CN102270619B - 用于电子封装组件的焊盘配置 - Google Patents

用于电子封装组件的焊盘配置 Download PDF

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CN102270619B
CN102270619B CN201110153456.8A CN201110153456A CN102270619B CN 102270619 B CN102270619 B CN 102270619B CN 201110153456 A CN201110153456 A CN 201110153456A CN 102270619 B CN102270619 B CN 102270619B
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pad
row
electronic packaging
line
extension
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CN102270619A (zh
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S·苏塔德雅
刘宪明
高华宏
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Kaiwei International Co
Marvell International Ltd
Marvell Asia Pte Ltd
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Mawier International Trade Co Ltd
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Abstract

本公开的实施方式提供了用于电子封装组件的焊盘配置。具体地，提供了一种电子封装组件，包括：焊接掩膜层，该焊接掩膜层具有至少一个开口；以及耦合到该焊接掩膜层的多个焊盘，其中该多个焊盘中的至少一个焊盘包括(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分，其中在该端子部分处的该第一侧配置为通过该焊接掩膜层中的该至少一个开口接纳封装互连结构，该封装互连结构用以在裸片与该电子封装组件外部的另一电子器件之间路由电信号，并且其中在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。可以描述和/或要求保护其他实施方式。

Description

用于电子封装组件的焊盘配置
相关申请的交叉引用
本公开要求2010年6月4日提交的美国临时专利申请No.61/351,471的优先权，就各方面而言，在此通过引用的方式包含其整个说明书的全部内容，除了可能存在的与本说明书不一致的那些部分。
技术领域
本公开的实施方式涉及电子封装组件领域，并且更特别地涉及用于电子封装组件的焊盘的技术、结构以及配置。
背景技术
在此出于一般地呈现本公开的上下文的目的而提供了背景技术描述。在该背景技术部分中所描述的当前署名的发明人的工作、以及本说明书中的并未以其他方式被判定为申请时的现有技术的各方面，均不表示明确地或隐含地被承认为相对于本公开的现有技术。
集成电路器件(诸如晶体管)形成在其尺寸持续缩减为更小维度的裸片或芯片上。裸片的紧缩维度和相关联的容纳裸片的封装组件对当前用于路由去往或来自半导体裸片的电信号的传统焊盘结构和/或焊盘配置提出了挑战。
发明内容
在一个实施方式中，本公开包括一种电子封装组件，该电子封装组件包括：焊接掩膜层，该焊接掩膜层具有至少一个开口；以及耦合到该焊接掩膜层的多个焊盘，其中该多个焊盘中的至少一个焊盘包括(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分，其中在该端子部分处的该第一侧配置为通过该焊接掩膜层中的该至少一个开口接纳封装互连结构，该封装互连结构用以在裸片与该电子封装组件外部的另一电子器件之间路由电信号，并且其中在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。
在另一实施方式中，本公开包括一种装置，该装置包括电子封装组件以及印刷电路板，该电子封装组件包括：焊接掩膜层，该焊接掩膜层具有至少一个开口；以及耦合到该焊接掩膜层的多个焊盘，其中该多个焊盘中的至少一个焊盘包括(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分，其中在该端子部分处的该第一侧配置为通过该焊接掩膜层中的该至少一个开口接纳封装互连结构，并且其中在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接，该印刷电路板使用该封装互连结构耦合到在该至少一个焊盘的该端子部分处的该第一侧，该封装互连结构用以在裸片与该印刷电路板之间路由电信号。
在另一实施方式中，本公开包括一种电子封装组件，该电子封装组件包括：焊接掩膜层，其中该焊接掩膜层具有至少一个开口。该电子封装组件进一步包括耦合到该焊接掩膜层的多个焊盘，其中该多个焊盘中的至少一个焊盘包括(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧配置为通过该焊接掩膜层中的一个或多个开口接纳封装互连结构。该封装互连结构在裸片与该电子封装组件外部的另一电子器件之间路由电信号，并且在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该电子封装组件进一步包括配置为接纳该裸片的裸片焊盘。该多个焊盘包括第一行焊盘，该第一行焊盘布置为与该裸片焊盘相邻。该多个焊盘包括布置为与该第一行焊盘相邻且平行的第二行焊盘，该第一行焊盘布置为比该第二行焊盘更靠近于该裸片焊盘。该至少两个焊盘中的第一焊盘布置在该第一行焊盘中，而该至少两个焊盘中的第二焊盘布置在该第二行焊盘中。
在另一实施方式中，本公开提供了一种制作电子封装组件的方法，其中该方法包括提供牺牲衬底并在该牺牲衬底上形成再分布层。该再分布层包括多个焊盘并且焊盘配置为容纳裸片。该多个焊盘的至少两个焊盘中的每一个包括：(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧耦合至该牺牲衬底，以及在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该多个焊盘包括第一行焊盘，该第一行焊盘布置为与该裸片焊盘相邻。该多个焊盘包括布置为与该第一行焊盘相邻且平行的第二行焊盘，该第一行焊盘布置为比该第二行焊盘更靠近于该裸片焊盘。该至少两个焊盘中的第一焊盘布置在该第一行焊盘中，而该至少两个焊盘中的第二焊盘布置在该第二行焊盘中。
在另一实施方式中，本公开包括一种电子封装组件，该电子封装组件包括焊接掩膜层。该焊接掩膜层具有至少一个开口。该电子封装组件进一步包括耦合到该焊接掩膜层的多个焊盘。该多个焊盘中的至少一个焊盘包括(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧配置为通过该焊接掩膜层中的该至少一个开口接纳封装互连结构。该封装互连结构在裸片与该电子封装组件外部的另一电子器件之间路由电信号。在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该电子封装组件进一步包括配置为接纳该裸片的裸片焊盘。该多个焊盘包括第一行焊盘，该第一行焊盘布置为与该裸片焊盘相邻。该多个焊盘包括布置为与该第一行焊盘相邻且平行的第二行焊盘，该第一行焊盘布置为比该第二行焊盘更靠近于该裸片焊盘。该至少一个焊盘的延伸部分在不垂直于该第一行焊盘的方向中延伸。
在另一实施方式中，本公开提供了一种制作电子封装组件的方法，其中该方法包括提供牺牲衬底并在该牺牲衬底上形成再分布层。该再分布层包括多个焊盘并且焊盘配置为接纳裸片。该多个焊盘的至少一个焊盘包括：(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧耦合至该牺牲衬底，以及在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该多个焊盘包括第一行焊盘，该第一行焊盘布置为与该裸片焊盘相邻。该多个焊盘包括布置为与该第一行焊盘相邻且平行的第二行焊盘，该第一行焊盘布置为比该第二行焊盘更靠近于该裸片焊盘。该至少一个焊盘的延伸部分在不垂直于该第一行焊盘的方向中延伸。
在另一实施方式中，本公开提供一种包括焊接掩膜层的电子封装组件。该焊接掩膜层具有至少一个开口。该电子封装组件进一步包括耦合到该焊接掩膜层的多个焊盘。该多个焊盘中的至少一个焊盘包括(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧配置为通过该焊接掩膜层中的该至少一个开口接纳封装互连结构。该封装互连结构在裸片与该电子封装组件外部的另一电子器件之间路由电信号。在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该电子封装组件进一步包括配置为接纳该裸片的裸片焊盘。该多个焊盘包括第一行焊盘，该第一行焊盘布置为与该裸片焊盘相邻。该多个焊盘包括布置为与该第一行焊盘相邻且平行的第二行焊盘，该第一行焊盘布置为比该第二行焊盘更靠近于该裸片焊盘。该多个焊盘包括布置为与该第二行焊盘相邻且平行的第三行焊盘，该第二行焊盘布置为比该第三行焊盘更靠近于该裸片焊盘。该延伸部分具有在该第一行焊盘和该第二行焊盘之间布置的终止端。
在另一实施方式中，本公开提供了一种制作电子封装组件的方法，其中该方法包括提供牺牲衬底并在该牺牲衬底上形成再分布层。该再分布层包括多个焊盘并且焊盘配置为接纳裸片。该多个焊盘的至少一个焊盘包括：(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧耦合至该牺牲衬底，以及在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该多个焊盘包括第一行焊盘，该第一行焊盘布置为与该裸片焊盘相邻。该多个焊盘包括布置为与该第一行焊盘相邻且平行的第二行焊盘，该第一行焊盘布置为比该第二行焊盘更靠近于该裸片焊盘。该多个焊盘包括布置为与该第二行焊盘相邻且平行的第三行焊盘，该第二行焊盘布置为比该第三行焊盘更靠近于该裸片焊盘。该延伸部分具有在该第一行焊盘和该第二行焊盘之间布置的终止端。
在另一实施方式中，本公开提供一种包括焊接掩膜层的电子封装组件。该焊接掩膜层具有至少一个开口。该电子封装组件进一步包括耦合到该焊接掩膜层的多个焊盘。该多个焊盘中的一个或者多个焊盘包括(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧配置为通过该焊接掩膜层中的该至少一个开口接纳封装互连结构。该封装互连结构在裸片与该电子封装组件外部的另一电子器件之间路由电信号。在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该电子封装组件进一步包括配置为接纳该裸片的裸片焊盘。该多个焊盘包括第一行焊盘，该第一行焊盘布置为与该裸片焊盘相邻。该多个焊盘包括布置为与该第一行焊盘相邻且平行的第二行焊盘，该第一行焊盘布置为比该第二行焊盘更靠近于该裸片焊盘。该多个焊盘包括布置为与该第二行焊盘相邻且平行的第三行焊盘，该第二行焊盘布置为比该第三行焊盘更靠近于该裸片焊盘。该延伸部分实质上在包括该多个焊盘的平面上与该端子部分远离的所有方向中扩展。
在另一实施方式中，本公开提供了一种制作电子封装组件的方法，其中该方法包括提供牺牲衬底并在该牺牲衬底上形成再分布层。该再分布层包括多个焊盘并且焊盘配置为接纳裸片。该多个焊盘的一个或者多个焊盘包括：(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧耦合至该牺牲衬底，以及在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该多个焊盘包括第一行焊盘，该第一行焊盘布置为与该裸片焊盘相邻。该多个焊盘包括布置为与该第一行焊盘相邻且平行的第二行焊盘，该第一行焊盘布置为比该第二行焊盘更靠近于该裸片焊盘。该多个焊盘包括布置为与该第二行焊盘相邻且平行的第三行焊盘，该第二行焊盘布置为比该第三行焊盘更靠近于该裸片焊盘。该延伸部分实质上在与该端子部分远离的所有方向中扩展。
在另一实施方式中，本公开提供一种包括焊接掩膜层的电子封装组件。该焊接掩膜层具有至少一个开口。该电子封装组件进一步包括耦合到该焊接掩膜层的多个焊盘。该多个焊盘中的至少一个焊盘包括(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧配置为通过该焊接掩膜层中的该至少一个开口接纳封装互连结构。该封装互连结构在裸片与该电子封装组件外部的另一电子器件之间路由电信号。在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。该电子封装组件进一步包括配置为接纳该裸片的裸片焊盘以及布置为与该裸片焊盘相邻的一个或者多个环状段结构。该一个或者多个环状段结构为该裸片提供电源连接和/或接地连接。
在另一实施方式中，本公开提供了一种制作电子封装组件的方法，其中该方法包括提供牺牲衬底并在该牺牲衬底上形成再分布层。该再分布层包括(i)多个焊盘，(ii)配置为接纳裸片的裸片焊盘，以及(iii)布置为与该裸片焊盘相邻的一个或者多个环状段结构。该一个或者多个环状段结构配置为为该裸片提供电源连接和/或接地连接。该多个焊盘的一个或者多个焊盘包括：(i)第一侧，(ii)第二侧，该第一侧布置为与该第二侧相对，(iii)端子部分以及(iv)延伸部分。在该端子部分处的该第一侧耦合至该牺牲衬底，以及在该延伸部分处的该第二侧配置为接纳来自该裸片的一个或多个电连接。
附图说明
通过结合附图的以下详细描述，将很容易理解本公开的实施方式。为方便进行这一描述，类似的参考标号表示类似的结构性元件。这里的实施方式在附图的各图中以示例的方式而不是限制的方式示出。
图1示意性地示出耦合到印刷电路板的电子封装组件的横截面视图。
图2A示意性地示出具有焊盘配置的电子封装组件的一部分的顶视图。
图2B示意性地示出图2A所绘制的电子封装组件的该一部分的横截面视图。
图3示意性地示出具有另一焊盘配置的电子封装组件的一部分的顶视图。
图4示意性地示出具有另一焊盘配置的电子封装组件的一部分的顶视图。
图5示意性地示出具有另一焊盘配置的电子封装组件的一部分的顶视图。
图6示意性地示出具有另一焊盘配置的电子封装组件的一部分的顶视图。
图7示意性地示出具有一个或多个环状段结构的电子封装组件的一部分的顶视图。
图8示意性地示出用以制作在此描述的电子封装组件的方法的工艺流程图。
具体实施方式
本公开的实施方式描述了用于电子封装组件的焊盘的技术、结构以及配置。在以下详细描述中，参考了作为其一部分的附图，其中贯穿附图，类似的参考标号表示类似的部分。在不脱离本公开范围的情况下，可以利用其他实施方式，并且可以进行结构上和逻辑上的改变。因此，以下详细描述不应理解为限制性的，并且实施方式的范围由所附权利要求书及其等同方案限定。
图1示意性地示出耦合到印刷电路板150的电子封装组件100的横截面视图。电子封装组件100包括如图所示地耦合的焊接掩膜层114和一个或多个再分布层106。
焊接掩膜层114一般地包括阻焊材料，诸如环氧树脂。在其他实施方式中，可以使用其他合适的电绝缘材料来制作焊接掩膜层114。一个或多个开口115还可以称为阻焊开口，形成在焊接掩膜层114中以提供对一个或多个再分布层106的访问。
该一个或多个再分布层106配置为路由电子封装组件100的一个或多个裸片108的电信号。例如，该一个或多个再分布层106能够提供在一个或多个裸片108与一个或多个封装互连结构116之间对输入/输出(I/O)信号和/或电源/接地信号的路由。
该一个或多个再分布层106一般地包括导电材料，诸如金属(例如，铜或铝)。在其他实施方式中，可以使用其他合适的导电材料来形成一个或多个再分布层106。
在一个实施方式中，该一个或多个再分布层106包括多个焊盘102和裸片焊盘104。在某些实施方式中，如所示出，焊盘102和裸片焊盘104是该一个或多个再分布层106的同一再分布层的部分。
焊盘102一般地具有第一侧A1和布置为与第一侧A1相对的第二侧A2。第一侧A1和第二侧A2通常指代焊盘102的相对表面，以方便描述在此描述的各种配置。
该多个焊盘102中的至少一个焊盘包括端子部分101和延伸部分103。端子部分101配置为接纳该一个或多个封装互连结构116中的至少一个封装互连结构。也就是说，端子部分101的第一侧A1用作该一个或多个封装互连结构116的接点焊盘(landing pad)，正如可以看到的那样。该一个或多个封装互连结构116可以通过形成在焊接掩膜层114中的一个或多个开口115直接键合到端子部分101的第一侧A1。
延伸部分103配置为接纳来自一个或多个裸片108的一个或多个电连接。在一个实施方式中，一根或多根键合线110耦合到延伸部分103的第二侧A2以路由该一个或多个裸片108的电信号。
一个或多个裸片108耦合到该一个或多个再分布层106。在一个实施方式中，该一个或多个裸片108附接到裸片焊盘104。裸片焊盘104包括如下表面，该一个或多个裸片108附接在该表面上。该一个或多个裸片108可以使用任何合适的技术(诸如裸片粘合技术)来耦合到裸片焊盘104。
该一个或多个裸片108一般地包括半导体材料，诸如硅。该一个或多个裸片108一般地具有有源侧和非有源侧，有源侧包括如下表面，在该表面上形成多个集成电路(IC)器件(未示出)，诸如用于逻辑和/或存储器的晶体管，并且非有源侧布置为与有源侧相对。该一个或多个裸片108的有源侧使用一根或多根键合线110电耦合到一个或多个再分布层106，正如可以看到的那样。
在某些实施方式中，裸片焊盘104用作接地焊盘以提供用于该一个或多个裸片108的电接地连接。该一个或多个裸片108可以使用一根或多根键合线110电耦合到裸片焊盘104，正如可以看到的那样。
模塑料112形成为实质上封住该一个或多个裸片108、该一根或多根键合线110以及焊盘102，正如可以看到的那样。模塑料112一般地包括电绝缘材料，诸如热固性树脂，其布置为保护该一个或多个裸片108和电子封装组件100的其他部件不受到与处理相关联的破碎、氧化或者潮湿的影响。
电子封装组件100电耦合到电子封装组件100外部的另一电子器件，诸如印刷电路板150。在某些实施方式中，印刷电路板150可以包括主板。
电子封装组件100使用该一个或多个封装互连结构116电耦合到印刷电路板150。该一个或多个封装互连结构116一般地包括诸如金属的导电材料。该一个或多个封装互连结构116可以形成为各种各样的形状(包括球面、平面或者多边形形状)，并且可以定位在各种各样的位置(包括在一行中，或者在含多行的阵列中)。在一个实施方式中，该一个或多个封装互连结构116包括焊球。
根据各种实施方式，电子封装组件100可以配置在球栅阵列、针栅阵列、接点栅格阵列、薄型四方扁平封装、双列直插式、混合型引线框架球(MLB)阵列或者其合适的组合中。在其他实施方式中，可以使用其他合适的封装配置。
电子封装组件100的焊盘102可以以各种各样的方式来排列，以提供各种各样的益处。例如，在此描述的焊盘结构和/或配置可以允许或促进减小的键合线长度、对于电子封装组件100的增加的I/O结构(例如焊盘)数量、由于用于键合的焊盘102的增加的面积或特定定位而引起的在选择键合位置方面(例如键合线角度、间隙(clearance))的增加的灵活性、键合线到同一焊盘的多重键合、和/或对单一电子封装布局的使用可用于多个不同应用，或者其组合。图2A至图7绘制了根据各种实施方式可以使用的某些示例焊盘配置。
图2A示意性地示出具有焊盘配置的电子封装组件200的一部分260的顶视图。为清楚起见，未绘制模塑料。
电子封装组件200包括一个或多个裸片108，该一个或多个裸片108包括多个键合焊盘109。该一个或多个裸片108的键合焊盘109使用一根或多根键合线110电耦合到相应的焊盘102。该一根或多根键合线110的一端可以直接耦合到键合焊盘109，该一根或多根键合线110的另一端可以直接耦合到焊盘102的端子部分101或延伸部分103，正如可以看到的那样。
焊盘102的第一行202布置为与裸片焊盘104相邻，正如可以看到的那样。焊盘102的第二行204布置为与第一行202相邻且平行，焊盘102的第三行206布置为与第二行204相邻且平行，并且焊盘102的第四行208布置为与第三行206相邻且平行，正如可以看到的那样。第一行202布置为比第二行204更靠近于裸片焊盘104，焊盘102的第二行204布置为比第三行206更靠近于裸片焊盘104，并且焊盘的第三行206布置为比第四行208更靠近于裸片焊盘104，正如可以看到的那样。在其他实施方式中，可以使用附加行的焊盘。
第一行202和第三行206中的焊盘102相对于第二行204和第四行208中的焊盘102交错，正如可以看到的那样。也就是说，在实质上垂直于行202、204、206、208的方向上，第一行202和第三行206中的焊盘102的端子部分101并未与第二行204和第四行208中的焊盘102的端子部分101对准。实质上垂直于行202、204、206、208的方向用箭头250标出。第一行202和第三行206中的焊盘102仅包括端子部分101，第二行204和第四行208中的焊盘102包括端子部分101和延伸部分103两者，正如可以看到的那样。
第二行204和第四行208中的焊盘102的延伸部分103从端子部分101分别延伸到第一行202与第三行206的焊盘102之间的位置，延伸部分103在朝向裸片焊盘104和/或该一个或多个裸片108的方向上延伸。延伸部分103可以在实质上垂直于该一个或多个裸片108的终止边缘的方向上延伸，该终止边缘与焊盘的第一行202相邻且平行，正如可以看到的那样。所绘制的端子部分101是圆形的，延伸部分103伸长且实质上为矩形。在其他实施方式中，可以针对端子部分101和延伸部分103使用其他合适的形状。
在图2A的顶视图中，形成在焊接掩膜层114中的一个或多个开口115以虚线形式绘制，以表明该一个或多个开口115位于焊盘102的端子部分101之下。尽管所绘制的电子封装组件200的该一部分260仅示出了与一个或多个裸片108的终止边缘之一相邻的焊盘102的配置，但是应当理解，可以沿着该一个或多个裸片108的其他或所有终止边缘类似地配置焊盘102和键合焊盘109。
图2B示意性地示出电子封装组件200的该一部分260沿着图2A的段XY的横截面视图。图2B的线211一般地对应于图2A的线211，其一般地表明图2A和图2B中焊盘102的共同维度。电子封装组件200包括如图所示地耦合的具有端子部分101和延伸部分的多个焊盘102、裸片焊盘104、一个或多个裸片108、一根或多根键合线110、模塑料112以及具有一个或多个开口115的焊接掩膜层114。
图3示意性地示出具有另一焊盘配置的电子封装组件300的一部分360的顶视图。电子封装组件300包括排列为第一行202、第二行204、第三行206和第四行208的多个焊盘102。行202、204、206、208对应于焊盘102的端子部分101，正如可以看到的那样。在其他实施方式中，可以使用附加行。
第一行202和第二行204相对于彼此交错，并且第一行202和第二行204中的焊盘102的延伸部分103延伸为使得每个延伸部分103的终止端对准以形成实质上平行于第一行202和第二行204的一行终止端302。第三行206和第四行208相对于彼此交错，并且第三行206和第四行208中的焊盘102的延伸部分103延伸为使得每个延伸部分103的终止端(例如接点区域305)对准以形成实质上平行于第三行206和第四行208的另一行终止端304。行302和304实质上彼此平行。尽管所绘制的延伸部分103实质上是线性的，但在其他实施方式中，可以针对延伸部分103使用其他非线性形状。
正如可以看到的那样，延伸部分103包括：接点区域305，以促进将一根或多根键合线110连接到延伸部分103；走线区307，以促进焊盘102之间的路由，接点区域305比走线区307更宽。例如，该更宽接点区域305可以配置为接纳该一根或多根键合线110，正如可以看到的那样。尽管该更宽接点区域305绘制为圆形，但在其他实施方式中，可以针对该更宽接点区域305使用其他形状。延伸部分103可以促进缩短一根或多根键合线110的导线长度，或者允许将焊盘102放置在键合线够不到的位置上(例如超出导线长度制造能力)。
图4示意性地示出具有另一焊盘配置的电子封装组件400的一部分460的顶视图。电子封装组件400包括排列为第一行202和第二行204的多个焊盘102。在其他实施方式中，可以使用附加行。
焊盘102包括端子部分101和延伸部分103，延伸部分103在远离端子部分101的相反方向上延伸，正如可以看到的那样。延伸部分103可以在远离端子部分101的单一方向上延伸，而不是在远离端子部分101的两个方向上延伸。在某些实施方式中，延伸部分103在实质上平行于一个或多个裸片108的终止边缘的方向上延伸，该终止边缘与焊盘102的第一行202相邻且平行。在其他实施方式中，延伸部分103在与一个或多个裸片108的相邻终止边缘既不平行又不垂直的方向上延伸。第一行202和第二行204中的焊盘并不相对于彼此交错。
延伸部分103可以配置为在不垂直于一个或多个裸片108的相邻终止边缘的方向上延伸以增加选择键合位置方面的灵活性(例如键合线角度、间隙)。在一个实施方式中，延伸部分103在不垂直于第一行202和/或第二行204的方向上延伸，正如可以看到的那样，以提供所希望的键合线角度或间隙。一根或多根键合线110可以耦合到焊盘102的端子部分101和/或延伸部分103。
图5示意性地示出具有另一焊盘配置的电子封装组件500的一部分560的顶视图。电子封装组件500包括排列为第一行202、第二行204和第三行206的多个焊盘102。在其他实施方式中，可以使用附加行。
行202、204、206并不相对于彼此交错。也就是说，行202、204、206中的焊盘102的端子部分101在实质上垂直于行202、204、206的方向上对准。实质上垂直于行202、204、206的方向由箭头250标出。在此情况下，焊盘102的延伸部分103可以以非线性方式在更靠近于裸片焊盘104或该一个或多个裸片108的行的焊盘102之间延伸。例如，在所绘制的实施方式中，第三行206的焊盘102的延伸部分103以非线性方式在第二行204的焊盘102之间延伸，从而使得延伸部分103的终止端(例如接点区域305)布置在布置于第一行202与第二行204中的焊盘102的端子部分101之间。在某些实施方式中，焊盘102的每个延伸部分103延伸为使得每个延伸部分103的终止端(例如接点区域305)对准，以形成实质上平行于第一行焊盘202和第二行焊盘204的一行终止端502。
正如可以看到的那样，延伸部分103包括：接点区域305，以促进将一根或多根键合线110连接到延伸部分103；走线区307，以促进在焊盘102之间进行路由，接点区域305比走线区307更宽。例如，该更宽接点区域305可以配置为接纳该一根或多根键合线110，正如可以看到的那样。尽管该更宽接点区域305绘制为矩形，但在其他实施方式中，可以针对该更宽接点区域305使用其他形状。电子封装组件500的焊盘102的配置允许利用焊盘102之间的区域来进行多重键合或者允许在选择用于一根或多根键合线的键合位置方面的增加的灵活性。
图6示意性地示出具有另一焊盘配置的电子封装组件600的一部分660的顶视图。电子封装组件600包括排列为第一行202、第二行204、第三行206、第四行208和第五行210的多个焊盘102。行202、204、206、208、210相对于彼此交错，正如可以看到的那样。在其他实施方式中，可以使用附加行。
第一行202、第二行204和第三行206中的焊盘102包括延伸部分103，延伸部分103在包括焊盘102的平面上在实质上远离端子部分101的所有方向上延伸。该平面例如可以与焊盘102形成于其上的表面(例如联系图8的方法800而描述的牺牲层)或者焊盘102所耦合到的表面(例如焊接掩膜层114)共面。
正如所绘制的那样，延伸部分103从端子部分101延伸，从而使得常量的最小间隔S或距离将相应焊盘102的每个部分(例如延伸部分103)彼此隔开。该最小间隔S例如可以是包括焊盘102的再分布层(例如图1的一个或多个再分布层106)的导电特征(例如金属特征)之间的最小设计距离。例如，由于技术约束或可靠性问题(诸如焊盘之间的电短路)，从制造角度而言，将诸如焊盘102之类的导电特征定位在小于最小间隔S的距离处甚至是不可行的。在所绘制的实施方式中，延伸部分103进一步在平行于行(例如第一行202、第二行204等)的方向上、而不是在垂直于行的方向上延伸。垂直于行的方向用箭头250标出。一个或多个开口115以虚线形式绘制，以表明该一个或多个开口115位于焊盘102的端子部分101之下。
在单一电子封装组件200中可以使用多种不同结构的焊盘102。第四行208包括仅具有端子部分101的焊盘102。第五行210包括如下焊盘102，该焊盘102包括端子部分101和延伸部分103，延伸部分103朝向裸片焊盘104或一个或多个裸片108延伸。在其他实施方式中，可以使用采用多种不同结构的焊盘102的其他配置。例如，在某些实施方式中，联系图1-图7而描述的针对焊盘102的结构和配置的实施方式可以适当地组合在单一的电子封装组件中。
图7示意性地示出具有一个或多个环状段结构720的电子封装组件700的一部分760的顶视图。电子封装组件700包括适合于在此描述的用于任何焊盘102的实施方式的多个焊盘102。焊盘102排列在第一行202和第二行204中。在其他实施方式中，可以使用附加行。
该一个或多个环状段结构720配置为为该一个或多个裸片108提供电源连接和/或接地连接。根据各种实施方式，该一个或多个环状段结构720布置在第一行202与该一个或多个裸片108之间，正如可以看到的那样。
使用一根或多根键合线110来将该一个或多个裸片108的键合焊盘109电耦合到该一个或多个环状段结构720和焊盘102，正如可以看到的那样。该一根或多根键合线110可以进一步用于将该一个或多个环状段结构720中的分离环状段结构电耦合在一起。
正如可以看到的那样，该一个或多个环状段结构720一般地在实质上平行于相邻行(例如第一行202)或该一个或多个裸片108的终止边缘的方向上伸长，该终止边缘与该一个或多个环状段结构720相邻。该一个或多个环状段结构720可以沿着该一个或多个裸片108的一个或多个(例如所有)终止边缘而布置，以实质上围绕该一个或多个裸片108，正如可以看到的那样。在一个实施方式中，该一个或多个环状段结构720是用于形成焊盘102和/或裸片焊盘(例如图6的裸片焊盘104)的同一金属层(例如图1的再分布层106)的部分。
该一个或多个环状段结构720提供将同一设计用于多种或各种类型的器件(例如一个或多个裸片108)的灵活性。也就是说，使用该一个或多个环状段结构720允许用于电子封装组件的单一布局可用于多个不同的应用。
尽管相应的电子封装组件200、300、400、500、600、700的所绘制的部分260、360、460、560、660、760仅示出了与一个或多个裸片108的终止边缘之一相邻的焊盘102的配置，但应当清楚，可以沿着该一个或多个裸片108的其他或所有终止边缘类似地配置焊盘102和键合焊盘109。应当理解，在此描述的各种焊盘配置可以用于四方扁平无引脚(QFN)封装或其他类型的封装。
图8示意性地示出用以制作在此描述的电子封装组件(例如电子封装组件100)的方法800的工艺流程图。在802处，方法800包括提供衬底。该衬底包括如下表面，在该表面上形成一个或多个再分布层(例如图1的一个或多个再分布层106)。该衬底是在最终电子封装组件中被去除的牺牲衬底。最终电子封装组件是准备好运输或由客户使用的组件。该衬底可以包括各种各样的合适的材料。在一个实施方式中，该衬底包括诸如铜的金属。
在804处，方法800进一步包括在衬底上形成再分布层(例如图1的一个或多个再分布层106)，该再分布层包括多个焊盘(例如图1的焊盘102)。再分布层可以进一步包括裸片焊盘(例如图1的裸片焊盘104)。再分布层可以通过任何合适的技术来形成，这些技术包括例如电镀、沉积、附接、对衬底进行图案化(如刻蚀)或者其他合适的工艺来形成，以提供在此描述的焊盘的结构或配置。
在806处，方法800进一步包括将裸片(例如图1的一个或多个裸片108)耦合到再分布层。在一个实施方式中，裸片的非有源表面使用裸片粘合剂耦合到裸片焊盘，裸片的有源表面使用一根或多根键合线(例如图1的一根或多根键合线110)电耦合到形成在衬底上的多个焊盘。在其他实施方式中，可以使用其他合适的技术来将裸片耦合到再分布层。
在808处，方法800进一步包括形成模塑料(例如图1的模塑料112)。该模塑料一般地形成为封住裸片、该一根或多根键合线以及再分布层。根据各种实施方式，模塑料通过将固态形式(例如，粉末)的树脂(例如，热固性树脂)沉积到模具中并施加热量和/或压力以熔化该树脂而形成。在其他实施方式中，可以使用其他公知的用于形成模塑料的技术。
在810处，方法800进一步包括去除衬底以暴露再分布层。衬底可以例如通过使用诸如刻蚀工艺之类的工艺选择性地去除衬底材料来去除。模塑料可以用作在去除衬底的刻蚀工艺期间的机械载体。
在812处，方法800进一步包括在暴露的再分布层上形成焊接掩膜层(例如图1的焊接掩膜层114)。焊接掩膜层可以通过任何公知的工艺来沉积。例如可以使用任何公知的图案化或曝光/显影工艺在焊接掩膜层形成一个或多个开口(例如图1的一个或多个开口115)。
在814处，方法800进一步包括通过焊接掩膜层将一个或多个封装互连结构(例如图1的一个或多个封装互连结构116)耦合到多个焊盘中的相应焊盘。该一个或多个封装互连结构(例如焊球)可以使用任何合适的沉积技术来形成或放置。在一个实施方式中，该一个或多个封装互连结构通过形成在焊接掩膜层中的一个或多个开口附接到焊盘的端子部分(例如图1的端子部分101)。
在耦合该一个或多个封装互连结构之后，电子封装组件(例如图1的电子封装组件100)可以通过例如切割来进行单片化，并且封装用于运输给客户使用。在封装中，电子封装组件可以使用一个或多个封装互连结构来安装在印刷电路板(例如图1的印刷电路板150)上，以将一个或多个裸片的电信号路由到印刷电路板。
各种操作以最有助于理解所要求保护的主题的方式被描述为按次序的多个离散操作。然而，描述的顺序不应当理解为暗示这些操作必然是依赖于顺序的。特别地，这些操作可以不以所呈现的顺序执行。所描述的操作可以以与所描述的实施方式不同的顺序来执行。可以执行各种附加的操作和/或所描述的操作在附加实施方式中可以省略。
本描述可以使用基于透视的描述，诸如向上/向下、之上/之下，和/或顶部/底部。这种描述仅用于方便讨论，而并非旨在将在此描述的实施方式的应用限制为任何特定方向。
出于本公开的目的，短语“A/B”意思是A或B。出于本公开的目的，短语“A和/或B”意思是“(A)、(B)或者(A和B)”。出于本公开的目的，短语“A、B和C中的至少一个”意思是“(A)、(B)、(C)、(A和B)、(A和C)、(B和C)、或者(A、B和C)”。出于本公开的目的，短语“(A)B”意思是“(B)或(AB)”，也就是说，A是可选元素。
本描述使用短语“在一个实施方式中”、“在实施方式中”或者类似的语言，其均可以指代一个或多个相同或不同的实施方式。另外，针对本公开的实施方式而使用的术语“包括”、“包含”、“具有”等是同义的。
尽管已经在此示出和描述了特定实施方式，但在不脱离本公开范围的情况下，用于实现相同目的的广泛的各种各样的变更和/或等同的实施方式或实现可以代替所示出和描述的实施方式。本公开旨在覆盖在此讨论的实施方式的任何调整或变化。因此，在此描述的实施方式显然旨在仅由权利要求书及其等同方案限定。

Claims (16)

1.一种电子封装组件，包括：
焊接掩膜层，所述焊接掩膜层具有至少一个开口；以及
耦合到所述焊接掩膜层的多个焊盘，其中所述多个焊盘中的至少一个焊盘包括(i)第一侧，(ii)第二侧，所述第一侧布置为与所述第二侧相对，(iii)端子部分以及(iv)延伸部分，
其中所述延伸部分在所述第一侧布置于所述焊接掩膜层上，以将所述至少一个焊盘耦合到所述焊接掩膜层，
其中所述端子部分在所述第一侧布置于所述焊接掩膜层中的所述至少一个开口之上，
其中所述端子部分经由所述焊接掩膜层中的所述至少一个开口耦合到封装互连结构，其中所述封装互连结构配置为在所述电子封装组件的裸片与所述电子封装组件外部的电子器件之间路由电信号，并且
其中所述延伸部分配置为在所述第二侧耦合到所述裸片。
2.根据权利要求1所述的电子封装组件，进一步包括配置为接纳所述裸片的裸片焊盘，其中所述多个焊盘包括：
布置为与所述裸片焊盘相邻的第一行焊盘；以及
布置为与所述裸片焊盘相邻并且与所述第一行焊盘平行的第二行焊盘，
其中所述第一行焊盘位于比所述第二行焊盘更靠近于所述裸片焊盘。
3.根据权利要求2所述的电子封装组件，其中所述多个焊盘中的所述至少一个焊盘位于所述第二行焊盘中。
4.根据权利要求2所述的电子封装组件，其中所述第一行焊盘和所述第二行焊盘相对于彼此交错。
5.根据权利要求2所述的电子封装组件，其中所述多个焊盘还包括：
布置为与所述裸片焊盘相邻并且与所述第二行焊盘平行的第三行焊盘，其中所述第二行焊盘位于比所述第三行焊盘更靠近于所述裸片焊盘；以及
布置为与所述裸片焊盘相邻并且与所述第三行焊盘平行的第四行焊盘，其中所述第三行焊盘位于比所述第四行焊盘更靠近于所述裸片焊盘，
其中所述多个焊盘中的所述至少一个焊盘位于所述第三行焊盘或所述第四行焊盘中。
6.根据权利要求5所述的电子封装组件，其中所述第三行焊盘和所述第四行焊盘相对于彼此交错。
7.根据权利要求5所述的电子封装组件，其中所述至少一个焊盘的所述延伸部分在所述第二行焊盘的多个焊盘之间延伸或者在所述第三行焊盘的多个焊盘之间延伸。
8.根据权利要求1所述的电子封装组件，其中所述至少一个焊盘的所述延伸部分在多个不同方向上远离所述端子部分延伸。
9.根据权利要求1所述的电子封装组件，其中所述至少一个焊盘的所述延伸部分实质上是非线性的。
10.根据权利要求1所述的电子封装组件，其中所述电子封装组件的所述裸片包括至少一个键合焊盘，所述键合焊盘经由键合线导电地耦合到所述至少一个焊盘的所述延伸部分。
11.根据权利要求10所述的电子封装组件，其中所述键合线附接到(i)所述裸片的所述至少一个键合焊盘，以及(ii)所述至少一个焊盘的在所述第二侧的所述延伸部分。
12.根据权利要求2所述的电子封装组件，其中：
所述裸片焊盘是接地焊盘，所述接地焊盘配置为提供用于所述裸片的接地连接；以及
所述裸片经由键合线被导电地耦合到所述接地焊盘。
13.根据权利要求2所述的电子封装组件，其中所述至少一个焊盘的所述延伸部分在垂直于所述裸片的外围边缘的方向上延伸，所述裸片的所述外围边缘与所述第一行焊盘相邻且平行。
14.根据权利要求10所述的电子封装组件，进一步包括模塑料，配置为实质上封住所述裸片和所述键合线，其中所述模塑料在所述第二侧布置在所述至少一个焊盘上，并且
其中所述封装互连结构在所述第一侧耦合到所述至少一个焊盘的所述端子部分。
15.根据权利要求2所述的电子封装组件，进一步包括：布置在(i)所述第一行焊盘与(ii)所述裸片之间的一个或多个环状段结构，其中所述一个或多个环状段结构在实质上平行于与所述一个或多个环状段结构相邻的所述裸片的外围边缘的方向上伸长，并且其中：
所述裸片的键合焊盘经由至少一个键合线导电地耦合到所述一个或多个环状段结构；
所述一个或多个环状段结构经由键合线导电地耦合到所述至少一个焊盘；以及
所述一个或多个环状段结构配置为向所述裸片提供电源或接地连接。
16.根据权利要求2所述的电子封装组件，其中所述裸片焊盘和所述多个焊盘是同一金属层的部分。
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