GB2062963B - Semiconductor chip mountings - Google Patents

Semiconductor chip mountings

Info

Publication number
GB2062963B
GB2062963B GB8035586A GB8035586A GB2062963B GB 2062963 B GB2062963 B GB 2062963B GB 8035586 A GB8035586 A GB 8035586A GB 8035586 A GB8035586 A GB 8035586A GB 2062963 B GB2062963 B GB 2062963B
Authority
GB
United Kingdom
Prior art keywords
semiconductor chip
chip mountings
mountings
semiconductor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8035586A
Other versions
GB2062963A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB2062963A publication Critical patent/GB2062963A/en
Application granted granted Critical
Publication of GB2062963B publication Critical patent/GB2062963B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10165—Alignment aids
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    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
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    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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    • H01L2224/818—Bonding techniques
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    • H01L2224/81815—Reflow soldering
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    • H01L2224/81909—Post-treatment of the bump connector or bonding area
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    • H01L2224/81935—Reshaping by heating means, e.g. reflowing
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
GB8035586A 1979-11-12 1980-11-05 Semiconductor chip mountings Expired GB2062963B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979155903U JPS5678356U (en) 1979-11-12 1979-11-12

Publications (2)

Publication Number Publication Date
GB2062963A GB2062963A (en) 1981-05-28
GB2062963B true GB2062963B (en) 1984-05-23

Family

ID=15616027

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8035586A Expired GB2062963B (en) 1979-11-12 1980-11-05 Semiconductor chip mountings

Country Status (3)

Country Link
JP (1) JPS5678356U (en)
DE (1) DE3042085C2 (en)
GB (1) GB2062963B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7659621B2 (en) 2003-10-14 2010-02-09 Unitive International Limited Solder structures for out of plane connections
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7839000B2 (en) 2002-06-25 2010-11-23 Unitive International Limited Solder structures including barrier layers with nickel and/or copper
US7879715B2 (en) 2002-06-25 2011-02-01 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8122540U1 (en) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "INFORMATION CARD WITH INTEGRATED BLOCK"
JPS5873127A (en) * 1981-10-28 1983-05-02 Hitachi Ltd Solder melting connection for ic chip
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
GB2156153B (en) * 1984-03-21 1988-02-24 Pitney Bowes Inc Alignment process for semiconductor chips
GB8522429D0 (en) * 1985-09-10 1985-10-16 Plessey Co Plc Alignment for hybrid device
US4763829A (en) * 1986-06-04 1988-08-16 American Telephone And Telegraph Company, At&T Bell Laboratories Soldering of electronic components
GB2194387A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Bonding integrated circuit devices
CA2034703A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
DE4003070A1 (en) * 1990-02-02 1991-08-08 Telefunken Electronic Gmbh Void-free solder joint of semiconductor die on substrate - by precoating die back surface with solder to form dome surface and attaching die by placing on substrate
US5311405A (en) * 1993-08-02 1994-05-10 Motorola, Inc. Method and apparatus for aligning and attaching a surface mount component
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
WO1996031905A1 (en) 1995-04-05 1996-10-10 Mcnc A solder bump structure for a microelectronic substrate
EP0899787A3 (en) * 1997-07-25 2001-05-16 Mcnc Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby
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US7879715B2 (en) 2002-06-25 2011-02-01 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US8294269B2 (en) 2002-06-25 2012-10-23 Unitive International Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
US7659621B2 (en) 2003-10-14 2010-02-09 Unitive International Limited Solder structures for out of plane connections
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
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DE3042085C2 (en) 1984-09-13
JPS5678356U (en) 1981-06-25
GB2062963A (en) 1981-05-28
DE3042085A1 (en) 1981-06-04

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