SE406248B - Sett att astadkomma ett behandlingsstod for mikro-plattor med integrerade kretsar vilka er avsedda att slutligt monteras pa ett substrat - Google Patents
Sett att astadkomma ett behandlingsstod for mikro-plattor med integrerade kretsar vilka er avsedda att slutligt monteras pa ett substratInfo
- Publication number
- SE406248B SE406248B SE7605080A SE7605080A SE406248B SE 406248 B SE406248 B SE 406248B SE 7605080 A SE7605080 A SE 7605080A SE 7605080 A SE7605080 A SE 7605080A SE 406248 B SE406248 B SE 406248B
- Authority
- SE
- Sweden
- Prior art keywords
- plater
- micro
- finally
- substrate
- intended
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7514872A FR2311406A1 (fr) | 1975-05-13 | 1975-05-13 | Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7605080L SE7605080L (sv) | 1976-11-14 |
SE406248B true SE406248B (sv) | 1979-01-29 |
Family
ID=9155164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7605080A SE406248B (sv) | 1975-05-13 | 1976-05-04 | Sett att astadkomma ett behandlingsstod for mikro-plattor med integrerade kretsar vilka er avsedda att slutligt monteras pa ett substrat |
Country Status (6)
Country | Link |
---|---|
US (1) | US4038744A (fr) |
JP (1) | JPS51139777A (fr) |
DE (1) | DE2620998A1 (fr) |
FR (1) | FR2311406A1 (fr) |
GB (1) | GB1523225A (fr) |
SE (1) | SE406248B (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2337381A1 (fr) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte |
CH623452B (fr) * | 1977-12-14 | Fontainemelon Horlogerie | Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede. | |
US4209355A (en) * | 1978-07-26 | 1980-06-24 | National Semiconductor Corporation | Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices |
US4399610A (en) * | 1981-04-01 | 1983-08-23 | Western Electric Company, Inc. | Assembling an electronic device |
FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
DE3377313D1 (en) * | 1982-08-23 | 1988-08-11 | Burroughs Corp | Alpha-particle protection in integrated circuit packages |
US4531285A (en) * | 1983-03-21 | 1985-07-30 | The United States Of America As Represented By The Secretary Of The Navy | Method for interconnecting close lead center integrated circuit packages to boards |
JPH0339746Y2 (fr) * | 1985-06-28 | 1991-08-21 | ||
DE3534502A1 (de) * | 1985-09-27 | 1987-04-09 | Licentia Gmbh | Verfahren zum herstellen einer klebekontaktierung |
JPS6413600U (fr) * | 1987-07-17 | 1989-01-24 | ||
JPH0266480A (ja) * | 1988-08-31 | 1990-03-06 | Murata Mfg Co Ltd | センサ素子の組立て実装方法 |
AU7954491A (en) * | 1990-05-14 | 1991-12-10 | Richard Lee Schendelman | Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction |
US5152056A (en) * | 1991-08-27 | 1992-10-06 | Sun Microsystems, Inc. | Method for replacing tape automated bonding components on a printed circuit board |
US5686352A (en) * | 1993-07-26 | 1997-11-11 | Motorola Inc. | Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE787379A (fr) * | 1971-08-10 | 1973-02-09 | Merck & Co Inc | Enzymes pour l'hygiene de la bouche et procede de preparation de ces enzymes |
US3868724A (en) * | 1973-11-21 | 1975-02-25 | Fairchild Camera Instr Co | Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier |
-
1975
- 1975-05-13 FR FR7514872A patent/FR2311406A1/fr active Granted
-
1976
- 1976-04-27 US US05/680,749 patent/US4038744A/en not_active Expired - Lifetime
- 1976-04-27 GB GB17133/76A patent/GB1523225A/en not_active Expired
- 1976-05-04 SE SE7605080A patent/SE406248B/xx unknown
- 1976-05-11 JP JP51052882A patent/JPS51139777A/ja active Granted
- 1976-05-12 DE DE19762620998 patent/DE2620998A1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
DE2620998A1 (de) | 1976-11-25 |
SE7605080L (sv) | 1976-11-14 |
JPS51139777A (en) | 1976-12-02 |
US4038744A (en) | 1977-08-02 |
GB1523225A (en) | 1978-08-31 |
FR2311406B1 (fr) | 1977-12-02 |
JPS5750072B2 (fr) | 1982-10-25 |
FR2311406A1 (fr) | 1976-12-10 |
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