FR2521350B1 - Boitier porteur de puce semi-conductrice - Google Patents

Boitier porteur de puce semi-conductrice

Info

Publication number
FR2521350B1
FR2521350B1 FR8221110A FR8221110A FR2521350B1 FR 2521350 B1 FR2521350 B1 FR 2521350B1 FR 8221110 A FR8221110 A FR 8221110A FR 8221110 A FR8221110 A FR 8221110A FR 2521350 B1 FR2521350 B1 FR 2521350B1
Authority
FR
France
Prior art keywords
semiconductor chip
chip holder
holder
semiconductor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8221110A
Other languages
English (en)
Other versions
FR2521350A1 (fr
Inventor
Gen Murakami
Takeshi Gappa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57016231A external-priority patent/JPS58134451A/ja
Priority claimed from JP57016230A external-priority patent/JPS58134450A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2521350A1 publication Critical patent/FR2521350A1/fr
Application granted granted Critical
Publication of FR2521350B1 publication Critical patent/FR2521350B1/fr
Expired legal-status Critical Current

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    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
FR8221110A 1982-02-05 1982-12-16 Boitier porteur de puce semi-conductrice Expired FR2521350B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57016231A JPS58134451A (ja) 1982-02-05 1982-02-05 多連フレ−ム
JP57016230A JPS58134450A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
FR2521350A1 FR2521350A1 (fr) 1983-08-12
FR2521350B1 true FR2521350B1 (fr) 1986-01-24

Family

ID=26352511

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8221110A Expired FR2521350B1 (fr) 1982-02-05 1982-12-16 Boitier porteur de puce semi-conductrice

Country Status (9)

Country Link
US (1) US4691225A (fr)
KR (1) KR910002035B1 (fr)
DE (1) DE3300693A1 (fr)
FR (1) FR2521350B1 (fr)
GB (2) GB2115607B (fr)
HK (2) HK70887A (fr)
IT (1) IT1161868B (fr)
MY (1) MY8700602A (fr)
SG (1) SG36187G (fr)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
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FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
EP0333237A3 (fr) * 1984-05-18 1990-03-21 BRITISH TELECOMMUNICATIONS public limited company Support pour puce à circuit intégré
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
US4762606A (en) * 1985-04-12 1988-08-09 Hughes Aircraft Company Mini chip carrier slotted array
US4802277A (en) * 1985-04-12 1989-02-07 Hughes Aircraft Company Method of making a chip carrier slotted array
IL78192A (en) * 1985-04-12 1992-03-29 Hughes Aircraft Co Mini chip carrier slotted array
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
US4870476A (en) * 1986-02-13 1989-09-26 Vtc Incorporated Integrated circuit packaging process and structure
US4822989A (en) * 1986-05-21 1989-04-18 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof
DE3619636A1 (de) * 1986-06-11 1987-12-17 Bosch Gmbh Robert Gehaeuse fuer integrierte schaltkreise
DE3625263A1 (de) * 1986-07-25 1988-02-04 Basf Ag Mikroelektronische bauelemente sowie dickschicht-hybridschaltungen
US5057461A (en) * 1987-03-19 1991-10-15 Texas Instruments Incorporated Method of mounting integrated circuit interconnect leads releasably on film
JPH02155256A (ja) * 1988-12-08 1990-06-14 Mitsubishi Electric Corp 半導体装置
US5010038A (en) * 1989-06-29 1991-04-23 Digital Equipment Corp. Method of cooling and powering an integrated circuit chip using a compliant interposing pad
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GB2138210B (en) 1985-10-30
FR2521350A1 (fr) 1983-08-12
GB8302769D0 (en) 1983-03-02
US4691225A (en) 1987-09-01
HK71387A (en) 1987-10-09
GB2138210A (en) 1984-10-17
HK70887A (en) 1987-10-09
GB8411298D0 (en) 1984-06-06
GB2115607A (en) 1983-09-07
DE3300693A1 (de) 1983-09-22
IT1161868B (it) 1987-03-18
MY8700602A (en) 1987-12-31
KR840003534A (ko) 1984-09-08
GB2115607B (en) 1985-10-30
KR910002035B1 (ko) 1991-03-30
IT8319413A0 (it) 1983-02-03
SG36187G (en) 1987-09-18

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