JP2001513697A - エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置 - Google Patents

エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置

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Publication number
JP2001513697A
JP2001513697A JP53695898A JP53695898A JP2001513697A JP 2001513697 A JP2001513697 A JP 2001513697A JP 53695898 A JP53695898 A JP 53695898A JP 53695898 A JP53695898 A JP 53695898A JP 2001513697 A JP2001513697 A JP 2001513697A
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Japan
Prior art keywords
aerosol
particles
phase
aerosol method
liquid
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Pending
Application number
JP53695898A
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English (en)
Japanese (ja)
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JP2001513697A5 (enExample
Inventor
ジェイ． ハンプデン−スミス、マーク
ティ． コダス、トイボ
エイチ． パウエル、クウィント
ジェイ． スカムサー、ダニエル
カルソ、ジェイムズ
ディ． チャンドラー、クライブ
Original Assignee
スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー
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Publication of JP2001513697A publication Critical patent/JP2001513697A/ja
Publication of JP2001513697A5 publication Critical patent/JP2001513697A5/ja
Pending legal-status Critical Current

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    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/003—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic followed by coating of the granules
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    • B01J2/006—Coating of the granules without description of the process or the device by which the granules are obtained
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009541588A (ja) * 2006-06-19 2009-11-26 キャボット コーポレイション 金属含有ナノ粒子、その合成及び使用
JP2009541520A (ja) * 2006-06-21 2009-11-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 少なくとも一つのセラミック球状色変換材料を有する光放出デバイス
JP2009543291A (ja) * 2006-06-28 2009-12-03 トムソン ライセンシング 電界放出バックライトを有する液晶ディスプレイ
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JP5071854B2 (ja) * 2005-09-12 2012-11-14 独立行政法人科学技術振興機構 微粒子−タンパク質複合体およびその作製方法、半導体装置、蛍光標識方法
JP2021112708A (ja) * 2020-01-18 2021-08-05 ナノミストテクノロジーズ株式会社 超音波霧化装置

Families Citing this family (274)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6933331B2 (en) 1998-05-22 2005-08-23 Nanoproducts Corporation Nanotechnology for drug delivery, contrast agents and biomedical implants
US6832735B2 (en) * 2002-01-03 2004-12-21 Nanoproducts Corporation Post-processed nanoscale powders and method for such post-processing
US7097686B2 (en) * 1997-02-24 2006-08-29 Cabot Corporation Nickel powders, methods for producing powders and devices fabricated from same
US6830823B1 (en) * 1997-02-24 2004-12-14 Superior Micropowders Llc Gold powders, methods for producing powders and devices fabricated from same
US6699304B1 (en) * 1997-02-24 2004-03-02 Superior Micropowders, Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US6602439B1 (en) * 1997-02-24 2003-08-05 Superior Micropowders, Llc Chemical-mechanical planarization slurries and powders and methods for using same
US6103393A (en) * 1998-02-24 2000-08-15 Superior Micropowders Llc Metal-carbon composite powders, methods for producing powders and devices fabricated from same
US6679937B1 (en) * 1997-02-24 2004-01-20 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
CA2280865C (en) * 1997-02-24 2008-08-12 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US6660680B1 (en) * 1997-02-24 2003-12-09 Superior Micropowders, Llc Electrocatalyst powders, methods for producing powders and devices fabricated from same
US20010001406A1 (en) * 1998-02-17 2001-05-24 Michael James Liberatore Method of making transmission lines and buried passive components in green tape
US7150920B2 (en) 1998-02-24 2006-12-19 Cabot Corporation Metal-carbon composite powders
US20050097987A1 (en) * 1998-02-24 2005-05-12 Cabot Corporation Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same
US7066976B2 (en) * 1998-02-24 2006-06-27 Cabot Corporation Method for the production of electrocatalyst powders
US6753108B1 (en) * 1998-02-24 2004-06-22 Superior Micropowders, Llc Energy devices and methods for the fabrication of energy devices
US6967183B2 (en) * 1998-08-27 2005-11-22 Cabot Corporation Electrocatalyst powders, methods for producing powders and devices fabricated from same
EP1123181A4 (en) * 1998-08-26 2003-07-02 Superior Micropowders Llc METHOD FOR FORMING AEROSOLS AND DEVICE FOR MANUFACTURING PARTICULATE PRODUCTS
US7141528B2 (en) * 1998-08-27 2006-11-28 Cabot Corporation Electrocatalyst powders, methods for producing powders and devices fabricated from same
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
EP0982379B1 (en) * 1998-08-28 2010-06-16 Sharp Kabushiki Kaisha Particle surface-modifying method and particle surface-modifying device
AU2514800A (en) * 1999-01-27 2000-08-18 United States Of America As Represented By The Secretary Of The Navy, The Matrix assisted pulsed laser evaporation direct write
DE19917347A1 (de) 1999-04-16 2000-11-09 Gsf Forschungszentrum Umwelt Verfahren und Vorrichtung zum trockenen Anbringen von Substanzen an inhalierbare pulverförmige Trägerstoffe
US6771019B1 (en) * 1999-05-14 2004-08-03 Ifire Technology, Inc. Electroluminescent laminate with patterned phosphor structure and thick film dielectric with improved dielectric properties
TW453876B (en) * 1999-06-30 2001-09-11 Inhale Therapeutic Syst Spray drying process control of drying kinetics
TW456027B (en) * 1999-08-18 2001-09-21 Matsushita Electronics Corp Method of making ferroelectric thin film, ferroelectric capacitor, ferroelectric memory and method for fabricating ferroelectric memory
WO2001015838A1 (en) * 1999-08-31 2001-03-08 Toho Titanium Co., Ltd. Nickel powder for monolithic ceramic capacitor
EP1151814A4 (en) * 1999-11-12 2006-11-02 Mitsui Mining & Smelting Co NICKEL POWDER AND CONDUCTIVE PASTE
JP3957444B2 (ja) * 1999-11-22 2007-08-15 三井金属鉱業株式会社 ニッケル粉、その製造方法及び電子部品電極形成用ペースト
FI20002217L (fi) * 1999-12-30 2001-07-01 Orion Yhtymae Oyj Inhalaatiopartikkelit
JP3841607B2 (ja) * 2000-02-03 2006-11-01 三井金属鉱業株式会社 ニッケル粉及び導電ペースト
US7137968B1 (en) 2000-03-13 2006-11-21 Nucryst Pharmaceuticals Corp. Transcutaneous medical device dressings and method of use
US6719987B2 (en) 2000-04-17 2004-04-13 Nucryst Pharmaceuticals Corp. Antimicrobial bioabsorbable materials
SG94805A1 (en) * 2000-05-02 2003-03-18 Shoei Chemical Ind Co Method for preparing metal powder
US7575761B2 (en) 2000-06-30 2009-08-18 Novartis Pharma Ag Spray drying process control of drying kinetics
US20030206966A1 (en) * 2000-07-27 2003-11-06 Burrell Robert E. Methods of inducing apoptosis and modulating metalloproteinases
US20040191329A1 (en) * 2000-07-27 2004-09-30 Burrell Robert E. Compositions and methods of metal-containing materials
US7001617B2 (en) 2001-04-23 2006-02-21 Nueryst Pharmaceuticals Corp. Method of induction of apoptosis and inhibition of matrix metalloproteinases using antimicrobial metals
US7427416B2 (en) * 2000-07-27 2008-09-23 Nucryst Pharmaceuticals Corp. Methods of treating conditions using metal-containing materials
US7008647B2 (en) * 2001-04-23 2006-03-07 Nucryst Pharmaceuticals Corp. Treatment of acne
US6989157B2 (en) * 2000-07-27 2006-01-24 Nucryst Pharmaceuticals Corp. Dry powders of metal-containing compounds
US20030185901A1 (en) 2000-07-27 2003-10-02 Burrell Robert E. Methods of treating conditions with a metal-containing material
US20030180379A1 (en) * 2000-07-27 2003-09-25 Burrell Robert E. Solutions and aerosols of metal-containing compounds
US6989156B2 (en) * 2001-04-23 2006-01-24 Nucryst Pharmaceuticals Corp. Therapeutic treatments using the direct application of antimicrobial metal compositions
ES2231528T3 (es) 2000-07-27 2005-05-16 Nucryst Pharmaceuticals Corp. Utilizacion de metales nobles para la fabricacion de un medicamento para el tratamientyo de trastornos y enfermedades cutaneas hiperproliferativas.
US7255881B2 (en) * 2000-07-27 2007-08-14 Nucryst Pharmaceuticals Corp. Metal-containing materials
US6679938B1 (en) 2001-01-26 2004-01-20 University Of Maryland Method of producing metal particles by spray pyrolysis using a co-solvent and apparatus therefor
US6719821B2 (en) * 2001-02-12 2004-04-13 Nanoproducts Corporation Precursors of engineered powders
US20060248982A1 (en) * 2001-02-20 2006-11-09 Nanoproducts Corp. Nanomaterials manufacturing methods and products thereof
US20020139457A1 (en) * 2001-04-02 2002-10-03 Coppola Vito A. Method of suppressing the oxidation characteristics of nickel
EP1370701A1 (en) * 2001-03-21 2003-12-17 Vishay Intertechnology, Inc. Method of suppressing the oxidation characteristics of nickel
WO2003007403A1 (en) * 2001-07-13 2003-01-23 Ceramic Fuel Cells Limited A fuel cell gas separator plate
US6855426B2 (en) 2001-08-08 2005-02-15 Nanoproducts Corporation Methods for producing composite nanoparticles
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7442227B2 (en) 2001-10-09 2008-10-28 Washington Unniversity Tightly agglomerated non-oxide particles and method for producing the same
CA2359347A1 (en) 2001-10-18 2003-04-18 Cesur Celik Laminated ceramic capacitor internal electrode material
KR20040077655A (ko) * 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
US6689192B1 (en) * 2001-12-13 2004-02-10 The Regents Of The University Of California Method for producing metallic nanoparticles
US6719946B2 (en) * 2001-12-20 2004-04-13 Fuelcell Energy, Inc. Anode support for carbonate fuel cells
US6889557B2 (en) * 2002-02-11 2005-05-10 Bechtel Bwxt Idaho, Llc Network and topology for identifying, locating and quantifying physical phenomena, systems and methods for employing same
US7334485B2 (en) 2002-02-11 2008-02-26 Battelle Energy Alliance, Llc System, method and computer-readable medium for locating physical phenomena
US7276264B1 (en) * 2002-02-11 2007-10-02 Battelle Energy Alliance, Llc Methods for coating conduit interior surfaces utilizing a thermal spray gun with extension arm
US7201925B2 (en) * 2002-04-23 2007-04-10 Nueryst Pharmaceuticals Corp. Treatment of ungual and subungual diseases
JP3767514B2 (ja) * 2002-04-26 2006-04-19 株式会社村田製作所 導電性ペースト
JP3744469B2 (ja) * 2002-06-07 2006-02-08 株式会社村田製作所 導電性ペースト
US7601406B2 (en) * 2002-06-13 2009-10-13 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7566360B2 (en) * 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7736693B2 (en) * 2002-06-13 2010-06-15 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
JP2004039735A (ja) * 2002-07-01 2004-02-05 Fujitsu Ltd 半導体基板及びその製造方法
KR100462073B1 (ko) * 2002-07-10 2004-12-17 한국화학연구원 미분체 합성을 위한 초음파 분무열분해 장치
JP2004139838A (ja) * 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
EP1567101A4 (en) * 2002-10-22 2009-06-03 Nucryst Pharm Corp PROPHYLACTIC TREATMENT METHODS
US7708974B2 (en) 2002-12-10 2010-05-04 Ppg Industries Ohio, Inc. Tungsten comprising nanomaterials and related nanotechnology
US7097684B2 (en) * 2002-12-12 2006-08-29 Aaf-Mcquay, Inc. Method of forming combined pleated scrim and filter media materials and product of same
US20060032332A1 (en) * 2003-03-13 2006-02-16 Kazumasa Ohnishi Cutting tool and cutting machine
US6831529B1 (en) * 2003-05-20 2004-12-14 Lambert Devoe Feed-through filter capacitor assembly
WO2004112799A1 (en) * 2003-06-13 2004-12-29 Chrysalis Technologies Incorporated Methods and apparatus for producing nanoscale particles
US7108733B2 (en) * 2003-06-20 2006-09-19 Massachusetts Institute Of Technology Metal slurry for electrode formation and production method of the same
DE10331785B4 (de) * 2003-07-11 2007-08-23 H. C. Starck Gmbh & Co. Kg Verfahren zur Herstellung feiner Metall-, Legierungs-und Verbundpulver
WO2005019096A1 (en) * 2003-08-23 2005-03-03 Chul-Sang Jeong Nanocomposite solution with complex function and method for preparation thereof
US7276385B1 (en) 2003-11-24 2007-10-02 Kovio, Inc. Methods of laser repairing a circuit, compositions and equipment for such methods, and structures formed from such methods
US7595085B2 (en) * 2004-03-09 2009-09-29 Delphi Technologies, Inc. Ceramic assembly with a stabilizer layer
JP3867232B2 (ja) * 2004-03-25 2007-01-10 株式会社 東北テクノアーチ 触媒ナノ粒子
JP5030267B2 (ja) * 2004-04-16 2012-09-19 独立行政法人物質・材料研究機構 金属コロイド顔料、導電ペースト材料または導電性インク材料の製造方法
US7169208B2 (en) * 2004-06-10 2007-01-30 Inco Limited Method and composition for dispersing extra-fine nickel powder
US20060083694A1 (en) 2004-08-07 2006-04-20 Cabot Corporation Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same
WO2006083326A2 (en) * 2004-08-07 2006-08-10 Cabot Corporation Gas dispersion manufacture of nanoparticulates and nanoparticulate-containing products and processing thereof
EP1810001A4 (en) 2004-10-08 2008-08-27 Sdc Materials Llc APPARATUS AND METHOD FOR SAMPLING AND COLLECTING POWDERS FLOWING IN A GAS STREAM
US20060090601A1 (en) * 2004-11-03 2006-05-04 Goia Dan V Polyol-based method for producing ultra-fine nickel powders
US20060102228A1 (en) * 2004-11-12 2006-05-18 Ferro Corporation Method of making solar cell contacts
KR100669802B1 (ko) * 2004-12-04 2007-01-16 삼성에스디아이 주식회사 박막 트랜지스터, 이의 제조 방법 및 상기 박막트랜지스터를 구비한 평판 표시 장치
US7235745B2 (en) * 2005-01-10 2007-06-26 Endicott Interconnect Technologies, Inc. Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate
US7687724B2 (en) * 2005-01-10 2010-03-30 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7824466B2 (en) * 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
WO2006076611A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Production of metal nanoparticles
US7245024B2 (en) * 2005-01-21 2007-07-17 Delphi Technologies, Inc. Electronic assembly with reduced leakage current
US20060162497A1 (en) * 2005-01-21 2006-07-27 Cabot Corporation Processes for forming nanoparticles in a flame spray system
US7345255B2 (en) * 2005-01-26 2008-03-18 Caterpillar Inc. Composite overlay compound
WO2006124625A2 (en) * 2005-05-12 2006-11-23 Nanosys, Inc. Use of nanoparticles in film formation and as solder
JP5620059B2 (ja) * 2005-06-08 2014-11-05 トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド 金属酸化物ナノ粒子及びその製造方法
JP5009907B2 (ja) * 2005-06-10 2012-08-29 シーマ ナノ テック イスラエル リミティド 向上透明導電性被膜及びそれらを作製する方法
WO2006135128A1 (en) * 2005-06-13 2006-12-21 Ki Yang Hwang Mass production method of nano silver, manufacturing method of germicide fiber coated with nano silver and its products
US7732330B2 (en) 2005-06-30 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using an ink-jet method of the same
US20070158621A1 (en) * 2005-07-19 2007-07-12 Kyocera Corporation Conductive Paste, Solar Cell Manufactured Using Conductive Paste, Screen Printing Method and Solar Cell Formed Using Screen Printing Method
US7504157B2 (en) * 2005-11-02 2009-03-17 H.C. Starck Gmbh Strontium titanium oxides and abradable coatings made therefrom
DE102006011453A1 (de) * 2006-03-13 2007-09-20 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Hochbeständiges Kunststoffbauteil, das zur Lumineszent geeignet ist
JP4967388B2 (ja) * 2006-03-15 2012-07-04 パナソニック株式会社 セラミック積層デバイスの製造方法およびセラミック積層デバイス
EP2015367A4 (en) * 2006-04-25 2011-10-05 Sharp Kk ELECTROCONDUCTIVE PULP FOR SOLAR BATTERY ELECTRODE
JP4978237B2 (ja) 2006-04-27 2012-07-18 昭栄化学工業株式会社 ニッケル粉末の製造方法
US8105643B2 (en) * 2006-05-31 2012-01-31 Cabot Corporation Process for printing features with smaller dimensions
US20080050452A1 (en) * 2006-06-30 2008-02-28 Nucryst Pharmaceuticals Metal-containing formulations and methods of use
US7879131B2 (en) * 2006-08-15 2011-02-01 Applied Nanotech Holdings, Inc. Metal encapsulation
US8159825B1 (en) 2006-08-25 2012-04-17 Hypres Inc. Method for fabrication of electrical contacts to superconducting circuits
US8231369B2 (en) * 2006-10-24 2012-07-31 Beneq Oy Device and method for producing nanoparticles
US7842181B2 (en) 2006-12-06 2010-11-30 Saudi Arabian Oil Company Composition and process for the removal of sulfur from middle distillate fuels
FR2910706B1 (fr) * 2006-12-21 2009-03-20 Commissariat Energie Atomique Element d'interconnexion a base de nanotubes de carbone
KR101528941B1 (ko) * 2006-12-27 2015-06-15 에버레디 배터리 컴퍼니, 인크. 촉매 전극을 갖는 전기화학 전지 및 전극과 전지 제조 방법
TWI477332B (zh) 2007-02-27 2015-03-21 Mitsubishi Materials Corp 金屬奈米粒子分散液及其製造方法及金屬奈米粒子之合成方法
DE102007015874A1 (de) * 2007-04-02 2008-10-09 Robert Bosch Gmbh Verfahren zur Herstellung einer porösen Schicht
EP2153157A4 (en) 2007-05-11 2014-02-26 Sdcmaterials Inc WATER COOLING SYSTEM AND HEAT TRANSFER SYSTEM
EP2152788B1 (en) * 2007-05-29 2019-08-21 Tpk Holding Co., Ltd Surfaces having particles and related methods
US20080296567A1 (en) * 2007-06-04 2008-12-04 Irving Lyn M Method of making thin film transistors comprising zinc-oxide-based semiconductor materials
CN100482382C (zh) * 2007-06-15 2009-04-29 中国科学技术大学 一种内含金纳米颗粒的二氧化钛空心球的制备方法
US8058195B2 (en) * 2007-06-19 2011-11-15 Cabot Corporation Nanoglass and flame spray processes for producing nanoglass
EP2025603A1 (fr) * 2007-07-11 2009-02-18 Aisapack Holding SA Bouteille plastique pour remplissage à chaud ou traitement thermique
JP5297011B2 (ja) * 2007-07-26 2013-09-25 太陽誘電株式会社 積層セラミックコンデンサ及びその製造方法
US8697934B2 (en) * 2007-07-31 2014-04-15 Kimberly-Clark Worldwide, Inc. Sensor products using conductive webs
US8058194B2 (en) 2007-07-31 2011-11-15 Kimberly-Clark Worldwide, Inc. Conductive webs
US8481449B1 (en) 2007-10-15 2013-07-09 SDCmaterials, Inc. Method and system for forming plug and play oxide catalysts
US8142646B2 (en) 2007-11-30 2012-03-27 Saudi Arabian Oil Company Process to produce low sulfur catalytically cracked gasoline without saturation of olefinic compounds
US8101231B2 (en) * 2007-12-07 2012-01-24 Cabot Corporation Processes for forming photovoltaic conductive features from multiple inks
WO2009085651A1 (en) * 2007-12-20 2009-07-09 Nucryst Pharmaceuticals Corp. Metal carbonate particles for use in medicine and methods of making thereof
WO2009090748A1 (ja) * 2008-01-17 2009-07-23 Applied Nanoparticle Laboratory Corporation 複合銀ナノ粒子、その製法及び製造装置
WO2009105749A2 (en) 2008-02-21 2009-08-27 Saudi Arabian Oil Company Catalyst to attain low sulfur gasoline
US8132337B1 (en) * 2008-02-27 2012-03-13 Robert Batey Method and apparatus for drying wood particles/sawdust and other particulate matter
US8561043B2 (en) * 2008-03-28 2013-10-15 International Business Machines Corporation Data transfer optimized software cache for irregular memory references
US20090250099A1 (en) * 2008-04-07 2009-10-08 Eric Ting-Shan Pan Solar-To-Electricity Conversion System Using Cascaded Architecture of Photovoltaic and Thermoelectric Devices
USD627900S1 (en) 2008-05-07 2010-11-23 SDCmaterials, Inc. Glove box
AU2009252769B2 (en) * 2008-05-29 2014-03-20 Kimberly-Clark Worldwide, Inc. Conductive webs containing electrical pathways and method for making same
US7944401B2 (en) * 2008-05-29 2011-05-17 Kimberly-Clark Worldwide, Inc. Radiating element for a signal emitting apparatus
TW200952301A (en) * 2008-06-02 2009-12-16 Inpaq Technology Co Ltd Electro-static discharge protection device with low temperature co-fire ceramic and manufacturing method thereof
US8507403B2 (en) * 2008-06-27 2013-08-13 Cabot Corporation Process for producing exhaust treatment catalyst powders, and their use
US8294024B2 (en) * 2008-08-13 2012-10-23 E I Du Pont De Nemours And Company Processes for forming photovoltaic devices
WO2010022353A1 (en) 2008-08-21 2010-02-25 Innova Meterials, Llc Enhanced surfaces, coatings, and related methods
US7846866B2 (en) * 2008-09-09 2010-12-07 Guardian Industries Corp. Porous titanium dioxide coatings and methods of forming porous titanium dioxide coatings having improved photocatalytic activity
US20100062265A1 (en) * 2008-09-09 2010-03-11 Guardian Industries Corp. Titanium Dioxide Coatings and Methods of Forming Titanium Dioxide Coatings Having Reduced Crystallite Size
US20100062032A1 (en) * 2008-09-09 2010-03-11 Guardian Industries Corp. Doped Titanium Dioxide Coatings and Methods of Forming Doped Titanium Dioxide Coatings
US8647652B2 (en) 2008-09-09 2014-02-11 Guardian Industries Corp. Stable silver colloids and silica-coated silver colloids, and methods of preparing stable silver colloids and silica-coated silver colloids
US7976734B2 (en) * 2008-09-10 2011-07-12 E.I. Du Pont De Nemours And Company Solar cell electrodes
WO2010051356A1 (en) 2008-10-29 2010-05-06 Zpower, Inc. Cathode active material
US8545899B2 (en) * 2008-11-03 2013-10-01 Guardian Industries Corp. Titanium dioxide coatings having roughened surfaces and methods of forming titanium dioxide coatings having roughened surfaces
KR101078079B1 (ko) * 2008-12-10 2011-10-28 엘에스전선 주식회사 은 수식 탄소 나노튜브 함유 전도성 페이스트 조성물
US8172982B2 (en) * 2008-12-22 2012-05-08 Kimberly-Clark Worldwide, Inc. Conductive webs and process for making same
US8710355B2 (en) 2008-12-22 2014-04-29 E I Du Pont De Nemours And Company Compositions and processes for forming photovoltaic devices
US7786839B2 (en) * 2008-12-28 2010-08-31 Pratt & Whitney Rocketdyne, Inc. Passive electrical components with inorganic dielectric coating layer
US8729440B2 (en) * 2009-03-02 2014-05-20 Harris Corporation Applicator and method for RF heating of material
US20100237055A1 (en) * 2009-03-20 2010-09-23 Gm Global Technology Operations, Inc. Defrosting or defogging structure
US20120164526A1 (en) * 2009-03-27 2012-06-28 Zpower, Llc Cathode
US9428821B2 (en) * 2009-05-12 2016-08-30 Jostens, Inc. Gold alloys
US8309489B2 (en) * 2009-06-18 2012-11-13 University Of Central Florida Research Foundation, Inc. Thermally stable nanoparticles on supports
EA201270042A1 (ru) * 2009-06-24 2012-06-29 СЕД МИЛЛЕННИУМ МЕТАЛС, ЭлЭлСи Медно-углеродная композиция
JP5374788B2 (ja) * 2009-08-31 2013-12-25 シャープ株式会社 導電性ペースト、太陽電池セル用電極、太陽電池セルおよび太陽電池セルの製造方法
US9469790B2 (en) 2009-09-29 2016-10-18 The Boeing Company Adhesive compositions comprising electrically insulating-coated carbon-based particles and methods for their use and preparation
US20110076450A1 (en) * 2009-09-29 2011-03-31 Sharma Pramod K Titanium dioxide coatings and methods of forming improved titanium dioxide coatings
US8709538B1 (en) 2009-09-29 2014-04-29 The Boeing Company Substantially aligned boron nitride nano-element arrays and methods for their use and preparation
KR101206250B1 (ko) * 2009-10-13 2012-11-28 주식회사 엘지화학 식각 마스크 패턴 형성용 페이스트 및 이의 스크린 인쇄법을 이용한 실리콘 태양전지의 제조방법
EP2497138B1 (en) 2009-11-03 2016-06-08 ZPower, LLC Novel electrodes and rechargeable batteries
US8803025B2 (en) 2009-12-15 2014-08-12 SDCmaterials, Inc. Non-plugging D.C. plasma gun
US9126191B2 (en) 2009-12-15 2015-09-08 SDCmaterials, Inc. Advanced catalysts for automotive applications
US8652992B2 (en) 2009-12-15 2014-02-18 SDCmaterials, Inc. Pinning and affixing nano-active material
US8557727B2 (en) 2009-12-15 2013-10-15 SDCmaterials, Inc. Method of forming a catalyst with inhibited mobility of nano-active material
US9149797B2 (en) 2009-12-15 2015-10-06 SDCmaterials, Inc. Catalyst production method and system
US9090475B1 (en) 2009-12-15 2015-07-28 SDCmaterials, Inc. In situ oxide removal, dispersal and drying for silicon SiO2
US8470112B1 (en) 2009-12-15 2013-06-25 SDCmaterials, Inc. Workflow for novel composite materials
US8545652B1 (en) 2009-12-15 2013-10-01 SDCmaterials, Inc. Impact resistant material
JP6016637B2 (ja) * 2009-12-16 2016-10-26 アプリコット マテリアルズ テクノロジーズ，エル．エル．シー． 表面積の大きな３次元電極を備えるキャパシタ及び製造方法
JP5470514B2 (ja) * 2009-12-22 2014-04-16 ナノミストテクノロジーズ株式会社 超音波霧化方法と霧化装置
US20110165345A1 (en) * 2010-01-07 2011-07-07 Toyota Motor Engineering & Manufacturing North America, Inc. Process to make structured particles
BR112012018217A2 (pt) 2010-02-04 2016-04-05 Third Millennium Metals Llc composições de metal-carbono
US9539643B2 (en) * 2010-02-12 2017-01-10 GM Global Technology Operations LLC Making metal and bimetal nanostructures with controlled morphology
US8535971B2 (en) * 2010-02-12 2013-09-17 Heraeus Precious Metals North America Conshohocken Llc Method for applying full back surface field and silver busbar to solar cell
CN102763233B (zh) * 2010-02-22 2015-08-19 株式会社村田制作所 热电转换材料及热电转换材料的制造方法
US8080495B2 (en) 2010-04-01 2011-12-20 Cabot Corporation Diesel oxidation catalysts
JP5075222B2 (ja) 2010-05-11 2012-11-21 Ｔｄｋ株式会社 電子部品及びその製造方法
US8431869B2 (en) 2010-06-02 2013-04-30 GM Global Technology Operations LLC Defrosting, defogging and de-icing structures
US20120006808A1 (en) * 2010-06-18 2012-01-12 Young David A Thermal Countermeasures Technology Electro-Resistive Heating Materials and Composites
US9719174B2 (en) * 2010-06-28 2017-08-01 United Technologies Corporation Article having composite coating
US9005432B2 (en) 2010-06-29 2015-04-14 Saudi Arabian Oil Company Removal of sulfur compounds from petroleum stream
AU2011289620C1 (en) 2010-08-07 2014-08-21 Tpk Holding Co., Ltd. Device components with surface-embedded additives and related manufacturing methods
US9572880B2 (en) 2010-08-27 2017-02-21 Sienna Biopharmaceuticals, Inc. Ultrasound delivery of nanoparticles
PL3222266T3 (pl) 2010-08-27 2018-10-31 Sienna Biopharmaceuticals, Inc. Kompozycje i sposoby do termomodulacji celowanej
CA2812180C (en) 2010-09-24 2019-03-05 Zpower, Llc Doped silver cathode
WO2012051176A2 (en) 2010-10-12 2012-04-19 Apricot Materials Technologies, LLC Ceramic capacitor and methods of manufacture
FI20106088A0 (fi) * 2010-10-21 2010-10-21 Beneq Oy Pinnankäsittelylaite ja -menetelmä
EP2444148A1 (de) * 2010-10-25 2012-04-25 Bayer Material Science AG Metallpartikelsol mit dotierten Silbernanopartikeln
CA2816422A1 (en) 2010-11-03 2012-05-10 Zpower, Llc Novel electrodes and rechargeable batteries
CN103221850B (zh) * 2010-11-22 2015-05-13 富士胶片株式会社 热射线屏蔽材料
GB2486190A (en) 2010-12-06 2012-06-13 P V Nano Cell Ltd Concentrated dispersion of nanometric silver particles
US8535518B2 (en) 2011-01-19 2013-09-17 Saudi Arabian Oil Company Petroleum upgrading and desulfurizing process
US8669202B2 (en) 2011-02-23 2014-03-11 SDCmaterials, Inc. Wet chemical and plasma methods of forming stable PtPd catalysts
AU2012225759A1 (en) 2011-03-04 2013-10-24 Third Millennium Metals, Llc Aluminum-carbon compositions
JP2012209148A (ja) * 2011-03-30 2012-10-25 Sony Corp 導電性粒子、導電性ペースト、及び、回路基板
US9783874B2 (en) 2011-06-30 2017-10-10 E I Du Pont De Nemours And Company Thick film paste and use thereof
US20130004659A1 (en) * 2011-06-30 2013-01-03 E I Du Pont De Nemours And Company Thick film paste and use thereof
AU2012299065B2 (en) 2011-08-19 2015-06-04 SDCmaterials, Inc. Coated substrates for use in catalysis and catalytic converters and methods of coating substrates with washcoat compositions
KR101694873B1 (ko) * 2011-08-24 2017-01-10 티피케이 홀딩 컴퍼니 리미티드 패턴화된 투명 전도체 및 관련된 제조 방법
US8844103B2 (en) * 2011-09-01 2014-09-30 Medtronic, Inc. Methods for making feedthrough assemblies including a capacitive filter array
TWI575062B (zh) 2011-12-16 2017-03-21 拜歐菲樂Ｉｐ有限責任公司 低溫注射組成物，用於低溫調節導管中流量之系統及方法
KR101353149B1 (ko) * 2011-12-27 2014-01-27 삼성전기주식회사 구리분말 제조방법
KR20140023543A (ko) * 2012-08-16 2014-02-27 삼성전기주식회사 내부 전극용 니켈 분말, 그 제조방법 및 이를 포함하는 적층 세라믹 전자부품
KR101434024B1 (ko) * 2012-08-17 2014-08-25 삼성전기주식회사 금속 분말, 전자 부품 및 이의 제조 방법
US9005522B2 (en) 2012-08-30 2015-04-14 Jostens, Inc. Silver alloy
CA2886154A1 (en) 2012-09-27 2014-04-03 Zpower, Llc Cathode
EP2906286B1 (en) 2012-10-11 2017-06-14 Nanocomposix, Inc. Silver nanoplate compositions and methods
CA2889423A1 (en) * 2012-10-26 2014-05-01 Nanocomposix, Inc. Metastable silver nanoparticle composites
US9511352B2 (en) 2012-11-21 2016-12-06 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
US9156025B2 (en) 2012-11-21 2015-10-13 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
JP5872063B2 (ja) * 2012-11-26 2016-03-01 三井金属鉱業株式会社 銅粉
US20140287158A1 (en) * 2013-03-21 2014-09-25 Intrinsiq Materials, Inc. Performance of conductive copper paste using copper flake
KR101514512B1 (ko) * 2013-04-08 2015-04-22 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
US9799421B2 (en) * 2013-06-07 2017-10-24 Heraeus Precious Metals North America Conshohocken Llc Thick print copper pastes for aluminum nitride substrates
TW201511296A (zh) 2013-06-20 2015-03-16 Plant PV 用於矽太陽能電池之核-殼型鎳粒子金屬化層
US9892816B2 (en) * 2013-06-27 2018-02-13 Heraeus Precious Metals North America Conshohocken Llc Platinum containing conductive paste
KR102248526B1 (ko) * 2013-07-23 2021-05-06 삼성전기주식회사 내부 전극용 니켈 분말, 이를 포함하는 적층 세라믹 커패시터 및 전자부품이 실장된 회로기판
US9586179B2 (en) 2013-07-25 2017-03-07 SDCmaterials, Inc. Washcoats and coated substrates for catalytic converters and methods of making and using same
JP6639394B2 (ja) * 2013-08-29 2020-02-05 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． 電気部品および機械部品を接合するための複合物および複層銀膜
US9331216B2 (en) 2013-09-23 2016-05-03 PLANT PV, Inc. Core-shell nickel alloy composite particle metallization layers for silicon solar cells
CA2926135A1 (en) 2013-10-22 2015-04-30 SDCmaterials, Inc. Compositions of lean nox trap
US9427732B2 (en) 2013-10-22 2016-08-30 SDCmaterials, Inc. Catalyst design for heavy-duty diesel combustion engines
WO2015142428A1 (en) * 2014-03-18 2015-09-24 Labinal, Llc Backplane module and method of manufacturing same
WO2015143225A1 (en) 2014-03-21 2015-09-24 SDCmaterials, Inc. Compositions for passive nox adsorption (pna) systems
US9388477B1 (en) * 2015-01-20 2016-07-12 Uchicago Argonne, Llc Noble metal superparticles and methods of preparation thereof
JP6256616B2 (ja) * 2015-04-22 2018-01-10 日立金属株式会社 金属粒子およびその製造方法、被覆金属粒子、金属粉体
WO2017035103A1 (en) 2015-08-25 2017-03-02 Plant Pv, Inc Core-shell, oxidation-resistant particles for low temperature conductive applications
US10418497B2 (en) 2015-08-26 2019-09-17 Hitachi Chemical Co., Ltd. Silver-bismuth non-contact metallization pastes for silicon solar cells
EP3153253B1 (en) 2015-10-05 2021-01-13 Ansaldo Energia IP UK Limited Method for treatment of metallic powder for selective laser melting
US10000645B2 (en) 2015-11-24 2018-06-19 PLANT PV, Inc. Methods of forming solar cells with fired multilayer film stacks
WO2017197361A1 (en) * 2016-05-13 2017-11-16 NanoCore Technologies Sinterable metal paste for use in additive manufacturing
EP3290399B1 (en) 2016-08-29 2022-03-02 Infineon Technologies AG Method for producing a metal-ceramic substrate with a least one via
TWI665691B (zh) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 積層陶瓷電容器及其製造方法
US10777359B2 (en) 2017-01-25 2020-09-15 Holy Stone Enterprise Co., Ltd. Multilayer ceramic capacitor
US10752847B2 (en) 2017-03-08 2020-08-25 Saudi Arabian Oil Company Integrated hydrothermal process to upgrade heavy oil
US10703999B2 (en) 2017-03-14 2020-07-07 Saudi Arabian Oil Company Integrated supercritical water and steam cracking process
US20190217393A1 (en) 2018-01-12 2019-07-18 Hammond Group, Inc. Methods for processing metal-containing materials
JP7128544B2 (ja) * 2018-02-26 2022-08-31 国立大学法人東海国立大学機構 熱交換器、冷凍機および焼結体
KR102442835B1 (ko) * 2018-03-28 2022-09-14 삼성전기주식회사 적층형 커패시터
KR102439906B1 (ko) * 2018-03-29 2022-09-05 삼성전기주식회사 적층형 커패시터
JP7089402B2 (ja) * 2018-05-18 2022-06-22 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7145652B2 (ja) * 2018-06-01 2022-10-03 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
KR102217288B1 (ko) 2018-08-16 2021-02-19 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
US10526552B1 (en) 2018-10-12 2020-01-07 Saudi Arabian Oil Company Upgrading of heavy oil for steam cracking process
JP6825170B2 (ja) * 2018-11-07 2021-02-03 日本化学工業株式会社 被覆粒子及びそれを含む導電性材料、並びに被覆粒子の製造方法
US11148159B2 (en) 2019-06-27 2021-10-19 Haier Us Appliance Solutions, Inc. Laundry center having a retractable dispensing assembly
CN110695373B (zh) * 2019-10-14 2022-05-10 天津大学 具有双层谐波结构的石墨烯包覆稀土元素负载铜复合材料的制备方法
US12257629B2 (en) 2020-01-09 2025-03-25 Tundra COmpoistes, LLC Apparatus and methods for sintering
US11282815B2 (en) 2020-01-14 2022-03-22 Micron Technology, Inc. Methods of forming microelectronic devices, and related microelectronic devices and electronic systems
CN113523267A (zh) * 2020-04-21 2021-10-22 香港大学 一种新型抗菌复合粉末和不锈钢及其制备方法和应用
US11335602B2 (en) 2020-06-18 2022-05-17 Micron Technology, Inc. Methods of forming microelectronic devices, and related microelectronic devices and electronic systems
US11563018B2 (en) 2020-06-18 2023-01-24 Micron Technology, Inc. Microelectronic devices, and related methods, memory devices, and electronic systems
US11380669B2 (en) 2020-06-18 2022-07-05 Micron Technology, Inc. Methods of forming microelectronic devices
US11557569B2 (en) 2020-06-18 2023-01-17 Micron Technology, Inc. Microelectronic devices including source structures overlying stack structures, and related electronic systems
US11699652B2 (en) 2020-06-18 2023-07-11 Micron Technology, Inc. Microelectronic devices and electronic systems
US11705367B2 (en) 2020-06-18 2023-07-18 Micron Technology, Inc. Methods of forming microelectronic devices, and related microelectronic devices, memory devices, electronic systems, and additional methods
US11825658B2 (en) 2020-08-24 2023-11-21 Micron Technology, Inc. Methods of forming microelectronic devices and memory devices
US11417676B2 (en) 2020-08-24 2022-08-16 Micron Technology, Inc. Methods of forming microelectronic devices and memory devices, and related microelectronic devices, memory devices, and electronic systems
CN112760512A (zh) * 2020-12-25 2021-05-07 湖南艾迪奥电子科技有限公司 一种电子元件用导电陶瓷粉的制备方法
CN114752234A (zh) * 2021-01-08 2022-07-15 杭州三花研究院有限公司 复合材料及其制备方法、换热器及热管理系统
US11751408B2 (en) 2021-02-02 2023-09-05 Micron Technology, Inc. Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems
RU2768644C1 (ru) * 2021-03-16 2022-03-24 Федеральное государственное бюджетное образовательное учреждение высшего образования "Кубанский государственный технологический университет" (ФГБОУ ВО "КубГТУ") Устройство для плакирования порошкового магнитного материала
EP3988320A1 (en) 2021-12-20 2022-04-27 Sicpa Holding SA Security marking, corresponding engraved intaglio printing plate, and methods and devices for producing, encoding/decoding and authenticating said security marking

Family Cites Families (525)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2398301A (en) 1943-07-26 1946-04-09 Dow Chemical Co Removal of highly unsaturated hydrocarbon impurities from diolefin-containing mixtures
US2785964A (en) * 1953-08-17 1957-03-19 Phillips Petroleum Co Process, apparatus, and system for producing, agglomerating, and collecting carbon black
NL6507771A (enExample) 1964-06-17 1965-12-20
US3401020A (en) 1964-11-25 1968-09-10 Phillips Petroleum Co Process and apparatus for the production of carbon black
US3313362A (en) * 1965-02-03 1967-04-11 Air Drilling Specialties Co Method of and composition for use in, gas drilling
US3415640A (en) * 1966-10-28 1968-12-10 Fansteel Metallurgical Corp Process for making dispersions of particulate oxides in metals
US3510291A (en) * 1966-11-10 1970-05-05 Westinghouse Electric Corp Vapor phase conversion of molybdenum or tungsten compound to form the oxide or metal
US3617358A (en) * 1967-09-29 1971-11-02 Metco Inc Flame spray powder and process
US3785801A (en) 1968-03-01 1974-01-15 Int Nickel Co Consolidated composite materials by powder metallurgy
SE345692B (enExample) 1969-05-19 1972-06-05 Montedison Spa
US3683382A (en) 1969-05-29 1972-08-08 Honeywell Inc Recording medium responsive to force fields and apparatus for recording and reproducing signals on the medium
USRE28972E (en) 1969-07-10 1976-09-21 Boehringer Ingelheim Gmbh 5-Aryl-1H-1,5-benzodiazepine-2,4-diones
US3846345A (en) * 1969-10-06 1974-11-05 Owens Illinois Inc Electroconductive paste composition and structures formed therefrom
US3620714A (en) * 1970-02-26 1971-11-16 Du Pont Process of preparing noble metal alloy powders
US3620713A (en) * 1970-02-26 1971-11-16 Du Pont Process of preparing noble metal powders
NL7117454A (enExample) 1970-12-24 1972-06-27
GB1367281A (en) * 1971-01-19 1974-09-18 Sony Corp Speed detecting devices
US3922388A (en) 1971-03-02 1975-11-25 Honeywell Inc Method of making an encapsulated thick film resistor and associated encapsulated conductors for use in an electrical circuit
US3768994A (en) 1971-03-15 1973-10-30 Owens Illinois Inc Gold powder
GB1381666A (en) 1971-04-02 1975-01-22 Univ Australian Compositions containing copper salts their methods of production and the recovery and purification of copper
US3816097A (en) 1971-05-06 1974-06-11 Owens Illinois Inc Powders of metal, silver and gold
US3717481A (en) 1971-05-13 1973-02-20 Du Pont Gold metallizing compositions
US4044193A (en) 1971-06-16 1977-08-23 Prototech Company Finely particulated colloidal platinum compound and sol for producing the same, and method of preparation of fuel cell electrodes and the like employing the same
US3725035A (en) 1971-07-02 1973-04-03 Du Pont Process for making gold powder
US3882050A (en) * 1971-12-23 1975-05-06 Ethyl Corp Method of depositing a noble metal on a surface of a nickel support
US3830435A (en) * 1972-06-12 1974-08-20 Int Nickel Co Production of ceramic-metal composite powders and articles thereof
US3814696A (en) 1972-06-19 1974-06-04 Eastman Kodak Co Colloidal metal in non-aqueous media
AU5910773A (en) 1972-08-23 1975-02-13 Uncle Ben S Australia Pty Treatment of meat products
IT967833B (it) 1972-09-25 1974-03-11 Montedison Spa Procedimento per preparare polveri di nichel submicroniche aventi for ma sferoidale
DE2310062A1 (de) 1973-02-28 1974-08-29 Siemens Ag Dickschichtschaltung auf keramiksubstrat mit durchkontaktierungen zwischen den leiterzuegen auf beiden seiten des substrates
DE2329352C2 (de) 1973-06-08 1982-05-19 Demetron Gesellschaft für Elektronik-Werkstoffe mbH, 6540 Hanau Verfahren zur Herstellung von Goldpulver
US4096316A (en) 1973-08-18 1978-06-20 Fuji Photo Film Co., Ltd. Method of producing magnetic material with alkaline borohydrides
US3902102A (en) 1974-04-01 1975-08-26 Sprague Electric Co Ceramic capacitor with base metal electrodes
GB1461176A (en) 1974-04-11 1977-01-13 Plessey Inc Method of producing powdered materials
US3881914A (en) * 1974-04-26 1975-05-06 Owens Illinois Inc Preparation of electronic grade copper
US3966463A (en) 1974-08-12 1976-06-29 Plessey Incorporated Oxidation and sinter-resistant metal powders and pastes
US4218507A (en) * 1975-01-13 1980-08-19 Graham Magnetics, Inc. Coated particles and process of preparing same
US4010025A (en) * 1975-04-07 1977-03-01 Plessey Incorporated Oxidation and sinter-resistant metal powders and pastes
US4036634A (en) 1975-04-07 1977-07-19 Plessey, Incorporated Oxidation and sinter-resistant metal powders
US4122232A (en) 1975-04-21 1978-10-24 Engelhard Minerals & Chemicals Corporation Air firable base metal conductors
US4019188A (en) * 1975-05-12 1977-04-19 International Business Machines Corporation Micromist jet printer
US4094853A (en) 1975-05-15 1978-06-13 Kenrich Petrochemicals, Inc. Alkoxy titanate salts useful as coupling agents
US3988651A (en) 1975-05-23 1976-10-26 Erie Technological Products, Inc. Monolithic ceramic capacitor
GB1558762A (en) * 1975-07-04 1980-01-09 Johnson Matthey Co Ltd Metal or alloy coated powders
US4072771A (en) 1975-11-28 1978-02-07 Bala Electronics Corporation Copper thick film conductor
US4223085A (en) * 1976-04-05 1980-09-16 Xerox Corporation Semi-conductive nickel carrier particles
US4089676A (en) 1976-05-24 1978-05-16 Williams Gold Refining Company Incorporated Method for producing nickel metal powder
JPS5324600A (en) 1976-08-19 1978-03-07 Murata Manufacturing Co Nonnreducing dielectric ceramic composition
JPS5332015A (en) 1976-09-07 1978-03-25 Fuji Photo Film Co Ltd Thermodevelopable photosensitive material
US4146957A (en) 1977-01-17 1979-04-03 Engelhard Minerals & Chemicals Corporation Thick film resistance thermometer
US4105483A (en) 1977-02-14 1978-08-08 Globe Industries Corporation Printing ink transfer process
US4211668A (en) 1977-03-07 1980-07-08 Thalatta, Inc. Process of microencapsulation and products thereof
US4289534A (en) 1977-05-03 1981-09-15 Graham Magnetics, Inc. Metal powder paint composition
US4186244A (en) * 1977-05-03 1980-01-29 Graham Magnetics Inc. Novel silver powder composition
US4130671A (en) 1977-09-30 1978-12-19 The United States Of America As Represented By The United States Department Of Energy Method for preparing a thick film conductor
US4140817A (en) 1977-11-04 1979-02-20 Bell Telephone Laboratories, Incorporated Thick film resistor circuits
US4136059A (en) 1977-12-12 1979-01-23 United Technologies Corporation Method for producing highly dispersed catalytic platinum
FR2429264A1 (fr) * 1978-06-20 1980-01-18 Louyot Comptoir Lyon Alemand Procede de fabrication d'un platinoide comportant une phase dispersee d'un oxyde refractaire
US4223369A (en) 1978-07-03 1980-09-16 Sprague Electric Company Monolithic capacitor with low firing zirconate and nickel electrodes
DE2851729C2 (de) 1978-11-30 1980-06-04 W.C. Heraeus Gmbh, 6450 Hanau Blendgold, Verfahren zum Verblenden gegossener oder gesinterter metallischer Zahnprothesen oder Zahnprothesenteile und Anwendung des Blendgoldes
US4266229A (en) * 1979-03-26 1981-05-05 Whittaker Corporation Light sensitive jet inks
US4255291A (en) * 1979-06-21 1981-03-10 E. I. Du Pont De Nemours And Company Air-fireable conductor composition
DE2929630C2 (de) 1979-07-21 1983-12-15 Dornier System Gmbh, 7990 Friedrichshafen Verfahren zur Herstellung von Silberpulver
US4333966A (en) 1979-07-30 1982-06-08 Graham Magnetics, Inc. Method of forming a conductive metal pattern
US4463030A (en) 1979-07-30 1984-07-31 Graham Magnetics Incorporated Process for forming novel silver powder composition
US4419383A (en) 1979-12-26 1983-12-06 Magnavox Government And Industrial Electronics Company Method for individually encapsulating magnetic particles
US4407674A (en) 1980-03-03 1983-10-04 Ercon, Inc. Novel electroconductive compositions and powder for use therein
US4402458A (en) * 1980-04-12 1983-09-06 Battelle-Institut E.V. Apparatus for atomizing liquids
US4396899A (en) 1980-04-16 1983-08-02 Kabushiki Kaisha Kirk Platinum thin film resistance element and production method therefor
US4450188A (en) 1980-04-18 1984-05-22 Shinroku Kawasumi Process for the preparation of precious metal-coated particles
JPS5922385B2 (ja) * 1980-04-25 1984-05-26 日産自動車株式会社 セラミツク基板のスル−ホ−ル充填用導電体ペ−スト
DE3023297C2 (de) 1980-06-21 1988-05-05 International Minerals & Chemical Luxembourg S.A., 2010 Luxembourg Verfahren zur Herstellung eines Vorproduktes für die Erzeugung von Siliziumcarbid
JPS597765B2 (ja) 1980-09-13 1984-02-21 昭宣 吉澤 微粉末金属の製造方法
US4487811A (en) 1980-12-29 1984-12-11 General Electric Company Electrical conductor
JPS57145214A (en) 1981-03-03 1982-09-08 Matsushita Electric Industrial Co Ltd Coated wire and stripper therefor
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4370308A (en) * 1981-05-15 1983-01-25 Cabot Corporation Production of carbon black
US4416932A (en) 1981-08-03 1983-11-22 E. I. Du Pont De Nemours And Company Thick film conductor compositions
US4381945A (en) * 1981-08-03 1983-05-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPS5837160A (ja) * 1981-08-27 1983-03-04 Mitsubishi Metal Corp 継目無鋼管製造用熱間傾斜圧延機のガイドシユ−用鋳造合金
JPS5852900A (ja) * 1981-09-24 1983-03-29 株式会社日立製作所 セラミツク多層配線板の製造方法
US4418099A (en) 1982-02-05 1983-11-29 Engelhard Corporation Non-burnished precious metal composition
JPS58151450A (ja) * 1982-02-27 1983-09-08 Kyowa Chuzosho:Kk 耐腐蝕性合金鋳鉄
US4508753A (en) * 1982-08-19 1985-04-02 Gte Automatic Electric Inc. Method of producing fine line conductive/resistive patterns on an insulating coating
JPS5938711U (ja) 1982-09-07 1984-03-12 株式会社クボタ 移植機の苗移送装置
US4477296A (en) 1982-09-30 1984-10-16 E. I. Du Pont De Nemours And Company Method for activating metal particles
JPS59103301A (ja) * 1982-12-03 1984-06-14 株式会社明電舎 感温抵抗素子
JPS59103301U (ja) 1982-12-11 1984-07-11 東芝電池株式会社 照明器具
FR2537898A1 (fr) 1982-12-21 1984-06-22 Univ Paris Procede de reduction de composes metalliques par les polyols, et poudres metalliques obtenues par ce procede
US4613371A (en) * 1983-01-24 1986-09-23 Gte Products Corporation Method for making ultrafine metal powder
US4517252A (en) * 1983-05-06 1985-05-14 The Boeing Company Pre-alloyed thick film conductor for use with aluminum wire bonding and method of bonding
US4500368A (en) * 1983-05-12 1985-02-19 Sprague Electric Company Ag/Pd electroding powder and method for making
US4775439A (en) 1983-07-25 1988-10-04 Amoco Corporation Method of making high metal content circuit patterns on plastic boards
JPS6060170A (ja) 1983-09-12 1985-04-06 Canon Inc 記録液
GB8326235D0 (en) * 1983-09-30 1983-11-02 Sherritt Gordon Mines Ltd Production of fine spherical copper powder
AU3994785A (en) * 1984-02-13 1985-08-27 Schmitt, J.J. 111 Method and apparatus for the gas jet deposition of conductingand dielectric thin solid films and products produced there by
JPS60195077A (ja) 1984-03-16 1985-10-03 奥野製薬工業株式会社 セラミツクスの無電解めつき用触媒組成物
US4578114A (en) 1984-04-05 1986-03-25 Metco Inc. Aluminum and yttrium oxide coated thermal spray powder
US5049434A (en) 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
US4548879A (en) 1984-05-21 1985-10-22 Rohm And Haas Company Solderable polymer thick films
US4600604A (en) * 1984-09-17 1986-07-15 E. I. Du Pont De Nemours And Company Metal oxide-coated copper powder
DE3571545D1 (en) 1984-09-19 1989-08-17 Bayer Ag Method of partially activating a substrate surfaces
US4599277A (en) 1984-10-09 1986-07-08 International Business Machines Corp. Control of the sintering of powdered metals
JPS6193828A (ja) * 1984-10-16 1986-05-12 Natl Res Inst For Metals 混合超微粉の製造法
US4668533A (en) 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
JPS622404A (ja) 1985-06-26 1987-01-08 昭栄化学工業株式会社 厚膜ペ−スト
US4720418A (en) * 1985-07-01 1988-01-19 Cts Corporation Pre-reacted resistor paint, and resistors made therefrom
US4612048A (en) 1985-07-15 1986-09-16 E. I. Du Pont De Nemours And Company Dimensionally stable powder metal compositions
US4818614A (en) * 1985-07-29 1989-04-04 Shiseido Company Ltd. Modified powder
US4650108A (en) * 1985-08-15 1987-03-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for forming hermetic seals
JPH0623405B2 (ja) 1985-09-17 1994-03-30 川崎製鉄株式会社 球状銅微粉の製造方法
JPS62113164A (ja) 1985-11-13 1987-05-25 Ricoh Co Ltd 事務用装置
DE3540255A1 (de) 1985-11-13 1987-07-23 Mtu Muenchen Gmbh Verfahren zur herstellung einer dispersionsgehaerteten metall-legierung
DE3786943T2 (de) 1986-03-07 1994-03-17 Nagakazu Furuya Gasdurchlässige Elektrode.
JPS62225573A (ja) * 1986-03-28 1987-10-03 Fukuda Metal Foil & Powder Co Ltd 導電性ペ−スト用銅粉
US4859241A (en) 1986-04-16 1989-08-22 Johnson Matthey Inc. Metal flake and use thereof
US4877647A (en) 1986-04-17 1989-10-31 Kansas State University Research Foundation Method of coating substrates with solvated clusters of metal particles
US5039552A (en) 1986-05-08 1991-08-13 The Boeing Company Method of making thick film gold conductor
US4687511A (en) * 1986-05-15 1987-08-18 Gte Products Corporation Metal matrix composite powders and process for producing same
DE3622123A1 (de) * 1986-07-02 1988-01-21 Dornier System Gmbh Verfahren und vorrichtung zur herstellung von verbundpulvern
JPH0797696B2 (ja) * 1986-07-05 1995-10-18 株式会社豊田自動織機製作所 ハイブリツドｉｃ基板と回路パタ−ン形成方法
JPS6331522A (ja) 1986-07-25 1988-02-10 Kao Corp 吸湿剤
US4799622A (en) * 1986-08-05 1989-01-24 Tao Nenryo Kogyo Kabushiki Kaisha Ultrasonic atomizing apparatus
US4808274A (en) * 1986-09-10 1989-02-28 Engelhard Corporation Metallized substrates and process for producing
US4670047A (en) 1986-09-12 1987-06-02 Gte Products Corporation Process for producing finely divided spherical metal powders
US4721524A (en) * 1986-09-19 1988-01-26 Pdp Alloys, Inc. Non-pyrophoric submicron alloy powders of Group VIII metals
US4731110A (en) * 1987-03-16 1988-03-15 Gte Products Corp. Hydrometallurigcal process for producing finely divided spherical precious metal based powders
FR2613372B1 (fr) * 1987-04-03 1989-06-09 Rhone Poulenc Chimie Particules composites polymere/metal compactes, dispersions aqueuses desdites particules, leur procede de preparation et leur application en biologie
US5338330A (en) 1987-05-22 1994-08-16 Exxon Research & Engineering Company Multiphase composite particle containing a distribution of nonmetallic compound particles
US4778517A (en) * 1987-05-27 1988-10-18 Gte Products Corporation Hydrometallurgical process for producing finely divided copper and copper alloy powders
US4879104A (en) 1987-06-16 1989-11-07 Cabot Corporation Process for producing carbon black
US4948623A (en) 1987-06-30 1990-08-14 International Business Machines Corporation Method of chemical vapor deposition of copper, silver, and gold using a cyclopentadienyl/metal complex
US5147484A (en) 1987-10-19 1992-09-15 International Business Machines Corporation Method for producing multi-layer ceramic substrates with oxidation resistant metalization
DK648187D0 (da) 1987-12-09 1987-12-09 Linkease Test Systems A S Fremgangsmaade og apparat til fremstilling af kredsloebsdel
US4931323A (en) 1987-12-10 1990-06-05 Texas Instruments Incorporated Thick film copper conductor patterning by laser
US4857241A (en) 1987-12-10 1989-08-15 Colgate-Palmolive Company Apparatus for making post-foaming gels and method
DE3802811A1 (de) * 1988-01-30 1989-08-10 Starck Hermann C Fa Agglomerierte metall-verbund-pulver, verfahren zu ihrer herstellung sowie deren verwendung
DE3809331C1 (enExample) * 1988-03-19 1989-04-27 Degussa Ag, 6000 Frankfurt, De
US4892579A (en) * 1988-04-21 1990-01-09 The Dow Chemical Company Process for preparing an amorphous alloy body from mixed crystalline elemental metal powders
US4802933A (en) * 1988-04-21 1989-02-07 Allied-Signal Inc. Nickel-palladium based brazing alloys
DE3843412A1 (de) 1988-04-22 1990-06-28 Bayer Ag Neue polythiophene, verfahren zu ihrer herstellung und ihre verwendung
US4857233A (en) * 1988-05-26 1989-08-15 Potters Industries, Inc. Nickel particle plating system
JPH01303787A (ja) 1988-05-31 1989-12-07 Juki Corp 厚膜回路制御方式
US5132248A (en) 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
US5045141A (en) 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
EP0363552B1 (en) 1988-07-27 1993-10-13 Tanaka Kikinzoku Kogyo K.K. Process for preparing metal particles
US4877451A (en) 1988-08-17 1989-10-31 Xerox Corporation Ink jet inks containing colored silica particles
US5882802A (en) * 1988-08-29 1999-03-16 Ostolski; Marian J. Noble metal coated, seeded bimetallic non-noble metal powders
US5121127A (en) 1988-09-30 1992-06-09 Sony Corporation Microstrip antenna
US4913731A (en) 1988-10-03 1990-04-03 Gte Products Corporation Process of making prealloyed tungsten alloy powders
US4892798A (en) * 1988-12-13 1990-01-09 Minnesota Mining And Manufacturing Company Electrophoretic imaging metal-toner fluid dispersion
JPH03504065A (ja) 1988-12-24 1991-09-05 テクノロジィ　アプリケーションズ　カンパニー　リミテッド プリント回路の改良された作製方法
JP2538043B2 (ja) 1989-04-05 1996-09-25 松下電器産業株式会社 パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法
FI83935C (fi) * 1989-05-24 1991-09-25 Outokumpu Oy Saett att behandla och framstaella material.
GB8917078D0 (en) 1989-07-26 1989-09-13 Emi Plc Thorn An electrically conductive ink
US4954926A (en) * 1989-07-28 1990-09-04 E. I. Du Pont De Nemours And Company Thick film conductor composition
US5126915A (en) 1989-07-28 1992-06-30 E. I. Du Pont De Nemours And Company Metal oxide-coated electrically conductive powders and compositions thereof
US5395422A (en) * 1989-08-22 1995-03-07 Hydro-Quebec Process of preparing nanocrystalline powders of an electroactive alloy
US5028473A (en) 1989-10-02 1991-07-02 Hughes Aircraft Company Three dimensional microcircuit structure and process for fabricating the same from ceramic tape
US5424140A (en) * 1989-10-10 1995-06-13 Alliedsignal Inc. Low melting nickel-palladium-silicon brazing alloys
CA2033139A1 (en) 1989-12-26 1991-06-27 Akira Shibata Silver-metal oxide composite material and process for producing the same
US5057363A (en) 1989-12-27 1991-10-15 Japan Capsular Products Inc. Magnetic display system
US5716663A (en) * 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
US5183784A (en) * 1990-02-21 1993-02-02 Johnson Matthey Inc. Silver-glass pastes
US5075262A (en) 1990-02-21 1991-12-24 Johnson Matthey, Inc. Silver-glass pastes
US5587111A (en) 1990-03-29 1996-12-24 Vacuum Metallurgical Co., Ltd. Metal paste, process for producing same and method of making a metallic thin film using the metal paste
JPH03281783A (ja) 1990-03-29 1991-12-12 Vacuum Metallurgical Co Ltd 金属薄膜の形成方法
US5167869A (en) 1990-04-12 1992-12-01 E. I. Du Pont De Nemours And Company Gold conductor composition for forming conductor patterns on ceramic based substrates
DE69121449T2 (de) 1990-04-12 1997-02-27 Matsushita Electric Ind Co Ltd Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters
US5059242A (en) 1990-04-27 1991-10-22 Firmstone Michael G Seed layer compositions containing organogold and organosilver compounds
US5122182A (en) * 1990-05-02 1992-06-16 The Perkin-Elmer Corporation Composite thermal spray powder of metal and non-metal
US5063021A (en) 1990-05-23 1991-11-05 Gte Products Corporation Method for preparing powders of nickel alloy and molybdenum for thermal spray coatings
US5399432A (en) * 1990-06-08 1995-03-21 Potters Industries, Inc. Galvanically compatible conductive filler and methods of making same
US5853451A (en) * 1990-06-12 1998-12-29 Kawasaki Steel Corporation Ultrafine spherical nickel powder for use as an electrode of laminated ceramic capacitors
US5091003A (en) * 1990-06-15 1992-02-25 Ford Motor Company Ink compositions and method for placing indicia on glass
DE69123183T2 (de) 1990-06-28 1997-04-17 Akira Shibata Verbundmaterial aus Silber- oder Silber-Kupferlegierung mit Metalloxyden und Verfahren zu seiner Herstellung
US5073409A (en) 1990-06-28 1991-12-17 The United States Of America As Represented By The Secretary Of The Navy Environmentally stable metal powders
US5281261A (en) * 1990-08-31 1994-01-25 Xerox Corporation Ink compositions containing modified pigment particles
US5149516A (en) 1990-10-15 1992-09-22 Mobil Oil Corp. Partial oxidation of methane over perovskite catalyst
JP3056522B2 (ja) 1990-11-30 2000-06-26 三菱レイヨン株式会社 金属―導電性高分子複合微粒子及びその製造方法
US5153023A (en) 1990-12-03 1992-10-06 Xerox Corporation Process for catalysis of electroless metal plating on plastic
DE4040446A1 (de) 1990-12-18 1992-06-25 Degussa Gold(i)mercaptocarbonsaeureester, verfahren zu ihrer herstellung und verwendung
CA2058075C (en) 1990-12-26 1996-07-02 Akira Yamakawa Composite ceramic powder and production process thereof
US5244538A (en) 1991-07-26 1993-09-14 Microelectronics And Computer Technology Corporation Method of patterning metal on a substrate using direct-write deposition of a mask
US5962085A (en) 1991-02-25 1999-10-05 Symetrix Corporation Misted precursor deposition apparatus and method with improved mist and mist flow
US5216207A (en) 1991-02-27 1993-06-01 David Sarnoff Research Center, Inc. Low temperature co-fired multilayer ceramic circuit boards with silver conductors
US5283104A (en) 1991-03-20 1994-02-01 International Business Machines Corporation Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
US5288430A (en) 1991-04-12 1994-02-22 Nec Corporation Conductive pastes
US5329293A (en) 1991-04-15 1994-07-12 Trident Methods and apparatus for preventing clogging in ink jet printers
US5171734A (en) 1991-04-22 1992-12-15 Sri International Coating a substrate in a fluidized bed maintained at a temperature below the vaporization temperature of the resulting coating composition
TW199884B (enExample) * 1991-05-08 1993-02-11 Sociere Des Produits Nestle S A
US5176764A (en) * 1991-05-08 1993-01-05 The Goodyear Tire & Rubber Company Tire assembly with inner and outer tires having cooperating vent components
US5139818A (en) 1991-06-06 1992-08-18 General Motors Corporation Method for applying metal catalyst patterns onto ceramic for electroless copper deposition
US5539041A (en) 1991-06-11 1996-07-23 Fiberite, Inc. Siloxane and phosphazene modified cyanate resin compositions
US5139891A (en) * 1991-07-01 1992-08-18 Olin Corporation Palladium alloys having utility in electrical applications
JPH06511481A (ja) * 1991-07-05 1994-12-22 ユニバーシティ オブ ロチェスター 気泡を取り込む超微小非凝集多孔質粒子
US5176744A (en) * 1991-08-09 1993-01-05 Microelectronics Computer & Technology Corp. Solution for direct copper writing
US5173274A (en) * 1991-08-16 1992-12-22 Southwest Research Institute Flash liquid aerosol production method and appartus
US5250229A (en) * 1991-10-10 1993-10-05 E. I. Du Pont De Nemours And Company Silver-rich conductor compositions for high thermal cycled and aged adhesion
FR2682625B1 (fr) 1991-10-18 1997-04-11 Degussa Prod Ceramiques Poudres de metaux et d'alliages de metaux sous forme de grains microcristallins spheriques et compacts, et procede et dispositif pour la fabrication des poudres.
JPH05125499A (ja) * 1991-11-01 1993-05-21 Yoshida Kogyo Kk <Ykk> 高強度高靭性アルミニウム基合金
JP3350949B2 (ja) 1992-02-20 2002-11-25 株式会社村田製作所 導電性ペースト
US5411792A (en) 1992-02-27 1995-05-02 Sumitomo Metal Mining Co., Ltd. Transparent conductive substrate
SG49195A1 (en) 1992-03-05 1998-05-18 Cabot Corp Process for producing carbon blacks and new carbon blacks
US5378508A (en) * 1992-04-01 1995-01-03 Akzo Nobel N.V. Laser direct writing
US5296189A (en) 1992-04-28 1994-03-22 International Business Machines Corporation Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith
DE4214723C2 (de) * 1992-05-04 1994-08-25 Starck H C Gmbh Co Kg Feinteilige Metallpulver
JP3253734B2 (ja) * 1992-06-19 2002-02-04 富士通株式会社 半導体装置製造用の石英製装置
JPH0631166A (ja) 1992-07-06 1994-02-08 Stonehard Assoc Inc 高分散白金微粒子担持触媒の製造方法
US5270368A (en) 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
US5428249A (en) * 1992-07-15 1995-06-27 Canon Kabushiki Kaisha Photovoltaic device with improved collector electrode
US5312674A (en) 1992-07-31 1994-05-17 Hughes Aircraft Company Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
GB9217811D0 (en) 1992-08-21 1992-10-07 Graetzel Michael Organic compounds
TW256798B (enExample) * 1992-10-05 1995-09-11 Du Pont
TW261554B (enExample) * 1992-10-05 1995-11-01 Du Pont
JP3042224B2 (ja) 1992-10-09 2000-05-15 昭栄化学工業株式会社 積層セラミックコンデンサの製造方法
US5332646A (en) 1992-10-21 1994-07-26 Minnesota Mining And Manufacturing Company Method of making a colloidal palladium and/or platinum metal dispersion
JP3064713B2 (ja) 1992-11-30 2000-07-12 昭栄化学工業株式会社 耐酸化性パラジウム粉末と耐酸化性パラジウム粉末の製造方法とこれを用いた厚膜導電性ペーストおよび積層セラミックコンデンサ
US5444453A (en) 1993-02-02 1995-08-22 Ball Corporation Microstrip antenna structure having an air gap and method of constructing same
US5433893A (en) 1993-02-03 1995-07-18 Chemet Corporation Conductive compositions
US5958361A (en) * 1993-03-19 1999-09-28 Regents Of The University Of Michigan Ultrafine metal oxide powders by flame spray pyrolysis
US5429670A (en) 1993-04-26 1995-07-04 Matsushita Electric Industrial Co., Ltd. Gold paste for a ceramic circuit board
JPH06318403A (ja) 1993-05-07 1994-11-15 Murata Mfg Co Ltd 導電性被膜形成用銅ペースト
US5545360A (en) 1993-06-08 1996-08-13 Industrial Technology Research Institute Process for preparing powders with superior homogeneity from aqueous solutions of metal nitrates
US5384953A (en) * 1993-07-21 1995-01-31 International Business Machines Corporation Structure and a method for repairing electrical lines
US5378408A (en) * 1993-07-29 1995-01-03 E. I. Du Pont De Nemours And Company Lead-free thick film paste composition
US5495386A (en) 1993-08-03 1996-02-27 Avx Corporation Electrical components, such as capacitors, and methods for their manufacture
US5494550A (en) * 1993-09-07 1996-02-27 Sensormatic Electronics Corporation Methods for the making of electronic article surveillance tags and improved electronic article surveillance tags produced thereby
EP0641670B1 (en) 1993-09-07 1996-07-31 Agfa-Gevaert N.V. Ink jet printing method
US5838271A (en) 1997-01-31 1998-11-17 Lg Semicon Co., Ltd. Digital to analog converter and bias circuit therefor for providing weighed currents
US5470373A (en) * 1993-11-15 1995-11-28 The United States Of America As Represented By The Secretary Of The Navy Oxidation resistant copper
US5712673A (en) 1993-12-01 1998-01-27 Dai Nippon Printing Co., Ltd. Thermal transfer recording medium and thermal transfer recording method
ATE440480T1 (de) 1993-12-30 2009-09-15 Miyake Kk Verbundfolie mit schaltungsfírmiger metallfolie oder dergleichen und verfahren zur herstellung
US5429657A (en) 1994-01-05 1995-07-04 E. I. Du Pont De Nemours And Company Method for making silver-palladium alloy powders by aerosol decomposition
JPH07207185A (ja) 1994-01-21 1995-08-08 Kawazumi Gijutsu Kenkyusho:Kk 被覆パラジウム微粉末および導電性ペースト
DE4403678A1 (de) * 1994-02-07 1995-08-10 Basf Ag Metalloxid- und metallbeschichtete Carrier für die Elektrophotographie
US5588983A (en) 1994-02-16 1996-12-31 Murata Manufacturing Co., Ltd. Production of copper powder
US5559057A (en) 1994-03-24 1996-09-24 Starfire Electgronic Development & Marketing Ltd. Method for depositing and patterning thin films formed by fusing nanocrystalline precursors
US5759939A (en) * 1994-04-08 1998-06-02 Kansas State University Research Foundation Composite metal oxide adsorbents
US5609919A (en) * 1994-04-21 1997-03-11 Altamat Inc. Method for producing droplets
DE19502434A1 (de) 1994-04-29 1995-11-02 Hewlett Packard Co System und Verfahren zur inkrementalen Herstellung von Schaltungsplatinen
DE4417495C1 (de) * 1994-05-19 1995-09-28 Schott Glaswerke Verfahren zur Herstellung von mit Y¶2¶0¶3¶ dispersionsverfestigten Reinst-Platin-Werkstoffen, Halbzeugen und Blechen
US5599046A (en) 1994-06-22 1997-02-04 Scientific Games Inc. Lottery ticket structure with circuit elements
US6379742B1 (en) * 1994-06-22 2002-04-30 Scientific Games Inc. Lottery ticket structure
DE69506333T2 (de) * 1994-07-11 1999-07-15 Agfa-Gevaert N.V., Mortsel Tintenstrahldruckverfahren
JP3587884B2 (ja) 1994-07-21 2004-11-10 富士通株式会社 多層回路基板の製造方法
DE69417555T2 (de) 1994-09-22 1999-10-21 Asea Brown Boveri Ag, Baden Verfahren zur Herstellung von einem gemischten Metalloxydpulver und das nach diesem Verfahren hergestellte gemischte Metalloxydpulver
DE4437752A1 (de) * 1994-10-21 1996-04-25 Basf Ag Verfahren zur Herstellung von siliciumoxidbeschichteten Feststoffteilchen
JPH08148787A (ja) * 1994-11-21 1996-06-07 Sumitomo Kinzoku Ceramics:Kk 厚膜ペースト
IL154538A (en) * 1994-12-15 2009-12-24 Cabot Corp The reaction of carbon black with diazonium salts, the resulting carbon black products
US5571311A (en) 1994-12-15 1996-11-05 Cabot Corporation Ink jet ink formulations containing carbon black products
JPH08170112A (ja) 1994-12-16 1996-07-02 Sumitomo Metal Mining Co Ltd 金属粉末の噴霧熱分解製造方法および装置
US5604027A (en) * 1995-01-03 1997-02-18 Xerox Corporation Some uses of microencapsulation for electric paper
US5861136A (en) 1995-01-10 1999-01-19 E. I. Du Pont De Nemours And Company Method for making copper I oxide powders by aerosol decomposition
US5523006A (en) * 1995-01-17 1996-06-04 Synmatix Corporation Ultrafine powder lubricant
DE69629864T2 (de) 1995-04-03 2004-07-15 Canon K.K. Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes
DE69622618T2 (de) 1995-04-04 2003-03-20 Canon K.K., Tokio/Tokyo Metallenthaltende Zusammensetzung zum Bilden einer elektronenemittierenden Vorrichtung und Verfahren zur Herstellung einer elektronenemittierenden Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes
JP3132664B2 (ja) 1995-04-24 2001-02-05 株式会社エヌ・ティ・ティ・ドコモ マイクロストリップアンテナ装置
US5781158A (en) 1995-04-25 1998-07-14 Young Hoek Ko Electric/magnetic microstrip antenna
US6548036B2 (en) * 1995-05-04 2003-04-15 Cabot Corporation Method for producing carbon black
US5565143A (en) 1995-05-05 1996-10-15 E. I. Du Pont De Nemours And Company Water-based silver-silver chloride compositions
US6156428A (en) * 1995-06-02 2000-12-05 Gibson; Charles P. Base metal particles having anisometric morphology
US5604673A (en) * 1995-06-07 1997-02-18 Hughes Electronics Low temperature co-fired ceramic substrates for power converters
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US6118426A (en) 1995-07-20 2000-09-12 E Ink Corporation Transducers and indicators having printed displays
US6124851A (en) 1995-07-20 2000-09-26 E Ink Corporation Electronic book with multiple page displays
JP3585598B2 (ja) 1995-08-25 2004-11-04 大日本印刷株式会社 熱転写シート
US6080261A (en) 1995-08-25 2000-06-27 Popat; Ghanshyam H. Adhesive image transfer technique
US5616165A (en) * 1995-08-25 1997-04-01 E. I. Du Pont De Nemours And Company Method for making gold powders by aerosol decomposition
AU6915696A (en) * 1995-09-07 1997-03-27 Penn State Research Foundation, The High production rate of nano particles by laser liquid interaction
KR0155877B1 (ko) 1995-09-12 1998-12-15 이대원 다층 회로기판 및 그 제조방법
US5679724A (en) 1995-09-29 1997-10-21 Xerox Corporation Submicron particles for ink jet inks
US5759230A (en) 1995-11-30 1998-06-02 The United States Of America As Represented By The Secretary Of The Navy Nanostructured metallic powders and films via an alcoholic solvent process
DE19545455C1 (de) 1995-12-06 1997-01-23 Degussa Verfahren zur Herstellung von Edelmetallpulvern
US5826329A (en) 1995-12-19 1998-10-27 Ncr Corporation Method of making printed circuit board using thermal transfer techniques
US5932280A (en) 1995-12-19 1999-08-03 Ncr Corporation Printed circuit board having printed resistors and method of making printed resistors on a printed circuit board using thermal transfer techniques
DE19548421B4 (de) * 1995-12-22 2004-06-03 Celanese Ventures Gmbh Verfahren zur kontinuierlichen Herstellung von Membranelektrodeneinheiten
US5945158A (en) * 1996-01-16 1999-08-31 N.V. Union Miniere S.A. Process for the production of silver coated particles
US5763106A (en) * 1996-01-19 1998-06-09 Hino Motors, Ltd. Composite powder and method for forming a self-lubricating composite coating and self-lubricating components formed thereby
US5909083A (en) 1996-02-16 1999-06-01 Dai Nippon Printing Co., Ltd. Process for producing plasma display panel
JPH09241862A (ja) 1996-03-01 1997-09-16 Murata Mfg Co Ltd 銅粉末及び銅ペースト並びにセラミック電子部品
US6027762A (en) * 1996-05-23 2000-02-22 Mitsumi Electric Co., Ltd. Method for producing flexible board
US6356234B1 (en) 1996-06-12 2002-03-12 R T Microwave Limited Electrical circuit
US5747562A (en) * 1996-06-14 1998-05-05 Cabot Corporation Ink and coating compositions containing silicon-treated carbon black
US5837045A (en) 1996-06-17 1998-11-17 Cabot Corporation Colored pigment and aqueous compositions containing same
US5998085A (en) 1996-07-23 1999-12-07 3M Innovative Properties Process for preparing high resolution emissive arrays and corresponding articles
US5948200A (en) * 1996-07-26 1999-09-07 Taiyo Yuden Co., Ltd. Method of manufacturing laminated ceramic electronic parts
US5756008A (en) 1996-08-14 1998-05-26 E. I. Du Pont De Nemours And Company Water cleanable silver composition
AU3781797A (en) 1996-08-16 1998-03-06 Hugh P Craig Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
US6652967B2 (en) 2001-08-08 2003-11-25 Nanoproducts Corporation Nano-dispersed powders and methods for their manufacture
US6344271B1 (en) 1998-11-06 2002-02-05 Nanoenergy Corporation Materials and products using nanostructured non-stoichiometric substances
US5801108A (en) 1996-09-11 1998-09-01 Motorola Inc. Low temperature cofireable dielectric paste
JP3137035B2 (ja) * 1997-05-26 2001-02-19 昭栄化学工業株式会社 ニッケル粉末及びその製造方法
JP3277823B2 (ja) 1996-09-25 2002-04-22 昭栄化学工業株式会社 金属粉末の製造方法
US5874770A (en) 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
TW353762B (en) 1996-10-21 1999-03-01 Dainippon Printing Co Ltd Transfer sheet, and pattern-forming method
US5930026A (en) 1996-10-25 1999-07-27 Massachusetts Institute Of Technology Nonemissive displays and piezoelectric power supplies therefor
US6207268B1 (en) * 1996-11-12 2001-03-27 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
US5725647A (en) * 1996-11-27 1998-03-10 Minnesota Mining And Manufacturing Company Pigmented inks and humectants used therewith
JP3205793B2 (ja) * 1996-12-19 2001-09-04 株式会社巴製作所 超微粒子及びその製造方法
US6103868A (en) 1996-12-27 2000-08-15 The Regents Of The University Of California Organically-functionalized monodisperse nanocrystals of metals
US5759712A (en) 1997-01-06 1998-06-02 Hockaday; Robert G. Surface replica fuel cell for micro fuel cell electrical power pack
US6099897A (en) 1997-01-29 2000-08-08 Mitsuboshi Belting Ltd. Method for producing metal particulate dispersion and metal particle-carrying substance
ATE353536T1 (de) 1997-02-20 2007-02-15 Partnerships Ltd Inc Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter
US6019926A (en) * 1997-02-20 2000-02-01 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Adminstration Reflective silvered polyimide films via in situ thermal reduction silver (I) complexes
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
TW340296B (en) 1997-02-21 1998-09-11 Ricoh Microelectronics Kk Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate
US6338809B1 (en) 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US6780350B1 (en) 1997-02-24 2004-08-24 Superior Micropowders Llc Metal-carbon composite powders, methods for producing powders and devices fabricated from same
US6699304B1 (en) 1997-02-24 2004-03-02 Superior Micropowders, Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
US7097686B2 (en) * 1997-02-24 2006-08-29 Cabot Corporation Nickel powders, methods for producing powders and devices fabricated from same
CA2280865C (en) 1997-02-24 2008-08-12 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US6830823B1 (en) 1997-02-24 2004-12-14 Superior Micropowders Llc Gold powders, methods for producing powders and devices fabricated from same
US6159267A (en) 1997-02-24 2000-12-12 Superior Micropowders Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
US6679937B1 (en) * 1997-02-24 2004-01-20 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
US6660680B1 (en) 1997-02-24 2003-12-09 Superior Micropowders, Llc Electrocatalyst powders, methods for producing powders and devices fabricated from same
US6103393A (en) 1998-02-24 2000-08-15 Superior Micropowders Llc Metal-carbon composite powders, methods for producing powders and devices fabricated from same
US5846615A (en) 1997-02-28 1998-12-08 The Whitaker Corporation Direct deposition of a gold layer
US5894038A (en) * 1997-02-28 1999-04-13 The Whitaker Corporation Direct deposition of palladium
US5828271A (en) 1997-03-06 1998-10-27 Northrop Grumman Corporation Planar ferrite toroid microwave phase shifter
US6399230B1 (en) 1997-03-06 2002-06-04 Sarnoff Corporation Multilayer ceramic circuit boards with embedded resistors
US5837041A (en) 1997-04-15 1998-11-17 Xerox Corporation Ink cartridges having ink compositions with pigmented particles and methods for their manufacture and use
US5853470A (en) 1997-04-28 1998-12-29 Eastman Kodak Company Pigmented ink jet inks containing aldehydes
EP0989205A4 (en) * 1997-04-30 2003-05-28 Takamatsu Res Lab METAL PASTE AND PROCESS FOR PRODUCING A METAL LAYER
US5928405A (en) * 1997-05-21 1999-07-27 Degussa Corporation Method of making metallic powders by aerosol thermolysis
US6025026A (en) * 1997-06-30 2000-02-15 Transitions Optical, Inc. Process for producing an adherent polymeric layer on polymeric substrates and articles produced thereby
US6190931B1 (en) * 1997-07-15 2001-02-20 Silverbrook Research Pty. Ltd. Method of manufacture of a linear spring electromagnetic grill ink jet printer
US6599631B2 (en) 2001-01-26 2003-07-29 Nanogram Corporation Polymer-inorganic particle composites
KR100274317B1 (ko) 1997-08-26 2001-01-15 정명식 화학증착에의한개구충전방법
US5879715A (en) * 1997-09-02 1999-03-09 Ceramem Corporation Process and system for production of inorganic nanoparticles
WO1999017352A1 (en) 1997-09-30 1999-04-08 Partnerships Limited, Inc. Method and compositions for metallizing microvias and high density interconnects in photodefined dielectrics
WO1999016556A1 (en) 1997-09-30 1999-04-08 Partnerships Limited, Inc. Method for metallizing holes
EP1023174A1 (en) 1997-09-30 2000-08-02 Partnerships Limited, Inc. Manufacture of thin metal objects
US6268014B1 (en) * 1997-10-02 2001-07-31 Chris Eberspacher Method for forming solar cell materials from particulars
CA2306384A1 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
JP3475749B2 (ja) 1997-10-17 2003-12-08 昭栄化学工業株式会社 ニッケル粉末及びその製造方法
WO1999030193A1 (fr) * 1997-12-05 1999-06-17 Sumitomo Electric Industries, Ltd. Fibre optique a dispersion plate
US6045769A (en) 1997-12-08 2000-04-04 Nanogram Corporation Process for carbon production
US6074725A (en) 1997-12-10 2000-06-13 Caliper Technologies Corp. Fabrication of microfluidic circuits by printing techniques
JP4003273B2 (ja) 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
EP0989570A4 (en) 1998-01-22 2005-08-31 Matsushita Electric Industrial Co Ltd INK FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING AN ELECTRONIC COMPONENT USING THE INK, AND INK JET DEVICE
WO1999038921A1 (en) 1998-01-29 1999-08-05 Cabot Corporation Processes of purifying a dispersion and making inkjet inks
EP0947245B1 (en) 1998-02-05 2004-04-07 Motorola Semiconducteurs S.A. Method of forming metal colloids and method of forming a metal oxide sensitive layer for a chemical sensor device
US20050097987A1 (en) 1998-02-24 2005-05-12 Cabot Corporation Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same
US6753108B1 (en) 1998-02-24 2004-06-22 Superior Micropowders, Llc Energy devices and methods for the fabrication of energy devices
NL1008460C2 (nl) * 1998-03-03 1999-09-06 Acheson Colloiden B V Geleidende inkt of verf.
CA2329859A1 (en) 1998-04-20 1999-12-02 Allen C. Templeton Nanometer particles containing a reactive monolayer
US6329899B1 (en) 1998-04-29 2001-12-11 Microcoating Technologies, Inc. Formation of thin film resistors
JP2000011875A (ja) 1998-06-19 2000-01-14 Dainippon Toryo Co Ltd プラズマディスプレイの製造方法
US6262129B1 (en) 1998-07-31 2001-07-17 International Business Machines Corporation Method for producing nanoparticles of transition metals
US6153348A (en) 1998-08-07 2000-11-28 Parelec Llc Electrostatic printing of conductors on photoresists and liquid metallic toners therefor
EP0980097B1 (en) * 1998-08-10 2013-01-09 Ulvac, Inc. Dispersion containing Cu ultrafine particles individually dispersed therein
US6277740B1 (en) * 1998-08-14 2001-08-21 Avery N. Goldstein Integrated circuit trenched features and method of producing same
US6780765B2 (en) 1998-08-14 2004-08-24 Avery N. Goldstein Integrated circuit trenched features and method of producing same
US6294401B1 (en) 1998-08-19 2001-09-25 Massachusetts Institute Of Technology Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same
KR20010072835A (ko) 1998-08-21 2001-07-31 추후제출 전기 회로 및 구성요소의 프린팅
US7098163B2 (en) * 1998-08-27 2006-08-29 Cabot Corporation Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
EP0982090B1 (en) 1998-08-27 2003-05-02 Agfa-Gevaert Method of preparation of recording elements
US6245494B1 (en) 1998-08-27 2001-06-12 Agfa-Gevaert Method of imaging a heat mode recording element comprising highly dispersed metal alloys
EP0985448A1 (en) * 1998-08-28 2000-03-15 Engelhard Corporation Nickel catalyst
JP3323887B2 (ja) 1998-09-08 2002-09-09 富士ゼロックス株式会社 インクジェット式プリンタ及び印刷方法
US6251488B1 (en) 1999-05-05 2001-06-26 Optomec Design Company Precision spray processes for direct write electronic components
US20030020768A1 (en) * 1998-09-30 2003-01-30 Renn Michael J. Direct write TM system
US6743319B2 (en) 1998-09-30 2004-06-01 Paralec Inc. Adhesiveless transfer lamination method and materials for producing electronic circuits
US6636676B1 (en) 1998-09-30 2003-10-21 Optomec Design Company Particle guidance system
DE19847161A1 (de) 1998-10-14 2000-04-20 Degussa Mittels Aerosol dotiertes pyrogen hergestelltes Siliciumdioxid
US6707680B2 (en) 1998-10-22 2004-03-16 Board Of Trustees Of The University Of Arkansas Surface applied passives
WO2000029208A1 (en) 1998-11-16 2000-05-25 Parelec Inc. Electrically heatable, transparent windows and mirrors and method for production
JP2000182889A (ja) 1998-12-16 2000-06-30 Matsushita Electric Ind Co Ltd 積層セラミック電子部品の製造方法、これに用いるインキジェット用インキおよびその製造方法
US6274412B1 (en) 1998-12-21 2001-08-14 Parelec, Inc. Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
US6358567B2 (en) * 1998-12-23 2002-03-19 The Regents Of The University Of California Colloidal spray method for low cost thin coating deposition
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
DE69922776T2 (de) 1999-01-21 2005-12-08 Sony International (Europe) Gmbh Nanoteilchenstruktur zur Anwendung in einer elektronischen Anordnung, insbesondere in einem chemischen Sensor
US6177151B1 (en) * 1999-01-27 2001-01-23 The United States Of America As Represented By The Secretary Of The Navy Matrix assisted pulsed laser evaporation direct write
JP4004675B2 (ja) * 1999-01-29 2007-11-07 株式会社日清製粉グループ本社 酸化物被覆金属微粒子の製造方法
US6169234B1 (en) * 1999-03-01 2001-01-02 Pioneer Hi-Bred International, Inc. Hybrid maize plant and seed 36B08
US6348295B1 (en) * 1999-03-26 2002-02-19 Massachusetts Institute Of Technology Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging
JP3571957B2 (ja) 1999-03-30 2004-09-29 松下電器産業株式会社 導体ペーストおよびセラミック多層基板の製造方法
US6251471B1 (en) 1999-05-12 2001-06-26 University Of New Hampshire Surface trace electrical feedthru
EP1099183A4 (en) 1999-05-24 2004-12-15 Potomac Photonics Inc MATERIAL SUPPLY SYSTEM FOR MANUFACTURING MINIATURE STRUCTURE
US6811885B1 (en) 1999-06-06 2004-11-02 Agfa-Gevaert Acid stable aqueous dispersion of metal particles and applications
US6667360B1 (en) 1999-06-10 2003-12-23 Rensselaer Polytechnic Institute Nanoparticle-filled polymers
WO2000076699A1 (fr) 1999-06-15 2000-12-21 Kimoto, Masaaki Poudre metallique composite ultrafine et procede de production de ladite poudre
US6238734B1 (en) 1999-07-08 2001-05-29 Air Products And Chemicals, Inc. Liquid precursor mixtures for deposition of multicomponent metal containing materials
US6143356A (en) 1999-08-06 2000-11-07 Parelec, Inc. Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards
WO2001015838A1 (en) * 1999-08-31 2001-03-08 Toho Titanium Co., Ltd. Nickel powder for monolithic ceramic capacitor
US6317023B1 (en) 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
JP2001135138A (ja) * 1999-10-29 2001-05-18 Matsushita Electric Ind Co Ltd 導体ペースト
EP1151814A4 (en) * 1999-11-12 2006-11-02 Mitsui Mining & Smelting Co NICKEL POWDER AND CONDUCTIVE PASTE
JP3957444B2 (ja) * 1999-11-22 2007-08-15 三井金属鉱業株式会社 ニッケル粉、その製造方法及び電子部品電極形成用ペースト
JP2001167633A (ja) 1999-12-09 2001-06-22 Ebara Corp 金属成分含有溶液及び金属薄膜形成方法
TW476073B (en) 1999-12-09 2002-02-11 Ebara Corp Solution containing metal component, method of and apparatus for forming thin metal film
WO2001047044A2 (en) * 1999-12-21 2001-06-28 Plastic Logic Limited Forming interconnects
EP1110647A3 (en) * 1999-12-22 2004-02-11 Mitsui Mining and Smelting Co., Ltd Paste to be fired for forming circuit board and method for preparing surface-modified silver powder
JP3908426B2 (ja) 1999-12-24 2007-04-25 日本碍子株式会社 セラミックコンデンサー電極形成用ペースト
WO2001053007A1 (en) 2000-01-21 2001-07-26 Midwest Research Institute Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles
JP3841607B2 (ja) * 2000-02-03 2006-11-01 三井金属鉱業株式会社 ニッケル粉及び導電ペースト
AU2001247961A1 (en) 2000-02-04 2001-08-14 Optomec Design Company Modified absorption through unique composite materials and material combinations
US6501663B1 (en) 2000-02-28 2002-12-31 Hewlett Packard Company Three-dimensional interconnect system
US6360656B2 (en) 2000-02-28 2002-03-26 Minolta Co., Ltd. Apparatus for and method of printing on three-dimensional object
WO2001078908A1 (en) * 2000-04-04 2001-10-25 Parlex Corporation High speed flip chip assembly process
TW512383B (en) * 2000-04-17 2002-12-01 Matsushita Electric Industrial Co Ltd Ink for display panels and manufacturing method of a plasma display panel using the ink
WO2001082315A1 (en) 2000-04-20 2001-11-01 Parelec, Inc. Compositions and method for printing resistors, capacitors and inductors
AU2001261469A1 (en) 2000-05-12 2001-11-26 Parelec Inc. Additive electronic circuits on thermally unstable substrates
JP3753925B2 (ja) * 2000-05-12 2006-03-08 株式会社ルネサステクノロジ 半導体集積回路
JP4035968B2 (ja) 2000-06-30 2008-01-23 セイコーエプソン株式会社 導電膜パターンの形成方法
US7282238B2 (en) 2000-06-30 2007-10-16 Ngimat Co. Method of depositing materials
GB0016747D0 (en) 2000-07-08 2000-08-30 Johnson Matthey Plc Ink
DE10035211A1 (de) * 2000-07-20 2002-01-31 Beiersdorf Ag Geformtes Seifenprodukt, enthaltend Talkum, eine oder mehrere Fettsäuren in Form ihrer Alkaliseifen und ein oder mehrere nichtionische Tenside bei gleichzeitiger Abwesenheit von Alkyl-(oligo)-glycosiden
AU2001278332A1 (en) * 2000-07-28 2002-02-13 Simon Fraser University Methods for the lithographic deposition of materials containingnanoparticles
US7351449B2 (en) 2000-09-22 2008-04-01 N Gimat Co. Chemical vapor deposition methods for making powders and coatings, and coatings made using these methods
JP4871443B2 (ja) 2000-10-13 2012-02-08 株式会社アルバック 金属超微粒子分散液の製造方法
US6649138B2 (en) 2000-10-13 2003-11-18 Quantum Dot Corporation Surface-modified semiconductive and metallic nanoparticles having enhanced dispersibility in aqueous media
JP2002124016A (ja) 2000-10-13 2002-04-26 Mitsubishi Electric Corp ディスク再生装置及びディスク再生方法
JP5008216B2 (ja) 2000-10-13 2012-08-22 株式会社アルバック インクジェット用インクの製法
AU2001290266A1 (en) 2000-10-25 2002-05-06 Harima Chemicals, Inc. Electroconductive metal paste and method for production thereof
US20030151030A1 (en) 2000-11-22 2003-08-14 Gurin Michael H. Enhanced conductivity nanocomposites and method of use thereof
US20040206941A1 (en) 2000-11-22 2004-10-21 Gurin Michael H. Composition for enhancing conductivity of a carrier medium and method of use thereof
JP4677092B2 (ja) * 2000-12-04 2011-04-27 株式会社アルバック フラットパネルディスプレイの電極形成方法
GB0030095D0 (en) 2000-12-09 2001-01-24 Xaar Technology Ltd Method of ink jet printing
TW533446B (en) 2000-12-22 2003-05-21 Koninkl Philips Electronics Nv Electroluminescent device and a method of manufacturing thereof
US6467897B1 (en) 2001-01-08 2002-10-22 3M Innovative Properties Company Energy curable inks and other compositions incorporating surface modified, nanometer-sized particles
AR032424A1 (es) 2001-01-30 2003-11-05 Procter & Gamble Composiciones de recubrimiento para modificar superficies.
JP3693647B2 (ja) * 2001-02-08 2005-09-07 日立マクセル株式会社 金属合金微粒子及びその製造方法
US6830806B2 (en) 2001-04-12 2004-12-14 Kreido Laboratories Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured
WO2002086924A1 (en) 2001-04-20 2002-10-31 Matsushita Electric Industrial Co., Ltd. Method of producing electronic parts, and member for production thereof
WO2002087749A1 (en) 2001-04-30 2002-11-07 Postech Foundation Colloid solution of metal nanoparticles, metal-polymer nanocomposites and methods for preparation thereof
US20030211246A1 (en) 2001-05-11 2003-11-13 Kydd Paul H. Additive electronic circuits on thermally unstable substrates
CN1280025C (zh) 2001-06-01 2006-10-18 利特斯公司 微沉积系统以及在衬底上沉积精确量的流体材料的方法
US20040231594A1 (en) 2001-06-01 2004-11-25 Edwards Charles O. Microdeposition apparatus
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
TW498409B (en) * 2001-07-04 2002-08-11 Ind Tech Res Inst Forming method and apparatus of integrated circuit with passive devices
EP1426978A4 (en) 2001-08-22 2008-09-10 Sumitomo Electric Industries CONDUCTIVE PASTE AND CONDUCTIVE FILM USING THE SAME, DEPOSITION METHOD, AND PROCESS FOR PRODUCING A COMPOUND METAL COMPONENT
AUPR725701A0 (en) 2001-08-24 2001-09-20 Commonwealth Scientific And Industrial Research Organisation Functionalised nanoparticle concentrates
WO2003021041A2 (de) 2001-09-03 2003-03-13 Basf Aktiengesellschaft Verfahren zur erhöhung der weisse von papier mit hilfe von kationischen polyelektrolyten
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20060001726A1 (en) * 2001-10-05 2006-01-05 Cabot Corporation Printable conductive features and processes for making same
AU2002337822A1 (en) 2001-10-05 2003-04-22 Superior Micropowders Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US6951666B2 (en) 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20030108664A1 (en) 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US6701605B2 (en) 2001-10-09 2004-03-09 Sonoco Development, Inc. Conductive electrical element and antenna with ink additive technology
US20030215565A1 (en) 2001-10-10 2003-11-20 Industrial Technology Research Institute Method and apparatus for the formation of laminated circuit having passive components therein
US6936181B2 (en) 2001-10-11 2005-08-30 Kovio, Inc. Methods for patterning using liquid embossing
US20030070569A1 (en) * 2001-10-11 2003-04-17 Colin Bulthaup Micro-stencil
US6562403B2 (en) 2001-10-15 2003-05-13 Kansas State University Research Foundation Synthesis of substantially monodispersed colloids
US20030073042A1 (en) * 2001-10-17 2003-04-17 Cernigliaro George J. Process and materials for formation of patterned films of functional materials
KR20040077655A (ko) 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
JP2003133691A (ja) 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
JP4039035B2 (ja) 2001-10-31 2008-01-30 セイコーエプソン株式会社 線パターンの形成方法、線パターン、電気光学装置、電子機器、非接触型カード媒体
IL161622A0 (en) 2001-11-01 2004-09-27 Yissum Res Dev Co Ink jet inks containing metal nanoparticles
US7553512B2 (en) 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
US20030146019A1 (en) 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
WO2003051562A1 (en) 2001-12-18 2003-06-26 Asahi Kasei Kabushiki Kaisha Metal oxide dispersion
JP4020764B2 (ja) * 2001-12-21 2007-12-12 Ｊｆｅミネラル株式会社 分散性に優れた金属超微粉スラリー
JP3803062B2 (ja) 2001-12-27 2006-08-02 矢崎総業株式会社 車両用指示装置
JP2003288812A (ja) 2001-12-29 2003-10-10 Samsung Electronics Co Ltd 金属ナノ粒子クラスターインクおよびこれを用いた金属パターン形成方法
DE10209835A1 (de) 2002-03-06 2003-10-16 Bosch Gmbh Robert Wasserlösliche Paste und deren Verwendung
JP3966034B2 (ja) 2002-03-14 2007-08-29 セイコーエプソン株式会社 吐出パターンデータ生成方法および吐出パターンデータ生成装置
US20030185889A1 (en) 2002-03-27 2003-10-02 Jixiong Yan Colloidal nanosilver solution and method for making the same
KR20040089453A (ko) 2002-03-28 2004-10-21 신꼬오덴기 고교 가부시키가이샤 배선 구조체 및 이의 제조 방법
JP3805273B2 (ja) 2002-03-29 2006-08-02 Ｕｈｔ株式会社 積層型電子部品の製造装置
TWI251018B (en) 2002-04-10 2006-03-11 Fujikura Ltd Electroconductive composition, electroconductive coating and method of producing the electroconductive coating
JP4042497B2 (ja) 2002-04-15 2008-02-06 セイコーエプソン株式会社 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体
US6773614B2 (en) 2002-04-16 2004-08-10 Hewlett-Packard Development Company, L.P. Method of patterning conductive films
EP1383364A3 (en) 2002-05-23 2006-01-04 Nashua Corporation Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
US20040173144A1 (en) 2002-05-31 2004-09-09 Edwards Charles O. Formation of printed circuit board structures using piezo microdeposition
EP2154212A1 (en) 2002-06-13 2010-02-17 Cima Nano Tech Israel Ltd A method for the production of conductive and transparent nano-coatings
US7736693B2 (en) 2002-06-13 2010-06-15 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
KR20060012545A (ko) 2002-07-03 2006-02-08 나노파우더스 인더스트리어스 리미티드. 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
KR100453131B1 (ko) * 2002-08-10 2004-10-15 율촌화학 주식회사 사슬 말단 기능성 고분자를 이용하여 안정화시킨 나노크기 금속 또는 금속염 및 이들의 제조 방법
US6890050B2 (en) 2002-08-20 2005-05-10 Palo Alto Research Center Incorporated Method for the printing of homogeneous electronic material with a multi-ejector print head
US20040058457A1 (en) * 2002-08-29 2004-03-25 Xueying Huang Functionalized nanoparticles
JP2004111253A (ja) 2002-09-19 2004-04-08 Noda Screen:Kk 電子デバイスの電気的接続用導電性組成物および電子デバイス
GB0221893D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
AU2003275533A1 (en) * 2002-09-25 2004-04-19 Konica Minolta Holdings, Inc. Electric circuit, thin film transistor, method for manufacturing electric circuit and method for manufacturing thin film transistor
US7078008B2 (en) 2002-10-01 2006-07-18 Conocophillips Company Process for converting alkanes to carbon filaments
JP3801158B2 (ja) 2002-11-19 2006-07-26 セイコーエプソン株式会社 多層配線基板の製造方法、多層配線基板、電子デバイス及び電子機器
EP1585604B1 (en) 2002-11-27 2012-01-04 Ulvac, Inc. Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors
US7914617B2 (en) 2002-11-27 2011-03-29 Tapesh Yadav Nano-engineered inks, methods for their manufacture and their applications
US7585349B2 (en) * 2002-12-09 2009-09-08 The University Of Washington Methods of nanostructure formation and shape selection
US20040126708A1 (en) 2002-12-31 2004-07-01 3M Innovative Properties Company Method for modifying the surface of a polymeric substrate
US20060172168A1 (en) 2003-01-10 2006-08-03 Wright Emma V Deposited structures
GB0300529D0 (en) 2003-01-10 2003-02-12 Qinetiq Nanomaterials Ltd Improvements in and relating to ink jet deposition
TWI265762B (en) 2003-01-14 2006-11-01 Sharp Kk Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
US7380690B2 (en) 2003-01-17 2008-06-03 Ricoh Company, Ltd. Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate
US7211205B2 (en) 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US7141185B2 (en) 2003-01-29 2006-11-28 Parelec, Inc. High conductivity inks with low minimum curing temperatures
WO2004068918A2 (en) 2003-01-31 2004-08-12 Aktina Limited Method for producing thin silver layers
WO2004075211A1 (en) 2003-02-20 2004-09-02 The Regents Of The University Of California Method of forming conductors at low temperatures using metallic nanocrystals and product
JP4332360B2 (ja) 2003-02-28 2009-09-16 大日本印刷株式会社 濡れ性パターン形成用塗工液およびパターン形成体の製造方法
KR100401335B1 (en) 2003-03-08 2003-10-10 Mijitech Co Ltd Metal nanoparticle surface-coated with silicon oxides and preparation thereof
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
JP2004304129A (ja) 2003-04-01 2004-10-28 Seiko Epson Corp 液滴吐出法によるパターン形成方法、多層配線構造の形成方法
JP4432347B2 (ja) 2003-04-07 2010-03-17 ソニー株式会社 液体吐出装置及び液体吐出方法
US6880909B2 (en) * 2003-04-22 2005-04-19 Lexmark International Inc. Method and apparatus for adjusting drop velocity
KR20030044987A (ko) 2003-05-22 2003-06-09 넵테크놀로지주식회사 나노 크기의 입자가 첨가 된 액상 세탁 세제의 제조 방법
JP3861854B2 (ja) 2003-05-28 2006-12-27 セイコーエプソン株式会社 電気回路の製造方法
AU2003232436A1 (en) 2003-05-29 2005-01-21 Seagate Technology Llc Synthesis of iron-based alloy nanoparticles
US7393081B2 (en) 2003-06-30 2008-07-01 Semiconductor Energy Laboratory Co., Ltd. Droplet jetting device and method of manufacturing pattern
US7202155B2 (en) * 2003-08-15 2007-04-10 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing wiring and method for manufacturing semiconductor device
US20050089683A1 (en) 2003-09-12 2005-04-28 Fuji Photo Film Co., Ltd. Magnetic particles and method of producing the same and magnetic recording medium
EP1678761A1 (en) 2003-10-29 2006-07-12 Conductive Inkjet Technology Limited Electrical connection of components
JP4157468B2 (ja) 2003-12-12 2008-10-01 日立電線株式会社 配線基板
JP2005191059A (ja) 2003-12-24 2005-07-14 Seiko Epson Corp 電気回路の形成方法、電気回路製造装置
JP2005219873A (ja) 2004-02-06 2005-08-18 Fuji Xerox Co Ltd 記録材の除湿装置
KR101215119B1 (ko) 2004-03-01 2012-12-24 스미토모덴키고교가부시키가이샤 금속콜로이드용액 및 잉크젯용 금속잉크
KR101171129B1 (ko) 2004-07-08 2012-08-03 미쓰비시 엔피쯔 가부시키가이샤 모발용 도포구 및 그 도포구 부착 화장재료 용기
US20060083694A1 (en) * 2004-08-07 2006-04-20 Cabot Corporation Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same
TW200625901A (en) * 2004-09-22 2006-07-16 Free Systems Pte Ltd An apparatus and method for adaptive digitial locking and soft evaluation of data symbols in a wireless digital communication system
GB0427164D0 (en) 2004-12-11 2005-01-12 Eastman Kodak Co Conductive silver dispersions and uses thereof
DE602006017644D1 (de) 2005-01-14 2010-12-02 Cabot Corp Sicherheitseinrichtungen sowie verwendung und herstellungsverfahren davon
WO2006076607A1 (en) 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of passive electricalcomponents
US20060158497A1 (en) 2005-01-14 2006-07-20 Karel Vanheusden Ink-jet printing of compositionally non-uniform features
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076610A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
WO2006076614A1 (en) 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc's) and other custom electronic devices
WO2006076611A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Production of metal nanoparticles
WO2006076608A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
WO2006076604A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
WO2006076605A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Circuit modeling and selective deposition
US20060162497A1 (en) 2005-01-21 2006-07-27 Cabot Corporation Processes for forming nanoparticles in a flame spray system

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Publication number Priority date Publication date Assignee Title
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JP2009541588A (ja) * 2006-06-19 2009-11-26 キャボット コーポレイション 金属含有ナノ粒子、その合成及び使用
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