AU8657598A - Interposer/adhesive composite - Google Patents
Interposer/adhesive compositeInfo
- Publication number
- AU8657598A AU8657598A AU86575/98A AU8657598A AU8657598A AU 8657598 A AU8657598 A AU 8657598A AU 86575/98 A AU86575/98 A AU 86575/98A AU 8657598 A AU8657598 A AU 8657598A AU 8657598 A AU8657598 A AU 8657598A
- Authority
- AU
- Australia
- Prior art keywords
- interposer
- adhesive composite
- composite
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90467697A | 1997-08-01 | 1997-08-01 | |
US08904676 | 1997-08-01 | ||
US791898A | 1998-01-16 | 1998-01-16 | |
US09007918 | 1998-01-16 | ||
PCT/US1998/013554 WO1999007014A1 (en) | 1997-08-01 | 1998-06-29 | Interposer/adhesive composite |
Publications (1)
Publication Number | Publication Date |
---|---|
AU8657598A true AU8657598A (en) | 1999-02-22 |
Family
ID=26677516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU86575/98A Abandoned AU8657598A (en) | 1997-08-01 | 1998-06-29 | Interposer/adhesive composite |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU8657598A (en) |
WO (1) | WO1999007014A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19954888C2 (en) * | 1999-11-15 | 2002-01-10 | Infineon Technologies Ag | Packaging for a semiconductor chip |
US6743026B1 (en) | 2003-04-15 | 2004-06-01 | International Business Machines Corporation | Printed wiring board thickness control for compression connectors used in electronic packaging |
US7659151B2 (en) * | 2007-04-12 | 2010-02-09 | Micron Technology, Inc. | Flip chip with interposer, and methods of making same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5148265A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
JP3522750B2 (en) * | 1991-09-12 | 2004-04-26 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Embossed pressure-sensitive adhesive transfer tape |
JP2616565B2 (en) * | 1994-09-12 | 1997-06-04 | 日本電気株式会社 | Electronic component assembly |
US5633785A (en) * | 1994-12-30 | 1997-05-27 | University Of Southern California | Integrated circuit component package with integral passive component |
-
1998
- 1998-06-29 WO PCT/US1998/013554 patent/WO1999007014A1/en active Application Filing
- 1998-06-29 AU AU86575/98A patent/AU8657598A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1999007014A1 (en) | 1999-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |