JP2005347299A - チップ内蔵基板の製造方法 - Google Patents
チップ内蔵基板の製造方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 53
- 238000007747 plating Methods 0.000 claims description 15
- 238000000059 patterning Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 57
- 239000000463 material Substances 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000011241 protective layer Substances 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 4
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- 230000000694 effects Effects 0.000 description 3
- 238000004380 ashing Methods 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
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Abstract
【解決手段】 基板上に半導体チップを設置する第1の工程と、前記基板上に設置された前記半導体チップに電気的に接続される、チップ接続配線を形成する第2の工程と、を有する、半導体チップを内蔵するチップ内蔵基板の製造方法であって、前記第1の工程の前に、前記基板上に、前記チップ接続配線のパターニングに用いるアライメントポストを形成する工程を有するようにした。当該アライメントポストを形成したため、前記チップ接続配線を形成する場合の位置決め精度が良好となる。
【選択図】 図3
Description
12,112 下地層
13,113 アライメントポスト
14,114 半導体チップ
15,115 配線ポスト
16,17,116,117 絶縁層
18 シード層
19 レジスト層
20 開口部
21,121 チップ接続配線
22,122 ソルダーレジスト層
23,123 Ni/Auメッキ層
24,124 ソルダーボール
131 密着層
132 電極パッド
133 保護層
134 外部保護層
135,136 配線
137 ライン
Claims (5)
- 基板上に半導体チップを設置する第1の工程と、
前記基板上に設置された前記半導体チップに電気的に接続される、チップ接続配線を形成する第2の工程と、を有する、半導体チップを内蔵するチップ内蔵基板の製造方法であって、
前記第1の工程の前に、前記基板上に、前記チップ接続配線の位置決めに用いるアライメントポストを形成する工程を有することを特徴とするチップ内蔵基板の製造方法。 - 前記アライメントポストは、前記チップ接続配線のパターニングを形成するレジストの、ステッパー露光の位置決めに用いることを特徴とする請求項1記載のチップ内蔵基板の製造方法。
- 前記チップ接続配線は、前記半導体チップ上に形成された絶縁層上に形成されることを特徴とする請求項1または2記載のチップ内蔵基板の製造方法。
- 前記アライメントポストは、前記半導体チップを前記基板上に設置する場合の位置決めに用いることを特徴とする請求項1乃至3のうち、いずれか1項記載のチップ内蔵基板の製造方法。
- 前記アライメントポストは、Cuメッキによって形成されることを特徴とする請求項1乃至4のうち、いずれか1項記載のチップ内蔵基板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004161505A JP2005347299A (ja) | 2004-05-31 | 2004-05-31 | チップ内蔵基板の製造方法 |
CNB2005100742271A CN100435302C (zh) | 2004-05-31 | 2005-05-31 | 芯片内置基板的制造方法 |
KR1020050046002A KR20060046308A (ko) | 2004-05-31 | 2005-05-31 | 칩 내장 기판의 제조 방법 |
US11/141,421 US7250329B2 (en) | 2004-05-31 | 2005-05-31 | Method of fabricating a built-in chip type substrate |
TW094117804A TW200603706A (en) | 2004-05-31 | 2005-05-31 | A method of fabricating a built-in chip type substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004161505A JP2005347299A (ja) | 2004-05-31 | 2004-05-31 | チップ内蔵基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
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JP2005347299A true JP2005347299A (ja) | 2005-12-15 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004161505A Pending JP2005347299A (ja) | 2004-05-31 | 2004-05-31 | チップ内蔵基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7250329B2 (ja) |
JP (1) | JP2005347299A (ja) |
KR (1) | KR20060046308A (ja) |
CN (1) | CN100435302C (ja) |
TW (1) | TW200603706A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8253229B2 (en) | 2006-10-27 | 2012-08-28 | Shinko Electric Industries Co., Ltd. | Semiconductor package and stacked layer type semiconductor package |
WO2021054100A1 (ja) * | 2019-09-18 | 2021-03-25 | オムロン株式会社 | 回路構造体の製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101015704B1 (ko) | 2008-12-01 | 2011-02-22 | 삼성전기주식회사 | 칩 내장 인쇄회로기판 및 그 제조방법 |
KR20120026855A (ko) | 2010-09-10 | 2012-03-20 | 삼성전기주식회사 | 임베디드 볼 그리드 어레이 기판 및 그 제조 방법 |
CN103594458B (zh) * | 2013-11-04 | 2016-07-06 | 株洲南车时代电气股份有限公司 | 一种衬板结构 |
TWI549235B (zh) * | 2014-07-03 | 2016-09-11 | 矽品精密工業股份有限公司 | 封裝結構及其製法與定位構形 |
CN104134614B (zh) * | 2014-07-04 | 2017-10-03 | 株洲南车时代电气股份有限公司 | 一种芯片焊接方法 |
CN105203221B (zh) * | 2015-11-04 | 2017-08-29 | 山东钢铁股份有限公司 | 一种空分塔表面温度测量装置 |
US11676916B2 (en) * | 2021-08-30 | 2023-06-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and formation method of package with warpage-control element |
Family Cites Families (13)
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JPH01112743A (ja) | 1987-10-27 | 1989-05-01 | Matsushita Electric Works Ltd | Ic実装用回路基板 |
DE3817600C2 (de) * | 1987-05-26 | 1994-06-23 | Matsushita Electric Works Ltd | Verfahren zur Herstellung einer Halbleitervorrichtung mit einem keramischen Substrat und einem integrierten Schaltungskreis |
US5148265A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US5903059A (en) * | 1995-11-21 | 1999-05-11 | International Business Machines Corporation | Microconnectors |
AU748621B2 (en) * | 1998-08-13 | 2002-06-06 | Merck & Co., Inc. | Integrin receptor antagonists |
KR100282526B1 (ko) * | 1999-01-20 | 2001-02-15 | 김영환 | 적층 반도체 패키지 및 그 제조방법, 그리고 그 적층 반도체 패키지를 제조하기 위한 패키지 얼라인용 치구 |
JP3207174B2 (ja) * | 1999-02-01 | 2001-09-10 | 京セラ株式会社 | 電気素子搭載配線基板およびその製造方法 |
US6348728B1 (en) | 2000-01-28 | 2002-02-19 | Fujitsu Limited | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer |
JP4441974B2 (ja) * | 2000-03-24 | 2010-03-31 | ソニー株式会社 | 半導体装置の製造方法 |
JP4041675B2 (ja) * | 2000-04-20 | 2008-01-30 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
JP4123693B2 (ja) * | 2000-07-12 | 2008-07-23 | 株式会社デンソー | 積層回路モジュールの製造方法 |
JP3609737B2 (ja) * | 2001-03-22 | 2005-01-12 | 三洋電機株式会社 | 回路装置の製造方法 |
JP4095827B2 (ja) * | 2002-05-10 | 2008-06-04 | 株式会社ルネサステクノロジ | 半導体装置 |
-
2004
- 2004-05-31 JP JP2004161505A patent/JP2005347299A/ja active Pending
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2005
- 2005-05-31 US US11/141,421 patent/US7250329B2/en not_active Expired - Fee Related
- 2005-05-31 KR KR1020050046002A patent/KR20060046308A/ko not_active Application Discontinuation
- 2005-05-31 TW TW094117804A patent/TW200603706A/zh unknown
- 2005-05-31 CN CNB2005100742271A patent/CN100435302C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8253229B2 (en) | 2006-10-27 | 2012-08-28 | Shinko Electric Industries Co., Ltd. | Semiconductor package and stacked layer type semiconductor package |
WO2021054100A1 (ja) * | 2019-09-18 | 2021-03-25 | オムロン株式会社 | 回路構造体の製造方法 |
Also Published As
Publication number | Publication date |
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CN1705092A (zh) | 2005-12-07 |
US7250329B2 (en) | 2007-07-31 |
KR20060046308A (ko) | 2006-05-17 |
US20050266609A1 (en) | 2005-12-01 |
TW200603706A (en) | 2006-01-16 |
CN100435302C (zh) | 2008-11-19 |
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