FR2382101A1 - Dispositif a semi-conducteur, comportant des pattes metalliques isolees - Google Patents

Dispositif a semi-conducteur, comportant des pattes metalliques isolees

Info

Publication number
FR2382101A1
FR2382101A1 FR7705769A FR7705769A FR2382101A1 FR 2382101 A1 FR2382101 A1 FR 2382101A1 FR 7705769 A FR7705769 A FR 7705769A FR 7705769 A FR7705769 A FR 7705769A FR 2382101 A1 FR2382101 A1 FR 2382101A1
Authority
FR
France
Prior art keywords
metallised
polyimide film
semiconductor circuits
convectors
metallisation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7705769A
Other languages
English (en)
Other versions
FR2382101B1 (fr
Inventor
Michel Monnier
Marc Monneraye
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laboratoires dElectronique Philips SAS
Original Assignee
Laboratoires dElectronique et de Physique Appliquee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laboratoires dElectronique et de Physique Appliquee filed Critical Laboratoires dElectronique et de Physique Appliquee
Priority to FR7705769A priority Critical patent/FR2382101A1/fr
Publication of FR2382101A1 publication Critical patent/FR2382101A1/fr
Application granted granted Critical
Publication of FR2382101B1 publication Critical patent/FR2382101B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/2401—Structure
    • H01L2224/2402—Laminated, e.g. MCM-L type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01084—Polonium [Po]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un dispositif à semiconducteur comportant au moins un élément semi-conducteur, et des pattes metalliques, séparées dudit élément par un film polyimide, et connectées par l'intermédiaire de trous métallisés. Application : montage des circuits intégrés.
FR7705769A 1977-02-28 1977-02-28 Dispositif a semi-conducteur, comportant des pattes metalliques isolees Granted FR2382101A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7705769A FR2382101A1 (fr) 1977-02-28 1977-02-28 Dispositif a semi-conducteur, comportant des pattes metalliques isolees

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7705769A FR2382101A1 (fr) 1977-02-28 1977-02-28 Dispositif a semi-conducteur, comportant des pattes metalliques isolees

Publications (2)

Publication Number Publication Date
FR2382101A1 true FR2382101A1 (fr) 1978-09-22
FR2382101B1 FR2382101B1 (fr) 1981-12-11

Family

ID=9187312

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7705769A Granted FR2382101A1 (fr) 1977-02-28 1977-02-28 Dispositif a semi-conducteur, comportant des pattes metalliques isolees

Country Status (1)

Country Link
FR (1) FR2382101A1 (fr)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2494908A1 (fr) * 1980-11-21 1982-05-28 Gao Ges Automation Org Element support pour modules de circuit integre
DE3124332A1 (de) * 1980-07-09 1982-06-03 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven "tragbares, aus mehreren schichten aufgebautes ausweiselement"
EP0072673A2 (fr) * 1981-08-13 1983-02-23 Minnesota Mining And Manufacturing Company Film support à conducteurs pour l'interconnexion électrique entre des composants électroniques et un circuit externe
EP0178227A2 (fr) * 1984-10-05 1986-04-16 Fujitsu Limited Dispositif semiconducteur à circuit intégré formé sur une tranche
US4691225A (en) * 1982-02-05 1987-09-01 Hitachi, Ltd. Semiconductor device and a method of producing the same
US4731645A (en) * 1982-05-14 1988-03-15 U.S. Philips Corporation Connection of a semiconductor to elements of a support, especially of a portable card
EP0277606A2 (fr) * 1987-02-02 1988-08-10 International Business Machines Corporation Structure d'empaquetage électronique
EP0281900A2 (fr) * 1987-03-11 1988-09-14 International Business Machines Corporation Système de fixage amovible et procédé pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit
EP0281899A2 (fr) * 1987-03-11 1988-09-14 International Business Machines Corporation Procédé et appareil pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit
EP0329018A2 (fr) * 1988-02-19 1989-08-23 Microelectronics and Computer Technology Corporation Circuit adapté à l'usager
EP0377932A2 (fr) * 1988-12-27 1990-07-18 Mitsubishi Denki Kabushiki Kaisha Ensemble de circuits intégrés à semiconducteur
US5081561A (en) * 1988-02-19 1992-01-14 Microelectronics And Computer Technology Corporation Customizable circuitry
EP0473929A1 (fr) * 1990-09-07 1992-03-11 International Business Machines Corporation Procédé de formation d'un dispositiv électronique à film mince.
US5132878A (en) * 1987-09-29 1992-07-21 Microelectronics And Computer Technology Corporation Customizable circuitry
WO1992013319A1 (fr) * 1991-01-28 1992-08-06 Siemens Aktiengesellschaft Procede pour fabriquer un support de donnees portable
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system
FR2749091A1 (fr) * 1996-05-24 1997-11-28 Texier Didier Dispositif de protection de logiciels contre une utilisation non autorisee
WO2004086502A1 (fr) * 2003-03-28 2004-10-07 Siemens Aktiengesellschaft Ensemble constitue d'un composant electrique sur un substrat et son procede de production
WO2009068010A1 (fr) * 2007-11-28 2009-06-04 Fachhochschule Kiel Module d'électronique de puissance laminé
DE102010039824B4 (de) 2010-08-26 2018-03-29 Semikron Elektronik Gmbh & Co. Kg Leistungsbaugruppe mit einer flexiblen Verbindungseinrichtung

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3124332A1 (de) * 1980-07-09 1982-06-03 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven "tragbares, aus mehreren schichten aufgebautes ausweiselement"
FR2494908A1 (fr) * 1980-11-21 1982-05-28 Gao Ges Automation Org Element support pour modules de circuit integre
EP0072673A2 (fr) * 1981-08-13 1983-02-23 Minnesota Mining And Manufacturing Company Film support à conducteurs pour l'interconnexion électrique entre des composants électroniques et un circuit externe
EP0072673A3 (en) * 1981-08-13 1985-03-27 Minnesota Mining And Manufacturing Company Area tape for the electrical interconnection between electronic components and external circuitry
US4691225A (en) * 1982-02-05 1987-09-01 Hitachi, Ltd. Semiconductor device and a method of producing the same
US4731645A (en) * 1982-05-14 1988-03-15 U.S. Philips Corporation Connection of a semiconductor to elements of a support, especially of a portable card
EP0178227A3 (en) * 1984-10-05 1987-08-26 Fujitsu Limited Integrated circuit semiconductor device formed on a wafer
EP0178227A2 (fr) * 1984-10-05 1986-04-16 Fujitsu Limited Dispositif semiconducteur à circuit intégré formé sur une tranche
EP0277606A2 (fr) * 1987-02-02 1988-08-10 International Business Machines Corporation Structure d'empaquetage électronique
EP0277606A3 (en) * 1987-02-02 1989-03-08 International Business Machines Corporation Full panel electronic packaging structure and method of making same
EP0281899B1 (fr) * 1987-03-11 1992-06-17 International Business Machines Corporation Procédé et appareil pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit
EP0281900A2 (fr) * 1987-03-11 1988-09-14 International Business Machines Corporation Système de fixage amovible et procédé pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit
EP0281899A2 (fr) * 1987-03-11 1988-09-14 International Business Machines Corporation Procédé et appareil pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit
EP0281900B1 (fr) * 1987-03-11 1993-06-09 International Business Machines Corporation Système de fixage amovible et procédé pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
US5438166A (en) * 1987-09-29 1995-08-01 Microelectronics And Computer Technology Corporation Customizable circuitry
US5132878A (en) * 1987-09-29 1992-07-21 Microelectronics And Computer Technology Corporation Customizable circuitry
US5081561A (en) * 1988-02-19 1992-01-14 Microelectronics And Computer Technology Corporation Customizable circuitry
EP0329018A3 (fr) * 1988-02-19 1990-02-28 Microelectronics and Computer Technology Corporation Circuit adapté à l'usager
EP0329018A2 (fr) * 1988-02-19 1989-08-23 Microelectronics and Computer Technology Corporation Circuit adapté à l'usager
EP0377932A2 (fr) * 1988-12-27 1990-07-18 Mitsubishi Denki Kabushiki Kaisha Ensemble de circuits intégrés à semiconducteur
EP0377932A3 (fr) * 1988-12-27 1990-12-12 Mitsubishi Denki Kabushiki Kaisha Ensemble de circuits intégrés à semiconducteur
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system
EP0473929A1 (fr) * 1990-09-07 1992-03-11 International Business Machines Corporation Procédé de formation d'un dispositiv électronique à film mince.
WO1992013319A1 (fr) * 1991-01-28 1992-08-06 Siemens Aktiengesellschaft Procede pour fabriquer un support de donnees portable
FR2749091A1 (fr) * 1996-05-24 1997-11-28 Texier Didier Dispositif de protection de logiciels contre une utilisation non autorisee
WO1997045783A1 (fr) * 1996-05-24 1997-12-04 Didier Texier Dispositif de gestion de droits d'acces
WO2004086502A1 (fr) * 2003-03-28 2004-10-07 Siemens Aktiengesellschaft Ensemble constitue d'un composant electrique sur un substrat et son procede de production
US7807931B2 (en) 2003-03-28 2010-10-05 Siemens Aktiengesellschaft Electrical component on a substrate and method for production thereof
WO2009068010A1 (fr) * 2007-11-28 2009-06-04 Fachhochschule Kiel Module d'électronique de puissance laminé
DE102010039824B4 (de) 2010-08-26 2018-03-29 Semikron Elektronik Gmbh & Co. Kg Leistungsbaugruppe mit einer flexiblen Verbindungseinrichtung

Also Published As

Publication number Publication date
FR2382101B1 (fr) 1981-12-11

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