FI90935B - Method for mounting a coaxial transmission line on a printed circuit board - Google Patents

Method for mounting a coaxial transmission line on a printed circuit board Download PDF

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Publication number
FI90935B
FI90935B FI911116A FI911116A FI90935B FI 90935 B FI90935 B FI 90935B FI 911116 A FI911116 A FI 911116A FI 911116 A FI911116 A FI 911116A FI 90935 B FI90935 B FI 90935B
Authority
FI
Finland
Prior art keywords
circuit board
cable
opening
coaxial cable
transmission line
Prior art date
Application number
FI911116A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI911116A0 (en
FI90935C (en
FI911116A (en
Inventor
Osmo Kukkonen
Original Assignee
Nokia Mobile Phones Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Mobile Phones Ltd filed Critical Nokia Mobile Phones Ltd
Priority to FI911116A priority Critical patent/FI90935C/en
Publication of FI911116A0 publication Critical patent/FI911116A0/en
Priority to GB9204890A priority patent/GB2253521B/en
Publication of FI911116A publication Critical patent/FI911116A/en
Application granted granted Critical
Publication of FI90935B publication Critical patent/FI90935B/en
Publication of FI90935C publication Critical patent/FI90935C/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Multi-Conductor Connections (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

9093590935

Koaksiaalisen siirtojohdon asennusmenetelmä painetulle piirilevylle - Förfarande för montering av en koaxial transmis-sionsledning pä en tryckt kretsskiva 5Coaxial transmission line installation method for printed circuit boards - Förfarande för montering av en coaxial transmis-sionsledning pä en tryckt kretsskiva 5

Keksintö koskee menetelmää, jolla kiinteävaippainen koaksiaalikaapeli tai vastaava voidaan asentaa painettuun piirilevyyn.The invention relates to a method by which a fixed-sheathed coaxial cable or the like can be mounted on a printed circuit board.

10 Elektroniikkateollisuudessa on usein tarvetta aikaansaada painetulle piirilevylle sähköisiltä ominaisuuksiltaan hyvä siirtojohto. Mikäli siirtojohto halutaan toteuttaa piirile-vyteknisin keinoin, se vaatii kalliin piirilevymateriaalin. Usein tulee edullisemmaksi käyttää halvempaa piirilevymate-15 riaalia (FR-4) ja lisätä siihen irralliset siirtojohdon pätkät haluttuihin paikkoihin. Tällaisena sähköisiltä ominaisuuksiltaan hyvänä siirtojohtona voidaan käyttää kiinteä-vaippaista, puolijäykkää koaksiaalikaapelia. Aikaisemmasta tekniikasta tunnetaan tällaisen koaksiaalikaapelin asentami-20 nen piirilevyn pintaan, jolloin keskijohdon kontakti haluttuun pisteeseen saadaan taivuttamalla se sopivasti piirilevyn pintaan. Tällöin ulkovaipan alla täytyy olla maataso, josta signaalimaan kontakti muodostuu piirilevyn maatason ja kaapelin maajohtimen välille. Tällöin ongelmaksi usein kui-25 tenkin muodostuu kaapelin keskijohdon epämääräinen muoto sen kulkiessa liitäntäkohdassa kaapelista piirilevyn pintaan, jolloin muodostuu epäjatkuvuuskohta signaalitielle. Tästä voi olla haittaa varsinkin suurilla taajuuksilla.10 In the electronics industry, there is often a need to provide a transmission line with good electrical properties for a printed circuit board. If the transmission line is to be implemented by circuit board technology, it requires expensive circuit board material. It is often more advantageous to use a cheaper circuit board material-15 material (FR-4) and add loose sections of transmission line to the desired locations. A fixed-sheathed, semi-rigid coaxial cable can be used as such a transmission line with good electrical properties. It is known from the prior art to install such a coaxial cable on the surface of the circuit board, whereby the contact of the middle conductor to the desired point is obtained by bending it appropriately on the surface of the circuit board. In this case, there must be a ground plane under the outer sheath from which the signal ground contact is formed between the ground plane of the circuit board and the ground conductor of the cable. In this case, however, the problem is often the vague shape of the center line of the cable as it passes from the cable to the surface of the circuit board at the connection point, whereby a discontinuity point is formed in the signal path. This can be a disadvantage, especially at high frequencies.

30 Esillä oleva keksintö esittää menetelmän, jolla tämä koaksiaalikaapelin asennus voidaan suorittaa niin, että vältetään edellä esitetty ongelma. Keksinnön mukaisesti piirilevyyn muodostetaan, esimerkiksi meistämällä tai jyrsimällä, syvennys tai aukko, johon koaksiaalikaapeli uppoaa niin syvälle, 35 että kaapelin keskijohdin tulee piirilevyn pinnan tasolle ilman taivutusta (kuvat 1 ja 2). Näin saadaan piirilevylle tehdyn liuskan ominaisimpedanssi ja koaksiaalikaapelin omi-naisimpedanssi yhtä suuriksi, jolloin signaali siirtyy liuskasta kaapeliin ja päinvastoin ilman epäjatkuvuuspisteitä ja 2 epäsovitusta (kuva 3). Signaalimaakontakti saadaan aikaan kaapelin maavaipan ja piirilevyn maatason välille tuomalla tämä maataso piirilevylle muodostetun syvennyksen tai aukon reunaan saakka, josta kontakti saadaan syntymään tinajuotok-5 sella. Vielä parempi kontakti syntyy, jos syvennys tai aukko läpimetalloidaan (kuva 4), jolloin juotoskontakti saadaan syntymään syvennyksen tai aukon seinämien ja kaapelin ulkovaipan välille. Kuvissa 4 ja 5 on myös esitetty läpimetal-loinnin aukaisu keskijohtimen kohdalta oikosulun välttämi-10 seksi juotoksen aikana.The present invention provides a method by which this coaxial cable installation can be performed so as to avoid the above problem. According to the invention, a recess or opening is formed in the circuit board, for example by stamping or milling, into which the coaxial cable sinks so deeply that the center conductor of the cable comes level with the surface of the circuit board without bending (Figures 1 and 2). This makes the characteristic impedance of the strip made on the circuit board and the characteristic impedance of the coaxial cable equal, whereby the signal is transferred from the strip to the cable and vice versa without discontinuity points and 2 mismatches (Fig. 3). Signal ground contact is provided between the ground sheath of the cable and the ground plane of the circuit board by bringing this ground plane to the edge of the recess or opening formed in the circuit board from which the contact is made by tin soldering. An even better contact is created if the recess or opening is metallized through (Figure 4), whereby solder contact is made between the walls of the recess or opening and the outer sheath of the cable. Figures 4 and 5 also show the opening of the diameter at the center conductor to avoid a short circuit during soldering.

Jos käytetään menetelmänä jyrsintää tai jotain vastaavaa menetelmää ja piirilevyn paksuus ja koaksiaalikaapelin halkaisija suhtautuvat toisiinsa sopivasti, voi olla järkevää 15 muodostaa piirilevyyn ainoastaan syvennys. Tämän syvennyksen laidat ja pohja voivat olla metalloidut.If milling or a similar method is used as the method and the thickness of the circuit board and the diameter of the coaxial cable correspond to each other appropriately, it may make sense to form only a recess in the circuit board. The edges and bottom of this recess may be metallized.

Keksinnön oleelliset tunnusmerkit on esitetty oheisissa paten t t ivaat imuks i s sa.The essential features of the invention are set out in the appended claims.

2020

Olennaista keksinnölle on myös se, että rakenteesta tulee erittäin kompakti, kun koaksiaalikaapelin halkaisija ja piirilevyn paksuus valitaan sopivasti siten, että noin puolet kaapelista uppoaa piirilevyn sisään (kuva 1).It is also essential for the invention that the structure becomes very compact when the diameter of the coaxial cable and the thickness of the circuit board are suitably selected so that about half of the cable sinks inside the circuit board (Figure 1).

2525

Keksinnön mukainen asennusmenetelmä täyttää myös RF-suojaus-vaatimukset, mikäli piirilevyn alapinta on ehyt maataso eli piirilevyn alapinta on metalloitu (toimii RF-suojakotelon osana), piirilevyyn muodostettu aukko peittyy kaapelin vai-30 pan avulla (aukon seinämät läpimetalloitu) ja kontaktivaipan ja piirilevyn välille tehdään juotos ympäri koko aukon. Aukon läpimetalloinnin aukaisun kohdalla juotoskontakti syntyy vaipan ja piirilevyn pinnan välille, kun piirilevyn paksuuden suhde kaapelin halkaisijaan on valittu siten, että kaa-35 pelin ulkopinta sivuaa piirilevyn pintaa tässä kohdassa (kuva 6) . Syvennyksen tapauksessa juottaminen voidaan suorittaa kaapelin vaipan sivuja pitkin.The installation method according to the invention also meets the RF protection requirements if the lower surface of the circuit board is an intact ground plane, i.e. the lower surface of the circuit board is metallized (acts as part of the RF shield), the opening formed in the circuit board is covered by a cable sheath (through-hole walls) make soldering around the entire opening. At the opening of the aperture through metallization, a solder contact is made between the sheath and the circuit board surface when the ratio of the circuit board thickness to the cable diameter is selected so that the outer surface of the kaa-35 game is lateral to the circuit board surface at this point (Fig. 6). In the case of a recess, soldering can be performed along the sides of the cable sheath.

Il 90935 3Il 90935 3

Keksintöä kuvataan vielä yksityiskohtaisemmin kuviin viittaamalla.The invention will be described in even more detail with reference to the figures.

Kuvat 1-3 esittävät piirilevyyn asennettua koaksiaalikaape-5 lia päästä, sivulta ja ylhäältä katsottuna, vastaavasti; kuva 4 esittää piirilevyn osaa perspektiivinäkymänä; kuva 5 esittää koaksiaalikaapelin ja piirilevyn geometriaa; ja kuva 6 esittää koaksiaalikaapelin ja piirilevyn perspektii-10 vinäkymää alhaalta katsottuna.Figures 1-3 show a coaxial cable mounted on a circuit board, seen from the end, from the side and from above, respectively; Figure 4 shows a part of the circuit board in a perspective view; Figure 5 shows the geometry of the coaxial cable and the circuit board; and Figure 6 is a bottom perspective view of the coaxial cable and circuit board.

Kuvassa 1 on esitetty koaksiaalikaapeli l piirilevyyn 2 asennettuna kaapelin päästä katsottuna. Piirilevyyn 2 on muodostettu aukko 3, johon koaksiaalikaapeli 1 on asennettu 15 siten, että kaapelin keskijohdin 4 jää levyn pinnan tasolle. Keskijohdinta ympäröi dielektrinen väliaine 5 ja sitä edelleen kaapelin kuparivaippa 6. Kuvassa 2 on esitetty sivuku-vantona kiinteävaippainen koaksiaalikaapeli 1 asennettuna piirilevyyn 2 muodostettuun aukkoon.Figure 1 shows a coaxial cable 1 mounted on a circuit board 2 as seen from the end of the cable. An opening 3 is formed in the circuit board 2, in which the coaxial cable 1 is mounted 15 so that the center conductor 4 of the cable remains at the level of the surface of the board. The center conductor is surrounded by a dielectric medium 5 and further by a copper sheath 6 of the cable. Figure 2 shows a side view of a fixed-sheathed coaxial cable 1 mounted in an opening formed in the circuit board 2.

2020

Kuvassa 3 on esitetty ylhäältäpäin katsottuna, miten painetun piirilevyn liuska 7 ja koaksiaalikaapelin keskijohdin liittyvät toisiinsa ilman epäjatkuvuuspisteitä. Kun piirilevylle tehdyn liuskan ja koaksiaalikaapelin ominaisimpe-25 danssit ovat samat, saadaan signaali siirtymään kaapelin yli ilman epäsovitusta.Figure 3 shows a top view of how the printed circuit board strip 7 and the center conductor of the coaxial cable are connected to each other without discontinuity points. When the characteristic impulses of the strip made on the circuit board and the coaxial cable are the same, the signal is made to move over the cable without mismatch.

Kuvassa 4 on esitetty läpimetalloitu piirilevyyn muodostettu aukko 3, johon on tehty läpimetalloinnin aukaisu 8 koaksiaa-30 likaapelin keskijohtimen kohdalta. Kuvassa näkyy myös painetun piirilevyn pinnassa oleva liuska 7. Kuvassa 5 on esitetty aukon läpimetalloinnin aukaisu 8 edestäpäin katsottuna. Kuvasta ilmenevät myös kaapelin ja piirilevyn mittasuhteet.Figure 4 shows a through-hole 3 formed in the circuit board, in which a through-opening 8 is made at the center conductor of the coaxial-30 dirt cable. The figure also shows a strip 7 on the surface of a printed circuit board. Figure 5 shows a front view of the opening 8 through metallization. The figure also shows the dimensions of the cable and the circuit board.

35 Kuvassa 6 on esitetty piirilevyn aukko alapuolelta, jolloin näkyy, että piirilevyn metalloitu alapinta 9 eli maataso sivuaa kaapelin ulkopintaa läpimetalloinnin aukaisun kohdalla, millä saadaan aikaan juotoskontakti vaipan ja piirilevyn pinnan välille.Fig. 6 shows the opening of the circuit board from below, whereby it can be seen that the metallized lower surface 9 of the circuit board, i.e. the ground plane, is lateral to the outer surface of the cable at the through-opening, thereby soldering contact between the sheath and the circuit board surface.

Claims (7)

1. Förfarande för att montera en koaxialkabel med en fast mantel eller motsvarande in pd ett tryckt kretskort, k ä n -netecknat av att in pd kretskortet (2) bildas en 5 fördjupning eller öppning (3), väri koaxialkabeln (1) in- läggs sd djupt, att kabelns mittledare (4) kommer i nivd med kretskortets yta utan böjning, varvid mittledaren (4) anslu-tas tili ytledningar (7) pa kretskortets yta. 10A method for mounting a coaxial cable with a fixed jacket or the like on a printed circuit board, characterized in that a depression or opening (3) is formed in the circuit board (2), whereby the coaxial cable (1) is formed. is then laid deep so that the center conductor (4) of the cable comes in level with the surface of the circuit board without bending, whereby the center conductor (4) is connected to surface lines (7) on the surface of the circuit board. 10 2. Förfarande enligt patentkravet 1, kdnneteck- n a t av att fördjupningen eller öppningen (3) genommetal-liseras.2. A method according to claim 1, characterized in that the recess or opening (3) is averaged. 3. Förfarande enligt patentkravet 2, kdnneteck-15 n a t av att i genommetalliseringen lämnas en öppning (8) invid koaxialkabelns (1) mittledare (4).3. A method as claimed in claim 2, characterized in that an opening (8) is left next to the middle conductor (4) of the coaxial cable (1) in the penetration. 4. Förfarande enligt ndgot av patentkraven 1-3, k ä n -netecknat av att kretskortets nedre yta (9) är me- 20 talliserad.Method according to any of claims 1-3, characterized in that the lower surface (9) of the circuit board is metallized. 5. Förfarande enligt ndgot av patentkraven 1-4, k ä n -netecknat av att den bildade fördjupningen eller öppningen (3) mdttsätts sd, att den övertäcks med kabelns 25 mantel (6).5. A method according to any one of claims 1-4, characterized in that the formed recess or opening (3) is saturated so that it is covered with the sheath (6) of the cable. 6. Förfarande enligt patentkravet 5, kanneteck-n a t av att tjockleker av koaxialkabeln och kretskortet väljs sd, att kabelns mantel tangerar ytan (9) som bildar 30 kretskortets jord.6. A method according to claim 5, characterized in that the thicknesses of the coaxial cable and the circuit board are selected so that the cable sheath tangles the surface (9) forming the ground of the circuit board. 7. Förfarande enligt patentkravet 5 eller 6, k d n n e -tecknat av att kabelns mantel (6) löds vid kretskortet (2) . 357. A method according to claim 5 or 6, characterized in that the sheath (6) of the cable is soldered to the circuit board (2). 35
FI911116A 1991-03-06 1991-03-06 Method for mounting a coaxial transmission line on a printed circuit board FI90935C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI911116A FI90935C (en) 1991-03-06 1991-03-06 Method for mounting a coaxial transmission line on a printed circuit board
GB9204890A GB2253521B (en) 1991-03-06 1992-03-05 Printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI911116 1991-03-06
FI911116A FI90935C (en) 1991-03-06 1991-03-06 Method for mounting a coaxial transmission line on a printed circuit board

Publications (4)

Publication Number Publication Date
FI911116A0 FI911116A0 (en) 1991-03-06
FI911116A FI911116A (en) 1992-09-07
FI90935B true FI90935B (en) 1993-12-31
FI90935C FI90935C (en) 1994-04-11

Family

ID=8532066

Family Applications (1)

Application Number Title Priority Date Filing Date
FI911116A FI90935C (en) 1991-03-06 1991-03-06 Method for mounting a coaxial transmission line on a printed circuit board

Country Status (2)

Country Link
FI (1) FI90935C (en)
GB (1) GB2253521B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2298316B (en) * 1995-02-23 1998-12-16 Standex Int Corp Surface mount electronic reed switch component
DE19640058C2 (en) * 1996-09-30 1999-06-10 Heraeus Sensor Nite Gmbh Printed circuit board with strain relief for connection cables, processes for their manufacture and connection and their use
US6625432B1 (en) 1998-05-25 2003-09-23 Mitsubishi Denki Kabushiki Kaisha Receiver
GB2342509A (en) * 1998-10-05 2000-04-12 Standex Int Corp Surface mount reed switch having transverse feet formed from leads

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3500428A (en) * 1967-08-30 1970-03-10 Gen Electric Microwave hybrid microelectronic circuit module
JPS52126765A (en) * 1976-04-16 1977-10-24 Seiko Instr & Electronics Sealing frame structure for circuit substrate and method of producing same
US4361862A (en) * 1979-05-14 1982-11-30 Western Electric Company, Inc. Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor
US4747019A (en) * 1984-12-14 1988-05-24 Murata Manufacturing Co., Ltd. Feedthrough capacitor arrangement
DE3501710A1 (en) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. PCB WITH INTEGRAL POSITIONING MEANS
GB2189084B (en) * 1986-04-10 1989-11-22 Stc Plc Integrated circuit package

Also Published As

Publication number Publication date
FI911116A0 (en) 1991-03-06
FI90935C (en) 1994-04-11
GB9204890D0 (en) 1992-04-22
GB2253521A (en) 1992-09-09
FI911116A (en) 1992-09-07
GB2253521B (en) 1994-11-23

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