IT1161868B - Dispositivo a semicondutturi e procedimento per la sua fabbricazione - Google Patents

Dispositivo a semicondutturi e procedimento per la sua fabbricazione

Info

Publication number
IT1161868B
IT1161868B IT19413/83A IT1941383A IT1161868B IT 1161868 B IT1161868 B IT 1161868B IT 19413/83 A IT19413/83 A IT 19413/83A IT 1941383 A IT1941383 A IT 1941383A IT 1161868 B IT1161868 B IT 1161868B
Authority
IT
Italy
Prior art keywords
procedure
manufacture
semiconductive device
semiconductive
Prior art date
Application number
IT19413/83A
Other languages
English (en)
Other versions
IT8319413A0 (it
Inventor
Murakami Gen
Gappa Takeshi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57016230A external-priority patent/JPS58134450A/ja
Priority claimed from JP57016231A external-priority patent/JPS58134451A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8319413A0 publication Critical patent/IT8319413A0/it
Application granted granted Critical
Publication of IT1161868B publication Critical patent/IT1161868B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT19413/83A 1982-02-05 1983-02-03 Dispositivo a semicondutturi e procedimento per la sua fabbricazione IT1161868B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57016230A JPS58134450A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法
JP57016231A JPS58134451A (ja) 1982-02-05 1982-02-05 多連フレ−ム

Publications (2)

Publication Number Publication Date
IT8319413A0 IT8319413A0 (it) 1983-02-03
IT1161868B true IT1161868B (it) 1987-03-18

Family

ID=26352511

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19413/83A IT1161868B (it) 1982-02-05 1983-02-03 Dispositivo a semicondutturi e procedimento per la sua fabbricazione

Country Status (9)

Country Link
US (1) US4691225A (it)
KR (1) KR910002035B1 (it)
DE (1) DE3300693A1 (it)
FR (1) FR2521350B1 (it)
GB (2) GB2115607B (it)
HK (2) HK71387A (it)
IT (1) IT1161868B (it)
MY (1) MY8700602A (it)
SG (1) SG36187G (it)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
EP0333237A3 (en) * 1984-05-18 1990-03-21 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
IL78192A (en) * 1985-04-12 1992-03-29 Hughes Aircraft Co Mini chip carrier slotted array
US4802277A (en) * 1985-04-12 1989-02-07 Hughes Aircraft Company Method of making a chip carrier slotted array
US4762606A (en) * 1985-04-12 1988-08-09 Hughes Aircraft Company Mini chip carrier slotted array
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
US4870476A (en) * 1986-02-13 1989-09-26 Vtc Incorporated Integrated circuit packaging process and structure
KR940003375B1 (ko) * 1986-05-21 1994-04-21 가부시끼가이샤 히다찌세이사꾸쇼 반도체 장치 및 그 제조 방법
DE3619636A1 (de) * 1986-06-11 1987-12-17 Bosch Gmbh Robert Gehaeuse fuer integrierte schaltkreise
DE3625263A1 (de) * 1986-07-25 1988-02-04 Basf Ag Mikroelektronische bauelemente sowie dickschicht-hybridschaltungen
US5057461A (en) * 1987-03-19 1991-10-15 Texas Instruments Incorporated Method of mounting integrated circuit interconnect leads releasably on film
JPH02155256A (ja) * 1988-12-08 1990-06-14 Mitsubishi Electric Corp 半導体装置
US5010038A (en) * 1989-06-29 1991-04-23 Digital Equipment Corp. Method of cooling and powering an integrated circuit chip using a compliant interposing pad
US5014418A (en) * 1989-07-13 1991-05-14 Gte Products Corporation Method of forming a two piece chip carrier
JP2515406B2 (ja) * 1989-09-05 1996-07-10 株式会社東芝 樹脂封止型半導体装置
US5045921A (en) * 1989-12-26 1991-09-03 Motorola, Inc. Pad array carrier IC device using flexible tape
NL9000161A (nl) * 1990-01-23 1991-08-16 Koninkl Philips Electronics Nv Halfgeleiderinrichting bevattende een drager en werkwijze voor het vervaardigen van de drager.
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
US5172303A (en) * 1990-11-23 1992-12-15 Motorola, Inc. Electronic component assembly
JPH04273451A (ja) * 1991-02-28 1992-09-29 Nippon Steel Corp 半導体装置
JPH04322452A (ja) * 1991-04-23 1992-11-12 Mitsubishi Electric Corp 半導体装置、半導体素子収納容器および半導体装置の製造方法
JPH05206314A (ja) * 1991-11-12 1993-08-13 Nec Corp 半導体装置
US5592025A (en) * 1992-08-06 1997-01-07 Motorola, Inc. Pad array semiconductor device
US5441918A (en) * 1993-01-29 1995-08-15 Lsi Logic Corporation Method of making integrated circuit die package
US5700697A (en) * 1993-02-01 1997-12-23 Silicon Packaging Technology Method for packaging an integrated circuit using a reconstructed package
US5291062A (en) * 1993-03-01 1994-03-01 Motorola, Inc. Area array semiconductor device having a lid with functional contacts
US5474958A (en) * 1993-05-04 1995-12-12 Motorola, Inc. Method for making semiconductor device having no die supporting surface
US5455385A (en) * 1993-06-28 1995-10-03 Harris Corporation Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
DE4332783A1 (de) * 1993-09-27 1995-03-30 Reichhardt Bernd Konfigurierbares elektronisches Bauelement für die Oberflächenmontage
US5583378A (en) * 1994-05-16 1996-12-10 Amkor Electronics, Inc. Ball grid array integrated circuit package with thermal conductor
US5550403A (en) * 1994-06-02 1996-08-27 Lsi Logic Corporation Improved laminate package for an integrated circuit and integrated circuit having such a package
US5747874A (en) * 1994-09-20 1998-05-05 Fujitsu Limited Semiconductor device, base member for semiconductor device and semiconductor device unit
DE4438449A1 (de) * 1994-10-28 1996-07-04 Sibet Gmbh Sican Forschungs Un Verfahren zur direkten Kontaktierung elektronischer Bauelemente mit einem Träger und direkt kontaktierbare Bauelemente hierzu
JPH08186151A (ja) * 1994-12-29 1996-07-16 Sony Corp 半導体装置及びその製造方法
US5760466A (en) * 1995-04-20 1998-06-02 Kyocera Corporation Semiconductor device having improved heat resistance
FR2734983B1 (fr) * 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
FR2734984B1 (fr) * 1995-05-29 1997-08-22 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
KR0178255B1 (ko) * 1995-11-17 1999-03-20 황인길 Bga 반도체 패키지의 pcb캐리어 프레임 및 그 제조방법
JPH09260436A (ja) * 1996-03-27 1997-10-03 Mitsubishi Electric Corp 半導体装置
US5986340A (en) * 1996-05-02 1999-11-16 National Semiconductor Corporation Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same
US5844319A (en) * 1997-03-03 1998-12-01 Motorola Corporation Microelectronic assembly with collar surrounding integrated circuit component on a substrate
JP2976917B2 (ja) * 1997-03-31 1999-11-10 日本電気株式会社 半導体装置
US6088901A (en) * 1997-06-10 2000-07-18 Siemens Aktiengesellschaft Method for producing a carrier element for semiconductor chips
US5962810A (en) * 1997-09-09 1999-10-05 Amkor Technology, Inc. Integrated circuit package employing a transparent encapsulant
US5939784A (en) * 1997-09-09 1999-08-17 Amkor Technology, Inc. Shielded surface acoustical wave package
US5952611A (en) * 1997-12-19 1999-09-14 Texas Instruments Incorporated Flexible pin location integrated circuit package
EP1063699A4 (en) * 1998-02-10 2007-07-25 Nissha Printing BASIC FOIL FOR SEMICONDUCTOR MODULE, METHOD FOR PRODUCING A BASE FOIL FOR A SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE
US6092281A (en) 1998-08-28 2000-07-25 Amkor Technology, Inc. Electromagnetic interference shield driver and method
US6274927B1 (en) 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
US6163076A (en) * 1999-06-04 2000-12-19 Advanced Semiconductor Engineering, Inc. Stacked structure of semiconductor package
US6407450B1 (en) 1999-07-15 2002-06-18 Altera Corporation Semiconductor package with universal substrate for electrically interfacing with different sized chips that have different logic functions
GB2356287B (en) * 1999-07-15 2004-03-24 Altera Corp Apparatus and method for packaging different sized semiconductor chips on a common substrate
US6448635B1 (en) 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip
US6335224B1 (en) * 2000-05-16 2002-01-01 Sandia Corporation Protection of microelectronic devices during packaging
DE10113771A1 (de) * 2001-03-21 2002-07-04 Infineon Technologies Ag Halbleiterbauelement und Verfahren zu dessen Kontaktierung mit einer Leiterplatte
US6861720B1 (en) 2001-08-29 2005-03-01 Amkor Technology, Inc. Placement template and method for placing optical dies
US6784534B1 (en) 2002-02-06 2004-08-31 Amkor Technology, Inc. Thin integrated circuit package having an optically transparent window

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1184319A (en) * 1967-12-27 1970-03-11 Rca Corp Semiconductor Device Assembly
JPS4919023B1 (it) * 1970-01-02 1974-05-14
US3691289A (en) * 1970-10-22 1972-09-12 Minnesota Mining & Mfg Packaging of semiconductor devices
NL164425C (nl) * 1971-02-05 1980-12-15 Philips Nv Halfgeleiderinrichting voorzien van een koellichaam.
GB1339660A (en) * 1971-11-20 1973-12-05 Ferranti Ltd Supports for semiconductor devices
US3778685A (en) * 1972-03-27 1973-12-11 Nasa Integrated circuit package with lead structure and method of preparing the same
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
US3916434A (en) * 1972-11-30 1975-10-28 Power Hybrids Inc Hermetically sealed encapsulation of semiconductor devices
IN139550B (it) * 1974-04-30 1976-07-03 Burroughs Corp
US3936866A (en) * 1974-06-14 1976-02-03 Northrop Corporation Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate
CH588797A5 (it) * 1975-01-14 1977-06-15 Ebauches Electroniques Sa
FR2311406A1 (fr) * 1975-05-13 1976-12-10 Honeywell Bull Soc Ind Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres
DE2528119A1 (de) * 1975-06-24 1977-01-20 Siemens Ag Elektrisch leitendes band
GB1509142A (en) * 1975-11-18 1978-04-26 Amp Inc Lead assembly
JPS52126765A (en) * 1976-04-16 1977-10-24 Seiko Instr & Electronics Sealing frame structure for circuit substrate and method of producing same
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS53103659U (it) * 1977-01-25 1978-08-21
FR2382101A1 (fr) * 1977-02-28 1978-09-22 Labo Electronique Physique Dispositif a semi-conducteur, comportant des pattes metalliques isolees
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
DE2752655A1 (de) * 1977-09-23 1979-06-07 Blaupunkt Werke Gmbh Elektronisches bauelement
FR2404992A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
US4366342A (en) * 1978-06-21 1982-12-28 Minnesota Mining And Manufacturing Company Conductively coated embossed articles
US4218701A (en) * 1978-07-24 1980-08-19 Citizen Watch Co., Ltd. Package for an integrated circuit having a container with support bars
EP0016522B1 (en) * 1979-02-19 1982-12-22 Fujitsu Limited Semiconductor device and method for manufacturing the same
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly
DE3021289A1 (de) * 1980-06-06 1981-12-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrischer baustein in schichtschaltungstechnik
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
US4477827A (en) * 1981-02-02 1984-10-16 Northern Telecom Limited Lead frame for leaded semiconductor chip carriers
CA1183280A (en) * 1981-02-09 1985-02-26 Francis N. Sinnadurai Integrated circuit chip carrier
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
US4459607A (en) * 1981-06-18 1984-07-10 Burroughs Corporation Tape automated wire bonded integrated circuit chip assembly
JPS58468A (ja) * 1981-06-24 1983-01-05 Komatsu Ltd 装軌式走行装置
US4495376A (en) * 1981-07-27 1985-01-22 Texas Instruments Incorporated Carrier for integrated circuit
US4463217A (en) * 1981-09-14 1984-07-31 Texas Instruments Incorporated Plastic surface mounted high pinout integrated circuit package
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice

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IT8319413A0 (it) 1983-02-03
GB2138210B (en) 1985-10-30
GB2138210A (en) 1984-10-17
KR910002035B1 (ko) 1991-03-30
HK70887A (en) 1987-10-09
GB2115607B (en) 1985-10-30
GB2115607A (en) 1983-09-07
GB8302769D0 (en) 1983-03-02
SG36187G (en) 1987-09-18
KR840003534A (ko) 1984-09-08
US4691225A (en) 1987-09-01
FR2521350A1 (fr) 1983-08-12
GB8411298D0 (en) 1984-06-06
MY8700602A (en) 1987-12-31
FR2521350B1 (fr) 1986-01-24
DE3300693A1 (de) 1983-09-22
HK71387A (en) 1987-10-09

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