FI90935C - Method for mounting a coaxial transmission line on a printed circuit board - Google Patents
Method for mounting a coaxial transmission line on a printed circuit board Download PDFInfo
- Publication number
- FI90935C FI90935C FI911116A FI911116A FI90935C FI 90935 C FI90935 C FI 90935C FI 911116 A FI911116 A FI 911116A FI 911116 A FI911116 A FI 911116A FI 90935 C FI90935 C FI 90935C
- Authority
- FI
- Finland
- Prior art keywords
- circuit board
- cable
- opening
- coaxial cable
- transmission line
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Multi-Conductor Connections (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
i 90935i 90935
Koaksiaalisen siirtojohdon asennusmenetelmå painetulle pii-rilevylle - Forfarande for montering av en koaxial transmissionsledning på en tryckt kretsskiva 5Method of installing a coaxial transmission line on a printed circuit board - Forfarande for montering av en coaxial transmissionsledning på en tryckt kretsskiva 5
Keksinto koskee menetelmåå, jolla kiinteåvaippainen koaksi-aalikaapeli tai vastaava voidaan asentaa painettuun piirile-vyyn.The invention relates to a method by which a fixed-sheathed coaxial cable or the like can be mounted on a printed circuit board.
10 Elektroniikkateollisuudessa on usein tarvetta aikaansaada painetulle piirilevylle såhkoisiltå ominaisuuksiltaan hyvå siirtojohto. Mikåli siirtojohto halutaan toteuttaa piirile-vyteknisin keinoin, se vaatii kalliin piirilevymateriaalin. Usein tulee edullisemmaksi kåyttåå halvempaa piirilevymate-15 riaalia (FR-4) ja lisåtå siihen irralliset siirtojohdon påt-kåt haluttuihin paikkoihin. Tållaisena såhkåisiltå ominaisuuksiltaan hyvånå siirtojohtona voidaan kåyttåå kiinteå-vaippaista, puolijåykkåå koaksiaalikaapelia. Aikaisemmasta tekniikasta tunnetaan tållaisen koaksiaalikaapelin asentami-20 nen piirilevyn pintaan, jolloin keskijohdon kontakti halut-tuun pisteeseen saadaan taivuttamalla se sopivasti piirilevyn pintaan. Tållåin ulkovaipan alla tåytyy olla maataso, josta signaalimaan kontakti muodostuu piirilevyn maatason ja kaapelin maajohtimen vålille. Tålloin ongelmaksi usein kui-25 tenkin muodostuu kaapelin keskijohdon epåmååråinen muoto sen kulkiessa liitåntåkohdassa kaapelista piirilevyn pintaan, jolloin muodostuu epåjatkuvuuskohta signaalitielle. Tåstå voi olla haittaa varsinkin suurilla taajuuksilla.10 In the electronics industry, there is often a need to provide a transmission line with good electrical properties on a printed circuit board. If the transmission line is to be implemented by circuit board technology, it requires expensive circuit board material. It is often more advantageous to use a cheaper circuit board material-15 material (FR-4) and add loose ends of the transmission line to the desired locations. A fixed-sheathed, semi-rigid coaxial cable can be used as such a transmission line with good electrical properties. It is known from the prior art to install such a coaxial cable on the surface of the circuit board, whereby the contact of the middle conductor to the desired point is obtained by bending it appropriately on the surface of the circuit board. In this case, there must be a ground plane under the outer sheath, from which the signal ground contact is formed between the ground plane of the circuit board and the ground conductor of the cable. In this case, however, the problem is often the irregular shape of the center line of the cable as it passes from the cable to the surface of the circuit board at the connection point, whereby a point of discontinuity in the signal path is formed. This can be a disadvantage, especially at high frequencies.
30 Esillå oleva keksintå esittåå menetelmån, jolla tåmå koaksiaalikaapelin asennus voidaan suorittaa niin, ettå våltetåån edellå esitetty ongelma. Keksinndn mukaisesti piirilevyyn muodostetaan, esimerkiksi meiståmållå tai jyrsimållå, syven-nys tai aukko, johon koaksiaalikaapeli uppoaa niin syvålle, 35 ettå kaapelin keskijohdin tulee piirilevyn pinnan tasolle ilman taivutusta (kuvat 1 ja 2). Nåin saadaan piirilevylle tehdyn liuskan ominaisimpedanssi ja koaksiaalikaapelin omi-naisimpedanssi yhtå suuriksi, jolloin signaali siirtyy lius-kasta kaapeliin ja påinvastoin ilman epåjatkuvuuspisteitå ja 2 epåsovitusta (kuva 3). Signaalimaakontakti saadaan aikaan kaapelin maavaipan ja piirilevyn maatason vålille tuomalla tåmå maataso piirilevylle muodostetun syvennyksen tai aukon reunaan saakka, josta kontakti saadaan syntymåån tinajuotok-5 sella. Vielå parempi kontakti syntyy, jos syvennys tai aukko låpimetalloidaan (kuva 4), jolloin juotoskontakti saadaan syntymåån syvennyksen tai aukon seinåmien ja kaapelin ulko-vaipan vålille. Kuvissa 4 ja 5 on myos esitetty låpimetal-loinnin aukaisu keskijohtimen kohdalta oikosulun vålttåmi-10 seksi juotoksen aikana.The present invention provides a method by which this coaxial cable installation can be performed so as to avoid the above problem. According to the invention, a recess or opening is formed in the circuit board, for example by stamping or milling, into which the coaxial cable sinks so deep that the center conductor of the cable comes level with the surface of the circuit board without bending (Figures 1 and 2). In this way, the characteristic impedance of the strip made on the circuit board and the characteristic impedance of the coaxial cable are made equal, whereby the signal is transferred from the strip to the cable and vice versa without discontinuity points and 2 mismatches (Figure 3). The signal ground contact is provided between the ground plane of the cable and the ground plane of the circuit board by bringing this ground plane to the edge of the recess or opening formed in the circuit board, from which the contact is made by tin soldering. An even better contact is created if the recess or opening is metallized (Fig. 4), whereby solder contact is made between the walls of the recess or opening and the outer sheath of the cable. Figures 4 and 5 also show the opening of the through-metallization at the center conductor to avoid a short circuit during soldering.
Jos kåytetåån menetelmånå jyrsintåå tai jotain vastaavaa menetelmåå ja piirilevyn paksuus ja koaksiaalikaapelin hal-kaisija suhtautuvat toisiinsa sopivasti, voi olla jårkevåå 15 muodostaa piirilevyyn ainoastaan syvennys. Tåmån syvennyksen laidat ja pohja voivat olla metalloidut.If milling or the like is used as the method, and the thickness of the circuit board and the diameter of the coaxial cable correspond to each other appropriately, it may make sense to form only a recess in the circuit board. The edges and bottom of this recess may be metallized.
Keksinnon oleelliset tunnusmerkit on esitetty oheisissa pa-t en11 ivaat imuks i s sa.The essential features of the invention are set out in the appended claims.
2020
Olennaista keksinndlle on myos se, ettå rakenteesta tulee erittåin kompakti, kun koaksiaalikaapelin halkaisija ja piirilevyn paksuus valitaan sopivasti siten, ettå noin puolet kaapelista uppoaa piirilevyn sisåån (kuva 1).It is also essential for the invention that the structure becomes very compact when the diameter of the coaxial cable and the thickness of the circuit board are suitably selected so that about half of the cable sinks inside the circuit board (Figure 1).
2525
Keksinnån mukainen asennusmenetelmå tåyttåå myos RF-suojaus-vaatimukset, mikåli piirilevyn alapinta on ehyt maataso eli piirilevyn alapinta on metalloitu (toimii RF-suojakotelon osana), piirilevyyn muodostettu aukko peittyy kaapelin vai-30 pan avulla (aukon seinåmåt låpimetalloitu) ja kontaktivaipan ja piirilevyn vålille tehdåån juotos ympåri koko aukon. Aukon låpimetalloinnin aukaisun kohdalla juotoskontakti syntyy vaipan ja piirilevyn pinnan vålille, kun piirilevyn paksuu-den suhde kaapelin halkaisijaan on valittu siten, ettå kaa-35 pelin ulkopinta sivuaa piirilevyn pintaa tåsså kohdassa (kuva 6) . Syvennyksen tapauksessa juottaminen voidaan suorittaa kaapelin vaipan sivuja pitkin.The installation method according to the invention also meets the RF protection requirements, if the lower surface of the circuit board is an intact ground plane, i.e. the lower surface of the circuit board is metallized (acts as part of the RF shield); an opening formed in the circuit board is covered by a cable sheath (aperture walls soldering is made around the entire opening. At the opening of the through-through metallization, a solder contact is made between the sheath and the circuit board surface when the ratio of the circuit board thickness to the cable diameter is selected so that the outer surface of the kaa-35 game is lateral to the circuit board surface at this point (Figure 6). In the case of a recess, soldering can be performed along the sides of the cable sheath.
IIII
90935 390935 3
KeksintSå kuvataan vielå yksityiskohtaisemmin kuviin viit-taamalla.The invention will be described in more detail with reference to the figures.
Kuvat 1-3 esittåvåt piirilevyyn asennettua koaksiaalikaape-5 lia pååstå, sivulta ja ylhååltå katsottuna, vastaavasti; kuva 4 esittåå piirilevyn osaa perspektiivinåkymånå; kuva 5 esittåå koaksiaalikaapelin ja piirilevyn geometriaa; ja kuva 6 esittåå koaksiaalikaapelin ja piirilevyn perspektii-10 vinåkymåå alhaalta katsottuna.Figures 1-3 show a coaxial cable mounted on a circuit board from the top, from the side and from above, respectively; Figure 4 shows a part of the circuit board in a perspective view; Figure 5 shows the geometry of a coaxial cable and a circuit board; and Figure 6 is a bottom perspective view of the coaxial cable and circuit board.
Kuvassa 1 on esitetty koaksiaalikaapeli l piirilevyyn 2 asennettuna kaapelin pååstå katsottuna. Piirilevyyn 2 on muodostettu aukko 3, johon koaksiaalikaapeli 1 on asennettu 15 siten, ettå kaapelin keskijohdin 4 jåå levyn pinnan tasolle. Keskijohdinta ympåroi dielektrinen våliaine 5 ja sitå edel-leen kaapelin kuparivaippa 6. Kuvassa 2 on esitetty sivuku-vantona kiinteåvaippainen koaksiaalikaapeli 1 asennettuna piirilevyyn 2 muodostettuun aukkoon.Figure 1 shows a coaxial cable 1 mounted on a circuit board 2 as seen from the end of the cable. An opening 3 is formed in the circuit board 2, in which the coaxial cable 1 is mounted 15 so that the center conductor 4 of the cable remains at the level of the surface of the board. The center conductor is surrounded by a dielectric medium 5 and further by a copper sheath 6 of the cable. Figure 2 shows a side view of a fixed-sheathed coaxial cable 1 mounted in an opening formed in the circuit board 2.
2020
Kuvassa 3 on esitetty ylhååltåpåin katsottuna, miten paine-tun piirilevyn liuska 7 ja koaksiaalikaapelin keskijohdin liittyvåt toisiinsa ilman epåjatkuvuuspisteitå. Kun piiri-levylle tehdyn liuskan ja koaksiaalikaapelin ominaisimpe-25 danssit ovat samat, saadaan signaali siirtymåån kaapelin yli ilman epåsovitusta.Figure 3 shows a top view of how the strip 7 of the printed circuit board and the center conductor of the coaxial cable are connected to each other without points of discontinuity. When the characteristic impulses of the strip made on the circuit board and the coaxial cable are the same, a signal is obtained to move over the cable without mismatch.
Kuvassa 4 on esitetty låpimetalloitu piirilevyyn muodostettu aukko 3, johon on tehty låpimetalloinnin aukaisu 8 koaksiaa-30 likaapelin keskijohtimen kohdalta. Kuvassa nåkyy my6s paine-tun piirilevyn pinnassa oleva liuska 7. Kuvassa 5 on esitetty aukon låpimetalloinnin aukaisu 8 edeståpåin katsottuna. Kuvasta ilmenevåt myos kaapelin ja piirilevyn mittasuhteet.Figure 4 shows a through-metallized opening 3 formed in the circuit board, in which a through-metallization opening 8 is made at the center conductor of the coaxial-30 dirt cable. The figure also shows a strip 7 on the surface of the printed circuit board. Figure 5 shows the opening 8 of the opening through-metallization seen from the front. The figure also shows the dimensions of the cable and the circuit board.
35 Kuvassa 6 on esitetty piirilevyn aukko alapuolelta, jolloin nåkyy, ettå piirilevyn metalloitu alapinta 9 eli maataso sivuaa kaapelin ulkopintaa låpimetalloinnin aukaisun kohdal-la, millå saadaan aikaan juotoskontakti vaipan ja piirilevyn pinnan vålille.Figure 6 shows the opening of the circuit board from below, showing that the metallized lower surface 9 of the circuit board, i.e. the ground plane, is lateral to the outer surface of the cable at the through-metallization opening, making solder contact between the sheath and the circuit board surface.
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI911116A FI90935C (en) | 1991-03-06 | 1991-03-06 | Method for mounting a coaxial transmission line on a printed circuit board |
GB9204890A GB2253521B (en) | 1991-03-06 | 1992-03-05 | Printed circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI911116A FI90935C (en) | 1991-03-06 | 1991-03-06 | Method for mounting a coaxial transmission line on a printed circuit board |
FI911116 | 1991-03-06 |
Publications (4)
Publication Number | Publication Date |
---|---|
FI911116A0 FI911116A0 (en) | 1991-03-06 |
FI911116A FI911116A (en) | 1992-09-07 |
FI90935B FI90935B (en) | 1993-12-31 |
FI90935C true FI90935C (en) | 1994-04-11 |
Family
ID=8532066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI911116A FI90935C (en) | 1991-03-06 | 1991-03-06 | Method for mounting a coaxial transmission line on a printed circuit board |
Country Status (2)
Country | Link |
---|---|
FI (1) | FI90935C (en) |
GB (1) | GB2253521B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2298316B (en) * | 1995-02-23 | 1998-12-16 | Standex Int Corp | Surface mount electronic reed switch component |
DE19640058C2 (en) * | 1996-09-30 | 1999-06-10 | Heraeus Sensor Nite Gmbh | Printed circuit board with strain relief for connection cables, processes for their manufacture and connection and their use |
KR100370859B1 (en) | 1998-05-25 | 2003-02-05 | 미쓰비시덴키 가부시키가이샤 | Receiver |
GB2342509A (en) * | 1998-10-05 | 2000-04-12 | Standex Int Corp | Surface mount reed switch having transverse feet formed from leads |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3500428A (en) * | 1967-08-30 | 1970-03-10 | Gen Electric | Microwave hybrid microelectronic circuit module |
JPS52126765A (en) * | 1976-04-16 | 1977-10-24 | Seiko Instr & Electronics | Sealing frame structure for circuit substrate and method of producing same |
US4361862A (en) * | 1979-05-14 | 1982-11-30 | Western Electric Company, Inc. | Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor |
US4747019A (en) * | 1984-12-14 | 1988-05-24 | Murata Manufacturing Co., Ltd. | Feedthrough capacitor arrangement |
DE3501710A1 (en) * | 1985-01-19 | 1986-07-24 | Allied Corp., Morristown, N.J. | PCB WITH INTEGRAL POSITIONING MEANS |
GB2189084B (en) * | 1986-04-10 | 1989-11-22 | Stc Plc | Integrated circuit package |
-
1991
- 1991-03-06 FI FI911116A patent/FI90935C/en active
-
1992
- 1992-03-05 GB GB9204890A patent/GB2253521B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FI911116A0 (en) | 1991-03-06 |
GB9204890D0 (en) | 1992-04-22 |
GB2253521B (en) | 1994-11-23 |
GB2253521A (en) | 1992-09-09 |
FI911116A (en) | 1992-09-07 |
FI90935B (en) | 1993-12-31 |
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Legal Events
Date | Code | Title | Description |
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BB | Publication of examined application |