|
US2398301A
(en)
|
1943-07-26 |
1946-04-09 |
Dow Chemical Co |
Removal of highly unsaturated hydrocarbon impurities from diolefin-containing mixtures
|
|
US2785964A
(en)
*
|
1953-08-17 |
1957-03-19 |
Phillips Petroleum Co |
Process, apparatus, and system for producing, agglomerating, and collecting carbon black
|
|
NL6507771A
(enExample)
|
1964-06-17 |
1965-12-20 |
|
|
|
US3401020A
(en)
|
1964-11-25 |
1968-09-10 |
Phillips Petroleum Co |
Process and apparatus for the production of carbon black
|
|
US3313362A
(en)
*
|
1965-02-03 |
1967-04-11 |
Air Drilling Specialties Co |
Method of and composition for use in, gas drilling
|
|
US3415640A
(en)
*
|
1966-10-28 |
1968-12-10 |
Fansteel Metallurgical Corp |
Process for making dispersions of particulate oxides in metals
|
|
US3510291A
(en)
*
|
1966-11-10 |
1970-05-05 |
Westinghouse Electric Corp |
Vapor phase conversion of molybdenum or tungsten compound to form the oxide or metal
|
|
US3617358A
(en)
*
|
1967-09-29 |
1971-11-02 |
Metco Inc |
Flame spray powder and process
|
|
US3785801A
(en)
|
1968-03-01 |
1974-01-15 |
Int Nickel Co |
Consolidated composite materials by powder metallurgy
|
|
SE345692B
(enExample)
|
1969-05-19 |
1972-06-05 |
Montedison Spa |
|
|
US3683382A
(en)
|
1969-05-29 |
1972-08-08 |
Honeywell Inc |
Recording medium responsive to force fields and apparatus for recording and reproducing signals on the medium
|
|
USRE28972E
(en)
|
1969-07-10 |
1976-09-21 |
Boehringer Ingelheim Gmbh |
5-Aryl-1H-1,5-benzodiazepine-2,4-diones
|
|
US3846345A
(en)
*
|
1969-10-06 |
1974-11-05 |
Owens Illinois Inc |
Electroconductive paste composition and structures formed therefrom
|
|
US3620714A
(en)
*
|
1970-02-26 |
1971-11-16 |
Du Pont |
Process of preparing noble metal alloy powders
|
|
US3620713A
(en)
*
|
1970-02-26 |
1971-11-16 |
Du Pont |
Process of preparing noble metal powders
|
|
NL7117454A
(enExample)
|
1970-12-24 |
1972-06-27 |
|
|
|
GB1367281A
(en)
*
|
1971-01-19 |
1974-09-18 |
Sony Corp |
Speed detecting devices
|
|
US3922388A
(en)
|
1971-03-02 |
1975-11-25 |
Honeywell Inc |
Method of making an encapsulated thick film resistor and associated encapsulated conductors for use in an electrical circuit
|
|
US3768994A
(en)
|
1971-03-15 |
1973-10-30 |
Owens Illinois Inc |
Gold powder
|
|
GB1381666A
(en)
|
1971-04-02 |
1975-01-22 |
Univ Australian |
Compositions containing copper salts their methods of production and the recovery and purification of copper
|
|
US3816097A
(en)
|
1971-05-06 |
1974-06-11 |
Owens Illinois Inc |
Powders of metal, silver and gold
|
|
US3717481A
(en)
|
1971-05-13 |
1973-02-20 |
Du Pont |
Gold metallizing compositions
|
|
US4044193A
(en)
|
1971-06-16 |
1977-08-23 |
Prototech Company |
Finely particulated colloidal platinum compound and sol for producing the same, and method of preparation of fuel cell electrodes and the like employing the same
|
|
US3725035A
(en)
|
1971-07-02 |
1973-04-03 |
Du Pont |
Process for making gold powder
|
|
US3882050A
(en)
*
|
1971-12-23 |
1975-05-06 |
Ethyl Corp |
Method of depositing a noble metal on a surface of a nickel support
|
|
US3830435A
(en)
*
|
1972-06-12 |
1974-08-20 |
Int Nickel Co |
Production of ceramic-metal composite powders and articles thereof
|
|
US3814696A
(en)
|
1972-06-19 |
1974-06-04 |
Eastman Kodak Co |
Colloidal metal in non-aqueous media
|
|
AU5910773A
(en)
|
1972-08-23 |
1975-02-13 |
Uncle Ben S Australia Pty |
Treatment of meat products
|
|
IT967833B
(it)
|
1972-09-25 |
1974-03-11 |
Montedison Spa |
Procedimento per preparare polveri di nichel submicroniche aventi for ma sferoidale
|
|
DE2310062A1
(de)
|
1973-02-28 |
1974-08-29 |
Siemens Ag |
Dickschichtschaltung auf keramiksubstrat mit durchkontaktierungen zwischen den leiterzuegen auf beiden seiten des substrates
|
|
DE2329352C2
(de)
|
1973-06-08 |
1982-05-19 |
Demetron Gesellschaft für Elektronik-Werkstoffe mbH, 6540 Hanau |
Verfahren zur Herstellung von Goldpulver
|
|
US4096316A
(en)
|
1973-08-18 |
1978-06-20 |
Fuji Photo Film Co., Ltd. |
Method of producing magnetic material with alkaline borohydrides
|
|
US3902102A
(en)
|
1974-04-01 |
1975-08-26 |
Sprague Electric Co |
Ceramic capacitor with base metal electrodes
|
|
GB1461176A
(en)
|
1974-04-11 |
1977-01-13 |
Plessey Inc |
Method of producing powdered materials
|
|
US3881914A
(en)
*
|
1974-04-26 |
1975-05-06 |
Owens Illinois Inc |
Preparation of electronic grade copper
|
|
US3966463A
(en)
|
1974-08-12 |
1976-06-29 |
Plessey Incorporated |
Oxidation and sinter-resistant metal powders and pastes
|
|
US4218507A
(en)
*
|
1975-01-13 |
1980-08-19 |
Graham Magnetics, Inc. |
Coated particles and process of preparing same
|
|
US4010025A
(en)
*
|
1975-04-07 |
1977-03-01 |
Plessey Incorporated |
Oxidation and sinter-resistant metal powders and pastes
|
|
US4036634A
(en)
|
1975-04-07 |
1977-07-19 |
Plessey, Incorporated |
Oxidation and sinter-resistant metal powders
|
|
US4122232A
(en)
|
1975-04-21 |
1978-10-24 |
Engelhard Minerals & Chemicals Corporation |
Air firable base metal conductors
|
|
US4019188A
(en)
*
|
1975-05-12 |
1977-04-19 |
International Business Machines Corporation |
Micromist jet printer
|
|
US4094853A
(en)
|
1975-05-15 |
1978-06-13 |
Kenrich Petrochemicals, Inc. |
Alkoxy titanate salts useful as coupling agents
|
|
US3988651A
(en)
|
1975-05-23 |
1976-10-26 |
Erie Technological Products, Inc. |
Monolithic ceramic capacitor
|
|
GB1558762A
(en)
*
|
1975-07-04 |
1980-01-09 |
Johnson Matthey Co Ltd |
Metal or alloy coated powders
|
|
US4072771A
(en)
|
1975-11-28 |
1978-02-07 |
Bala Electronics Corporation |
Copper thick film conductor
|
|
US4223085A
(en)
*
|
1976-04-05 |
1980-09-16 |
Xerox Corporation |
Semi-conductive nickel carrier particles
|
|
US4089676A
(en)
|
1976-05-24 |
1978-05-16 |
Williams Gold Refining Company Incorporated |
Method for producing nickel metal powder
|
|
JPS5324600A
(en)
|
1976-08-19 |
1978-03-07 |
Murata Manufacturing Co |
Nonnreducing dielectric ceramic composition
|
|
JPS5332015A
(en)
|
1976-09-07 |
1978-03-25 |
Fuji Photo Film Co Ltd |
Thermodevelopable photosensitive material
|
|
US4146957A
(en)
|
1977-01-17 |
1979-04-03 |
Engelhard Minerals & Chemicals Corporation |
Thick film resistance thermometer
|
|
US4105483A
(en)
|
1977-02-14 |
1978-08-08 |
Globe Industries Corporation |
Printing ink transfer process
|
|
US4211668A
(en)
|
1977-03-07 |
1980-07-08 |
Thalatta, Inc. |
Process of microencapsulation and products thereof
|
|
US4289534A
(en)
|
1977-05-03 |
1981-09-15 |
Graham Magnetics, Inc. |
Metal powder paint composition
|
|
US4186244A
(en)
*
|
1977-05-03 |
1980-01-29 |
Graham Magnetics Inc. |
Novel silver powder composition
|
|
US4130671A
(en)
|
1977-09-30 |
1978-12-19 |
The United States Of America As Represented By The United States Department Of Energy |
Method for preparing a thick film conductor
|
|
US4140817A
(en)
|
1977-11-04 |
1979-02-20 |
Bell Telephone Laboratories, Incorporated |
Thick film resistor circuits
|
|
US4136059A
(en)
|
1977-12-12 |
1979-01-23 |
United Technologies Corporation |
Method for producing highly dispersed catalytic platinum
|
|
FR2429264A1
(fr)
*
|
1978-06-20 |
1980-01-18 |
Louyot Comptoir Lyon Alemand |
Procede de fabrication d'un platinoide comportant une phase dispersee d'un oxyde refractaire
|
|
US4223369A
(en)
|
1978-07-03 |
1980-09-16 |
Sprague Electric Company |
Monolithic capacitor with low firing zirconate and nickel electrodes
|
|
DE2851729C2
(de)
|
1978-11-30 |
1980-06-04 |
W.C. Heraeus Gmbh, 6450 Hanau |
Blendgold, Verfahren zum Verblenden gegossener oder gesinterter metallischer Zahnprothesen oder Zahnprothesenteile und Anwendung des Blendgoldes
|
|
US4266229A
(en)
*
|
1979-03-26 |
1981-05-05 |
Whittaker Corporation |
Light sensitive jet inks
|
|
US4255291A
(en)
*
|
1979-06-21 |
1981-03-10 |
E. I. Du Pont De Nemours And Company |
Air-fireable conductor composition
|
|
DE2929630C2
(de)
|
1979-07-21 |
1983-12-15 |
Dornier System Gmbh, 7990 Friedrichshafen |
Verfahren zur Herstellung von Silberpulver
|
|
US4333966A
(en)
|
1979-07-30 |
1982-06-08 |
Graham Magnetics, Inc. |
Method of forming a conductive metal pattern
|
|
US4463030A
(en)
|
1979-07-30 |
1984-07-31 |
Graham Magnetics Incorporated |
Process for forming novel silver powder composition
|
|
US4419383A
(en)
|
1979-12-26 |
1983-12-06 |
Magnavox Government And Industrial Electronics Company |
Method for individually encapsulating magnetic particles
|
|
US4407674A
(en)
|
1980-03-03 |
1983-10-04 |
Ercon, Inc. |
Novel electroconductive compositions and powder for use therein
|
|
US4402458A
(en)
*
|
1980-04-12 |
1983-09-06 |
Battelle-Institut E.V. |
Apparatus for atomizing liquids
|
|
US4396899A
(en)
|
1980-04-16 |
1983-08-02 |
Kabushiki Kaisha Kirk |
Platinum thin film resistance element and production method therefor
|
|
US4450188A
(en)
|
1980-04-18 |
1984-05-22 |
Shinroku Kawasumi |
Process for the preparation of precious metal-coated particles
|
|
JPS5922385B2
(ja)
*
|
1980-04-25 |
1984-05-26 |
日産自動車株式会社 |
セラミツク基板のスル−ホ−ル充填用導電体ペ−スト
|
|
DE3023297C2
(de)
|
1980-06-21 |
1988-05-05 |
International Minerals & Chemical Luxembourg S.A., 2010 Luxembourg |
Verfahren zur Herstellung eines Vorproduktes für die Erzeugung von Siliziumcarbid
|
|
JPS597765B2
(ja)
|
1980-09-13 |
1984-02-21 |
昭宣 吉澤 |
微粉末金属の製造方法
|
|
US4487811A
(en)
|
1980-12-29 |
1984-12-11 |
General Electric Company |
Electrical conductor
|
|
JPS57145214A
(en)
|
1981-03-03 |
1982-09-08 |
Matsushita Electric Industrial Co Ltd |
Coated wire and stripper therefor
|
|
JPS57185316A
(en)
*
|
1981-05-11 |
1982-11-15 |
Sumitomo Metal Mining Co Ltd |
Electrically conductive resin paste
|
|
US4370308A
(en)
*
|
1981-05-15 |
1983-01-25 |
Cabot Corporation |
Production of carbon black
|
|
US4416932A
(en)
|
1981-08-03 |
1983-11-22 |
E. I. Du Pont De Nemours And Company |
Thick film conductor compositions
|
|
US4381945A
(en)
*
|
1981-08-03 |
1983-05-03 |
E. I. Du Pont De Nemours And Company |
Thick film conductor compositions
|
|
JPS5837160A
(ja)
*
|
1981-08-27 |
1983-03-04 |
Mitsubishi Metal Corp |
継目無鋼管製造用熱間傾斜圧延機のガイドシユ−用鋳造合金
|
|
JPS5852900A
(ja)
*
|
1981-09-24 |
1983-03-29 |
株式会社日立製作所 |
セラミツク多層配線板の製造方法
|
|
US4418099A
(en)
|
1982-02-05 |
1983-11-29 |
Engelhard Corporation |
Non-burnished precious metal composition
|
|
JPS58151450A
(ja)
*
|
1982-02-27 |
1983-09-08 |
Kyowa Chuzosho:Kk |
耐腐蝕性合金鋳鉄
|
|
US4508753A
(en)
*
|
1982-08-19 |
1985-04-02 |
Gte Automatic Electric Inc. |
Method of producing fine line conductive/resistive patterns on an insulating coating
|
|
JPS5938711U
(ja)
|
1982-09-07 |
1984-03-12 |
株式会社クボタ |
移植機の苗移送装置
|
|
US4477296A
(en)
|
1982-09-30 |
1984-10-16 |
E. I. Du Pont De Nemours And Company |
Method for activating metal particles
|
|
JPS59103301A
(ja)
*
|
1982-12-03 |
1984-06-14 |
株式会社明電舎 |
感温抵抗素子
|
|
JPS59103301U
(ja)
|
1982-12-11 |
1984-07-11 |
東芝電池株式会社 |
照明器具
|
|
FR2537898A1
(fr)
|
1982-12-21 |
1984-06-22 |
Univ Paris |
Procede de reduction de composes metalliques par les polyols, et poudres metalliques obtenues par ce procede
|
|
US4613371A
(en)
*
|
1983-01-24 |
1986-09-23 |
Gte Products Corporation |
Method for making ultrafine metal powder
|
|
US4517252A
(en)
*
|
1983-05-06 |
1985-05-14 |
The Boeing Company |
Pre-alloyed thick film conductor for use with aluminum wire bonding and method of bonding
|
|
US4500368A
(en)
*
|
1983-05-12 |
1985-02-19 |
Sprague Electric Company |
Ag/Pd electroding powder and method for making
|
|
US4775439A
(en)
|
1983-07-25 |
1988-10-04 |
Amoco Corporation |
Method of making high metal content circuit patterns on plastic boards
|
|
JPS6060170A
(ja)
|
1983-09-12 |
1985-04-06 |
Canon Inc |
記録液
|
|
GB8326235D0
(en)
*
|
1983-09-30 |
1983-11-02 |
Sherritt Gordon Mines Ltd |
Production of fine spherical copper powder
|
|
AU3994785A
(en)
*
|
1984-02-13 |
1985-08-27 |
Schmitt, J.J. 111 |
Method and apparatus for the gas jet deposition of conductingand dielectric thin solid films and products produced there by
|
|
JPS60195077A
(ja)
|
1984-03-16 |
1985-10-03 |
奥野製薬工業株式会社 |
セラミツクスの無電解めつき用触媒組成物
|
|
US4578114A
(en)
|
1984-04-05 |
1986-03-25 |
Metco Inc. |
Aluminum and yttrium oxide coated thermal spray powder
|
|
US5049434A
(en)
|
1984-04-30 |
1991-09-17 |
National Starch And Chemical Investment Holding Corporation |
Pre-patterned device substrate device-attach adhesive transfer system
|
|
US4548879A
(en)
|
1984-05-21 |
1985-10-22 |
Rohm And Haas Company |
Solderable polymer thick films
|
|
US4600604A
(en)
*
|
1984-09-17 |
1986-07-15 |
E. I. Du Pont De Nemours And Company |
Metal oxide-coated copper powder
|
|
DE3571545D1
(en)
|
1984-09-19 |
1989-08-17 |
Bayer Ag |
Method of partially activating a substrate surfaces
|
|
US4599277A
(en)
|
1984-10-09 |
1986-07-08 |
International Business Machines Corp. |
Control of the sintering of powdered metals
|
|
JPS6193828A
(ja)
*
|
1984-10-16 |
1986-05-12 |
Natl Res Inst For Metals |
混合超微粉の製造法
|
|
US4668533A
(en)
|
1985-05-10 |
1987-05-26 |
E. I. Du Pont De Nemours And Company |
Ink jet printing of printed circuit boards
|
|
JPS622404A
(ja)
|
1985-06-26 |
1987-01-08 |
昭栄化学工業株式会社 |
厚膜ペ−スト
|
|
US4720418A
(en)
*
|
1985-07-01 |
1988-01-19 |
Cts Corporation |
Pre-reacted resistor paint, and resistors made therefrom
|
|
US4612048A
(en)
|
1985-07-15 |
1986-09-16 |
E. I. Du Pont De Nemours And Company |
Dimensionally stable powder metal compositions
|
|
US4818614A
(en)
*
|
1985-07-29 |
1989-04-04 |
Shiseido Company Ltd. |
Modified powder
|
|
US4650108A
(en)
*
|
1985-08-15 |
1987-03-17 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
Method for forming hermetic seals
|
|
JPH0623405B2
(ja)
|
1985-09-17 |
1994-03-30 |
川崎製鉄株式会社 |
球状銅微粉の製造方法
|
|
JPS62113164A
(ja)
|
1985-11-13 |
1987-05-25 |
Ricoh Co Ltd |
事務用装置
|
|
DE3540255A1
(de)
|
1985-11-13 |
1987-07-23 |
Mtu Muenchen Gmbh |
Verfahren zur herstellung einer dispersionsgehaerteten metall-legierung
|
|
DE3786943T2
(de)
|
1986-03-07 |
1994-03-17 |
Nagakazu Furuya |
Gasdurchlässige Elektrode.
|
|
JPS62225573A
(ja)
*
|
1986-03-28 |
1987-10-03 |
Fukuda Metal Foil & Powder Co Ltd |
導電性ペ−スト用銅粉
|
|
US4859241A
(en)
|
1986-04-16 |
1989-08-22 |
Johnson Matthey Inc. |
Metal flake and use thereof
|
|
US4877647A
(en)
|
1986-04-17 |
1989-10-31 |
Kansas State University Research Foundation |
Method of coating substrates with solvated clusters of metal particles
|
|
US5039552A
(en)
|
1986-05-08 |
1991-08-13 |
The Boeing Company |
Method of making thick film gold conductor
|
|
US4687511A
(en)
*
|
1986-05-15 |
1987-08-18 |
Gte Products Corporation |
Metal matrix composite powders and process for producing same
|
|
DE3622123A1
(de)
*
|
1986-07-02 |
1988-01-21 |
Dornier System Gmbh |
Verfahren und vorrichtung zur herstellung von verbundpulvern
|
|
JPH0797696B2
(ja)
*
|
1986-07-05 |
1995-10-18 |
株式会社豊田自動織機製作所 |
ハイブリツドic基板と回路パタ−ン形成方法
|
|
JPS6331522A
(ja)
|
1986-07-25 |
1988-02-10 |
Kao Corp |
吸湿剤
|
|
US4799622A
(en)
*
|
1986-08-05 |
1989-01-24 |
Tao Nenryo Kogyo Kabushiki Kaisha |
Ultrasonic atomizing apparatus
|
|
US4808274A
(en)
*
|
1986-09-10 |
1989-02-28 |
Engelhard Corporation |
Metallized substrates and process for producing
|
|
US4670047A
(en)
|
1986-09-12 |
1987-06-02 |
Gte Products Corporation |
Process for producing finely divided spherical metal powders
|
|
US4721524A
(en)
*
|
1986-09-19 |
1988-01-26 |
Pdp Alloys, Inc. |
Non-pyrophoric submicron alloy powders of Group VIII metals
|
|
US4731110A
(en)
*
|
1987-03-16 |
1988-03-15 |
Gte Products Corp. |
Hydrometallurigcal process for producing finely divided spherical precious metal based powders
|
|
FR2613372B1
(fr)
*
|
1987-04-03 |
1989-06-09 |
Rhone Poulenc Chimie |
Particules composites polymere/metal compactes, dispersions aqueuses desdites particules, leur procede de preparation et leur application en biologie
|
|
US5338330A
(en)
|
1987-05-22 |
1994-08-16 |
Exxon Research & Engineering Company |
Multiphase composite particle containing a distribution of nonmetallic compound particles
|
|
US4778517A
(en)
*
|
1987-05-27 |
1988-10-18 |
Gte Products Corporation |
Hydrometallurgical process for producing finely divided copper and copper alloy powders
|
|
US4879104A
(en)
|
1987-06-16 |
1989-11-07 |
Cabot Corporation |
Process for producing carbon black
|
|
US4948623A
(en)
|
1987-06-30 |
1990-08-14 |
International Business Machines Corporation |
Method of chemical vapor deposition of copper, silver, and gold using a cyclopentadienyl/metal complex
|
|
US5147484A
(en)
|
1987-10-19 |
1992-09-15 |
International Business Machines Corporation |
Method for producing multi-layer ceramic substrates with oxidation resistant metalization
|
|
DK648187D0
(da)
|
1987-12-09 |
1987-12-09 |
Linkease Test Systems A S |
Fremgangsmaade og apparat til fremstilling af kredsloebsdel
|
|
US4931323A
(en)
|
1987-12-10 |
1990-06-05 |
Texas Instruments Incorporated |
Thick film copper conductor patterning by laser
|
|
US4857241A
(en)
|
1987-12-10 |
1989-08-15 |
Colgate-Palmolive Company |
Apparatus for making post-foaming gels and method
|
|
DE3802811A1
(de)
*
|
1988-01-30 |
1989-08-10 |
Starck Hermann C Fa |
Agglomerierte metall-verbund-pulver, verfahren zu ihrer herstellung sowie deren verwendung
|
|
DE3809331C1
(enExample)
*
|
1988-03-19 |
1989-04-27 |
Degussa Ag, 6000 Frankfurt, De |
|
|
US4892579A
(en)
*
|
1988-04-21 |
1990-01-09 |
The Dow Chemical Company |
Process for preparing an amorphous alloy body from mixed crystalline elemental metal powders
|
|
US4802933A
(en)
*
|
1988-04-21 |
1989-02-07 |
Allied-Signal Inc. |
Nickel-palladium based brazing alloys
|
|
DE3843412A1
(de)
|
1988-04-22 |
1990-06-28 |
Bayer Ag |
Neue polythiophene, verfahren zu ihrer herstellung und ihre verwendung
|
|
US4857233A
(en)
*
|
1988-05-26 |
1989-08-15 |
Potters Industries, Inc. |
Nickel particle plating system
|
|
JPH01303787A
(ja)
|
1988-05-31 |
1989-12-07 |
Juki Corp |
厚膜回路制御方式
|
|
US5132248A
(en)
|
1988-05-31 |
1992-07-21 |
The United States Of America As Represented By The United States Department Of Energy |
Direct write with microelectronic circuit fabrication
|
|
US5045141A
(en)
|
1988-07-01 |
1991-09-03 |
Amoco Corporation |
Method of making solderable printed circuits formed without plating
|
|
EP0363552B1
(en)
|
1988-07-27 |
1993-10-13 |
Tanaka Kikinzoku Kogyo K.K. |
Process for preparing metal particles
|
|
US4877451A
(en)
|
1988-08-17 |
1989-10-31 |
Xerox Corporation |
Ink jet inks containing colored silica particles
|
|
US5882802A
(en)
*
|
1988-08-29 |
1999-03-16 |
Ostolski; Marian J. |
Noble metal coated, seeded bimetallic non-noble metal powders
|
|
US5121127A
(en)
|
1988-09-30 |
1992-06-09 |
Sony Corporation |
Microstrip antenna
|
|
US4913731A
(en)
|
1988-10-03 |
1990-04-03 |
Gte Products Corporation |
Process of making prealloyed tungsten alloy powders
|
|
US4892798A
(en)
*
|
1988-12-13 |
1990-01-09 |
Minnesota Mining And Manufacturing Company |
Electrophoretic imaging metal-toner fluid dispersion
|
|
JPH03504065A
(ja)
|
1988-12-24 |
1991-09-05 |
テクノロジィ アプリケーションズ カンパニー リミテッド |
プリント回路の改良された作製方法
|
|
JP2538043B2
(ja)
|
1989-04-05 |
1996-09-25 |
松下電器産業株式会社 |
パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法
|
|
FI83935C
(fi)
*
|
1989-05-24 |
1991-09-25 |
Outokumpu Oy |
Saett att behandla och framstaella material.
|
|
GB8917078D0
(en)
|
1989-07-26 |
1989-09-13 |
Emi Plc Thorn |
An electrically conductive ink
|
|
US4954926A
(en)
*
|
1989-07-28 |
1990-09-04 |
E. I. Du Pont De Nemours And Company |
Thick film conductor composition
|
|
US5126915A
(en)
|
1989-07-28 |
1992-06-30 |
E. I. Du Pont De Nemours And Company |
Metal oxide-coated electrically conductive powders and compositions thereof
|
|
US5395422A
(en)
*
|
1989-08-22 |
1995-03-07 |
Hydro-Quebec |
Process of preparing nanocrystalline powders of an electroactive alloy
|
|
US5028473A
(en)
|
1989-10-02 |
1991-07-02 |
Hughes Aircraft Company |
Three dimensional microcircuit structure and process for fabricating the same from ceramic tape
|
|
US5424140A
(en)
*
|
1989-10-10 |
1995-06-13 |
Alliedsignal Inc. |
Low melting nickel-palladium-silicon brazing alloys
|
|
CA2033139A1
(en)
|
1989-12-26 |
1991-06-27 |
Akira Shibata |
Silver-metal oxide composite material and process for producing the same
|
|
US5057363A
(en)
|
1989-12-27 |
1991-10-15 |
Japan Capsular Products Inc. |
Magnetic display system
|
|
US5716663A
(en)
*
|
1990-02-09 |
1998-02-10 |
Toranaga Technologies |
Multilayer printed circuit
|
|
US5183784A
(en)
*
|
1990-02-21 |
1993-02-02 |
Johnson Matthey Inc. |
Silver-glass pastes
|
|
US5075262A
(en)
|
1990-02-21 |
1991-12-24 |
Johnson Matthey, Inc. |
Silver-glass pastes
|
|
US5587111A
(en)
|
1990-03-29 |
1996-12-24 |
Vacuum Metallurgical Co., Ltd. |
Metal paste, process for producing same and method of making a metallic thin film using the metal paste
|
|
JPH03281783A
(ja)
|
1990-03-29 |
1991-12-12 |
Vacuum Metallurgical Co Ltd |
金属薄膜の形成方法
|
|
US5167869A
(en)
|
1990-04-12 |
1992-12-01 |
E. I. Du Pont De Nemours And Company |
Gold conductor composition for forming conductor patterns on ceramic based substrates
|
|
DE69121449T2
(de)
|
1990-04-12 |
1997-02-27 |
Matsushita Electric Ind Co Ltd |
Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters
|
|
US5059242A
(en)
|
1990-04-27 |
1991-10-22 |
Firmstone Michael G |
Seed layer compositions containing organogold and organosilver compounds
|
|
US5122182A
(en)
*
|
1990-05-02 |
1992-06-16 |
The Perkin-Elmer Corporation |
Composite thermal spray powder of metal and non-metal
|
|
US5063021A
(en)
|
1990-05-23 |
1991-11-05 |
Gte Products Corporation |
Method for preparing powders of nickel alloy and molybdenum for thermal spray coatings
|
|
US5399432A
(en)
*
|
1990-06-08 |
1995-03-21 |
Potters Industries, Inc. |
Galvanically compatible conductive filler and methods of making same
|
|
US5853451A
(en)
*
|
1990-06-12 |
1998-12-29 |
Kawasaki Steel Corporation |
Ultrafine spherical nickel powder for use as an electrode of laminated ceramic capacitors
|
|
US5091003A
(en)
*
|
1990-06-15 |
1992-02-25 |
Ford Motor Company |
Ink compositions and method for placing indicia on glass
|
|
DE69123183T2
(de)
|
1990-06-28 |
1997-04-17 |
Akira Shibata |
Verbundmaterial aus Silber- oder Silber-Kupferlegierung mit Metalloxyden und Verfahren zu seiner Herstellung
|
|
US5073409A
(en)
|
1990-06-28 |
1991-12-17 |
The United States Of America As Represented By The Secretary Of The Navy |
Environmentally stable metal powders
|
|
US5281261A
(en)
*
|
1990-08-31 |
1994-01-25 |
Xerox Corporation |
Ink compositions containing modified pigment particles
|
|
US5149516A
(en)
|
1990-10-15 |
1992-09-22 |
Mobil Oil Corp. |
Partial oxidation of methane over perovskite catalyst
|
|
JP3056522B2
(ja)
|
1990-11-30 |
2000-06-26 |
三菱レイヨン株式会社 |
金属―導電性高分子複合微粒子及びその製造方法
|
|
US5153023A
(en)
|
1990-12-03 |
1992-10-06 |
Xerox Corporation |
Process for catalysis of electroless metal plating on plastic
|
|
DE4040446A1
(de)
|
1990-12-18 |
1992-06-25 |
Degussa |
Gold(i)mercaptocarbonsaeureester, verfahren zu ihrer herstellung und verwendung
|
|
CA2058075C
(en)
|
1990-12-26 |
1996-07-02 |
Akira Yamakawa |
Composite ceramic powder and production process thereof
|
|
US5244538A
(en)
|
1991-07-26 |
1993-09-14 |
Microelectronics And Computer Technology Corporation |
Method of patterning metal on a substrate using direct-write deposition of a mask
|
|
US5962085A
(en)
|
1991-02-25 |
1999-10-05 |
Symetrix Corporation |
Misted precursor deposition apparatus and method with improved mist and mist flow
|
|
US5216207A
(en)
|
1991-02-27 |
1993-06-01 |
David Sarnoff Research Center, Inc. |
Low temperature co-fired multilayer ceramic circuit boards with silver conductors
|
|
US5283104A
(en)
|
1991-03-20 |
1994-02-01 |
International Business Machines Corporation |
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
|
|
US5288430A
(en)
|
1991-04-12 |
1994-02-22 |
Nec Corporation |
Conductive pastes
|
|
US5329293A
(en)
|
1991-04-15 |
1994-07-12 |
Trident |
Methods and apparatus for preventing clogging in ink jet printers
|
|
US5171734A
(en)
|
1991-04-22 |
1992-12-15 |
Sri International |
Coating a substrate in a fluidized bed maintained at a temperature below the vaporization temperature of the resulting coating composition
|
|
TW199884B
(enExample)
*
|
1991-05-08 |
1993-02-11 |
Sociere Des Produits Nestle S A |
|
|
US5176764A
(en)
*
|
1991-05-08 |
1993-01-05 |
The Goodyear Tire & Rubber Company |
Tire assembly with inner and outer tires having cooperating vent components
|
|
US5139818A
(en)
|
1991-06-06 |
1992-08-18 |
General Motors Corporation |
Method for applying metal catalyst patterns onto ceramic for electroless copper deposition
|
|
US5539041A
(en)
|
1991-06-11 |
1996-07-23 |
Fiberite, Inc. |
Siloxane and phosphazene modified cyanate resin compositions
|
|
US5139891A
(en)
*
|
1991-07-01 |
1992-08-18 |
Olin Corporation |
Palladium alloys having utility in electrical applications
|
|
JPH06511481A
(ja)
*
|
1991-07-05 |
1994-12-22 |
ユニバーシティ オブ ロチェスター |
気泡を取り込む超微小非凝集多孔質粒子
|
|
US5176744A
(en)
*
|
1991-08-09 |
1993-01-05 |
Microelectronics Computer & Technology Corp. |
Solution for direct copper writing
|
|
US5173274A
(en)
*
|
1991-08-16 |
1992-12-22 |
Southwest Research Institute |
Flash liquid aerosol production method and appartus
|
|
US5250229A
(en)
*
|
1991-10-10 |
1993-10-05 |
E. I. Du Pont De Nemours And Company |
Silver-rich conductor compositions for high thermal cycled and aged adhesion
|
|
FR2682625B1
(fr)
|
1991-10-18 |
1997-04-11 |
Degussa Prod Ceramiques |
Poudres de metaux et d'alliages de metaux sous forme de grains microcristallins spheriques et compacts, et procede et dispositif pour la fabrication des poudres.
|
|
JPH05125499A
(ja)
*
|
1991-11-01 |
1993-05-21 |
Yoshida Kogyo Kk <Ykk> |
高強度高靭性アルミニウム基合金
|
|
JP3350949B2
(ja)
|
1992-02-20 |
2002-11-25 |
株式会社村田製作所 |
導電性ペースト
|
|
US5411792A
(en)
|
1992-02-27 |
1995-05-02 |
Sumitomo Metal Mining Co., Ltd. |
Transparent conductive substrate
|
|
SG49195A1
(en)
|
1992-03-05 |
1998-05-18 |
Cabot Corp |
Process for producing carbon blacks and new carbon blacks
|
|
US5378508A
(en)
*
|
1992-04-01 |
1995-01-03 |
Akzo Nobel N.V. |
Laser direct writing
|
|
US5296189A
(en)
|
1992-04-28 |
1994-03-22 |
International Business Machines Corporation |
Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith
|
|
DE4214723C2
(de)
*
|
1992-05-04 |
1994-08-25 |
Starck H C Gmbh Co Kg |
Feinteilige Metallpulver
|
|
JP3253734B2
(ja)
*
|
1992-06-19 |
2002-02-04 |
富士通株式会社 |
半導体装置製造用の石英製装置
|
|
JPH0631166A
(ja)
|
1992-07-06 |
1994-02-08 |
Stonehard Assoc Inc |
高分散白金微粒子担持触媒の製造方法
|
|
US5270368A
(en)
|
1992-07-15 |
1993-12-14 |
Videojet Systems International, Inc. |
Etch-resistant jet ink and process
|
|
US5428249A
(en)
*
|
1992-07-15 |
1995-06-27 |
Canon Kabushiki Kaisha |
Photovoltaic device with improved collector electrode
|
|
US5312674A
(en)
|
1992-07-31 |
1994-05-17 |
Hughes Aircraft Company |
Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
|
|
GB9217811D0
(en)
|
1992-08-21 |
1992-10-07 |
Graetzel Michael |
Organic compounds
|
|
TW256798B
(enExample)
*
|
1992-10-05 |
1995-09-11 |
Du Pont |
|
|
TW261554B
(enExample)
*
|
1992-10-05 |
1995-11-01 |
Du Pont |
|
|
JP3042224B2
(ja)
|
1992-10-09 |
2000-05-15 |
昭栄化学工業株式会社 |
積層セラミックコンデンサの製造方法
|
|
US5332646A
(en)
|
1992-10-21 |
1994-07-26 |
Minnesota Mining And Manufacturing Company |
Method of making a colloidal palladium and/or platinum metal dispersion
|
|
JP3064713B2
(ja)
|
1992-11-30 |
2000-07-12 |
昭栄化学工業株式会社 |
耐酸化性パラジウム粉末と耐酸化性パラジウム粉末の製造方法とこれを用いた厚膜導電性ペーストおよび積層セラミックコンデンサ
|
|
US5444453A
(en)
|
1993-02-02 |
1995-08-22 |
Ball Corporation |
Microstrip antenna structure having an air gap and method of constructing same
|
|
US5433893A
(en)
|
1993-02-03 |
1995-07-18 |
Chemet Corporation |
Conductive compositions
|
|
US5958361A
(en)
*
|
1993-03-19 |
1999-09-28 |
Regents Of The University Of Michigan |
Ultrafine metal oxide powders by flame spray pyrolysis
|
|
US5429670A
(en)
|
1993-04-26 |
1995-07-04 |
Matsushita Electric Industrial Co., Ltd. |
Gold paste for a ceramic circuit board
|
|
JPH06318403A
(ja)
|
1993-05-07 |
1994-11-15 |
Murata Mfg Co Ltd |
導電性被膜形成用銅ペースト
|
|
US5545360A
(en)
|
1993-06-08 |
1996-08-13 |
Industrial Technology Research Institute |
Process for preparing powders with superior homogeneity from aqueous solutions of metal nitrates
|
|
US5384953A
(en)
*
|
1993-07-21 |
1995-01-31 |
International Business Machines Corporation |
Structure and a method for repairing electrical lines
|
|
US5378408A
(en)
*
|
1993-07-29 |
1995-01-03 |
E. I. Du Pont De Nemours And Company |
Lead-free thick film paste composition
|
|
US5495386A
(en)
|
1993-08-03 |
1996-02-27 |
Avx Corporation |
Electrical components, such as capacitors, and methods for their manufacture
|
|
US5494550A
(en)
*
|
1993-09-07 |
1996-02-27 |
Sensormatic Electronics Corporation |
Methods for the making of electronic article surveillance tags and improved electronic article surveillance tags produced thereby
|
|
EP0641670B1
(en)
|
1993-09-07 |
1996-07-31 |
Agfa-Gevaert N.V. |
Ink jet printing method
|
|
US5838271A
(en)
|
1997-01-31 |
1998-11-17 |
Lg Semicon Co., Ltd. |
Digital to analog converter and bias circuit therefor for providing weighed currents
|
|
US5470373A
(en)
*
|
1993-11-15 |
1995-11-28 |
The United States Of America As Represented By The Secretary Of The Navy |
Oxidation resistant copper
|
|
US5712673A
(en)
|
1993-12-01 |
1998-01-27 |
Dai Nippon Printing Co., Ltd. |
Thermal transfer recording medium and thermal transfer recording method
|
|
ATE440480T1
(de)
|
1993-12-30 |
2009-09-15 |
Miyake Kk |
Verbundfolie mit schaltungsfírmiger metallfolie oder dergleichen und verfahren zur herstellung
|
|
US5429657A
(en)
|
1994-01-05 |
1995-07-04 |
E. I. Du Pont De Nemours And Company |
Method for making silver-palladium alloy powders by aerosol decomposition
|
|
JPH07207185A
(ja)
|
1994-01-21 |
1995-08-08 |
Kawazumi Gijutsu Kenkyusho:Kk |
被覆パラジウム微粉末および導電性ペースト
|
|
DE4403678A1
(de)
*
|
1994-02-07 |
1995-08-10 |
Basf Ag |
Metalloxid- und metallbeschichtete Carrier für die Elektrophotographie
|
|
US5588983A
(en)
|
1994-02-16 |
1996-12-31 |
Murata Manufacturing Co., Ltd. |
Production of copper powder
|
|
US5559057A
(en)
|
1994-03-24 |
1996-09-24 |
Starfire Electgronic Development & Marketing Ltd. |
Method for depositing and patterning thin films formed by fusing nanocrystalline precursors
|
|
US5759939A
(en)
*
|
1994-04-08 |
1998-06-02 |
Kansas State University Research Foundation |
Composite metal oxide adsorbents
|
|
US5609919A
(en)
*
|
1994-04-21 |
1997-03-11 |
Altamat Inc. |
Method for producing droplets
|
|
DE19502434A1
(de)
|
1994-04-29 |
1995-11-02 |
Hewlett Packard Co |
System und Verfahren zur inkrementalen Herstellung von Schaltungsplatinen
|
|
DE4417495C1
(de)
*
|
1994-05-19 |
1995-09-28 |
Schott Glaswerke |
Verfahren zur Herstellung von mit Y¶2¶0¶3¶ dispersionsverfestigten Reinst-Platin-Werkstoffen, Halbzeugen und Blechen
|
|
US5599046A
(en)
|
1994-06-22 |
1997-02-04 |
Scientific Games Inc. |
Lottery ticket structure with circuit elements
|
|
US6379742B1
(en)
*
|
1994-06-22 |
2002-04-30 |
Scientific Games Inc. |
Lottery ticket structure
|
|
DE69506333T2
(de)
*
|
1994-07-11 |
1999-07-15 |
Agfa-Gevaert N.V., Mortsel |
Tintenstrahldruckverfahren
|
|
JP3587884B2
(ja)
|
1994-07-21 |
2004-11-10 |
富士通株式会社 |
多層回路基板の製造方法
|
|
DE69417555T2
(de)
|
1994-09-22 |
1999-10-21 |
Asea Brown Boveri Ag, Baden |
Verfahren zur Herstellung von einem gemischten Metalloxydpulver und das nach diesem Verfahren hergestellte gemischte Metalloxydpulver
|
|
DE4437752A1
(de)
*
|
1994-10-21 |
1996-04-25 |
Basf Ag |
Verfahren zur Herstellung von siliciumoxidbeschichteten Feststoffteilchen
|
|
JPH08148787A
(ja)
*
|
1994-11-21 |
1996-06-07 |
Sumitomo Kinzoku Ceramics:Kk |
厚膜ペースト
|
|
IL154538A
(en)
*
|
1994-12-15 |
2009-12-24 |
Cabot Corp |
The reaction of carbon black with diazonium salts, the resulting carbon black products
|
|
US5571311A
(en)
|
1994-12-15 |
1996-11-05 |
Cabot Corporation |
Ink jet ink formulations containing carbon black products
|
|
JPH08170112A
(ja)
|
1994-12-16 |
1996-07-02 |
Sumitomo Metal Mining Co Ltd |
金属粉末の噴霧熱分解製造方法および装置
|
|
US5604027A
(en)
*
|
1995-01-03 |
1997-02-18 |
Xerox Corporation |
Some uses of microencapsulation for electric paper
|
|
US5861136A
(en)
|
1995-01-10 |
1999-01-19 |
E. I. Du Pont De Nemours And Company |
Method for making copper I oxide powders by aerosol decomposition
|
|
US5523006A
(en)
*
|
1995-01-17 |
1996-06-04 |
Synmatix Corporation |
Ultrafine powder lubricant
|
|
DE69629864T2
(de)
|
1995-04-03 |
2004-07-15 |
Canon K.K. |
Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes
|
|
DE69622618T2
(de)
|
1995-04-04 |
2003-03-20 |
Canon K.K., Tokio/Tokyo |
Metallenthaltende Zusammensetzung zum Bilden einer elektronenemittierenden Vorrichtung und Verfahren zur Herstellung einer elektronenemittierenden Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes
|
|
JP3132664B2
(ja)
|
1995-04-24 |
2001-02-05 |
株式会社エヌ・ティ・ティ・ドコモ |
マイクロストリップアンテナ装置
|
|
US5781158A
(en)
|
1995-04-25 |
1998-07-14 |
Young Hoek Ko |
Electric/magnetic microstrip antenna
|
|
US6548036B2
(en)
*
|
1995-05-04 |
2003-04-15 |
Cabot Corporation |
Method for producing carbon black
|
|
US5565143A
(en)
|
1995-05-05 |
1996-10-15 |
E. I. Du Pont De Nemours And Company |
Water-based silver-silver chloride compositions
|
|
US6156428A
(en)
*
|
1995-06-02 |
2000-12-05 |
Gibson; Charles P. |
Base metal particles having anisometric morphology
|
|
US5604673A
(en)
*
|
1995-06-07 |
1997-02-18 |
Hughes Electronics |
Low temperature co-fired ceramic substrates for power converters
|
|
US5882722A
(en)
*
|
1995-07-12 |
1999-03-16 |
Partnerships Limited, Inc. |
Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
|
|
US6118426A
(en)
|
1995-07-20 |
2000-09-12 |
E Ink Corporation |
Transducers and indicators having printed displays
|
|
US6124851A
(en)
|
1995-07-20 |
2000-09-26 |
E Ink Corporation |
Electronic book with multiple page displays
|
|
JP3585598B2
(ja)
|
1995-08-25 |
2004-11-04 |
大日本印刷株式会社 |
熱転写シート
|
|
US6080261A
(en)
|
1995-08-25 |
2000-06-27 |
Popat; Ghanshyam H. |
Adhesive image transfer technique
|
|
US5616165A
(en)
*
|
1995-08-25 |
1997-04-01 |
E. I. Du Pont De Nemours And Company |
Method for making gold powders by aerosol decomposition
|
|
AU6915696A
(en)
*
|
1995-09-07 |
1997-03-27 |
Penn State Research Foundation, The |
High production rate of nano particles by laser liquid interaction
|
|
KR0155877B1
(ko)
|
1995-09-12 |
1998-12-15 |
이대원 |
다층 회로기판 및 그 제조방법
|
|
US5679724A
(en)
|
1995-09-29 |
1997-10-21 |
Xerox Corporation |
Submicron particles for ink jet inks
|
|
US5759230A
(en)
|
1995-11-30 |
1998-06-02 |
The United States Of America As Represented By The Secretary Of The Navy |
Nanostructured metallic powders and films via an alcoholic solvent process
|
|
DE19545455C1
(de)
|
1995-12-06 |
1997-01-23 |
Degussa |
Verfahren zur Herstellung von Edelmetallpulvern
|
|
US5826329A
(en)
|
1995-12-19 |
1998-10-27 |
Ncr Corporation |
Method of making printed circuit board using thermal transfer techniques
|
|
US5932280A
(en)
|
1995-12-19 |
1999-08-03 |
Ncr Corporation |
Printed circuit board having printed resistors and method of making printed resistors on a printed circuit board using thermal transfer techniques
|
|
DE19548421B4
(de)
*
|
1995-12-22 |
2004-06-03 |
Celanese Ventures Gmbh |
Verfahren zur kontinuierlichen Herstellung von Membranelektrodeneinheiten
|
|
US5945158A
(en)
*
|
1996-01-16 |
1999-08-31 |
N.V. Union Miniere S.A. |
Process for the production of silver coated particles
|
|
US5763106A
(en)
*
|
1996-01-19 |
1998-06-09 |
Hino Motors, Ltd. |
Composite powder and method for forming a self-lubricating composite coating and self-lubricating components formed thereby
|
|
US5909083A
(en)
|
1996-02-16 |
1999-06-01 |
Dai Nippon Printing Co., Ltd. |
Process for producing plasma display panel
|
|
JPH09241862A
(ja)
|
1996-03-01 |
1997-09-16 |
Murata Mfg Co Ltd |
銅粉末及び銅ペースト並びにセラミック電子部品
|
|
US6027762A
(en)
*
|
1996-05-23 |
2000-02-22 |
Mitsumi Electric Co., Ltd. |
Method for producing flexible board
|
|
US6356234B1
(en)
|
1996-06-12 |
2002-03-12 |
R T Microwave Limited |
Electrical circuit
|
|
US5747562A
(en)
*
|
1996-06-14 |
1998-05-05 |
Cabot Corporation |
Ink and coating compositions containing silicon-treated carbon black
|
|
US5837045A
(en)
|
1996-06-17 |
1998-11-17 |
Cabot Corporation |
Colored pigment and aqueous compositions containing same
|
|
US5998085A
(en)
|
1996-07-23 |
1999-12-07 |
3M Innovative Properties |
Process for preparing high resolution emissive arrays and corresponding articles
|
|
US5948200A
(en)
*
|
1996-07-26 |
1999-09-07 |
Taiyo Yuden Co., Ltd. |
Method of manufacturing laminated ceramic electronic parts
|
|
US5756008A
(en)
|
1996-08-14 |
1998-05-26 |
E. I. Du Pont De Nemours And Company |
Water cleanable silver composition
|
|
AU3781797A
(en)
|
1996-08-16 |
1998-03-06 |
Hugh P Craig |
Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
|
|
US6652967B2
(en)
|
2001-08-08 |
2003-11-25 |
Nanoproducts Corporation |
Nano-dispersed powders and methods for their manufacture
|
|
US6344271B1
(en)
|
1998-11-06 |
2002-02-05 |
Nanoenergy Corporation |
Materials and products using nanostructured non-stoichiometric substances
|
|
US5801108A
(en)
|
1996-09-11 |
1998-09-01 |
Motorola Inc. |
Low temperature cofireable dielectric paste
|
|
JP3137035B2
(ja)
*
|
1997-05-26 |
2001-02-19 |
昭栄化学工業株式会社 |
ニッケル粉末及びその製造方法
|
|
JP3277823B2
(ja)
|
1996-09-25 |
2002-04-22 |
昭栄化学工業株式会社 |
金属粉末の製造方法
|
|
US5874770A
(en)
|
1996-10-10 |
1999-02-23 |
General Electric Company |
Flexible interconnect film including resistor and capacitor layers
|
|
TW353762B
(en)
|
1996-10-21 |
1999-03-01 |
Dainippon Printing Co Ltd |
Transfer sheet, and pattern-forming method
|
|
US5930026A
(en)
|
1996-10-25 |
1999-07-27 |
Massachusetts Institute Of Technology |
Nonemissive displays and piezoelectric power supplies therefor
|
|
US6207268B1
(en)
*
|
1996-11-12 |
2001-03-27 |
Dai Nippon Printing Co., Ltd. |
Transfer sheet, and pattern-forming method
|
|
US5725647A
(en)
*
|
1996-11-27 |
1998-03-10 |
Minnesota Mining And Manufacturing Company |
Pigmented inks and humectants used therewith
|
|
JP3205793B2
(ja)
*
|
1996-12-19 |
2001-09-04 |
株式会社巴製作所 |
超微粒子及びその製造方法
|
|
US6103868A
(en)
|
1996-12-27 |
2000-08-15 |
The Regents Of The University Of California |
Organically-functionalized monodisperse nanocrystals of metals
|
|
US5759712A
(en)
|
1997-01-06 |
1998-06-02 |
Hockaday; Robert G. |
Surface replica fuel cell for micro fuel cell electrical power pack
|
|
US6099897A
(en)
|
1997-01-29 |
2000-08-08 |
Mitsuboshi Belting Ltd. |
Method for producing metal particulate dispersion and metal particle-carrying substance
|
|
ATE353536T1
(de)
|
1997-02-20 |
2007-02-15 |
Partnerships Ltd Inc |
Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter
|
|
US6019926A
(en)
*
|
1997-02-20 |
2000-02-01 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Adminstration |
Reflective silvered polyimide films via in situ thermal reduction silver (I) complexes
|
|
US6379745B1
(en)
*
|
1997-02-20 |
2002-04-30 |
Parelec, Inc. |
Low temperature method and compositions for producing electrical conductors
|
|
TW340296B
(en)
|
1997-02-21 |
1998-09-11 |
Ricoh Microelectronics Kk |
Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate
|
|
US6338809B1
(en)
|
1997-02-24 |
2002-01-15 |
Superior Micropowders Llc |
Aerosol method and apparatus, particulate products, and electronic devices made therefrom
|
|
US6780350B1
(en)
|
1997-02-24 |
2004-08-24 |
Superior Micropowders Llc |
Metal-carbon composite powders, methods for producing powders and devices fabricated from same
|
|
US6699304B1
(en)
|
1997-02-24 |
2004-03-02 |
Superior Micropowders, Llc |
Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
|
|
US7097686B2
(en)
*
|
1997-02-24 |
2006-08-29 |
Cabot Corporation |
Nickel powders, methods for producing powders and devices fabricated from same
|
|
CA2280865C
(en)
|
1997-02-24 |
2008-08-12 |
Superior Micropowders Llc |
Aerosol method and apparatus, particulate products, and electronic devices made therefrom
|
|
US6830823B1
(en)
|
1997-02-24 |
2004-12-14 |
Superior Micropowders Llc |
Gold powders, methods for producing powders and devices fabricated from same
|
|
US6159267A
(en)
|
1997-02-24 |
2000-12-12 |
Superior Micropowders Llc |
Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
|
|
US6679937B1
(en)
*
|
1997-02-24 |
2004-01-20 |
Cabot Corporation |
Copper powders methods for producing powders and devices fabricated from same
|
|
US6660680B1
(en)
|
1997-02-24 |
2003-12-09 |
Superior Micropowders, Llc |
Electrocatalyst powders, methods for producing powders and devices fabricated from same
|
|
US6103393A
(en)
|
1998-02-24 |
2000-08-15 |
Superior Micropowders Llc |
Metal-carbon composite powders, methods for producing powders and devices fabricated from same
|
|
US5846615A
(en)
|
1997-02-28 |
1998-12-08 |
The Whitaker Corporation |
Direct deposition of a gold layer
|
|
US5894038A
(en)
*
|
1997-02-28 |
1999-04-13 |
The Whitaker Corporation |
Direct deposition of palladium
|
|
US5828271A
(en)
|
1997-03-06 |
1998-10-27 |
Northrop Grumman Corporation |
Planar ferrite toroid microwave phase shifter
|
|
US6399230B1
(en)
|
1997-03-06 |
2002-06-04 |
Sarnoff Corporation |
Multilayer ceramic circuit boards with embedded resistors
|
|
US5837041A
(en)
|
1997-04-15 |
1998-11-17 |
Xerox Corporation |
Ink cartridges having ink compositions with pigmented particles and methods for their manufacture and use
|
|
US5853470A
(en)
|
1997-04-28 |
1998-12-29 |
Eastman Kodak Company |
Pigmented ink jet inks containing aldehydes
|
|
EP0989205A4
(en)
*
|
1997-04-30 |
2003-05-28 |
Takamatsu Res Lab |
METAL PASTE AND PROCESS FOR PRODUCING A METAL LAYER
|
|
US5928405A
(en)
*
|
1997-05-21 |
1999-07-27 |
Degussa Corporation |
Method of making metallic powders by aerosol thermolysis
|
|
US6025026A
(en)
*
|
1997-06-30 |
2000-02-15 |
Transitions Optical, Inc. |
Process for producing an adherent polymeric layer on polymeric substrates and articles produced thereby
|
|
US6190931B1
(en)
*
|
1997-07-15 |
2001-02-20 |
Silverbrook Research Pty. Ltd. |
Method of manufacture of a linear spring electromagnetic grill ink jet printer
|
|
US6599631B2
(en)
|
2001-01-26 |
2003-07-29 |
Nanogram Corporation |
Polymer-inorganic particle composites
|
|
KR100274317B1
(ko)
|
1997-08-26 |
2001-01-15 |
정명식 |
화학증착에의한개구충전방법
|
|
US5879715A
(en)
*
|
1997-09-02 |
1999-03-09 |
Ceramem Corporation |
Process and system for production of inorganic nanoparticles
|
|
WO1999017352A1
(en)
|
1997-09-30 |
1999-04-08 |
Partnerships Limited, Inc. |
Method and compositions for metallizing microvias and high density interconnects in photodefined dielectrics
|
|
WO1999016556A1
(en)
|
1997-09-30 |
1999-04-08 |
Partnerships Limited, Inc. |
Method for metallizing holes
|
|
EP1023174A1
(en)
|
1997-09-30 |
2000-08-02 |
Partnerships Limited, Inc. |
Manufacture of thin metal objects
|
|
US6268014B1
(en)
*
|
1997-10-02 |
2001-07-31 |
Chris Eberspacher |
Method for forming solar cell materials from particulars
|
|
CA2306384A1
(en)
*
|
1997-10-14 |
1999-04-22 |
Patterning Technologies Limited |
Method of forming an electronic device
|
|
JP3475749B2
(ja)
|
1997-10-17 |
2003-12-08 |
昭栄化学工業株式会社 |
ニッケル粉末及びその製造方法
|
|
WO1999030193A1
(fr)
*
|
1997-12-05 |
1999-06-17 |
Sumitomo Electric Industries, Ltd. |
Fibre optique a dispersion plate
|
|
US6045769A
(en)
|
1997-12-08 |
2000-04-04 |
Nanogram Corporation |
Process for carbon production
|
|
US6074725A
(en)
|
1997-12-10 |
2000-06-13 |
Caliper Technologies Corp. |
Fabrication of microfluidic circuits by printing techniques
|
|
JP4003273B2
(ja)
|
1998-01-19 |
2007-11-07 |
セイコーエプソン株式会社 |
パターン形成方法および基板製造装置
|
|
EP0989570A4
(en)
|
1998-01-22 |
2005-08-31 |
Matsushita Electric Industrial Co Ltd |
INK FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING AN ELECTRONIC COMPONENT USING THE INK, AND INK JET DEVICE
|
|
WO1999038921A1
(en)
|
1998-01-29 |
1999-08-05 |
Cabot Corporation |
Processes of purifying a dispersion and making inkjet inks
|
|
EP0947245B1
(en)
|
1998-02-05 |
2004-04-07 |
Motorola Semiconducteurs S.A. |
Method of forming metal colloids and method of forming a metal oxide sensitive layer for a chemical sensor device
|
|
US20050097987A1
(en)
|
1998-02-24 |
2005-05-12 |
Cabot Corporation |
Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same
|
|
US6753108B1
(en)
|
1998-02-24 |
2004-06-22 |
Superior Micropowders, Llc |
Energy devices and methods for the fabrication of energy devices
|
|
NL1008460C2
(nl)
*
|
1998-03-03 |
1999-09-06 |
Acheson Colloiden B V |
Geleidende inkt of verf.
|
|
CA2329859A1
(en)
|
1998-04-20 |
1999-12-02 |
Allen C. Templeton |
Nanometer particles containing a reactive monolayer
|
|
US6329899B1
(en)
|
1998-04-29 |
2001-12-11 |
Microcoating Technologies, Inc. |
Formation of thin film resistors
|
|
JP2000011875A
(ja)
|
1998-06-19 |
2000-01-14 |
Dainippon Toryo Co Ltd |
プラズマディスプレイの製造方法
|
|
US6262129B1
(en)
|
1998-07-31 |
2001-07-17 |
International Business Machines Corporation |
Method for producing nanoparticles of transition metals
|
|
US6153348A
(en)
|
1998-08-07 |
2000-11-28 |
Parelec Llc |
Electrostatic printing of conductors on photoresists and liquid metallic toners therefor
|
|
EP0980097B1
(en)
*
|
1998-08-10 |
2013-01-09 |
Ulvac, Inc. |
Dispersion containing Cu ultrafine particles individually dispersed therein
|
|
US6277740B1
(en)
*
|
1998-08-14 |
2001-08-21 |
Avery N. Goldstein |
Integrated circuit trenched features and method of producing same
|
|
US6780765B2
(en)
|
1998-08-14 |
2004-08-24 |
Avery N. Goldstein |
Integrated circuit trenched features and method of producing same
|
|
US6294401B1
(en)
|
1998-08-19 |
2001-09-25 |
Massachusetts Institute Of Technology |
Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same
|
|
KR20010072835A
(ko)
|
1998-08-21 |
2001-07-31 |
추후제출 |
전기 회로 및 구성요소의 프린팅
|
|
US7098163B2
(en)
*
|
1998-08-27 |
2006-08-29 |
Cabot Corporation |
Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
|
|
US20030148024A1
(en)
|
2001-10-05 |
2003-08-07 |
Kodas Toivo T. |
Low viscosity precursor compositons and methods for the depositon of conductive electronic features
|
|
EP0982090B1
(en)
|
1998-08-27 |
2003-05-02 |
Agfa-Gevaert |
Method of preparation of recording elements
|
|
US6245494B1
(en)
|
1998-08-27 |
2001-06-12 |
Agfa-Gevaert |
Method of imaging a heat mode recording element comprising highly dispersed metal alloys
|
|
EP0985448A1
(en)
*
|
1998-08-28 |
2000-03-15 |
Engelhard Corporation |
Nickel catalyst
|
|
JP3323887B2
(ja)
|
1998-09-08 |
2002-09-09 |
富士ゼロックス株式会社 |
インクジェット式プリンタ及び印刷方法
|
|
US6251488B1
(en)
|
1999-05-05 |
2001-06-26 |
Optomec Design Company |
Precision spray processes for direct write electronic components
|
|
US20030020768A1
(en)
*
|
1998-09-30 |
2003-01-30 |
Renn Michael J. |
Direct write TM system
|
|
US6743319B2
(en)
|
1998-09-30 |
2004-06-01 |
Paralec Inc. |
Adhesiveless transfer lamination method and materials for producing electronic circuits
|
|
US6636676B1
(en)
|
1998-09-30 |
2003-10-21 |
Optomec Design Company |
Particle guidance system
|
|
DE19847161A1
(de)
|
1998-10-14 |
2000-04-20 |
Degussa |
Mittels Aerosol dotiertes pyrogen hergestelltes Siliciumdioxid
|
|
US6707680B2
(en)
|
1998-10-22 |
2004-03-16 |
Board Of Trustees Of The University Of Arkansas |
Surface applied passives
|
|
WO2000029208A1
(en)
|
1998-11-16 |
2000-05-25 |
Parelec Inc. |
Electrically heatable, transparent windows and mirrors and method for production
|
|
JP2000182889A
(ja)
|
1998-12-16 |
2000-06-30 |
Matsushita Electric Ind Co Ltd |
積層セラミック電子部品の製造方法、これに用いるインキジェット用インキおよびその製造方法
|
|
US6274412B1
(en)
|
1998-12-21 |
2001-08-14 |
Parelec, Inc. |
Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
|
|
US6358567B2
(en)
*
|
1998-12-23 |
2002-03-19 |
The Regents Of The University Of California |
Colloidal spray method for low cost thin coating deposition
|
|
US6114088A
(en)
*
|
1999-01-15 |
2000-09-05 |
3M Innovative Properties Company |
Thermal transfer element for forming multilayer devices
|
|
DE69922776T2
(de)
|
1999-01-21 |
2005-12-08 |
Sony International (Europe) Gmbh |
Nanoteilchenstruktur zur Anwendung in einer elektronischen Anordnung, insbesondere in einem chemischen Sensor
|
|
US6177151B1
(en)
*
|
1999-01-27 |
2001-01-23 |
The United States Of America As Represented By The Secretary Of The Navy |
Matrix assisted pulsed laser evaporation direct write
|
|
JP4004675B2
(ja)
*
|
1999-01-29 |
2007-11-07 |
株式会社日清製粉グループ本社 |
酸化物被覆金属微粒子の製造方法
|
|
US6169234B1
(en)
*
|
1999-03-01 |
2001-01-02 |
Pioneer Hi-Bred International, Inc. |
Hybrid maize plant and seed 36B08
|
|
US6348295B1
(en)
*
|
1999-03-26 |
2002-02-19 |
Massachusetts Institute Of Technology |
Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging
|
|
JP3571957B2
(ja)
|
1999-03-30 |
2004-09-29 |
松下電器産業株式会社 |
導体ペーストおよびセラミック多層基板の製造方法
|
|
US6251471B1
(en)
|
1999-05-12 |
2001-06-26 |
University Of New Hampshire |
Surface trace electrical feedthru
|
|
EP1099183A4
(en)
|
1999-05-24 |
2004-12-15 |
Potomac Photonics Inc |
MATERIAL SUPPLY SYSTEM FOR MANUFACTURING MINIATURE STRUCTURE
|
|
US6811885B1
(en)
|
1999-06-06 |
2004-11-02 |
Agfa-Gevaert |
Acid stable aqueous dispersion of metal particles and applications
|
|
US6667360B1
(en)
|
1999-06-10 |
2003-12-23 |
Rensselaer Polytechnic Institute |
Nanoparticle-filled polymers
|
|
WO2000076699A1
(fr)
|
1999-06-15 |
2000-12-21 |
Kimoto, Masaaki |
Poudre metallique composite ultrafine et procede de production de ladite poudre
|
|
US6238734B1
(en)
|
1999-07-08 |
2001-05-29 |
Air Products And Chemicals, Inc. |
Liquid precursor mixtures for deposition of multicomponent metal containing materials
|
|
US6143356A
(en)
|
1999-08-06 |
2000-11-07 |
Parelec, Inc. |
Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards
|
|
WO2001015838A1
(en)
*
|
1999-08-31 |
2001-03-08 |
Toho Titanium Co., Ltd. |
Nickel powder for monolithic ceramic capacitor
|
|
US6317023B1
(en)
|
1999-10-15 |
2001-11-13 |
E. I. Du Pont De Nemours And Company |
Method to embed passive components
|
|
JP2001135138A
(ja)
*
|
1999-10-29 |
2001-05-18 |
Matsushita Electric Ind Co Ltd |
導体ペースト
|
|
EP1151814A4
(en)
*
|
1999-11-12 |
2006-11-02 |
Mitsui Mining & Smelting Co |
NICKEL POWDER AND CONDUCTIVE PASTE
|
|
JP3957444B2
(ja)
*
|
1999-11-22 |
2007-08-15 |
三井金属鉱業株式会社 |
ニッケル粉、その製造方法及び電子部品電極形成用ペースト
|
|
JP2001167633A
(ja)
|
1999-12-09 |
2001-06-22 |
Ebara Corp |
金属成分含有溶液及び金属薄膜形成方法
|
|
TW476073B
(en)
|
1999-12-09 |
2002-02-11 |
Ebara Corp |
Solution containing metal component, method of and apparatus for forming thin metal film
|
|
WO2001047044A2
(en)
*
|
1999-12-21 |
2001-06-28 |
Plastic Logic Limited |
Forming interconnects
|
|
EP1110647A3
(en)
*
|
1999-12-22 |
2004-02-11 |
Mitsui Mining and Smelting Co., Ltd |
Paste to be fired for forming circuit board and method for preparing surface-modified silver powder
|
|
JP3908426B2
(ja)
|
1999-12-24 |
2007-04-25 |
日本碍子株式会社 |
セラミックコンデンサー電極形成用ペースト
|
|
WO2001053007A1
(en)
|
2000-01-21 |
2001-07-26 |
Midwest Research Institute |
Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles
|
|
JP3841607B2
(ja)
*
|
2000-02-03 |
2006-11-01 |
三井金属鉱業株式会社 |
ニッケル粉及び導電ペースト
|
|
AU2001247961A1
(en)
|
2000-02-04 |
2001-08-14 |
Optomec Design Company |
Modified absorption through unique composite materials and material combinations
|
|
US6501663B1
(en)
|
2000-02-28 |
2002-12-31 |
Hewlett Packard Company |
Three-dimensional interconnect system
|
|
US6360656B2
(en)
|
2000-02-28 |
2002-03-26 |
Minolta Co., Ltd. |
Apparatus for and method of printing on three-dimensional object
|
|
WO2001078908A1
(en)
*
|
2000-04-04 |
2001-10-25 |
Parlex Corporation |
High speed flip chip assembly process
|
|
TW512383B
(en)
*
|
2000-04-17 |
2002-12-01 |
Matsushita Electric Industrial Co Ltd |
Ink for display panels and manufacturing method of a plasma display panel using the ink
|
|
WO2001082315A1
(en)
|
2000-04-20 |
2001-11-01 |
Parelec, Inc. |
Compositions and method for printing resistors, capacitors and inductors
|
|
AU2001261469A1
(en)
|
2000-05-12 |
2001-11-26 |
Parelec Inc. |
Additive electronic circuits on thermally unstable substrates
|
|
JP3753925B2
(ja)
*
|
2000-05-12 |
2006-03-08 |
株式会社ルネサステクノロジ |
半導体集積回路
|
|
JP4035968B2
(ja)
|
2000-06-30 |
2008-01-23 |
セイコーエプソン株式会社 |
導電膜パターンの形成方法
|
|
US7282238B2
(en)
|
2000-06-30 |
2007-10-16 |
Ngimat Co. |
Method of depositing materials
|
|
GB0016747D0
(en)
|
2000-07-08 |
2000-08-30 |
Johnson Matthey Plc |
Ink
|
|
DE10035211A1
(de)
*
|
2000-07-20 |
2002-01-31 |
Beiersdorf Ag |
Geformtes Seifenprodukt, enthaltend Talkum, eine oder mehrere Fettsäuren in Form ihrer Alkaliseifen und ein oder mehrere nichtionische Tenside bei gleichzeitiger Abwesenheit von Alkyl-(oligo)-glycosiden
|
|
AU2001278332A1
(en)
*
|
2000-07-28 |
2002-02-13 |
Simon Fraser University |
Methods for the lithographic deposition of materials containingnanoparticles
|
|
US7351449B2
(en)
|
2000-09-22 |
2008-04-01 |
N Gimat Co. |
Chemical vapor deposition methods for making powders and coatings, and coatings made using these methods
|
|
JP4871443B2
(ja)
|
2000-10-13 |
2012-02-08 |
株式会社アルバック |
金属超微粒子分散液の製造方法
|
|
US6649138B2
(en)
|
2000-10-13 |
2003-11-18 |
Quantum Dot Corporation |
Surface-modified semiconductive and metallic nanoparticles having enhanced dispersibility in aqueous media
|
|
JP2002124016A
(ja)
|
2000-10-13 |
2002-04-26 |
Mitsubishi Electric Corp |
ディスク再生装置及びディスク再生方法
|
|
JP5008216B2
(ja)
|
2000-10-13 |
2012-08-22 |
株式会社アルバック |
インクジェット用インクの製法
|
|
AU2001290266A1
(en)
|
2000-10-25 |
2002-05-06 |
Harima Chemicals, Inc. |
Electroconductive metal paste and method for production thereof
|
|
US20030151030A1
(en)
|
2000-11-22 |
2003-08-14 |
Gurin Michael H. |
Enhanced conductivity nanocomposites and method of use thereof
|
|
US20040206941A1
(en)
|
2000-11-22 |
2004-10-21 |
Gurin Michael H. |
Composition for enhancing conductivity of a carrier medium and method of use thereof
|
|
JP4677092B2
(ja)
*
|
2000-12-04 |
2011-04-27 |
株式会社アルバック |
フラットパネルディスプレイの電極形成方法
|
|
GB0030095D0
(en)
|
2000-12-09 |
2001-01-24 |
Xaar Technology Ltd |
Method of ink jet printing
|
|
TW533446B
(en)
|
2000-12-22 |
2003-05-21 |
Koninkl Philips Electronics Nv |
Electroluminescent device and a method of manufacturing thereof
|
|
US6467897B1
(en)
|
2001-01-08 |
2002-10-22 |
3M Innovative Properties Company |
Energy curable inks and other compositions incorporating surface modified, nanometer-sized particles
|
|
AR032424A1
(es)
|
2001-01-30 |
2003-11-05 |
Procter & Gamble |
Composiciones de recubrimiento para modificar superficies.
|
|
JP3693647B2
(ja)
*
|
2001-02-08 |
2005-09-07 |
日立マクセル株式会社 |
金属合金微粒子及びその製造方法
|
|
US6830806B2
(en)
|
2001-04-12 |
2004-12-14 |
Kreido Laboratories |
Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured
|
|
WO2002086924A1
(en)
|
2001-04-20 |
2002-10-31 |
Matsushita Electric Industrial Co., Ltd. |
Method of producing electronic parts, and member for production thereof
|
|
WO2002087749A1
(en)
|
2001-04-30 |
2002-11-07 |
Postech Foundation |
Colloid solution of metal nanoparticles, metal-polymer nanocomposites and methods for preparation thereof
|
|
US20030211246A1
(en)
|
2001-05-11 |
2003-11-13 |
Kydd Paul H. |
Additive electronic circuits on thermally unstable substrates
|
|
CN1280025C
(zh)
|
2001-06-01 |
2006-10-18 |
利特斯公司 |
微沉积系统以及在衬底上沉积精确量的流体材料的方法
|
|
US20040231594A1
(en)
|
2001-06-01 |
2004-11-25 |
Edwards Charles O. |
Microdeposition apparatus
|
|
US7115218B2
(en)
|
2001-06-28 |
2006-10-03 |
Parelec, Inc. |
Low temperature method and composition for producing electrical conductors
|
|
TW498409B
(en)
*
|
2001-07-04 |
2002-08-11 |
Ind Tech Res Inst |
Forming method and apparatus of integrated circuit with passive devices
|
|
EP1426978A4
(en)
|
2001-08-22 |
2008-09-10 |
Sumitomo Electric Industries |
CONDUCTIVE PASTE AND CONDUCTIVE FILM USING THE SAME, DEPOSITION METHOD, AND PROCESS FOR PRODUCING A COMPOUND METAL COMPONENT
|
|
AUPR725701A0
(en)
|
2001-08-24 |
2001-09-20 |
Commonwealth Scientific And Industrial Research Organisation |
Functionalised nanoparticle concentrates
|
|
WO2003021041A2
(de)
|
2001-09-03 |
2003-03-13 |
Basf Aktiengesellschaft |
Verfahren zur erhöhung der weisse von papier mit hilfe von kationischen polyelektrolyten
|
|
US7629017B2
(en)
|
2001-10-05 |
2009-12-08 |
Cabot Corporation |
Methods for the deposition of conductive electronic features
|
|
US20060001726A1
(en)
*
|
2001-10-05 |
2006-01-05 |
Cabot Corporation |
Printable conductive features and processes for making same
|
|
AU2002337822A1
(en)
|
2001-10-05 |
2003-04-22 |
Superior Micropowders Llc |
Low viscosity precursor compositions and methods for the deposition of conductive electronic features
|
|
US7524528B2
(en)
|
2001-10-05 |
2009-04-28 |
Cabot Corporation |
Precursor compositions and methods for the deposition of passive electrical components on a substrate
|
|
US6951666B2
(en)
|
2001-10-05 |
2005-10-04 |
Cabot Corporation |
Precursor compositions for the deposition of electrically conductive features
|
|
US20030108664A1
(en)
|
2001-10-05 |
2003-06-12 |
Kodas Toivo T. |
Methods and compositions for the formation of recessed electrical features on a substrate
|
|
US6701605B2
(en)
|
2001-10-09 |
2004-03-09 |
Sonoco Development, Inc. |
Conductive electrical element and antenna with ink additive technology
|
|
US20030215565A1
(en)
|
2001-10-10 |
2003-11-20 |
Industrial Technology Research Institute |
Method and apparatus for the formation of laminated circuit having passive components therein
|
|
US6936181B2
(en)
|
2001-10-11 |
2005-08-30 |
Kovio, Inc. |
Methods for patterning using liquid embossing
|
|
US20030070569A1
(en)
*
|
2001-10-11 |
2003-04-17 |
Colin Bulthaup |
Micro-stencil
|
|
US6562403B2
(en)
|
2001-10-15 |
2003-05-13 |
Kansas State University Research Foundation |
Synthesis of substantially monodispersed colloids
|
|
US20030073042A1
(en)
*
|
2001-10-17 |
2003-04-17 |
Cernigliaro George J. |
Process and materials for formation of patterned films of functional materials
|
|
KR20040077655A
(ko)
|
2001-10-19 |
2004-09-06 |
슈페리어 마이크로파우더스 엘엘씨 |
전자 형상 증착용 테잎 조성물
|
|
JP2003133691A
(ja)
|
2001-10-22 |
2003-05-09 |
Seiko Epson Corp |
膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
|
|
JP4039035B2
(ja)
|
2001-10-31 |
2008-01-30 |
セイコーエプソン株式会社 |
線パターンの形成方法、線パターン、電気光学装置、電子機器、非接触型カード媒体
|
|
IL161622A0
(en)
|
2001-11-01 |
2004-09-27 |
Yissum Res Dev Co |
Ink jet inks containing metal nanoparticles
|
|
US7553512B2
(en)
|
2001-11-02 |
2009-06-30 |
Cabot Corporation |
Method for fabricating an inorganic resistor
|
|
US20030146019A1
(en)
|
2001-11-22 |
2003-08-07 |
Hiroyuki Hirai |
Board and ink used for forming conductive pattern, and method using thereof
|
|
WO2003051562A1
(en)
|
2001-12-18 |
2003-06-26 |
Asahi Kasei Kabushiki Kaisha |
Metal oxide dispersion
|
|
JP4020764B2
(ja)
*
|
2001-12-21 |
2007-12-12 |
Jfeミネラル株式会社 |
分散性に優れた金属超微粉スラリー
|
|
JP3803062B2
(ja)
|
2001-12-27 |
2006-08-02 |
矢崎総業株式会社 |
車両用指示装置
|
|
JP2003288812A
(ja)
|
2001-12-29 |
2003-10-10 |
Samsung Electronics Co Ltd |
金属ナノ粒子クラスターインクおよびこれを用いた金属パターン形成方法
|
|
DE10209835A1
(de)
|
2002-03-06 |
2003-10-16 |
Bosch Gmbh Robert |
Wasserlösliche Paste und deren Verwendung
|
|
JP3966034B2
(ja)
|
2002-03-14 |
2007-08-29 |
セイコーエプソン株式会社 |
吐出パターンデータ生成方法および吐出パターンデータ生成装置
|
|
US20030185889A1
(en)
|
2002-03-27 |
2003-10-02 |
Jixiong Yan |
Colloidal nanosilver solution and method for making the same
|
|
KR20040089453A
(ko)
|
2002-03-28 |
2004-10-21 |
신꼬오덴기 고교 가부시키가이샤 |
배선 구조체 및 이의 제조 방법
|
|
JP3805273B2
(ja)
|
2002-03-29 |
2006-08-02 |
Uht株式会社 |
積層型電子部品の製造装置
|
|
TWI251018B
(en)
|
2002-04-10 |
2006-03-11 |
Fujikura Ltd |
Electroconductive composition, electroconductive coating and method of producing the electroconductive coating
|
|
JP4042497B2
(ja)
|
2002-04-15 |
2008-02-06 |
セイコーエプソン株式会社 |
導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体
|
|
US6773614B2
(en)
|
2002-04-16 |
2004-08-10 |
Hewlett-Packard Development Company, L.P. |
Method of patterning conductive films
|
|
EP1383364A3
(en)
|
2002-05-23 |
2006-01-04 |
Nashua Corporation |
Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
|
|
US20040173144A1
(en)
|
2002-05-31 |
2004-09-09 |
Edwards Charles O. |
Formation of printed circuit board structures using piezo microdeposition
|
|
EP2154212A1
(en)
|
2002-06-13 |
2010-02-17 |
Cima Nano Tech Israel Ltd |
A method for the production of conductive and transparent nano-coatings
|
|
US7736693B2
(en)
|
2002-06-13 |
2010-06-15 |
Cima Nanotech Israel Ltd. |
Nano-powder-based coating and ink compositions
|
|
KR20060012545A
(ko)
|
2002-07-03 |
2006-02-08 |
나노파우더스 인더스트리어스 리미티드. |
저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
|
|
KR100453131B1
(ko)
*
|
2002-08-10 |
2004-10-15 |
율촌화학 주식회사 |
사슬 말단 기능성 고분자를 이용하여 안정화시킨 나노크기 금속 또는 금속염 및 이들의 제조 방법
|
|
US6890050B2
(en)
|
2002-08-20 |
2005-05-10 |
Palo Alto Research Center Incorporated |
Method for the printing of homogeneous electronic material with a multi-ejector print head
|
|
US20040058457A1
(en)
*
|
2002-08-29 |
2004-03-25 |
Xueying Huang |
Functionalized nanoparticles
|
|
JP2004111253A
(ja)
|
2002-09-19 |
2004-04-08 |
Noda Screen:Kk |
電子デバイスの電気的接続用導電性組成物および電子デバイス
|
|
GB0221893D0
(en)
*
|
2002-09-20 |
2002-10-30 |
Avecia Ltd |
Process
|
|
AU2003275533A1
(en)
*
|
2002-09-25 |
2004-04-19 |
Konica Minolta Holdings, Inc. |
Electric circuit, thin film transistor, method for manufacturing electric circuit and method for manufacturing thin film transistor
|
|
US7078008B2
(en)
|
2002-10-01 |
2006-07-18 |
Conocophillips Company |
Process for converting alkanes to carbon filaments
|
|
JP3801158B2
(ja)
|
2002-11-19 |
2006-07-26 |
セイコーエプソン株式会社 |
多層配線基板の製造方法、多層配線基板、電子デバイス及び電子機器
|
|
EP1585604B1
(en)
|
2002-11-27 |
2012-01-04 |
Ulvac, Inc. |
Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors
|
|
US7914617B2
(en)
|
2002-11-27 |
2011-03-29 |
Tapesh Yadav |
Nano-engineered inks, methods for their manufacture and their applications
|
|
US7585349B2
(en)
*
|
2002-12-09 |
2009-09-08 |
The University Of Washington |
Methods of nanostructure formation and shape selection
|
|
US20040126708A1
(en)
|
2002-12-31 |
2004-07-01 |
3M Innovative Properties Company |
Method for modifying the surface of a polymeric substrate
|
|
US20060172168A1
(en)
|
2003-01-10 |
2006-08-03 |
Wright Emma V |
Deposited structures
|
|
GB0300529D0
(en)
|
2003-01-10 |
2003-02-12 |
Qinetiq Nanomaterials Ltd |
Improvements in and relating to ink jet deposition
|
|
TWI265762B
(en)
|
2003-01-14 |
2006-11-01 |
Sharp Kk |
Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
|
|
US7380690B2
(en)
|
2003-01-17 |
2008-06-03 |
Ricoh Company, Ltd. |
Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate
|
|
US7211205B2
(en)
|
2003-01-29 |
2007-05-01 |
Parelec, Inc. |
High conductivity inks with improved adhesion
|
|
US7141185B2
(en)
|
2003-01-29 |
2006-11-28 |
Parelec, Inc. |
High conductivity inks with low minimum curing temperatures
|
|
WO2004068918A2
(en)
|
2003-01-31 |
2004-08-12 |
Aktina Limited |
Method for producing thin silver layers
|
|
WO2004075211A1
(en)
|
2003-02-20 |
2004-09-02 |
The Regents Of The University Of California |
Method of forming conductors at low temperatures using metallic nanocrystals and product
|
|
JP4332360B2
(ja)
|
2003-02-28 |
2009-09-16 |
大日本印刷株式会社 |
濡れ性パターン形成用塗工液およびパターン形成体の製造方法
|
|
KR100401335B1
(en)
|
2003-03-08 |
2003-10-10 |
Mijitech Co Ltd |
Metal nanoparticle surface-coated with silicon oxides and preparation thereof
|
|
US6921626B2
(en)
|
2003-03-27 |
2005-07-26 |
Kodak Polychrome Graphics Llc |
Nanopastes as patterning compositions for electronic parts
|
|
JP2004304129A
(ja)
|
2003-04-01 |
2004-10-28 |
Seiko Epson Corp |
液滴吐出法によるパターン形成方法、多層配線構造の形成方法
|
|
JP4432347B2
(ja)
|
2003-04-07 |
2010-03-17 |
ソニー株式会社 |
液体吐出装置及び液体吐出方法
|
|
US6880909B2
(en)
*
|
2003-04-22 |
2005-04-19 |
Lexmark International Inc. |
Method and apparatus for adjusting drop velocity
|
|
KR20030044987A
(ko)
|
2003-05-22 |
2003-06-09 |
넵테크놀로지주식회사 |
나노 크기의 입자가 첨가 된 액상 세탁 세제의 제조 방법
|
|
JP3861854B2
(ja)
|
2003-05-28 |
2006-12-27 |
セイコーエプソン株式会社 |
電気回路の製造方法
|
|
AU2003232436A1
(en)
|
2003-05-29 |
2005-01-21 |
Seagate Technology Llc |
Synthesis of iron-based alloy nanoparticles
|
|
US7393081B2
(en)
|
2003-06-30 |
2008-07-01 |
Semiconductor Energy Laboratory Co., Ltd. |
Droplet jetting device and method of manufacturing pattern
|
|
US7202155B2
(en)
*
|
2003-08-15 |
2007-04-10 |
Semiconductor Energy Laboratory Co., Ltd. |
Method for manufacturing wiring and method for manufacturing semiconductor device
|
|
US20050089683A1
(en)
|
2003-09-12 |
2005-04-28 |
Fuji Photo Film Co., Ltd. |
Magnetic particles and method of producing the same and magnetic recording medium
|
|
EP1678761A1
(en)
|
2003-10-29 |
2006-07-12 |
Conductive Inkjet Technology Limited |
Electrical connection of components
|
|
JP4157468B2
(ja)
|
2003-12-12 |
2008-10-01 |
日立電線株式会社 |
配線基板
|
|
JP2005191059A
(ja)
|
2003-12-24 |
2005-07-14 |
Seiko Epson Corp |
電気回路の形成方法、電気回路製造装置
|
|
JP2005219873A
(ja)
|
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|
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(ko)
|
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|
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|
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|
|
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(en)
*
|
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|
|
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(en)
*
|
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|
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|
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|
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|
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|
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|
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|
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|
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