FR2311406A1 - Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres - Google Patents
Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integresInfo
- Publication number
- FR2311406A1 FR2311406A1 FR7514872A FR7514872A FR2311406A1 FR 2311406 A1 FR2311406 A1 FR 2311406A1 FR 7514872 A FR7514872 A FR 7514872A FR 7514872 A FR7514872 A FR 7514872A FR 2311406 A1 FR2311406 A1 FR 2311406A1
- Authority
- FR
- France
- Prior art keywords
- platelets
- micro
- integrated circuits
- manufacturing methods
- packaging supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7514872A FR2311406A1 (fr) | 1975-05-13 | 1975-05-13 | Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres |
GB17133/76A GB1523225A (en) | 1975-05-13 | 1976-04-27 | Methods of manufacturing carrier supports for integrated circuit chips |
US05/680,749 US4038744A (en) | 1975-05-13 | 1976-04-27 | Methods of manufacturing carrier supports for integrated chips and mounting of integrated circuit chips to a substrate |
SE7605080A SE406248B (sv) | 1975-05-13 | 1976-05-04 | Sett att astadkomma ett behandlingsstod for mikro-plattor med integrerade kretsar vilka er avsedda att slutligt monteras pa ett substrat |
JP51052882A JPS51139777A (en) | 1975-05-13 | 1976-05-11 | Method of making carriers for integrated citcuits chip |
DE19762620998 DE2620998A1 (de) | 1975-05-13 | 1976-05-12 | Verfahren zur herstellung von traegern fuer die verarbeitung von ic-chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7514872A FR2311406A1 (fr) | 1975-05-13 | 1975-05-13 | Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2311406A1 true FR2311406A1 (fr) | 1976-12-10 |
FR2311406B1 FR2311406B1 (fr) | 1977-12-02 |
Family
ID=9155164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7514872A Granted FR2311406A1 (fr) | 1975-05-13 | 1975-05-13 | Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres |
Country Status (6)
Country | Link |
---|---|
US (1) | US4038744A (fr) |
JP (1) | JPS51139777A (fr) |
DE (1) | DE2620998A1 (fr) |
FR (1) | FR2311406A1 (fr) |
GB (1) | GB1523225A (fr) |
SE (1) | SE406248B (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2412225A1 (fr) * | 1977-12-14 | 1979-07-13 | Fontainemelon Horlogerie | Module electronique pour pieces d'horlogerie et son procede de fabrication |
FR2433830A1 (fr) * | 1978-07-26 | 1980-03-14 | Nat Semiconductor Corp | Procede de fabrication de ruban composite bossele pour le soudage en serie automatique de dispositifs semi-conducteurs |
EP0102525A2 (fr) * | 1982-08-23 | 1984-03-14 | BURROUGHS CORPORATION (a Delaware corporation) | Protection contre des particules alpha dans des empaquetages de circuits intégrés |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2337381A1 (fr) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte |
US4399610A (en) * | 1981-04-01 | 1983-08-23 | Western Electric Company, Inc. | Assembling an electronic device |
FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
US4531285A (en) * | 1983-03-21 | 1985-07-30 | The United States Of America As Represented By The Secretary Of The Navy | Method for interconnecting close lead center integrated circuit packages to boards |
JPH0339746Y2 (fr) * | 1985-06-28 | 1991-08-21 | ||
DE3534502A1 (de) * | 1985-09-27 | 1987-04-09 | Licentia Gmbh | Verfahren zum herstellen einer klebekontaktierung |
JPS6413600U (fr) * | 1987-07-17 | 1989-01-24 | ||
JPH0266480A (ja) * | 1988-08-31 | 1990-03-06 | Murata Mfg Co Ltd | センサ素子の組立て実装方法 |
AU7954491A (en) * | 1990-05-14 | 1991-12-10 | Richard Lee Schendelman | Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction |
US5152056A (en) * | 1991-08-27 | 1992-10-06 | Sun Microsystems, Inc. | Method for replacing tape automated bonding components on a printed circuit board |
US5686352A (en) * | 1993-07-26 | 1997-11-11 | Motorola Inc. | Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE787379A (fr) * | 1971-08-10 | 1973-02-09 | Merck & Co Inc | Enzymes pour l'hygiene de la bouche et procede de preparation de ces enzymes |
US3868724A (en) * | 1973-11-21 | 1975-02-25 | Fairchild Camera Instr Co | Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier |
-
1975
- 1975-05-13 FR FR7514872A patent/FR2311406A1/fr active Granted
-
1976
- 1976-04-27 GB GB17133/76A patent/GB1523225A/en not_active Expired
- 1976-04-27 US US05/680,749 patent/US4038744A/en not_active Expired - Lifetime
- 1976-05-04 SE SE7605080A patent/SE406248B/xx unknown
- 1976-05-11 JP JP51052882A patent/JPS51139777A/ja active Granted
- 1976-05-12 DE DE19762620998 patent/DE2620998A1/de not_active Ceased
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2412225A1 (fr) * | 1977-12-14 | 1979-07-13 | Fontainemelon Horlogerie | Module electronique pour pieces d'horlogerie et son procede de fabrication |
FR2433830A1 (fr) * | 1978-07-26 | 1980-03-14 | Nat Semiconductor Corp | Procede de fabrication de ruban composite bossele pour le soudage en serie automatique de dispositifs semi-conducteurs |
EP0102525A2 (fr) * | 1982-08-23 | 1984-03-14 | BURROUGHS CORPORATION (a Delaware corporation) | Protection contre des particules alpha dans des empaquetages de circuits intégrés |
EP0102525A3 (en) * | 1982-08-23 | 1986-01-15 | Burroughs Corporation (A Michigan Corporation) | Alpha-particle protection in integrated circuit packages |
Also Published As
Publication number | Publication date |
---|---|
US4038744A (en) | 1977-08-02 |
GB1523225A (en) | 1978-08-31 |
SE406248B (sv) | 1979-01-29 |
DE2620998A1 (de) | 1976-11-25 |
JPS51139777A (en) | 1976-12-02 |
JPS5750072B2 (fr) | 1982-10-25 |
FR2311406B1 (fr) | 1977-12-02 |
SE7605080L (sv) | 1976-11-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1079559B (it) | Apparecchiatura automatizzata per la fabbricazione di circuiti integrati | |
IT1063394B (it) | Procedimento perfezionato per la fabbricazione di circuiti integrati | |
FR2299724A1 (fr) | Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres | |
FR2336801A1 (fr) | Circuit integre | |
JPS51114068A (en) | Package for integrated circuits using novel heattradiaing structure | |
FR2310040A1 (fr) | Circuit logique integre programmable | |
IT1063554B (it) | Procedimento per la fabbricazione di circuiti integrati | |
FR2299282A1 (fr) | Fabrication du ver | |
BE857663A (fr) | Procede de fabrication de circuits integres programmables | |
SE407728B (sv) | Halvledararrangemang for logikkretsar | |
FR2311406A1 (fr) | Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres | |
PL200127A1 (pl) | Sposob wytwarzania przyrzadu polprzewodnikowego | |
IT1041193B (it) | Perfezionamenti nei procedimenti per la fabbricazione di dispositivi a semiconduttor | |
FR2313777A1 (fr) | Agencement semi-conducteur integre | |
IT1064171B (it) | Procedimento per la fabbricazione di circuiti integrati | |
FR2335052A1 (fr) | Circuit integre | |
SE7711952L (sv) | Anordning for avgradning av arbetsstycken | |
SE7606179L (sv) | Halvledaranordningsaggregat | |
GB1549453A (en) | Method for compensating for emitter-push effect in the fabrication of transistors | |
FR2326779A1 (fr) | Procede de fabrication de circuits integres | |
SE426595B (sv) | Forfarande for framstellning av cellulosaetrar | |
SE406663B (sv) | Reglerbart hallarorgan for integrerade kretsar | |
BE840685A (fr) | Circuits a semi-conducteurs | |
FR2375955B1 (fr) | Machine pour la fabrication de micro-assemblages electroniques | |
IT1058540B (it) | Mandrino espansore |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |