ATE211305T1 - Halbleiterchipanordnungen, herstellungsmethoden und komponenten für dieselben - Google Patents

Halbleiterchipanordnungen, herstellungsmethoden und komponenten für dieselben

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Publication number
ATE211305T1
ATE211305T1 AT91918245T AT91918245T ATE211305T1 AT E211305 T1 ATE211305 T1 AT E211305T1 AT 91918245 T AT91918245 T AT 91918245T AT 91918245 T AT91918245 T AT 91918245T AT E211305 T1 ATE211305 T1 AT E211305T1
Authority
AT
Austria
Prior art keywords
central
semiconductor chip
front surface
components
manufacturing methods
Prior art date
Application number
AT91918245T
Other languages
English (en)
Inventor
Igor Y Khandros
Thomas H Distefano
Original Assignee
Tessera Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27079801&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE211305(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US07/586,758 external-priority patent/US5148266A/en
Application filed by Tessera Inc filed Critical Tessera Inc
Application granted granted Critical
Publication of ATE211305T1 publication Critical patent/ATE211305T1/de

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    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
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    • H01L2924/30—Technical effects
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    • H01L2924/30107—Inductance
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    • H01L2924/3011—Impedance
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Die Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thermistors And Varistors (AREA)
  • Measuring Leads Or Probes (AREA)
AT91918245T 1990-09-24 1991-09-24 Halbleiterchipanordnungen, herstellungsmethoden und komponenten für dieselben ATE211305T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/586,758 US5148266A (en) 1990-09-24 1990-09-24 Semiconductor chip assemblies having interposer and flexible lead
US07/673,020 US5148265A (en) 1990-09-24 1991-03-21 Semiconductor chip assemblies with fan-in leads
PCT/US1991/006920 WO1992005582A1 (en) 1990-09-24 1991-09-24 Semiconductor chip assemblies, methods of making same and components for same

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AT91918245T ATE211305T1 (de) 1990-09-24 1991-09-24 Halbleiterchipanordnungen, herstellungsmethoden und komponenten für dieselben
AT03076966T ATE352870T1 (de) 1990-09-24 1991-09-24 Halbleiterchipanordnung und verfahren zu ihrer herstellung

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EP (3) EP1111672B2 (de)
JP (1) JP2924923B2 (de)
KR (1) KR970005709B1 (de)
AT (3) ATE297054T2 (de)
AU (1) AU8731291A (de)
CA (1) CA2091438C (de)
DE (3) DE69133468T3 (de)
DK (2) DK1353374T3 (de)
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WO (1) WO1992005582A1 (de)

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US6392306B1 (en) 2002-05-21
EP1111672B2 (de) 2016-08-03
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ATE352870T1 (de) 2007-02-15
ES2281598T3 (es) 2007-10-01
US6133627A (en) 2000-10-17
ATE297054T2 (de) 2005-06-15
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EP0551382A4 (en) 1993-09-01
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DE69133558T2 (de) 2007-11-29
AU8731291A (en) 1992-04-15
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US20020011663A1 (en) 2002-01-31
US5148265A (en) 1992-09-15
US6433419B2 (en) 2002-08-13
US6465893B1 (en) 2002-10-15
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EP1353374B1 (de) 2007-01-24
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CA2091438C (en) 2000-08-08
EP1111672A2 (de) 2001-06-27
DE69133558D1 (de) 2007-03-15
EP1111672B1 (de) 2005-06-01
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JPH06504408A (ja) 1994-05-19
US6372527B1 (en) 2002-04-16
US5347159A (en) 1994-09-13
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JP2924923B2 (ja) 1999-07-26

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