FI90935C - Method for mounting a coaxial transmission line on a printed circuit board - Google Patents

Method for mounting a coaxial transmission line on a printed circuit board Download PDF

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Publication number
FI90935C
FI90935C FI911116A FI911116A FI90935C FI 90935 C FI90935 C FI 90935C FI 911116 A FI911116 A FI 911116A FI 911116 A FI911116 A FI 911116A FI 90935 C FI90935 C FI 90935C
Authority
FI
Finland
Prior art keywords
circuit board
cable
opening
coaxial cable
transmission line
Prior art date
Application number
FI911116A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI911116A0 (en
FI911116A (en
FI90935B (en
Inventor
Osmo Kukkonen
Original Assignee
Nokia Mobile Phones Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Mobile Phones Ltd filed Critical Nokia Mobile Phones Ltd
Priority to FI911116A priority Critical patent/FI90935C/en
Publication of FI911116A0 publication Critical patent/FI911116A0/en
Priority to GB9204890A priority patent/GB2253521B/en
Publication of FI911116A publication Critical patent/FI911116A/en
Application granted granted Critical
Publication of FI90935B publication Critical patent/FI90935B/en
Publication of FI90935C publication Critical patent/FI90935C/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0243Printed circuits associated with mounted high frequency components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809Coaxial layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10356Cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10969Metallic case or integral heatsink of component electrically connected to a pad on PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Multi-Conductor Connections (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

i 90935i 90935

Koaksiaalisen siirtojohdon asennusmenetelmå painetulle pii-rilevylle - Forfarande for montering av en koaxial transmissionsledning på en tryckt kretsskiva 5Method of installing a coaxial transmission line on a printed circuit board - Forfarande for montering av en coaxial transmissionsledning på en tryckt kretsskiva 5

Keksinto koskee menetelmåå, jolla kiinteåvaippainen koaksi-aalikaapeli tai vastaava voidaan asentaa painettuun piirile-vyyn.The invention relates to a method by which a fixed-sheathed coaxial cable or the like can be mounted on a printed circuit board.

10 Elektroniikkateollisuudessa on usein tarvetta aikaansaada painetulle piirilevylle såhkoisiltå ominaisuuksiltaan hyvå siirtojohto. Mikåli siirtojohto halutaan toteuttaa piirile-vyteknisin keinoin, se vaatii kalliin piirilevymateriaalin. Usein tulee edullisemmaksi kåyttåå halvempaa piirilevymate-15 riaalia (FR-4) ja lisåtå siihen irralliset siirtojohdon påt-kåt haluttuihin paikkoihin. Tållaisena såhkåisiltå ominaisuuksiltaan hyvånå siirtojohtona voidaan kåyttåå kiinteå-vaippaista, puolijåykkåå koaksiaalikaapelia. Aikaisemmasta tekniikasta tunnetaan tållaisen koaksiaalikaapelin asentami-20 nen piirilevyn pintaan, jolloin keskijohdon kontakti halut-tuun pisteeseen saadaan taivuttamalla se sopivasti piirilevyn pintaan. Tållåin ulkovaipan alla tåytyy olla maataso, josta signaalimaan kontakti muodostuu piirilevyn maatason ja kaapelin maajohtimen vålille. Tålloin ongelmaksi usein kui-25 tenkin muodostuu kaapelin keskijohdon epåmååråinen muoto sen kulkiessa liitåntåkohdassa kaapelista piirilevyn pintaan, jolloin muodostuu epåjatkuvuuskohta signaalitielle. Tåstå voi olla haittaa varsinkin suurilla taajuuksilla.10 In the electronics industry, there is often a need to provide a transmission line with good electrical properties on a printed circuit board. If the transmission line is to be implemented by circuit board technology, it requires expensive circuit board material. It is often more advantageous to use a cheaper circuit board material-15 material (FR-4) and add loose ends of the transmission line to the desired locations. A fixed-sheathed, semi-rigid coaxial cable can be used as such a transmission line with good electrical properties. It is known from the prior art to install such a coaxial cable on the surface of the circuit board, whereby the contact of the middle conductor to the desired point is obtained by bending it appropriately on the surface of the circuit board. In this case, there must be a ground plane under the outer sheath, from which the signal ground contact is formed between the ground plane of the circuit board and the ground conductor of the cable. In this case, however, the problem is often the irregular shape of the center line of the cable as it passes from the cable to the surface of the circuit board at the connection point, whereby a point of discontinuity in the signal path is formed. This can be a disadvantage, especially at high frequencies.

30 Esillå oleva keksintå esittåå menetelmån, jolla tåmå koaksiaalikaapelin asennus voidaan suorittaa niin, ettå våltetåån edellå esitetty ongelma. Keksinndn mukaisesti piirilevyyn muodostetaan, esimerkiksi meiståmållå tai jyrsimållå, syven-nys tai aukko, johon koaksiaalikaapeli uppoaa niin syvålle, 35 ettå kaapelin keskijohdin tulee piirilevyn pinnan tasolle ilman taivutusta (kuvat 1 ja 2). Nåin saadaan piirilevylle tehdyn liuskan ominaisimpedanssi ja koaksiaalikaapelin omi-naisimpedanssi yhtå suuriksi, jolloin signaali siirtyy lius-kasta kaapeliin ja påinvastoin ilman epåjatkuvuuspisteitå ja 2 epåsovitusta (kuva 3). Signaalimaakontakti saadaan aikaan kaapelin maavaipan ja piirilevyn maatason vålille tuomalla tåmå maataso piirilevylle muodostetun syvennyksen tai aukon reunaan saakka, josta kontakti saadaan syntymåån tinajuotok-5 sella. Vielå parempi kontakti syntyy, jos syvennys tai aukko låpimetalloidaan (kuva 4), jolloin juotoskontakti saadaan syntymåån syvennyksen tai aukon seinåmien ja kaapelin ulko-vaipan vålille. Kuvissa 4 ja 5 on myos esitetty låpimetal-loinnin aukaisu keskijohtimen kohdalta oikosulun vålttåmi-10 seksi juotoksen aikana.The present invention provides a method by which this coaxial cable installation can be performed so as to avoid the above problem. According to the invention, a recess or opening is formed in the circuit board, for example by stamping or milling, into which the coaxial cable sinks so deep that the center conductor of the cable comes level with the surface of the circuit board without bending (Figures 1 and 2). In this way, the characteristic impedance of the strip made on the circuit board and the characteristic impedance of the coaxial cable are made equal, whereby the signal is transferred from the strip to the cable and vice versa without discontinuity points and 2 mismatches (Figure 3). The signal ground contact is provided between the ground plane of the cable and the ground plane of the circuit board by bringing this ground plane to the edge of the recess or opening formed in the circuit board, from which the contact is made by tin soldering. An even better contact is created if the recess or opening is metallized (Fig. 4), whereby solder contact is made between the walls of the recess or opening and the outer sheath of the cable. Figures 4 and 5 also show the opening of the through-metallization at the center conductor to avoid a short circuit during soldering.

Jos kåytetåån menetelmånå jyrsintåå tai jotain vastaavaa menetelmåå ja piirilevyn paksuus ja koaksiaalikaapelin hal-kaisija suhtautuvat toisiinsa sopivasti, voi olla jårkevåå 15 muodostaa piirilevyyn ainoastaan syvennys. Tåmån syvennyksen laidat ja pohja voivat olla metalloidut.If milling or the like is used as the method, and the thickness of the circuit board and the diameter of the coaxial cable correspond to each other appropriately, it may make sense to form only a recess in the circuit board. The edges and bottom of this recess may be metallized.

Keksinnon oleelliset tunnusmerkit on esitetty oheisissa pa-t en11 ivaat imuks i s sa.The essential features of the invention are set out in the appended claims.

2020

Olennaista keksinndlle on myos se, ettå rakenteesta tulee erittåin kompakti, kun koaksiaalikaapelin halkaisija ja piirilevyn paksuus valitaan sopivasti siten, ettå noin puolet kaapelista uppoaa piirilevyn sisåån (kuva 1).It is also essential for the invention that the structure becomes very compact when the diameter of the coaxial cable and the thickness of the circuit board are suitably selected so that about half of the cable sinks inside the circuit board (Figure 1).

2525

Keksinnån mukainen asennusmenetelmå tåyttåå myos RF-suojaus-vaatimukset, mikåli piirilevyn alapinta on ehyt maataso eli piirilevyn alapinta on metalloitu (toimii RF-suojakotelon osana), piirilevyyn muodostettu aukko peittyy kaapelin vai-30 pan avulla (aukon seinåmåt låpimetalloitu) ja kontaktivaipan ja piirilevyn vålille tehdåån juotos ympåri koko aukon. Aukon låpimetalloinnin aukaisun kohdalla juotoskontakti syntyy vaipan ja piirilevyn pinnan vålille, kun piirilevyn paksuu-den suhde kaapelin halkaisijaan on valittu siten, ettå kaa-35 pelin ulkopinta sivuaa piirilevyn pintaa tåsså kohdassa (kuva 6) . Syvennyksen tapauksessa juottaminen voidaan suorittaa kaapelin vaipan sivuja pitkin.The installation method according to the invention also meets the RF protection requirements, if the lower surface of the circuit board is an intact ground plane, i.e. the lower surface of the circuit board is metallized (acts as part of the RF shield); an opening formed in the circuit board is covered by a cable sheath (aperture walls soldering is made around the entire opening. At the opening of the through-through metallization, a solder contact is made between the sheath and the circuit board surface when the ratio of the circuit board thickness to the cable diameter is selected so that the outer surface of the kaa-35 game is lateral to the circuit board surface at this point (Figure 6). In the case of a recess, soldering can be performed along the sides of the cable sheath.

IIII

90935 390935 3

KeksintSå kuvataan vielå yksityiskohtaisemmin kuviin viit-taamalla.The invention will be described in more detail with reference to the figures.

Kuvat 1-3 esittåvåt piirilevyyn asennettua koaksiaalikaape-5 lia pååstå, sivulta ja ylhååltå katsottuna, vastaavasti; kuva 4 esittåå piirilevyn osaa perspektiivinåkymånå; kuva 5 esittåå koaksiaalikaapelin ja piirilevyn geometriaa; ja kuva 6 esittåå koaksiaalikaapelin ja piirilevyn perspektii-10 vinåkymåå alhaalta katsottuna.Figures 1-3 show a coaxial cable mounted on a circuit board from the top, from the side and from above, respectively; Figure 4 shows a part of the circuit board in a perspective view; Figure 5 shows the geometry of a coaxial cable and a circuit board; and Figure 6 is a bottom perspective view of the coaxial cable and circuit board.

Kuvassa 1 on esitetty koaksiaalikaapeli l piirilevyyn 2 asennettuna kaapelin pååstå katsottuna. Piirilevyyn 2 on muodostettu aukko 3, johon koaksiaalikaapeli 1 on asennettu 15 siten, ettå kaapelin keskijohdin 4 jåå levyn pinnan tasolle. Keskijohdinta ympåroi dielektrinen våliaine 5 ja sitå edel-leen kaapelin kuparivaippa 6. Kuvassa 2 on esitetty sivuku-vantona kiinteåvaippainen koaksiaalikaapeli 1 asennettuna piirilevyyn 2 muodostettuun aukkoon.Figure 1 shows a coaxial cable 1 mounted on a circuit board 2 as seen from the end of the cable. An opening 3 is formed in the circuit board 2, in which the coaxial cable 1 is mounted 15 so that the center conductor 4 of the cable remains at the level of the surface of the board. The center conductor is surrounded by a dielectric medium 5 and further by a copper sheath 6 of the cable. Figure 2 shows a side view of a fixed-sheathed coaxial cable 1 mounted in an opening formed in the circuit board 2.

2020

Kuvassa 3 on esitetty ylhååltåpåin katsottuna, miten paine-tun piirilevyn liuska 7 ja koaksiaalikaapelin keskijohdin liittyvåt toisiinsa ilman epåjatkuvuuspisteitå. Kun piiri-levylle tehdyn liuskan ja koaksiaalikaapelin ominaisimpe-25 danssit ovat samat, saadaan signaali siirtymåån kaapelin yli ilman epåsovitusta.Figure 3 shows a top view of how the strip 7 of the printed circuit board and the center conductor of the coaxial cable are connected to each other without points of discontinuity. When the characteristic impulses of the strip made on the circuit board and the coaxial cable are the same, a signal is obtained to move over the cable without mismatch.

Kuvassa 4 on esitetty låpimetalloitu piirilevyyn muodostettu aukko 3, johon on tehty låpimetalloinnin aukaisu 8 koaksiaa-30 likaapelin keskijohtimen kohdalta. Kuvassa nåkyy my6s paine-tun piirilevyn pinnassa oleva liuska 7. Kuvassa 5 on esitetty aukon låpimetalloinnin aukaisu 8 edeståpåin katsottuna. Kuvasta ilmenevåt myos kaapelin ja piirilevyn mittasuhteet.Figure 4 shows a through-metallized opening 3 formed in the circuit board, in which a through-metallization opening 8 is made at the center conductor of the coaxial-30 dirt cable. The figure also shows a strip 7 on the surface of the printed circuit board. Figure 5 shows the opening 8 of the opening through-metallization seen from the front. The figure also shows the dimensions of the cable and the circuit board.

35 Kuvassa 6 on esitetty piirilevyn aukko alapuolelta, jolloin nåkyy, ettå piirilevyn metalloitu alapinta 9 eli maataso sivuaa kaapelin ulkopintaa låpimetalloinnin aukaisun kohdal-la, millå saadaan aikaan juotoskontakti vaipan ja piirilevyn pinnan vålille.Figure 6 shows the opening of the circuit board from below, showing that the metallized lower surface 9 of the circuit board, i.e. the ground plane, is lateral to the outer surface of the cable at the through-metallization opening, making solder contact between the sheath and the circuit board surface.

Claims (7)

1. Menetelmå kiinteåvaippaisen koaksiaalikaapelin tai vas-taavan asentamiseksi painettuun piirilevyyn, tunnettu siitå, ettå piirilevyyn (2) muodostetaan syvennys tai aukko 5 (3), johon koaksiaalikaapeli (1) upotetaan niin syvålle, ettå kaapelin keskijohdin (4) tulee piirilevyn pinnan tasol-le ilman taivutusta, jolloin keskijohdin (4) liitetåån piirilevyn pinnassa oleviin liuskajohtimiin (7).A method for mounting a fixed-sheathed coaxial cable or the like on a printed circuit board, characterized in that a recess or opening 5 (3) is formed in the circuit board (2) into which the coaxial cable (1) is embedded so deep that the cable center conductor le without bending, whereby the middle conductor (4) is connected to the strip conductors (7) on the surface of the circuit board. 2. Patenttivaatimuksen 1 mukainen menetelmå, t u η n e t - t u siitå, ettå syvennys tai aukko (3) låpimetalloidaan.Method according to Claim 1, characterized in that the recess or opening (3) is metallized. 3. Patenttivaatimuksen 2 mukainen menetelmå, t u η n e t -t u siitå, ettå låpimetallointiin jåtetåån aukaisu (8) 15 koaksiaalikaapelin (1) keskijohtimen (4) kohdalle.Method according to Claim 2, characterized in that an opening (8) is left in the metallization at the center conductor (4) of the coaxial cable (1). 4. Jonkin patenttivaatimuksen 1-3 mukainen menetelmå, tunnettu siitå, ettå piirilevyn alapinta (9) on me-talloitu. 20Method according to one of Claims 1 to 3, characterized in that the lower surface (9) of the circuit board is metallized. 20 5. Jonkin patenttivaatimuksen 1-4 mukainen menetelmå, tunnettu siitå, ettå muodostettu syvennys tai aukko (3) mitoitetaan siten, ettå se peittyy kaapelin vaipan (6) avulla. 25Method according to one of Claims 1 to 4, characterized in that the formed recess or opening (3) is dimensioned so as to be covered by the cable sheath (6). 25 6. Patenttivaatimuksen 5 mukainen menetelmå, t u η n e t -t u siitå, ettå koaksiaalikaapelin ja piirilevyn paksuudet valitaan niin, ettå kaapelin vaippa sivuaa piirilevyn maa-tason muodostavaa pintaa (9). 30A method according to claim 5, characterized in that the thicknesses of the coaxial cable and the circuit board are selected so that the sheath of the cable is lateral to the surface (9) forming the ground plane of the circuit board. 30 7. Patenttivaatimuksen 5 tai 6 mukainen menetelmå, tunnettu siitå, ettå kaapelin vaippa (6) juotetaan piirilevyyn (2) . 90935Method according to Claim 5 or 6, characterized in that the cable sheath (6) is soldered to the circuit board (2). 90935
FI911116A 1991-03-06 1991-03-06 Method for mounting a coaxial transmission line on a printed circuit board FI90935C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI911116A FI90935C (en) 1991-03-06 1991-03-06 Method for mounting a coaxial transmission line on a printed circuit board
GB9204890A GB2253521B (en) 1991-03-06 1992-03-05 Printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI911116A FI90935C (en) 1991-03-06 1991-03-06 Method for mounting a coaxial transmission line on a printed circuit board
FI911116 1991-03-06

Publications (4)

Publication Number Publication Date
FI911116A0 FI911116A0 (en) 1991-03-06
FI911116A FI911116A (en) 1992-09-07
FI90935B FI90935B (en) 1993-12-31
FI90935C true FI90935C (en) 1994-04-11

Family

ID=8532066

Family Applications (1)

Application Number Title Priority Date Filing Date
FI911116A FI90935C (en) 1991-03-06 1991-03-06 Method for mounting a coaxial transmission line on a printed circuit board

Country Status (2)

Country Link
FI (1) FI90935C (en)
GB (1) GB2253521B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2298316B (en) * 1995-02-23 1998-12-16 Standex Int Corp Surface mount electronic reed switch component
DE19640058C2 (en) * 1996-09-30 1999-06-10 Heraeus Sensor Nite Gmbh Printed circuit board with strain relief for connection cables, processes for their manufacture and connection and their use
KR100370859B1 (en) 1998-05-25 2003-02-05 미쓰비시덴키 가부시키가이샤 Receiver
GB2342509A (en) * 1998-10-05 2000-04-12 Standex Int Corp Surface mount reed switch having transverse feet formed from leads

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3500428A (en) * 1967-08-30 1970-03-10 Gen Electric Microwave hybrid microelectronic circuit module
JPS52126765A (en) * 1976-04-16 1977-10-24 Seiko Instr & Electronics Sealing frame structure for circuit substrate and method of producing same
US4361862A (en) * 1979-05-14 1982-11-30 Western Electric Company, Inc. Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor
US4747019A (en) * 1984-12-14 1988-05-24 Murata Manufacturing Co., Ltd. Feedthrough capacitor arrangement
DE3501710A1 (en) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. PCB WITH INTEGRAL POSITIONING MEANS
GB2189084B (en) * 1986-04-10 1989-11-22 Stc Plc Integrated circuit package

Also Published As

Publication number Publication date
FI911116A0 (en) 1991-03-06
GB9204890D0 (en) 1992-04-22
GB2253521B (en) 1994-11-23
GB2253521A (en) 1992-09-09
FI911116A (en) 1992-09-07
FI90935B (en) 1993-12-31

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