FR2382101A1 - Dispositif a semi-conducteur, comportant des pattes metalliques isolees - Google Patents
Dispositif a semi-conducteur, comportant des pattes metalliques isoleesInfo
- Publication number
- FR2382101A1 FR2382101A1 FR7705769A FR7705769A FR2382101A1 FR 2382101 A1 FR2382101 A1 FR 2382101A1 FR 7705769 A FR7705769 A FR 7705769A FR 7705769 A FR7705769 A FR 7705769A FR 2382101 A1 FR2382101 A1 FR 2382101A1
- Authority
- FR
- France
- Prior art keywords
- metallised
- polyimide film
- semiconductor circuits
- convectors
- metallisation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2401—Structure
- H01L2224/2402—Laminated, e.g. MCM-L type
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Wire Bonding (AREA)
Abstract
L'invention concerne un dispositif à semiconducteur comportant au moins un élément semi-conducteur, et des pattes metalliques, séparées dudit élément par un film polyimide, et connectées par l'intermédiaire de trous métallisés. Application : montage des circuits intégrés.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7705769A FR2382101A1 (fr) | 1977-02-28 | 1977-02-28 | Dispositif a semi-conducteur, comportant des pattes metalliques isolees |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7705769A FR2382101A1 (fr) | 1977-02-28 | 1977-02-28 | Dispositif a semi-conducteur, comportant des pattes metalliques isolees |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2382101A1 true FR2382101A1 (fr) | 1978-09-22 |
FR2382101B1 FR2382101B1 (fr) | 1981-12-11 |
Family
ID=9187312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7705769A Granted FR2382101A1 (fr) | 1977-02-28 | 1977-02-28 | Dispositif a semi-conducteur, comportant des pattes metalliques isolees |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2382101A1 (fr) |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2494908A1 (fr) * | 1980-11-21 | 1982-05-28 | Gao Ges Automation Org | Element support pour modules de circuit integre |
DE3124332A1 (de) * | 1980-07-09 | 1982-06-03 | Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven | "tragbares, aus mehreren schichten aufgebautes ausweiselement" |
EP0072673A2 (fr) * | 1981-08-13 | 1983-02-23 | Minnesota Mining And Manufacturing Company | Film support à conducteurs pour l'interconnexion électrique entre des composants électroniques et un circuit externe |
EP0178227A2 (fr) * | 1984-10-05 | 1986-04-16 | Fujitsu Limited | Dispositif semiconducteur à circuit intégré formé sur une tranche |
US4691225A (en) * | 1982-02-05 | 1987-09-01 | Hitachi, Ltd. | Semiconductor device and a method of producing the same |
US4731645A (en) * | 1982-05-14 | 1988-03-15 | U.S. Philips Corporation | Connection of a semiconductor to elements of a support, especially of a portable card |
EP0277606A2 (fr) * | 1987-02-02 | 1988-08-10 | International Business Machines Corporation | Structure d'empaquetage électronique |
EP0281899A2 (fr) * | 1987-03-11 | 1988-09-14 | International Business Machines Corporation | Procédé et appareil pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit |
EP0281900A2 (fr) * | 1987-03-11 | 1988-09-14 | International Business Machines Corporation | Système de fixage amovible et procédé pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit |
EP0329018A2 (fr) * | 1988-02-19 | 1989-08-23 | Microelectronics and Computer Technology Corporation | Circuit adapté à l'usager |
EP0377932A2 (fr) * | 1988-12-27 | 1990-07-18 | Mitsubishi Denki Kabushiki Kaisha | Ensemble de circuits intégrés à semiconducteur |
US5081561A (en) * | 1988-02-19 | 1992-01-14 | Microelectronics And Computer Technology Corporation | Customizable circuitry |
EP0473929A1 (fr) * | 1990-09-07 | 1992-03-11 | International Business Machines Corporation | Procédé de formation d'un dispositiv électronique à film mince. |
US5132878A (en) * | 1987-09-29 | 1992-07-21 | Microelectronics And Computer Technology Corporation | Customizable circuitry |
WO1992013319A1 (fr) * | 1991-01-28 | 1992-08-06 | Siemens Aktiengesellschaft | Procede pour fabriquer un support de donnees portable |
US5165166A (en) * | 1987-09-29 | 1992-11-24 | Microelectronics And Computer Technology Corporation | Method of making a customizable circuitry |
US5452182A (en) * | 1990-04-05 | 1995-09-19 | Martin Marietta Corporation | Flexible high density interconnect structure and flexibly interconnected system |
FR2749091A1 (fr) * | 1996-05-24 | 1997-11-28 | Texier Didier | Dispositif de protection de logiciels contre une utilisation non autorisee |
WO2004086502A1 (fr) * | 2003-03-28 | 2004-10-07 | Siemens Aktiengesellschaft | Ensemble constitue d'un composant electrique sur un substrat et son procede de production |
WO2009068010A1 (fr) * | 2007-11-28 | 2009-06-04 | Fachhochschule Kiel | Module d'électronique de puissance laminé |
DE102010039824B4 (de) | 2010-08-26 | 2018-03-29 | Semikron Elektronik Gmbh & Co. Kg | Leistungsbaugruppe mit einer flexiblen Verbindungseinrichtung |
-
1977
- 1977-02-28 FR FR7705769A patent/FR2382101A1/fr active Granted
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3124332A1 (de) * | 1980-07-09 | 1982-06-03 | Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven | "tragbares, aus mehreren schichten aufgebautes ausweiselement" |
FR2494908A1 (fr) * | 1980-11-21 | 1982-05-28 | Gao Ges Automation Org | Element support pour modules de circuit integre |
EP0072673A2 (fr) * | 1981-08-13 | 1983-02-23 | Minnesota Mining And Manufacturing Company | Film support à conducteurs pour l'interconnexion électrique entre des composants électroniques et un circuit externe |
EP0072673A3 (en) * | 1981-08-13 | 1985-03-27 | Minnesota Mining And Manufacturing Company | Area tape for the electrical interconnection between electronic components and external circuitry |
US4691225A (en) * | 1982-02-05 | 1987-09-01 | Hitachi, Ltd. | Semiconductor device and a method of producing the same |
US4731645A (en) * | 1982-05-14 | 1988-03-15 | U.S. Philips Corporation | Connection of a semiconductor to elements of a support, especially of a portable card |
EP0178227A3 (en) * | 1984-10-05 | 1987-08-26 | Fujitsu Limited | Integrated circuit semiconductor device formed on a wafer |
EP0178227A2 (fr) * | 1984-10-05 | 1986-04-16 | Fujitsu Limited | Dispositif semiconducteur à circuit intégré formé sur une tranche |
EP0277606A2 (fr) * | 1987-02-02 | 1988-08-10 | International Business Machines Corporation | Structure d'empaquetage électronique |
EP0277606A3 (en) * | 1987-02-02 | 1989-03-08 | International Business Machines Corporation | Full panel electronic packaging structure and method of making same |
EP0281899B1 (fr) * | 1987-03-11 | 1992-06-17 | International Business Machines Corporation | Procédé et appareil pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit |
EP0281899A2 (fr) * | 1987-03-11 | 1988-09-14 | International Business Machines Corporation | Procédé et appareil pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit |
EP0281900A2 (fr) * | 1987-03-11 | 1988-09-14 | International Business Machines Corporation | Système de fixage amovible et procédé pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit |
EP0281900B1 (fr) * | 1987-03-11 | 1993-06-09 | International Business Machines Corporation | Système de fixage amovible et procédé pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit |
US5165166A (en) * | 1987-09-29 | 1992-11-24 | Microelectronics And Computer Technology Corporation | Method of making a customizable circuitry |
US5438166A (en) * | 1987-09-29 | 1995-08-01 | Microelectronics And Computer Technology Corporation | Customizable circuitry |
US5132878A (en) * | 1987-09-29 | 1992-07-21 | Microelectronics And Computer Technology Corporation | Customizable circuitry |
US5081561A (en) * | 1988-02-19 | 1992-01-14 | Microelectronics And Computer Technology Corporation | Customizable circuitry |
EP0329018A3 (fr) * | 1988-02-19 | 1990-02-28 | Microelectronics and Computer Technology Corporation | Circuit adapté à l'usager |
EP0329018A2 (fr) * | 1988-02-19 | 1989-08-23 | Microelectronics and Computer Technology Corporation | Circuit adapté à l'usager |
EP0377932A2 (fr) * | 1988-12-27 | 1990-07-18 | Mitsubishi Denki Kabushiki Kaisha | Ensemble de circuits intégrés à semiconducteur |
EP0377932A3 (fr) * | 1988-12-27 | 1990-12-12 | Mitsubishi Denki Kabushiki Kaisha | Ensemble de circuits intégrés à semiconducteur |
US5452182A (en) * | 1990-04-05 | 1995-09-19 | Martin Marietta Corporation | Flexible high density interconnect structure and flexibly interconnected system |
EP0473929A1 (fr) * | 1990-09-07 | 1992-03-11 | International Business Machines Corporation | Procédé de formation d'un dispositiv électronique à film mince. |
WO1992013319A1 (fr) * | 1991-01-28 | 1992-08-06 | Siemens Aktiengesellschaft | Procede pour fabriquer un support de donnees portable |
FR2749091A1 (fr) * | 1996-05-24 | 1997-11-28 | Texier Didier | Dispositif de protection de logiciels contre une utilisation non autorisee |
WO1997045783A1 (fr) * | 1996-05-24 | 1997-12-04 | Didier Texier | Dispositif de gestion de droits d'acces |
WO2004086502A1 (fr) * | 2003-03-28 | 2004-10-07 | Siemens Aktiengesellschaft | Ensemble constitue d'un composant electrique sur un substrat et son procede de production |
US7807931B2 (en) | 2003-03-28 | 2010-10-05 | Siemens Aktiengesellschaft | Electrical component on a substrate and method for production thereof |
WO2009068010A1 (fr) * | 2007-11-28 | 2009-06-04 | Fachhochschule Kiel | Module d'électronique de puissance laminé |
DE102010039824B4 (de) | 2010-08-26 | 2018-03-29 | Semikron Elektronik Gmbh & Co. Kg | Leistungsbaugruppe mit einer flexiblen Verbindungseinrichtung |
Also Published As
Publication number | Publication date |
---|---|
FR2382101B1 (fr) | 1981-12-11 |
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Legal Events
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CD | Change of name or company name | ||
ST | Notification of lapse |