28 | 2019-08-11 | 塔可馬科技股份有限公司 | 光起始劑及包括該光起始劑之光敏性組合物 |
KR101457172B1 (ko) * | 2013-11-28 | 2014-10-31 | 타코마테크놀러지 주식회사 | 광개시제 및 이를 포함한 감광성 조성물 |
KR101435652B1 (ko) | 2014-01-17 | 2014-08-28 | 주식회사 삼양사 | 신규한 β-옥심에스테르 플루오렌 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물 |
US11107808B1 (en) | 2014-01-28 | 2021-08-31 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11031394B1 (en) | 2014-01-28 | 2021-06-08 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10297586B2 (en) | 2015-03-09 | 2019-05-21 | Monolithic 3D Inc. | Methods for processing a 3D semiconductor device |
US12094829B2 (en) | 2014-01-28 | 2024-09-17 | Monolithic 3D Inc. | 3D semiconductor device and structure |
CN104910053B (zh) * | 2014-06-09 | 2017-09-12 | 北京英力科技发展有限公司 | 不对称二肟酯化合物及其制造方法与应用 |
JP6169545B2 (ja) | 2014-09-09 | 2017-07-26 | 富士フイルム株式会社 | 重合性組成物、インクジェット記録用インク組成物、インクジェット記録方法、及び記録物 |
JP6169548B2 (ja) | 2014-09-26 | 2017-07-26 | 富士フイルム株式会社 | 重合性組成物、インクジェット記録用インク組成物、インクジェット記録方法、及び記録物 |
JP6086888B2 (ja) | 2014-09-26 | 2017-03-01 | 富士フイルム株式会社 | インクジェット記録用インク組成物、インクジェット記録方法、及び記録物 |
KR101824429B1 (ko) | 2015-01-26 | 2018-02-06 | 주식회사 삼양사 | 신규한 디옥심에스테르 화합물 및 이를 포함하는 광중합 개시제 및 포토레지스트 조성물 |
CN104672354A (zh) * | 2015-02-04 | 2015-06-03 | 天津墨森科技有限公司 | 一种双肟酯类光引发剂及其制备方法和应用 |
KR101828927B1 (ko) | 2015-02-06 | 2018-02-14 | 주식회사 삼양사 | 신규한 옥심에스테르 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물 |
KR101824443B1 (ko) | 2015-04-09 | 2018-02-05 | 주식회사 삼양사 | 신규한 플루오렌일 옥심 에스테르 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물 |
US10381328B2 (en) | 2015-04-19 | 2019-08-13 | Monolithic 3D Inc. | Semiconductor device and structure |
US11056468B1 (en) | 2015-04-19 | 2021-07-06 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10825779B2 (en) | 2015-04-19 | 2020-11-03 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11011507B1 (en) | 2015-04-19 | 2021-05-18 | Monolithic 3D Inc. | 3D semiconductor device and structure |
KR101777845B1 (ko) | 2015-06-08 | 2017-09-12 | 주식회사 삼양사 | 신규한 플루오란텐 옥심 에스테르 유도체, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물 |
KR102613079B1 (ko) | 2015-07-17 | 2023-12-12 | 타코마테크놀러지 주식회사 | 옥심에스테르 화합물 및 이를 포함하는 감광성 수지 조성물 |
KR101744197B1 (ko) | 2015-07-31 | 2017-06-09 | (주)켐이 | 플루오렌 유도체, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물 |
KR101796993B1 (ko) | 2015-08-24 | 2017-11-13 | (주)켐이 | 플루오렌 유도체, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물 |
US11956952B2 (en) | 2015-08-23 | 2024-04-09 | Monolithic 3D Inc. | Semiconductor memory device and structure |
KR20180044227A (ko) * | 2015-08-24 | 2018-05-02 | 가부시키가이샤 아데카 | 옥심에스테르 화합물 및 그 화합물을 함유하는 중합 개시제 |
US11937422B2 (en) | 2015-11-07 | 2024-03-19 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US12100658B2 (en) | 2015-09-21 | 2024-09-24 | Monolithic 3D Inc. | Method to produce a 3D multilayer semiconductor device and structure |
US11114427B2 (en) | 2015-11-07 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor processor and memory device and structure |
CN115942752A (zh) | 2015-09-21 | 2023-04-07 | 莫诺利特斯3D有限公司 | 3d半导体器件和结构 |
US11978731B2 (en) | 2015-09-21 | 2024-05-07 | Monolithic 3D Inc. | Method to produce a multi-level semiconductor memory device and structure |
US10522225B1 (en) | 2015-10-02 | 2019-12-31 | Monolithic 3D Inc. | Semiconductor device with non-volatile memory |
US12120880B1 (en) | 2015-10-24 | 2024-10-15 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US11991884B1 (en) | 2015-10-24 | 2024-05-21 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US10418369B2 (en) | 2015-10-24 | 2019-09-17 | Monolithic 3D Inc. | Multi-level semiconductor memory device and structure |
US12016181B2 (en) | 2015-10-24 | 2024-06-18 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US11114464B2 (en) | 2015-10-24 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10847540B2 (en) | 2015-10-24 | 2020-11-24 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11296115B1 (en) | 2015-10-24 | 2022-04-05 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US12035531B2 (en) | 2015-10-24 | 2024-07-09 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
KR102509606B1 (ko) | 2015-10-30 | 2023-03-14 | 주식회사 삼양사 | 신규한 퀴놀리닐 베타 옥심에스테르 유도체 화합물, 이를 포함하는 광중합 개시제, 및 포토레지스트 조성물 |
TWI634135B (zh) | 2015-12-25 | 2018-09-01 | 日商富士軟片股份有限公司 | 樹脂、組成物、硬化膜、硬化膜的製造方法及半導體元件 |
JP6688087B2 (ja) * | 2016-01-15 | 2020-04-28 | 株式会社Adeka | 化合物、組成物及び光重合開始剤 |
KR102134138B1 (ko) | 2016-03-14 | 2020-07-15 | 후지필름 가부시키가이샤 | 조성물, 막, 경화막, 광학 센서 및 막의 제조 방법 |
WO2017183428A1 (ja) | 2016-04-21 | 2017-10-26 | 富士フイルム株式会社 | 画像表示機能付きミラーおよびハーフミラー |
KR101892086B1 (ko) | 2016-05-19 | 2018-08-27 | 주식회사 삼양사 | 옥심에스테르 유도체 화합물, 이를 포함하는 광중합 개시제, 및 감광성 조성물 |
TWI830588B (zh) | 2016-08-01 | 2024-01-21 | 日商富士軟片股份有限公司 | 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、積層體的製造方法及半導體元件 |
TW201821280A (zh) | 2016-09-30 | 2018-06-16 | 日商富士軟片股份有限公司 | 積層體以及半導體元件的製造方法 |
US11251149B2 (en) | 2016-10-10 | 2022-02-15 | Monolithic 3D Inc. | 3D memory device and structure |
US11930648B1 (en) | 2016-10-10 | 2024-03-12 | Monolithic 3D Inc. | 3D memory devices and structures with metal layers |
US11869591B2 (en) | 2016-10-10 | 2024-01-09 | Monolithic 3D Inc. | 3D memory devices and structures with control circuits |
US11812620B2 (en) | 2016-10-10 | 2023-11-07 | Monolithic 3D Inc. | 3D DRAM memory devices and structures with control circuits |
US11329059B1 (en) | 2016-10-10 | 2022-05-10 | Monolithic 3D Inc. | 3D memory devices and structures with thinned single crystal substrates |
US11711928B2 (en) | 2016-10-10 | 2023-07-25 | Monolithic 3D Inc. | 3D memory devices and structures with control circuits |
WO2018084076A1 (ja) | 2016-11-04 | 2018-05-11 | 富士フイルム株式会社 | ウインドシールドガラス、ヘッドアップディスプレイシステム、およびハーフミラーフィルム |
KR101991838B1 (ko) | 2016-12-28 | 2019-06-24 | 주식회사 삼양사 | 신규 1,3-벤조디아졸 베타-옥심 에스테르 화합물 및 이를 포함하는 조성물 |
KR20180090135A (ko) | 2017-02-02 | 2018-08-10 | 주식회사 삼양사 | 신규한 옥심에스테르 비페닐 화합물, 이를 포함하는 광중합 개시제 및 감광성 조성물 |
CN110121668B (zh) | 2017-02-09 | 2022-03-04 | 富士胶片株式会社 | 半反射镜、半反射镜的制造方法及带图像显示功能的反射镜 |
WO2018198559A1 (ja) | 2017-04-28 | 2018-11-01 | 富士フイルム株式会社 | 画像表示機能付き防眩ミラー |
EP3633455A4 (en) | 2017-05-31 | 2020-06-17 | FUJIFILM Corporation | PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, HARDENED FILM, LAMINATE, PROCESS FOR PRODUCING HARDENED FILM, AND SEMICONDUCTOR DEVICE |
EP3642192A1 (fr) * | 2017-06-22 | 2020-04-29 | Elkem Silicones France S.A.S. | Photoamorceurs radicalaires et leurs utilisations dans les compositions silicones |
CN109305951A (zh) * | 2017-07-26 | 2019-02-05 | 湖北固润科技股份有限公司 | 香豆素肟酯类化合物及其制备和应用 |
EP3680700B1 (en) | 2017-09-07 | 2023-12-27 | FUJIFILM Corporation | One-way mirror film for displaying projected images, laminated glass for displaying projected images, and image display system |
WO2019054281A1 (ja) | 2017-09-15 | 2019-03-21 | 富士フイルム株式会社 | 組成物、膜、積層体、赤外線透過フィルタ、固体撮像素子および赤外線センサ |
JP7163673B2 (ja) * | 2017-10-02 | 2022-11-01 | 東洋インキScホールディングス株式会社 | カラーフィルタ用感光性着色組成物及びカラーフィルタ |
KR101991903B1 (ko) | 2017-12-07 | 2019-10-01 | 주식회사 삼양사 | 카바졸 옥심에스테르 유도체 화합물 및 이를 포함하는 광중합 개시제와 감광성 조성물 |
JP6934101B2 (ja) | 2018-02-23 | 2021-09-08 | 富士フイルム株式会社 | 画像表示用合わせガラスの製造方法、画像表示用合わせガラス、および、画像表示システム |
KR102453516B1 (ko) | 2018-03-13 | 2022-10-12 | 후지필름 가부시키가이샤 | 경화막의 제조 방법, 고체 촬상 소자의 제조 방법 |
TWI833785B (zh) | 2018-08-09 | 2024-03-01 | 日商三菱化學股份有限公司 | 全像記錄媒體用組合物及全像記錄媒體 |
KR20200024024A (ko) | 2018-08-27 | 2020-03-06 | 동우 화인켐 주식회사 | 파이렌 유도체 및 이를 포함하는 광경화성 조성물 |
CN112601912A (zh) | 2018-09-07 | 2021-04-02 | 富士胶片株式会社 | 车辆用前照灯单元、前照灯用遮光膜、前照灯用遮光膜的制造方法 |
WO2020059509A1 (ja) | 2018-09-20 | 2020-03-26 | 富士フイルム株式会社 | 硬化性組成物、硬化膜、赤外線透過フィルタ、積層体、固体撮像素子、センサ、及び、パターン形成方法 |
EP3859447A4 (en) | 2018-09-28 | 2021-11-17 | FUJIFILM Corporation | LIGHT SENSITIVE RESIN COMPOSITION, HARDENED FILM, LAMINATE, METHOD FOR MANUFACTURING THE HARDENED FILM AND SEMICONDUCTIVE COMPONENT |
CN112840244B (zh) | 2018-10-17 | 2023-02-28 | 富士胶片株式会社 | 投影像显示用部件、挡风玻璃及平视显示系统 |
EP3893053A4 (en) | 2018-12-05 | 2022-02-23 | FUJIFILM Corporation | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE |
KR102636334B1 (ko) | 2018-12-05 | 2024-02-14 | 후지필름 가부시키가이샤 | 패턴 형성 방법, 감광성 수지 조성물, 경화막, 적층체, 및 디바이스 |
WO2020122023A1 (ja) | 2018-12-10 | 2020-06-18 | 富士フイルム株式会社 | 投映像表示用部材、ウインドシールドガラスおよびヘッドアップディスプレイシステム |
KR102125820B1 (ko) | 2018-12-24 | 2020-06-23 | (주)경인양행 | 옥심 화합물을 포함하는 광중합 개시제 및 광경화형 잉크 조성물 |
KR102228630B1 (ko) | 2018-12-28 | 2021-03-16 | 주식회사 삼양사 | 카바졸 멀티 베타 옥심에스테르 유도체 화합물 및 이를 포함하는 광중합 개시제와 포토레지스트 조성물 |
US20220121113A1 (en) | 2019-01-23 | 2022-04-21 | Basf Se | Oxime ester photoinitiators having a special aroyl chromophore |
JP6677330B2 (ja) * | 2019-02-21 | 2020-04-08 | 三菱ケミカル株式会社 | カルバゾール化合物 |
EP3936924A4 (en) | 2019-03-06 | 2022-05-04 | FUJIFILM Corporation | LAMINATED FILM FOR DISPLAYING A PROJECTION IMAGE, LAMINATED GLASS FOR DISPLAYING A PROJECTION IMAGE AND IMAGE DISPLAY SYSTEM |
JP7171890B2 (ja) | 2019-03-15 | 2022-11-15 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリマー前駆体 |
JP7229337B2 (ja) | 2019-03-29 | 2023-02-27 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、インダクタ、アンテナ |
US11158652B1 (en) | 2019-04-08 | 2021-10-26 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11763864B2 (en) | 2019-04-08 | 2023-09-19 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures with bit-line pillars |
US11018156B2 (en) | 2019-04-08 | 2021-05-25 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11296106B2 (en) | 2019-04-08 | 2022-04-05 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US10892016B1 (en) | 2019-04-08 | 2021-01-12 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
JP2020200272A (ja) * | 2019-06-11 | 2020-12-17 | 株式会社Adeka | カルバモイルオキシム化合物並びに該化合物を含有する重合開始剤及び重合性組成物 |
CN113518774B (zh) | 2019-06-21 | 2024-10-18 | 艾坚蒙(安庆)科技发展有限公司 | 一种新的二芳酰基咔唑化合物及其作为增感剂的应用 |
CN112111028A (zh) | 2019-06-21 | 2020-12-22 | 江苏英力科技发展有限公司 | 一种含有酰基咔唑衍生物和咔唑基肟酯的光引发剂组合物及其在光固化组合物中的应用 |
EP3992254B1 (en) | 2019-06-27 | 2024-02-21 | FUJIFILM Corporation | Composition, film, and optical sensor |
JP7237166B2 (ja) | 2019-08-29 | 2023-03-10 | 富士フイルム株式会社 | 組成物、膜、近赤外線カットフィルタ、パターン形成方法、積層体、固体撮像素子、赤外線センサ、画像表示装置、カメラモジュール、及び、化合物 |
EP4024096A4 (en) | 2019-08-30 | 2022-12-14 | FUJIFILM Corporation | COMPOSITION, FILM, OPTICAL FILTER AND PRODUCTION METHOD THEREOF, SEMICONDUCTOR IMAGING ELEMENT, INFRARED SENSOR AND SENSOR MODULE |
KR102681975B1 (ko) | 2019-09-26 | 2024-07-05 | 후지필름 가부시키가이샤 | 도열층의 제조 방법, 적층체의 제조 방법 및 반도체 디바이스의 제조 방법 |
EP4036644A4 (en) | 2019-09-27 | 2022-11-30 | FUJIFILM Corporation | PROJECTOR FOR HEADUP DISPLAY |
JP7367053B2 (ja) | 2019-11-21 | 2023-10-23 | 富士フイルム株式会社 | パターン形成方法、光硬化性樹脂組成物、積層体の製造方法、及び、電子デバイスの製造方法 |
EP4083142A4 (en) | 2019-12-25 | 2023-02-08 | FUJIFILM Corporation | RESIN COMPOSITION, CURED PRODUCT, UV ABSORBER, UV CUT FILTER, LENS, PROTECTIVE MATERIAL, COMPOUND AND METHOD OF SYNTHETICING A COMPOUND |
JP2023517304A (ja) | 2020-03-04 | 2023-04-25 | ベーアーエスエフ・エスエー | オキシムエステル光開始剤 |
JP7470780B2 (ja) | 2020-03-30 | 2024-04-18 | 富士フイルム株式会社 | 組成物、膜及び光センサ |
WO2021200815A1 (ja) | 2020-03-30 | 2021-10-07 | 株式会社Adeka | ラジカル重合開始剤、組成物、硬化物及び硬化物の製造方法 |
EP4130812A4 (en) | 2020-03-30 | 2023-11-22 | FUJIFILM Corporation | REFLECTIVE FILM, WINDSHIELD GLASS AND HEAD-UP DISPLAY SYSTEM |
JP7483003B2 (ja) | 2020-06-03 | 2024-05-14 | 富士フイルム株式会社 | 反射フィルム、合わせガラスの製造方法、および、合わせガラス |
JP7428810B2 (ja) | 2020-08-21 | 2024-02-06 | 富士フイルム株式会社 | 重合性組成物、重合体、紫外線遮蔽材料、積層体、化合物、紫外線吸収剤及び化合物の製造方法 |
WO2022059706A1 (ja) | 2020-09-18 | 2022-03-24 | 富士フイルム株式会社 | 組成物、磁性粒子含有膜、及び、電子部品 |
JPWO2022065183A1 (zh) | 2020-09-24 | 2022-03-31 | ||
WO2022065006A1 (ja) | 2020-09-28 | 2022-03-31 | 富士フイルム株式会社 | 積層体の製造方法、アンテナインパッケージの製造方法、積層体及び組成物 |
CN116568545A (zh) | 2020-12-09 | 2023-08-08 | 富士胶片株式会社 | 反射膜、挡风玻璃及平视显示系统 |
TW202231641A (zh) | 2020-12-16 | 2022-08-16 | 日商富士軟片股份有限公司 | 組成物、膜、濾光器、固體攝像元件、圖像顯示裝置及紅外線感測器 |
KR20230121723A (ko) | 2020-12-17 | 2023-08-21 | 가부시키가이샤 아데카 | 화합물 및 조성물 |
EP4266093A4 (en) | 2020-12-17 | 2024-08-28 | Fujifilm Corp | COMPOSITION, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE AND INFRARED SENSOR |
KR102547857B1 (ko) | 2020-12-31 | 2023-06-28 | (주)켐이 | 페노티아진 화합물, 이를 포함하는 광중합 개시제 및 이를 포함하는 전자재료용 조성물 |
JPWO2022196599A1 (zh) | 2021-03-19 | 2022-09-22 | ||
WO2022202394A1 (ja) | 2021-03-22 | 2022-09-29 | 富士フイルム株式会社 | 組成物、磁性粒子含有硬化物、磁性粒子導入基板、電子材料 |
TW202248755A (zh) | 2021-03-22 | 2022-12-16 | 日商富士軟片股份有限公司 | 負型感光性樹脂組成物、硬化物、積層體、硬化物的製造方法以及半導體元件 |
EP4318057A1 (en) | 2021-03-29 | 2024-02-07 | FUJIFILM Corporation | Black photosensitive composition, manufacturing method of black photosensitive composition, cured film, color filter, light-shielding film, optical element, solid-state image capturing element, and headlight unit |
WO2022264987A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JPWO2023002928A1 (zh) | 2021-07-20 | 2023-01-26 | ||
JP7259141B1 (ja) | 2021-08-31 | 2023-04-17 | 富士フイルム株式会社 | 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法、並びに、処理液 |
EP4410855A1 (en) | 2021-09-29 | 2024-08-07 | FUJIFILM Corporation | Composition, resin, film and optical sensor |
WO2023054324A1 (ja) | 2021-09-30 | 2023-04-06 | 富士フイルム株式会社 | ヘッドアップディスプレイシステム及び輸送機 |
JPWO2023054565A1 (zh) | 2021-09-30 | 2023-04-06 | ||
CN118302708A (zh) | 2021-11-05 | 2024-07-05 | 富士胶片株式会社 | 虚像显示装置、平视显示系统及运输机 |
JP7354479B1 (ja) | 2021-12-23 | 2023-10-02 | 富士フイルム株式会社 | 接合体の製造方法、接合体、積層体の製造方法、積層体、デバイスの製造方法、及び、デバイス、並びに、ポリイミド含有前駆体部形成用組成物 |
KR20240129216A (ko) | 2022-02-24 | 2024-08-27 | 후지필름 가부시키가이샤 | 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 적층체의 제조 방법, 반도체 디바이스의 제조 방법, 및, 반도체 디바이스 |
WO2023190064A1 (ja) | 2022-03-29 | 2023-10-05 | 富士フイルム株式会社 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
WO2024181097A1 (ja) * | 2023-02-27 | 2024-09-06 | 富士フイルム株式会社 | 光硬化性組成物、硬化物の製造方法、膜、光学素子、イメージセンサ、固体撮像素子、画像表示装置、及び、ラジカル重合開始剤 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1180846A (en) | 1967-08-08 | 1970-02-11 | Agfa Gevaert Nv | Photopolymerisation of Ethylenically Unsaturated Organic Compounds |
FR2393345A1 (fr) | 1977-06-01 | 1978-12-29 | Agfa Gevaert Nv | Fabrication d'elements modifies sous forme d'images |
GB2029423A (en) | 1978-08-25 | 1980-03-19 | Agfa Gevaert Nv | Photo-polymerisable materials and recording method |
US4590145A (en) | 1985-06-28 | 1986-05-20 | Daicel Chemical Industries, Ltd. | Photopolymerization initiator comprised of thioxanthones and oxime esters |
US5019482A (en) | 1987-08-12 | 1991-05-28 | Asahi Kasei Kogyo Kabushiki Kaisha | Polymer/oxime ester/coumarin compound photosensitive composition |
KR0147207B1 (ko) | 1993-07-28 | 1998-08-17 | 단노 다께시 | 광개시제 조성물 및 그를 사용한 감광성 물질 |
JPH07278214A (ja) | 1994-02-15 | 1995-10-24 | Hitachi Chem Co Ltd | 光開始剤、感光性組成物、感光材料およびパターンの製造法 |
JPH0990627A (ja) * | 1995-09-27 | 1997-04-04 | Toray Ind Inc | 感光性ポリイミド前駆体組成物 |
US20010037037A1 (en) * | 1995-10-31 | 2001-11-01 | Kurt Dietliker | Oximesulfonic acid esters and the use thereof as latent sulfonic acids |
JP3672126B2 (ja) | 1996-03-18 | 2005-07-13 | 富士写真フイルム株式会社 | 光重合性組成物 |
US6770420B2 (en) * | 1996-09-02 | 2004-08-03 | Ciba Specialty Chemicals Corporation | Alkylsulfonyloximes for high-resolution i-line photoresists of high sensitivity |
SG77689A1 (en) | 1998-06-26 | 2001-01-16 | Ciba Sc Holding Ag | New o-acyloxime photoinitiators |
MY121423A (en) * | 1998-06-26 | 2006-01-28 | Ciba Sc Holding Ag | Photopolymerizable thermosetting resin compositions |
EP1163553B1 (en) * | 1999-03-03 | 2006-06-14 | Ciba SC Holding AG | Oxime derivatives and the use thereof as photoinitiators |
NL1014545C2 (nl) * | 1999-03-31 | 2002-02-26 | Ciba Sc Holding Ag | Oxim-derivaten en de toepassing daarvan als latente zuren. |
NL1016815C2 (nl) * | 1999-12-15 | 2002-05-14 | Ciba Sc Holding Ag | Oximester-fotoinitiatoren. |
SG97168A1 (en) | 1999-12-15 | 2003-07-18 | Ciba Sc Holding Ag | Photosensitive resin composition |
TWI272451B (en) * | 2000-09-25 | 2007-02-01 | Ciba Sc Holding Ag | Chemically amplified photoresist composition, process for preparation of a photoresist, and use of said chemically amplified photoresist composition |
DE60202950T2 (de) * | 2001-06-01 | 2005-07-07 | Ciba Specialty Chemicals Holding Inc. | Substituierte oxim-derivate und ihre verwendung als latente säuren |
JP4337481B2 (ja) * | 2002-09-17 | 2009-09-30 | 東レ株式会社 | ネガ型感光性樹脂前駆体組成物およびそれを用いた電子部品ならびに表示装置 |
CN1241562C (zh) * | 2004-08-05 | 2006-02-15 | 陕西师范大学 | 连翘苷在制备治疗肥胖病口服药物和保健食品中的应用 |
-
2002
- 2002-06-04 CN CNB028116755A patent/CN100528838C/zh not_active Expired - Lifetime
- 2002-06-04 EP EP02778878A patent/EP1395615B1/en not_active Expired - Lifetime
- 2002-06-04 AT AT02778878T patent/ATE446322T1/de not_active IP Right Cessation
- 2002-06-04 DE DE60234095T patent/DE60234095D1/de not_active Expired - Lifetime
- 2002-06-04 US US10/480,146 patent/US7189489B2/en not_active Expired - Lifetime
- 2002-06-04 CA CA002446722A patent/CA2446722A1/en not_active Abandoned
- 2002-06-04 WO PCT/EP2002/006107 patent/WO2002100903A1/en active Application Filing
- 2002-06-04 JP JP2003503669A patent/JP3860170B2/ja not_active Expired - Lifetime
- 2002-06-04 KR KR1020037016235A patent/KR100801457B1/ko active IP Right Grant
- 2002-06-10 TW TW091112531A patent/TW593357B/zh not_active IP Right Cessation
-
2006
- 2006-06-14 JP JP2006164492A patent/JP2006342166A/ja active Pending
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Also Published As
Publication number | Publication date |
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KR20040007700A (ko) | 2004-01-24 |
JP2004534797A (ja) | 2004-11-18 |
JP2006342166A (ja) | 2006-12-21 |
ATE446322T1 (de) | 2009-11-15 |
CA2446722A1 (en) | 2002-12-19 |
KR100801457B1 (ko) | 2008-02-11 |
WO2002100903A1 (en) | 2002-12-19 |
EP1395615A1 (en) | 2004-03-10 |
DE60234095D1 (de) | 2009-12-03 |
US20040170924A1 (en) | 2004-09-02 |
US7189489B2 (en) | 2007-03-13 |
JP3860170B2 (ja) | 2006-12-20 |
TW593357B (en) | 2004-06-21 |
EP1395615B1 (en) | 2009-10-21 |
CN100528838C (zh) | 2009-08-19 |
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