JPS52126765A - Sealing frame structure for circuit substrate and method of producing same - Google Patents

Sealing frame structure for circuit substrate and method of producing same

Info

Publication number
JPS52126765A
JPS52126765A JP4390476A JP4390476A JPS52126765A JP S52126765 A JPS52126765 A JP S52126765A JP 4390476 A JP4390476 A JP 4390476A JP 4390476 A JP4390476 A JP 4390476A JP S52126765 A JPS52126765 A JP S52126765A
Authority
JP
Japan
Prior art keywords
frame structure
circuit substrate
sealing frame
producing same
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4390476A
Other languages
Japanese (ja)
Inventor
Isao Fukuda
Nobuo Ukon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP4390476A priority Critical patent/JPS52126765A/en
Priority to GB1480777A priority patent/GB1531677A/en
Publication of JPS52126765A publication Critical patent/JPS52126765A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP4390476A 1976-04-16 1976-04-16 Sealing frame structure for circuit substrate and method of producing same Pending JPS52126765A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP4390476A JPS52126765A (en) 1976-04-16 1976-04-16 Sealing frame structure for circuit substrate and method of producing same
GB1480777A GB1531677A (en) 1976-04-16 1977-04-07 Electronic circuit assembly and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4390476A JPS52126765A (en) 1976-04-16 1976-04-16 Sealing frame structure for circuit substrate and method of producing same

Publications (1)

Publication Number Publication Date
JPS52126765A true JPS52126765A (en) 1977-10-24

Family

ID=12676687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4390476A Pending JPS52126765A (en) 1976-04-16 1976-04-16 Sealing frame structure for circuit substrate and method of producing same

Country Status (2)

Country Link
JP (1) JPS52126765A (en)
GB (1) GB1531677A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521350B1 (en) * 1982-02-05 1986-01-24 Hitachi Ltd SEMICONDUCTOR CHIP HOLDER
FI90935C (en) * 1991-03-06 1994-04-11 Nokia Mobile Phones Ltd Method for mounting a coaxial transmission line on a printed circuit board
US7095101B2 (en) * 2000-11-15 2006-08-22 Jiahn-Chang Wu Supporting frame for surface-mount diode package
DE102011118734A1 (en) * 2011-11-16 2013-05-16 Thomas Hofmann Composite layer circuit with externally accessible integrated components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840663A (en) * 1971-09-29 1973-06-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840663A (en) * 1971-09-29 1973-06-14

Also Published As

Publication number Publication date
GB1531677A (en) 1978-11-08

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