EP1447849A3 - Halbleiterbauelement und mit demselben versehene Leiterplatte - Google Patents

Halbleiterbauelement und mit demselben versehene Leiterplatte Download PDF

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Publication number
EP1447849A3
EP1447849A3 EP04009500A EP04009500A EP1447849A3 EP 1447849 A3 EP1447849 A3 EP 1447849A3 EP 04009500 A EP04009500 A EP 04009500A EP 04009500 A EP04009500 A EP 04009500A EP 1447849 A3 EP1447849 A3 EP 1447849A3
Authority
EP
European Patent Office
Prior art keywords
electrodes
semiconductor chip
interconnecting pattern
semiconductor device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04009500A
Other languages
English (en)
French (fr)
Other versions
EP1447849A2 (de
Inventor
Nobuaki Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of EP1447849A2 publication Critical patent/EP1447849A2/de
Publication of EP1447849A3 publication Critical patent/EP1447849A3/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
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    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
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    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
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    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
EP04009500A 1997-03-10 1998-03-10 Halbleiterbauelement und mit demselben versehene Leiterplatte Withdrawn EP1447849A3 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7261497 1997-03-10
JP7261497 1997-03-10
EP98905829A EP0913866B1 (de) 1997-03-10 1998-03-10 Halbleiterbauelement und mit diesem Bauelement bestückte Leiterplatte

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP98905829A Division EP0913866B1 (de) 1997-03-10 1998-03-10 Halbleiterbauelement und mit diesem Bauelement bestückte Leiterplatte

Publications (2)

Publication Number Publication Date
EP1447849A2 EP1447849A2 (de) 2004-08-18
EP1447849A3 true EP1447849A3 (de) 2005-07-20

Family

ID=13494452

Family Applications (3)

Application Number Title Priority Date Filing Date
EP04005159A Withdrawn EP1427016A3 (de) 1997-03-10 1998-03-10 Halbleiterbauelement und mit demselben versehene Leiterplatte
EP98905829A Expired - Lifetime EP0913866B1 (de) 1997-03-10 1998-03-10 Halbleiterbauelement und mit diesem Bauelement bestückte Leiterplatte
EP04009500A Withdrawn EP1447849A3 (de) 1997-03-10 1998-03-10 Halbleiterbauelement und mit demselben versehene Leiterplatte

Family Applications Before (2)

Application Number Title Priority Date Filing Date
EP04005159A Withdrawn EP1427016A3 (de) 1997-03-10 1998-03-10 Halbleiterbauelement und mit demselben versehene Leiterplatte
EP98905829A Expired - Lifetime EP0913866B1 (de) 1997-03-10 1998-03-10 Halbleiterbauelement und mit diesem Bauelement bestückte Leiterplatte

Country Status (8)

Country Link
US (8) US6515370B2 (de)
EP (3) EP1427016A3 (de)
JP (2) JP3963484B2 (de)
KR (1) KR100563585B1 (de)
AU (1) AU6121598A (de)
DE (1) DE69830883T2 (de)
TW (1) TW392262B (de)
WO (1) WO1998040915A1 (de)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6870272B2 (en) * 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US6284563B1 (en) 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US6211572B1 (en) 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
TW448524B (en) * 1997-01-17 2001-08-01 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
DE69830883T2 (de) * 1997-03-10 2006-04-20 Seiko Epson Corp. Halbleiterbauelement und mit diesem Bauelement bestückte Leiterplatte
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