SG99333A1 - Packaging of a microchip device - Google Patents

Packaging of a microchip device

Info

Publication number
SG99333A1
SG99333A1 SG200100221A SG200100221A SG99333A1 SG 99333 A1 SG99333 A1 SG 99333A1 SG 200100221 A SG200100221 A SG 200100221A SG 200100221 A SG200100221 A SG 200100221A SG 99333 A1 SG99333 A1 SG 99333A1
Authority
SG
Singapore
Prior art keywords
packaging
microchip device
microchip
Prior art date
Application number
SG200100221A
Inventor
Chuen Khiang Wang
Original Assignee
Chuen Khiang Wang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuen Khiang Wang filed Critical Chuen Khiang Wang
Priority to SG200100221A priority Critical patent/SG99333A1/en
Publication of SG99333A1 publication Critical patent/SG99333A1/en

Links

SG200100221A 2001-01-15 2001-01-15 Packaging of a microchip device SG99333A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200100221A SG99333A1 (en) 2001-01-15 2001-01-15 Packaging of a microchip device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200100221A SG99333A1 (en) 2001-01-15 2001-01-15 Packaging of a microchip device

Publications (1)

Publication Number Publication Date
SG99333A1 true SG99333A1 (en) 2003-10-27

Family

ID=30768931

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200100221A SG99333A1 (en) 2001-01-15 2001-01-15 Packaging of a microchip device

Country Status (1)

Country Link
SG (1) SG99333A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208540A (en) * 1998-08-25 2000-07-28 Texas Instr Inc <Ti> Method for airtightly sealing thin semiconductor chip scale package
JP2000260791A (en) * 1999-03-08 2000-09-22 Fuji Xerox Co Ltd Semiconductor device and its manufacture
US6133627A (en) * 1990-09-24 2000-10-17 Tessera, Inc. Semiconductor chip package with center contacts

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6133627A (en) * 1990-09-24 2000-10-17 Tessera, Inc. Semiconductor chip package with center contacts
JP2000208540A (en) * 1998-08-25 2000-07-28 Texas Instr Inc <Ti> Method for airtightly sealing thin semiconductor chip scale package
JP2000260791A (en) * 1999-03-08 2000-09-22 Fuji Xerox Co Ltd Semiconductor device and its manufacture

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