CN103594458B - 一种衬板结构 - Google Patents
一种衬板结构 Download PDFInfo
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- CN103594458B CN103594458B CN201310536791.5A CN201310536791A CN103594458B CN 103594458 B CN103594458 B CN 103594458B CN 201310536791 A CN201310536791 A CN 201310536791A CN 103594458 B CN103594458 B CN 103594458B
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CN201310536791.5A CN103594458B (zh) | 2013-11-04 | 2013-11-04 | 一种衬板结构 |
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CN103594458A CN103594458A (zh) | 2014-02-19 |
CN103594458B true CN103594458B (zh) | 2016-07-06 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103985686B (zh) * | 2014-06-09 | 2016-10-12 | 株洲南车时代电气股份有限公司 | 一种igbt模块封装焊接结构 |
CN104134614B (zh) * | 2014-07-04 | 2017-10-03 | 株洲南车时代电气股份有限公司 | 一种芯片焊接方法 |
CN114571021A (zh) * | 2021-10-12 | 2022-06-03 | 祥博传热科技股份有限公司 | 一种高导热覆铜陶瓷基板制作方法 |
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JP2006263774A (ja) * | 2005-03-24 | 2006-10-05 | Toshiba Corp | はんだ材とそれを用いた半導体装置 |
JP2009071102A (ja) * | 2007-09-14 | 2009-04-02 | Omron Corp | パワーモジュール構造 |
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JP2005347299A (ja) * | 2004-05-31 | 2005-12-15 | Shinko Electric Ind Co Ltd | チップ内蔵基板の製造方法 |
JP5113815B2 (ja) * | 2009-09-18 | 2013-01-09 | 株式会社東芝 | パワーモジュール |
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JP2006263774A (ja) * | 2005-03-24 | 2006-10-05 | Toshiba Corp | はんだ材とそれを用いた半導体装置 |
JP2009071102A (ja) * | 2007-09-14 | 2009-04-02 | Omron Corp | パワーモジュール構造 |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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Effective date of registration: 20201022 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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