WO2011002049A1 - アンテナおよびアンテナモジュール - Google Patents
アンテナおよびアンテナモジュール Download PDFInfo
- Publication number
- WO2011002049A1 WO2011002049A1 PCT/JP2010/061230 JP2010061230W WO2011002049A1 WO 2011002049 A1 WO2011002049 A1 WO 2011002049A1 JP 2010061230 W JP2010061230 W JP 2010061230W WO 2011002049 A1 WO2011002049 A1 WO 2011002049A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- coil
- antenna
- connection
- coil electrode
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0025—Modular arrays
Definitions
- the present invention relates to an antenna and an antenna module used for communication using electromagnetic field coupling such as RFID communication.
- a non-contact IC card including a wireless communication IC and a card reader are configured, and communication is performed by bringing the non-contact IC card and the card reader within a predetermined distance.
- An antenna is required to perform communication, and the resonance frequency of this antenna is set based on the frequency of the communication signal.
- Such an antenna is described in Patent Document 1, Patent Document 2, and the like, and basically has a coil electrode wound in a plane and a capacitance for setting a resonance frequency together with the inductance of the coil electrode. Generating structure.
- Patent Document 1 a coil electrode wound around each of the front and back sides of the insulating sheet is provided. A desired capacitance is generated by arranging these coil electrodes so as to face each other. At this time, a large capacitance is obtained by widening the coil electrode.
- Patent Document 1 a structure is described in which one counter electrode of the coil electrode and the capacitor is formed on the front surface side of the insulating sheet, and the other counter electrode of the capacitor is formed on the back surface side.
- a conductive through hole is mechanically formed in the insulating sheet.
- a coil electrode is formed on the front surface side of the insulating sheet, and a capacitance adjustment pattern for generating a coil electrode and capacitance is formed on the back surface side. Then, the capacitance is adjusted by adjusting the shape (line length) of the capacitance adjustment pattern.
- JP 2001-84463 A Japanese Patent Laid-Open No. 10-334203
- the capacitance adjustment pattern on the back surface side is formed in the same winding direction as the coil electrode on the front surface side when viewed in plan view, that is, along the direction of the magnetic field on the antenna surface. ing. Therefore, the capacitance adjustment pattern on the back side does not contribute to the inductance of the antenna, and the inductance depends only on the pattern of the coil electrode on the front side. For this reason, in order to increase the inductance in order to increase the radiant magnetic field, the structure must be increased in size, such as increasing the number of turns of the coil electrode on the surface side.
- the characteristics of the antenna are determined by the inductance and capacitance determined by the formation pattern of the coil electrode.
- an object of the present invention is to realize a simple and small antenna which can obtain a predetermined magnetic field strength and whose characteristics can be easily designed. Another object is to realize an antenna module having excellent communication characteristics using the antenna.
- the present invention relates to an antenna including a first coil electrode and a second coil electrode that are arranged to face each other at a predetermined interval.
- the first coil electrode is formed in a planar shape and a winding shape, and has a first end and a second end.
- the second coil electrode is spaced apart from the first coil electrode by a predetermined distance, is formed in a planar shape and a winding shape, and has a third end portion and a fourth end portion.
- the antenna also includes a first connection electrode and a second connection electrode for connecting the second end of the first coil electrode and the fourth end of the second coil electrode to an external element.
- the antenna includes an intermediate electrode disposed between the fourth end and the second connection electrode.
- the first end and the third end are capacitively coupled, the second end and the first connection electrode are capacitively coupled, and the fourth end and the intermediate electrode are capacitively coupled.
- the first coil electrode, the second coil electrode, the first connection electrode, the second connection electrode, and the intermediate electrode are formed in a predetermined shape so that the intermediate electrode and the second connection electrode are capacitively coupled.
- the coupling capacitance between the first end and the third end is larger than the coupling capacitance between the second end and the first connection electrode.
- the coupling capacitance between the fourth end and the intermediate electrode is larger than the coupling capacitance between the intermediate electrode and the second connection electrode.
- the capacitance of the antenna is greater than the coupling capacitance between the first end and the third end and the coupling capacitance between the fourth end and the intermediate electrode. It is influenced by the coupling capacitance and the coupling capacitance between the intermediate electrode and the second connection electrode. Therefore, if the capacitive coupling portion between the first connection electrode and the second end and the capacitive coupling portion between the second connection electrode and the intermediate electrode, which are structures for connecting to external elements, are formed with high accuracy. It becomes possible to give a degree of freedom to the structure of the other part of the antenna. Thereby, an antenna having a stable characteristic can be formed with an easy design.
- the first coil electrode and the second coil electrode are formed such that the electrodes formed in a wound shape excluding the end portions do not substantially overlap along a direction orthogonal to the plane. May be.
- the first coil electrode and the second coil electrode can be capacitively coupled mainly at their end portions.
- the first coil electrode can be formed on the first main surface of the insulating substrate having a predetermined thickness.
- the second coil electrode can be formed on the second main surface facing the first main surface of the insulating substrate.
- This configuration shows a specific structure of the first coil electrode and the second coil electrode.
- the above-mentioned structure is easily realizable by forming the 1st coil electrode and the 2nd coil electrode facing both main surfaces of an insulating substrate.
- the intermediate electrode can be formed on the first main surface.
- This configuration shows the specific structure of the intermediate electrode.
- the intermediate electrode is formed on the same first main surface as the first coil electrode, the structure is simplified and the first coil electrode, the second coil electrode, the first connection electrode, and the second connection electrode are simplified. It becomes easy to set the coupling capacity.
- the first connection electrode and the second connection electrode, and the second end portion and the intermediate electrode are disposed so as to face each other with an insulating external element mounting substrate interposed therebetween. May be.
- This configuration shows a specific structure that gives a positional relationship between the first connection electrode and the second connection electrode and the second end portion and the intermediate electrode.
- the first connection electrode, the coupling electrode facing the second end, the second connection electrode, and the second electrode and the intermediate electrode side surface of the external element mounting substrate At least one of the coupling electrodes facing the intermediate electrode may be formed.
- the first connection electrode and the second connection electrode may be formed on the same plane as the first coil electrode.
- the first connection electrode and the second end may be arranged at a predetermined interval so as to have a predetermined coupling capacity by electromagnetic field coupling in the same plane.
- the second connection electrode and the intermediate electrode may be arranged at a predetermined interval so as to have a predetermined coupling capacity by electromagnetic field coupling in the same plane.
- This configuration shows a case where the first connection electrode and the second connection electrode are formed on the same plane as the first coil electrode. Even in this configuration, the same effect as that obtained when the above-described external element mounting substrate is used can be obtained. Furthermore, with this configuration, it is not necessary to use an external element mounting substrate, and a simpler configuration can be realized.
- the shape satisfying at least one of the first connection electrode having a smaller area than the second end and the second connection electrode having a smaller area than the intermediate electrode may be formed.
- This structure shows a structure for more specifically realizing the above-described coupling capacitance relationship. As described above, by reducing the areas of the first connection electrode and the second connection electrode, the coupling capacitance including the first connection electrode and the second connection electrode as constituent elements can be easily reduced.
- the present invention also relates to an antenna module including a wireless communication IC element.
- the antenna module includes a first coil electrode and a second coil electrode.
- the first coil electrode is formed in a planar shape and a winding shape, and has a first end and a second end.
- the second coil electrode is spaced apart from the first coil electrode by a predetermined distance, is formed in a planar shape and a winding shape, and has a third end portion and a fourth end portion.
- the antenna module also includes a first connection electrode and a second connection electrode for connecting the second end of the first coil electrode and the fourth end of the second coil electrode to the wireless communication IC element.
- the antenna module includes an intermediate electrode disposed between the fourth end and the second connection electrode.
- the first end and the third end are capacitively coupled, the second end and the first connection electrode are capacitively coupled, and the fourth end and the intermediate electrode are capacitively coupled.
- the first coil electrode, the second coil electrode, the first connection electrode, the second connection electrode, and the intermediate electrode are formed in a predetermined shape so that the intermediate electrode and the second connection electrode are capacitively coupled.
- the coupling capacitance between the first end and the third end is larger than the coupling capacitance between the second end and the first connection electrode.
- the coupling capacitance between the fourth end and the intermediate electrode is larger than the coupling capacitance between the intermediate electrode and the second connection electrode.
- This configuration shows an antenna module having the above-described antenna structure and mounted with a wireless communication IC.
- the present invention also relates to an antenna module including a wireless communication IC element.
- the wireless communication IC element includes a first mounting land electrode and a second mounting land electrode.
- the antenna module includes a first coil electrode and a second coil electrode.
- the first coil electrode is formed in a planar shape and a winding shape, and has a first end and a second end.
- the second coil electrode is spaced apart from the first coil electrode by a predetermined distance, is formed in a planar shape and a winding shape, and has a third end portion and a fourth end portion.
- the antenna module includes an intermediate electrode disposed between the fourth end portion and the second mounting land electrode.
- the first end and the third end are capacitively coupled, the second end and the first mounting land electrode are capacitively coupled, and the fourth end and the intermediate electrode are capacitively coupled.
- the first coil electrode, the second coil electrode, and the intermediate electrode are formed in a predetermined shape so that the intermediate electrode and the second mounting land electrode are capacitively coupled, and the wireless communication IC element is the first coil.
- the electrode and the second coil electrode are disposed.
- the coupling capacitance between the first end and the third end is larger than the coupling capacitance between the second end and the first mounting land electrode.
- the coupling capacitance between the fourth end and the intermediate electrode is larger than the coupling capacitance between the intermediate electrode and the second mounting land electrode.
- the first connection electrode and the second connection electrode are not used, and instead of the first connection electrode and the second connection electrode, the first mounting land electrode and the second connection electrode of the wireless communication IC are used.
- 2 shows a configuration in which a land electrode for mounting is used. Even with such a configuration, an antenna module having stable characteristics can be realized.
- the present invention it is possible to realize a simple and small-sized antenna that can generate a stronger magnetic field than the conventional one and whose characteristics can be easily designed. Furthermore, an antenna module having excellent communication characteristics can be realized using the antenna.
- FIG. 1 is the top view and side view of 100 C of antenna modules which concern on 4th Embodiment. It is a disassembled perspective view which shows the structure of antenna module 100D which concerns on 5th Embodiment. It is a side view of antenna module 100D concerning an 11th embodiment. It is a top view which shows the other example of formation of a 1st coil electrode and a 2nd coil electrode. 2 is a diagram illustrating a configuration of an electromagnetic coupling module 90.
- FIG. 1 ist coil electrode and a 2nd coil electrode.
- FIG. 1 is an exploded perspective view showing the configuration of the antenna module 100 of the present embodiment.
- 2A is a plan view of the antenna module 100 viewed from the first main surface 12 side, and
- FIG. 2B is a side view thereof.
- the antenna module 100 includes an antenna 1 and a wireless communication IC 80.
- the antenna 1 includes a flat and thin flexible sheet 10 made of an insulating material such as a resin, and a mounting substrate 15 for a wireless communication IC 80.
- the first coil electrode 21 is formed on the first main surface 12 of the flexible sheet 10, and the second coil electrode 31 is formed on the second main surface 13 facing the first main surface 12.
- the first coil electrode 21 and the second coil electrode 31 are linear electrodes made of a metal thin film or the like formed in a wound shape, and are attached to the flexible sheet 10 with an adhesive or the like.
- the first coil electrode 21 has one end 22A (corresponding to the “second end” of the present invention) on the outermost periphery, and the other end 22B (the “first end of the present invention” on the innermost periphery). ”).
- 1st coil electrode 21 sees flexible sheet 10 from the 1st principal surface 12 side, and goes to inner end side 22B of the innermost circumference from one end 22A of the outermost circumference to the inner peripheral side sequentially counterclockwise It has a structure in which linear electrodes are continuously formed.
- the second coil electrode 31 has one end 32A (corresponding to the “fourth end” of the present invention) on the outermost periphery, and the other end 32B (the “third end” of the present invention) on the innermost periphery. ”).
- the second coil electrode 31 is continuous from the innermost other end 32B to the outermost one end 32A so that the second coil electrode 31 is sequentially wound clockwise from the other innermost end 32B to the outer peripheral side. It has a structure in which a linear electrode is formed. That is, the second coil electrode 31 has a shape wound in the reverse winding direction with respect to the first coil electrode 21.
- the first coil electrode 21 and the second coil electrode 31 are continuously wound in the same direction when viewed in the same direction, for example, the first main surface 12 to the second main surface 13. It becomes the shape to do.
- the current directions of the first coil electrode 12 and the second coil electrode 13 match, and the direction of the magnetic field generated by the first coil electrode 21 and the direction of the magnetic field generated by the second coil electrode 31 match.
- these magnetic fields act so as to add to each other, and the magnetic field as an antenna (a magnetic field whose axis is perpendicular to the main surface) becomes stronger.
- the first coil electrode 21 and the second coil electrode 31 function as one continuous coil having a larger number of turns, in which the winding direction does not change midway.
- the first coil electrode 21 is formed only by facing the end portions of the first coil electrode 21 and the second coil electrode 31 without performing mechanical conduction processing such as perforation on the flexible sheet 10.
- the second coil electrode 31 can be connected in an alternating manner, so that a resonant antenna can be formed with a simple process and a simple structure.
- the number of turns of the first coil electrode 21 and the length from the planar center position of the first coil electrode 21 to the electrode group are set based on an inductance L21 (see FIG. 3) realized by the first coil electrode 21.
- the number of turns of the second coil electrode 31 and the length from the planar center position of the second coil electrode 31 to the electrode group are set based on an inductance L31 (see FIG. 3) realized by the second coil electrode 31.
- the outermost circumferential end portion 22A and the innermost circumferential end portion 22B of the first coil electrode 21 have a substantially rectangular shape that is wider than the linear electrode portion to be wound.
- the outermost peripheral end portion 32A and the innermost peripheral end 32B of the second coil electrode 31 also have a substantially rectangular shape that is wider than the wound linear electrode portion.
- the first coil electrode 21 and the second coil electrode 31 have a shape in which the innermost circumferential end portions 22B and 32B overlap each other in plan view. Thereby, the first coil electrode 21 and the second coil electrode 31 are connected in an alternating manner. Further, a capacitor having a large facing area and a relatively large capacitance C23B (see FIG. 3) corresponding to the facing area of the other end 22B, 32B, the thickness of the flexible sheet 10, and the dielectric constant can be formed.
- the first coil electrode 21 and the second coil electrode 31 are formed in a shape that hardly overlaps in the portion of the linear electrode excluding these innermost peripheral ends.
- a substantially rectangular intermediate electrode 22C is disposed on the first main surface of the flexible sheet 10 at a position spaced a predetermined distance from the outermost peripheral end 22A of the first coil electrode 21. Specifically, the intermediate electrode 22C is disposed so as to overlap the outermost peripheral end portion 32A of the second coil electrode 31 in plan view. The intermediate electrode 22C is also formed with the same area as the outermost peripheral end portions 22A and 32A and the innermost peripheral end portions 22B and 32B. Thereby, the outermost peripheral end portion 32A of the second coil electrode 31, the intermediate electrode 22C, and the flexible sheet 10 form a capacitor having a large facing area and a relatively large capacitance C23A.
- the mounting substrate 15 is made of a substantially rectangular insulating layer in plan view, includes the outermost peripheral end portion 22A of the first coil electrode 21 and the intermediate electrode 22C, and is formed in an area where the wireless communication IC 80 can be mounted. Yes.
- One surface of the mounting substrate 15 includes a plurality of electrode pads 151 ⁇ / b> A (corresponding to “first connection electrodes” in the present invention) and 151 ⁇ / b> B (corresponding to “second connection electrodes” in the present invention). Electrode pads (four in FIGS. 1 and 2) are formed. A wireless communication IC 80 is mounted using this electrode pad.
- the electrode pads 151A and 151B have substantially the same area as the mounting lands formed in the wireless communication IC 80.
- the arrangement interval between the electrode pads 151A and 151B is substantially the same as the arrangement interval between the outer peripheral end portion 22A and the intermediate electrode 22C.
- the mounting substrate 15 is disposed on the first main surface 12 side of the flexible sheet 10 so that the electrode pad 151A overlaps the outermost peripheral end 22A and the electrode pad 151B overlaps the intermediate electrode 22C in plan view. At this time, the mounting substrate 15 is fixed to the flexible sheet 10 with, for example, an insulating adhesive or an adhesive sheet. With such a configuration, the electrode pad 151A, the outermost peripheral end 22A, and the mounting substrate 15 form a capacitor having a small facing area and a small capacitance C25A. Further, the electrode pad 151B, the intermediate electrode 22C, and the mounting substrate 15 form a capacitor having a small facing area and a small capacitance C25B.
- the antenna module 100 of the present embodiment has a circuit configuration as shown in FIG.
- FIG. 3 is a diagram simulating an equivalent circuit when the antenna module 100 of the present embodiment is viewed from the side.
- a capacitor by the electrode pad 151A and the outermost peripheral end 22A ( A capacitance C25A), an inductor (inductance L21) by the first coil electrode 21, and a capacitor (capacitance C23B) by the innermost peripheral ends 22B and 32B are connected in series.
- the capacitance C25A due to the electrode pad 151A and the outermost peripheral end portion 22A is smaller than the capacitance C23B due to the innermost peripheral end portions 22B and 32B. Therefore, from the formula of the synthetic capacitance by the series connection of the capacitances, these synthetic capacitances are greatly influenced by the small capacitance C25A and hardly affected by the large capacitance C23B. Therefore, if the capacitance C25A is stable, the combined capacitance is stable even if the capacitance C23B varies.
- a capacitor (capacitance C25B) by the electrode pad 151B and the intermediate electrode 22C, and the intermediate electrode 22C A capacitor (capacitance C23A) by the outermost peripheral end portion 32A is connected in series.
- the capacitance C25B due to the electrode pad 151B and the intermediate electrode 22C is smaller than the capacitance C23A due to the intermediate electrode 22C and the outermost peripheral end portion 32A. Therefore, from the formula of the composite capacitance by the series connection of the capacitances, these composite capacitances are greatly influenced by the small capacitance C25B and hardly affected by the large capacitance C23A. Therefore, if the capacitance C25B is stable, the combined capacitance is stable even if the capacitance C23A varies.
- resonance is caused by the capacitance C25A formed by the electrode pad 151A and the outermost peripheral end 22A disposed on both surfaces of the mounting substrate 15, and the capacitance C25B formed by the electrode pad 151B and the intermediate electrode 22C.
- the circuit capacitance is substantially determined.
- the electrode pads 151A and 151B have a smaller area than the outermost peripheral end 22A and the intermediate electrode 22C.
- the outermost peripheral end 22A and the intermediate electrode 22C have a larger area than the electrode pads 151A and 151B. Therefore, when the mounting substrate 15 is disposed on the flexible sheet 10, even if there is some variation, the electrode pads 151A, 151B, the outermost peripheral end 22A, and the intermediate electrode 22C are opposed to each other with certainty. It can be arranged. Thereby, the capacitances C25A and C25B depending on the electrode pads 151A and 151B do not vary.
- the capacitances C25A and C25B do not vary, so that the resonance frequency of the resonance circuit as the antenna 1 is hardly affected. Thereby, if the structure of the said antenna is used, the antenna module of the stable communication characteristic can be formed.
- the wireless communication IC 80 is mounted on the electrode pads 151A and 151B of the mounting board 15 having a small area, the mounting accuracy and mounting speed of the wireless communication IC 80 can be improved. Thereby, the manufacturing yield and manufacturing speed of the antenna module 100 can also be improved.
- the capacitances C25A and C25B are shown to be smaller than the capacitances C23A and C23B. Specifically, the capacitances C23A and C23B are about 100 pF, and the capacitances C25A and C25B are about 20 pF.
- an antenna having desired high-accuracy characteristics can be easily realized.
- each capacitance is an example, and it is further preferable that the difference between the capacitances C25A and C25B and the capacitances C23A and C23B is made larger based on desired antenna characteristics.
- the capacitances C25A and C25B are reduced by reducing the areas of the electrode pads 151A and 151B has been described.
- the material of the mounting substrate 15 is changed or the thickness of the mounting substrate 15 is increased.
- the capacitances C25A and C25B may be reduced.
- FIG. 4 is a side view of the antenna module 100A according to the second embodiment.
- mounting electrodes 152A and 152B are provided on the surface of the mounting substrate 15 on the flexible sheet 10 side with respect to the antenna module 100 (antenna 1) shown in the first embodiment. It has a configuration.
- the mounting electrode 152A is formed so as to overlap the electrode pad 151A in plan view, and is formed in substantially the same shape as the outermost peripheral end 22A.
- the mounting electrode 152B is formed so as to overlap the electrode pad 151B in plan view, and is formed in substantially the same shape as the intermediate electrode 22C.
- the mounting substrate 15 is installed on the flexible sheet 10 so that the mounting electrode 152A and the outermost peripheral end 22A overlap, and the mounting electrode 152B and the intermediate electrode 22C overlap.
- the mounting substrate 15 and the flexible sheet 10 are fixed by an insulating adhesive sheet 16 or the like.
- the antenna module 100A of the present embodiment has a circuit configuration as shown in FIG.
- FIG. 5 is a diagram simulating an equivalent circuit when the antenna module 100A of this embodiment is viewed from the side.
- a capacitor (capacitance by the electrode pad 151A and the mounting electrode 152A is provided.
- a capacitor (capacitance C55A) by the mounting electrode 152A and the outermost peripheral end 22A an inductor (inductance L21) by the first coil electrode 21, and a capacitor (capacitance C23B) by the innermost peripheral ends 22B and 32B are connected in series. ing.
- the capacitance C25A due to the electrode pad 151A and the mounting electrode 152A is smaller than the capacitance C23B due to the innermost peripheral ends 22B and 32B.
- the capacitance C55A due to the mounting electrode 152A and the outermost peripheral end portion 22A is substantially the same as the capacitance C23B. Therefore, from the formula of the composite capacitance by the series connection of the capacitances, these composite capacitances are greatly influenced by the small capacitance C25A and are hardly influenced by the large capacitances C55A and C23B. Therefore, if the capacitance C25A is stable, the combined capacitance is stable even if the capacitances C55A and C23B vary.
- a capacitor (capacitance C25B) formed by the electrode pad 151B and the mounting electrode 152B is mounted between the other end of the wireless communication IC 80 on the electrode pad 151B side and the inductor (inductance L31) formed by the second coil electrode 31.
- a capacitor (capacitance C55B) by the electrode 152B and the intermediate electrode 22C, and a capacitor (capacitance C23A) by the intermediate electrode 22C and the outermost peripheral end 32A are connected in series.
- the capacitance C25B due to the electrode pad 151B and the mounting electrode 152B is smaller than the capacitance C23A due to the intermediate electrode 22C and the outermost peripheral end portion 32A.
- the capacitance C55B due to the mounting electrode 152B and the intermediate electrode 22C is substantially the same as the capacitance C23A. Therefore, from the formula of the combined capacitance by the series connection of the capacitances, these combined capacitances are greatly influenced by the small capacitance C25B and are not easily influenced by the large capacitances C55B and C23A. Therefore, if the capacitance C25B is stabilized, the combined capacitance is stabilized even if the capacitances C55B and C23A vary.
- the resonance is caused by the capacitance C25A formed by the electrode pad 151A and the mounting electrode 152A disposed on both surfaces of the mounting substrate 15, and the capacitance C25B formed by the electrode pad 151B and the mounting electrode 152B.
- the circuit capacitance is substantially determined.
- the capacitances C25A and C25B do not vary, so that the resonance frequency of the resonance circuit as the antenna 1A and the antenna module 100A is almost affected. Therefore, an antenna module having stable communication characteristics can be formed.
- the electrode pads 151A and 151B and the mounting electrodes 152A and 152B are formed when the mounting substrate 15 is formed, so that these electrodes can be arranged facing each other with high accuracy. .
- the capacitances C25A and C25B can be set with high accuracy, and the antenna and the antenna module can be formed more stably.
- the mounting electrodes 152A and 152B have the same area as the intermediate electrode 22C and the outermost peripheral end 22A.
- the mounting electrodes 152A and 152B are wider than the electrode pads 151A and 151B, It can utilize for the structure of this embodiment. In this embodiment, an example in which two mounting electrodes are formed to face each of the two electrode pads has been shown. However, only the mounting electrode facing one electrode pad may be formed.
- FIG. 6 is a side view of the antenna 1B and the antenna module 100B according to the present embodiment. As shown in FIG. 6, the antenna 1B and the antenna module 100B of the present embodiment are obtained by omitting the mounting substrate 15 from the antenna 1 and the antenna module 100 shown in the first embodiment.
- the mounting lands 81A and 81B formed in the wireless communication IC 80 are arranged to face the outermost peripheral end 22A and the intermediate electrode 22C with the insulating adhesive layer 17 interposed therebetween.
- FIG. 7 is an exploded perspective view showing the configuration of the antenna module 100C of the present embodiment.
- FIG. 8A is a plan view of an antenna module 100C according to this embodiment, and
- FIG. 8B is a side view thereof.
- the antenna module 100C includes an antenna 1C and a wireless communication IC 80.
- the basic structure of the antenna 1C is the same as that of the antenna 1 shown in the first embodiment, and the first coil electrode 21C is disposed in a wound shape on the first main surface of the insulating flexible sheet 10C.
- the second coil electrode 31C is disposed on the two main surfaces in a wound shape.
- the first coil electrode 21C has a shape that is sequentially wound inward in the counterclockwise direction from the outermost peripheral end portion 22A to the innermost peripheral end portion 22B when viewed from the first main surface side.
- the second coil electrode 31C has a shape that is sequentially wound clockwise and outward from the innermost peripheral end portion 32B to the outermost peripheral end portion 32A when viewed from the second main surface side.
- the outermost peripheral end 22A and the innermost peripheral end 22B of the first coil electrode 21C have a shape wider than the wound linear electrode portion.
- the outermost peripheral end portion 32A and the innermost peripheral end 32B of the second coil electrode 31C also have a shape wider than the wound linear electrode portion.
- the first coil electrode 21C and the second coil electrode 31C have a shape in which the innermost peripheral end portions 22B and 32B overlap each other in plan view. Thereby, the innermost peripheral end portions 22B and 32B of the first coil electrode 21C and the second coil electrode 31C and the flexible sheet 10C form a capacitor having a large opposing area and a relatively large capacitance.
- the first coil electrode 21C and the second coil electrode 31C are formed in a shape that hardly overlaps in the linear electrode portions excluding the outermost peripheral end and the innermost peripheral end. ing.
- an intermediate electrode 22C having an area similar to that of the outermost peripheral end portion 22A is disposed at a predetermined distance from the outermost peripheral end portion 22A of the first coil electrode 21C. Yes. Specifically, the intermediate electrode 22C is disposed so as to overlap the outermost peripheral end portion 32A of the second coil electrode 31C in plan view. Thus, a capacitor having a relatively large capacitance and a large facing area is formed by the outermost peripheral end portion 32A of the second coil electrode 31C, the intermediate electrode 22C, and the flexible sheet 10C.
- electrode pads 151A are formed so as to be spaced apart from the outermost peripheral end 22A so as to allow capacitive coupling.
- electrode pads 151B are formed on the first main surface of the flexible sheet 10C so as to be spaced apart from the intermediate electrode 22C so as to allow capacitive coupling.
- a capacitor having a small capacitance is formed by the outermost peripheral end portion 22A and the electrode pad 151A formed on the same surface.
- a capacitor having a small capacitance is formed by the intermediate electrode 22C and the electrode pad 151B formed on the same surface.
- the wireless communication IC 80 is mounted on the flexible sheet 10C via an electrode pad group arranged in a predetermined pattern including these electrode pads 151A and 151B.
- the capacitive coupling obtained on the same plane is significantly lower than the capacitive coupling between the opposing electrodes. Therefore, the capacitance by the outermost peripheral end 22A and the electrode pad 151A obtained by capacitive coupling on the same plane, and the capacitance by the intermediate electrode 22C and the electrode pad 151B are the capacitor and the outermost peripheral by the innermost peripheral ends 22B and 32B. It is extremely smaller than the capacitance due to the end portion 32A and the intermediate electrode 22C.
- the combined capacitance as the resonance circuit is determined by the capacitance due to the outermost peripheral end 22A and the electrode pad 151A and the capacitance due to the intermediate electrode 22C and the electrode pad 151B.
- FIG. 9 is an exploded perspective view showing the configuration of the antenna module 100D according to the present embodiment.
- FIG. 10 is a side view of the antenna module 100D according to the present embodiment.
- the antenna module 100D of the present embodiment uses the insulator substrate 10D having a configuration in which the insulating layers 10DA and 10DB are stacked without using the flexible sheet 10 and the mounting substrate 15 of the antenna module 100 shown in the first embodiment.
- the insulator layer 10DA of the antenna module 100D corresponds to the flexible sheet 10 of the antenna module 100, and the insulator layer 10DB of the antenna module 100D is formed by forming the mounting substrate 15 of the antenna module 100 with the same area as the flexible sheet 10. Equivalent to. Even with such a configuration, an antenna module having stable communication characteristics can be formed.
- the electrode pads 151A and 151B formed on the mounting substrate 15 and the insulator layer 10DB are also used as electrodes for mounting the wireless communication IC 80.
- An electrode for mounting the wireless communication IC 80 may be formed and connected by a wiring electrode pattern.
- FIG. 11 is a plan view showing another example of forming the first coil electrode and the second coil electrode.
- FIG. 11A shows a case where the inner peripheral ends of the first coil electrode 21 and the second coil electrode 31 are opposed to each other as a linear electrode instead of a wide flat plate.
- FIG. 11B shows a case where the inner peripheral ends of the first coil electrode 21 and the second coil electrode 31 face each other with a predetermined shift. Even if it is such a structure, the effect similar to each above-mentioned embodiment can be acquired. Although not shown, the present invention can be applied to each embodiment of the present invention even if both ends of the first coil electrode and the second coil electrode are not wide flat plates.
- FIG. 12A and 12B are diagrams showing the configuration of the electromagnetic coupling module 90, FIG. 12A shows an external perspective view, and FIG. 12B shows an exploded lamination view.
- the electromagnetic coupling module 90 includes a power supply board 91 and a wireless communication IC 80 mounted on the power supply board 91 as shown in FIG.
- the power supply substrate 91 is formed by a laminated circuit substrate formed by laminating dielectric layers having electrode patterns formed on the surface. For example, as shown in FIG. 12B, it has a structure in which nine dielectric layers 911 to 919 are laminated. On the uppermost dielectric layer 911, mounting lands 941A and 941B for the wireless communication IC 80 are formed, and surface electrode patterns 951A and 951B are formed on the mounting lands 941A and 941B, respectively.
- the second to eighth dielectric layers 922 to 928 are provided with first C annular pattern electrodes 922 to 928 and second C annular pattern electrodes 932 to 938, respectively.
- the first C annular pattern electrodes 922 to 928 are electrically connected by via holes to form a first coil whose axial direction is the stacking direction. Both ends of the first coil are connected to mounting lands 941A and 941B provided in the uppermost dielectric layer 911 by via holes.
- the second C annular pattern electrodes 932 to 938 are electrically connected by via holes to form a second coil whose axial direction is the stacking direction. Both ends of the second coil are connected to the end portions of the surface electrode patterns 951A and 951B provided on the uppermost dielectric layer 911 by via holes.
- Two external connection electrodes 961 and 962 are formed on the dielectric layer 919 which is the lowermost layer. These two external connection electrodes 961 and 962 are connected to the first C annular pattern electrodes 922 to 928 and the second C annular pattern electrodes 932 to 938, respectively, through holes. These two external connection electrodes play the same role as the external connection mounting lands of the wireless communication ICs shown in the above embodiments.
Abstract
Description
図1は本実施形態のアンテナモジュール100の構成を示す分解斜視図である。図2(A)はアンテナモジュール100の第1主面12側から見た平面図であり、図2(B)はその側面図である。
Claims (10)
- 平面状で且つ巻回状に形成され、第1端部および第2端部を有する第1コイル電極と、
該第1コイル電極に対して所定間隔離間し、平面状で且つ巻回状に形成され、第3端部および第4端部を有する第2コイル電極と、
前記第1コイル電極の第2端部および前記第2コイル電極の第4端部とを外部素子に接続させるための第1接続用電極および第2接続用電極と、
前記第4端部と前記第2接続用電極との間に配設された中間電極と、を備え、
前記第1端部と前記第3端部とが容量結合し、前記第2端部と前記第1接続用電極とが容量結合し、前記第4端部と前記中間電極とが容量結合し、前記中間電極と前記第2接続用電極とが容量結合するように、前記第1コイル電極、前記第2コイル電極、前記第1接続用電極、前記第2接続用電極および前記中間電極が所定形状で形成されており、
前記第1端部と前記第3端部との結合容量が、前記第2端部と前記第1接続用電極との結合容量よりも大きく、
前記第4端部と前記中間電極との結合容量が、前記中間電極と前記第2接続用電極との結合容量よりも大きい、ことを特徴とするアンテナ。 - 請求項1に記載のアンテナであって、
前記第1コイル電極と前記第2コイル電極は、端部を除く巻回状に形成された電極が、前記平面に直交する方向に沿って略重なり合わない形状からなる、アンテナ。 - 請求項1または請求項2に記載のアンテナであって、
前記第1コイル電極は、所定厚みからなる絶縁性基板の第1主面に形成され、
前記第2コイル電極は、前記絶縁性基板の前記第1主面に対向する第2主面に形成されている、アンテナ。 - 請求項1乃至請求項3のいずれかに記載のアンテナであって、
前記中間電極は前記第1主面に形成されている、アンテナ。 - 請求項1乃至請求項4のいずれかに記載のアンテナであって、
前記第1接続用電極および前記第2接続用電極と、前記第2端部および前記中間電極とは、絶縁性の外部素子搭載用基板を介して対向するように配設されている、アンテナ。 - 請求項5に記載のアンテナであって、
前記外部素子搭載用基板の前記第2端部および前記中間電極側の面には、前記第1接続用電極および前記第2端部と対向する結合用電極、前記第2接続用電極および前記中間電極と対向する結合用電極の少なくとも一方が形成されている、アンテナ。 - 請求項1乃至請求項4のいずれかに記載のアンテナであって、
前記第1接続用電極および前記第2接続用電極は、前記第1コイル電極と同一平面上に形成されており、
前記第1接続用電極と前記第2端部とが同一平面における電磁界結合による所定の結合容量となるように所定間隔で配設され、
前記第2接続用電極と前記中間電極とが同一平面における電磁界結合による所定の結合容量となるように所定間隔で配設されている、アンテナ。 - 請求項1乃至請求項7のいずれかに記載のアンテナであって、
前記第1接続用電極が前記第2端部よりも面積が小さいこと、および、第2接続用電極が前記中間電極よりも面積が小さいこと、の少なくともいずれか一方を満たす形状に、前記第1接続用電極、前記第2接続用電極、前記第1コイル電極の第2端部、および前記中間電極が形成されている、アンテナ。 - 無線通信用IC素子と、
平面状で且つ巻回状に形成され、第1端部および第2端部を有する第1コイル電極と、
該第1コイル電極に対して所定間隔離間し、平面状で且つ巻回状に形成され、第3端部および第4端部を有する第2コイル電極と、
前記第1コイル電極の第2端部および前記第2コイル電極の第4端部とを前記無線通信用IC素子に接続させるための第1接続用電極および第2接続用電極と、
前記第4端部と前記第2接続用電極との間に配設された中間電極と、を備え、
前記第1端部と前記第3端部とが容量結合し、前記第2端部と前記第1接続用電極とが容量結合し、前記第4端部と前記中間電極とが容量結合し、前記中間電極と前記第2接続用電極とが容量結合するように、前記第1コイル電極、前記第2コイル電極、前記第1接続用電極、前記第2接続用電極および前記中間電極が所定形状で形成されており、
前記第1端部と前記第3端部との結合容量が、前記第2端部と前記第1接続用電極との結合容量よりも大きく、
前記第4端部と前記中間電極との結合容量が、前記中間電極と前記第2接続用電極との結合容量よりも大きい、ことを特徴とするアンテナモジュール。 - 第1実装用ランド電極および第2実装用ランド電極を備えた無線通信用IC素子と、
平面状で且つ巻回状に形成され、第1端部および第2端部を有する第1コイル電極と、
該第1コイル電極に対して所定間隔離間し、平面状で且つ巻回状に形成され、第3端部および第4端部を有する第2コイル電極と、
前記第4端部と前記第2実装用ランド電極との間に配設された中間電極と、を備え、
前記第1端部と前記第3端部とが容量結合し、前記第2端部と前記第1実装用ランド電極とが容量結合し、前記第4端部と前記中間電極とが容量結合し、前記中間電極と前記第2実装用ランド電極とが容量結合するように、前記第1コイル電極、前記第2コイル電極、および前記中間電極が所定形状で形成されるとともに、前記無線通信用IC素子が前記第1コイル電極および前記第2コイル電極に対して配設されており、
前記第1端部と前記第3端部との結合容量が、前記第2端部と前記第1実装用ランド電極との結合容量よりも大きく、
前記第4端部と前記中間電極との結合容量が、前記中間電極と前記第2実装用ランド電極との結合容量よりも大きい、ことを特徴とするアンテナモジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080027007.2A CN102474008B (zh) | 2009-07-03 | 2010-07-01 | 天线以及天线模块 |
JP2011520973A JP5516581B2 (ja) | 2009-07-03 | 2010-07-01 | アンテナおよびアンテナモジュール |
US13/339,544 US8847844B2 (en) | 2009-07-03 | 2011-12-29 | Antenna and antenna module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009158334 | 2009-07-03 | ||
JP2009-158334 | 2009-07-03 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/339,544 Continuation US8847844B2 (en) | 2009-07-03 | 2011-12-29 | Antenna and antenna module |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011002049A1 true WO2011002049A1 (ja) | 2011-01-06 |
Family
ID=43410793
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/053496 WO2011001709A1 (ja) | 2009-07-03 | 2010-03-04 | アンテナおよびアンテナモジュール |
PCT/JP2010/061232 WO2011002050A1 (ja) | 2009-07-03 | 2010-07-01 | アンテナモジュール |
PCT/JP2010/061230 WO2011002049A1 (ja) | 2009-07-03 | 2010-07-01 | アンテナおよびアンテナモジュール |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/053496 WO2011001709A1 (ja) | 2009-07-03 | 2010-03-04 | アンテナおよびアンテナモジュール |
PCT/JP2010/061232 WO2011002050A1 (ja) | 2009-07-03 | 2010-07-01 | アンテナモジュール |
Country Status (4)
Country | Link |
---|---|
US (3) | US8847831B2 (ja) |
JP (2) | JP4788850B2 (ja) |
CN (2) | CN102474009B (ja) |
WO (3) | WO2011001709A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102956991A (zh) * | 2011-08-17 | 2013-03-06 | 泰科电子日本合同会社 | 天线 |
CN103107416A (zh) * | 2011-11-15 | 2013-05-15 | 财团法人工业技术研究院 | 射频辨识标签天线 |
WO2014083916A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社村田製作所 | アンテナモジュール |
US20140203985A1 (en) * | 2012-04-27 | 2014-07-24 | Murata Manufacturing Co., Ltd. | Coil antenna and communication terminal device |
JP2014199979A (ja) * | 2013-03-29 | 2014-10-23 | ソニー株式会社 | 非接触通信アンテナ、通信装置及び非接触通信アンテナの製造方法 |
EP2518904B1 (en) * | 2011-04-27 | 2019-06-19 | Samsung Electro-Mechanics Co., Ltd | Contactless power transmission device |
Families Citing this family (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
US8450997B2 (en) * | 2009-04-28 | 2013-05-28 | Brown University | Electromagnetic position and orientation sensing system |
CN102474009B (zh) | 2009-07-03 | 2015-01-07 | 株式会社村田制作所 | 天线及天线模块 |
US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
US20130293191A1 (en) | 2011-01-26 | 2013-11-07 | Panasonic Corporation | Non-contact charging module and non-contact charging instrument |
EP2681538B1 (en) | 2011-03-11 | 2019-03-06 | Mc10, Inc. | Integrated devices to facilitate quantitative assays and diagnostics |
KR102000302B1 (ko) | 2011-05-27 | 2019-07-15 | 엠씨10, 인크 | 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법 |
CN103503234B (zh) * | 2011-06-13 | 2017-04-12 | 株式会社村田制作所 | 天线装置及通信终端装置 |
US9306411B2 (en) | 2011-06-14 | 2016-04-05 | Panasonic Intellectual Property Management Co., Ltd. | Electronic device including non-contact charging module |
DE112012003250T5 (de) | 2011-08-05 | 2014-04-30 | Mc10, Inc. | Katheder Ballon-Verfahren und Vorrichtung unter Einsatz von Abtastelementen |
US9757050B2 (en) | 2011-08-05 | 2017-09-12 | Mc10, Inc. | Catheter balloon employing force sensing elements |
WO2013033724A1 (en) | 2011-09-01 | 2013-03-07 | Mc10, Inc. | Electronics for detection of a condition of tissue |
JP5825026B2 (ja) * | 2011-10-04 | 2015-12-02 | 株式会社村田製作所 | アンテナ装置および通信端末装置 |
JP6277130B2 (ja) | 2011-10-05 | 2018-02-14 | エムシーテン、インコーポレイテッド | 医療用の装置およびそれの製造方法 |
US10204734B2 (en) | 2011-11-02 | 2019-02-12 | Panasonic Corporation | Electronic device including non-contact charging module and near field communication antenna |
KR101558311B1 (ko) | 2011-11-02 | 2015-10-07 | 파나소닉 주식회사 | 비접촉 무선 통신용 코일, 전송 코일 및 휴대 무선 단말 |
US8763914B2 (en) * | 2012-01-17 | 2014-07-01 | On Track Innovations Ltd. | Decoupled contactless bi-directional systems and methods |
JP2013169122A (ja) | 2012-02-17 | 2013-08-29 | Panasonic Corp | 非接触充電モジュール及びそれを備えた携帯端末 |
JP6313744B2 (ja) | 2012-03-23 | 2018-04-18 | エルジー イノテック カンパニー リミテッド | 無線電力受信機 |
TWI459418B (zh) | 2012-03-23 | 2014-11-01 | Lg伊諾特股份有限公司 | 無線功率接收器以及包含有其之可攜式終端裝置 |
WO2013169606A1 (en) * | 2012-05-05 | 2013-11-14 | Board Of Regents, The University Of Texas System | Passive wireless self-resonant sensor |
US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
JP6112383B2 (ja) | 2012-06-28 | 2017-04-12 | パナソニックIpマネジメント株式会社 | 携帯端末 |
CN106058474B (zh) * | 2012-06-28 | 2020-02-28 | 株式会社村田制作所 | 天线装置及通信终端装置 |
JP6008237B2 (ja) | 2012-06-28 | 2016-10-19 | パナソニックIpマネジメント株式会社 | 携帯端末 |
US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
JP2015521894A (ja) | 2012-07-05 | 2015-08-03 | エムシー10 インコーポレイテッドMc10,Inc. | 流量センシングを含むカテーテルデバイス |
WO2014045518A1 (ja) * | 2012-09-18 | 2014-03-27 | パナソニック株式会社 | アンテナ、送信装置、受信装置、三次元集積回路、及び非接触通信システム |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
US9082025B2 (en) | 2012-10-09 | 2015-07-14 | Mc10, Inc. | Conformal electronics integrated with apparel |
US9640602B2 (en) * | 2012-10-19 | 2017-05-02 | Infineon Technologies Austria Ag | Semiconductor device including magnetically coupled monolithic integrated coils |
KR20140051679A (ko) * | 2012-10-23 | 2014-05-02 | 삼성전자주식회사 | 근거리 무선통신 안테나 장치 및 이를 구비하는 휴대 단말기 |
JP5655987B2 (ja) * | 2012-12-07 | 2015-01-21 | 株式会社村田製作所 | アンテナモジュール |
US20140184461A1 (en) * | 2013-01-01 | 2014-07-03 | Jungmin Kim | Antenna Assembly |
FR3001070B1 (fr) * | 2013-01-17 | 2016-05-06 | Inside Secure | Systeme d'antenne pour microcircuit sans contact |
WO2014128339A1 (en) | 2013-02-22 | 2014-08-28 | Nokia Corporation | Apparatus and methods for wireless coupling |
US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
JP2016527649A (ja) | 2013-08-05 | 2016-09-08 | エムシー10 インコーポレイテッドMc10,Inc. | 適合する電子機器を含む可撓性温度センサ |
JP2016532468A (ja) | 2013-10-07 | 2016-10-20 | エムシー10 インコーポレイテッドMc10,Inc. | 検知および分析のためのコンフォーマルセンサシステム |
TWI532351B (zh) * | 2013-11-07 | 2016-05-01 | 國立交通大學 | 寬頻連接結構及其連接方法、傳輸裝置及傳輸寬頻訊號的方法 |
US9906076B2 (en) | 2013-11-11 | 2018-02-27 | Samsung Electro-Mechanics Co., Ltd. | Non-contact type power transmitting coil and non-contact type power supplying apparatus |
TWI560937B (en) * | 2013-11-22 | 2016-12-01 | Wistron Neweb Corp | Near field communication antenna |
EP3071096A4 (en) | 2013-11-22 | 2017-08-09 | Mc10, Inc. | Conformal sensor systems for sensing and analysis of cardiac activity |
CN104752817B (zh) * | 2013-12-27 | 2018-07-06 | 无锡村田电子有限公司 | 天线装置及天线装置的设计方法 |
WO2015103580A2 (en) | 2014-01-06 | 2015-07-09 | Mc10, Inc. | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
JP2015144160A (ja) * | 2014-01-31 | 2015-08-06 | デクセリアルズ株式会社 | アンテナ装置、非接触電力伝送用アンテナユニット、電子機器 |
WO2015122421A1 (ja) * | 2014-02-14 | 2015-08-20 | 株式会社村田製作所 | アンテナ装置および無線通信装置 |
JP6637896B2 (ja) | 2014-03-04 | 2020-01-29 | エムシー10 インコーポレイテッドMc10,Inc. | 電子デバイス用の可撓性を有するマルチパート封止ハウジングを備えるコンフォーマルなicデバイス |
CN104915707B (zh) | 2014-03-10 | 2018-04-24 | 东芝存储器株式会社 | 半导体存储装置 |
WO2015138712A1 (en) | 2014-03-12 | 2015-09-17 | Mc10, Inc. | Quantification of a change in assay |
CN206558694U (zh) * | 2014-05-21 | 2017-10-13 | 株式会社村田制作所 | Rfid标签及具备该rfid标签的通信装置 |
CN206516763U (zh) * | 2014-05-30 | 2017-09-22 | 株式会社村田制作所 | 天线装置以及电子设备 |
JP2017524315A (ja) * | 2014-07-01 | 2017-08-24 | エムシー10 インコーポレイテッドMc10,Inc. | コンフォーマル電子デバイス |
US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
US10297572B2 (en) | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
KR102257892B1 (ko) * | 2014-11-26 | 2021-05-28 | 삼성전자주식회사 | 개선된 nfc 안테나 및 그 안테나를 갖는 전자 장치 |
JP6319464B2 (ja) | 2015-01-15 | 2018-05-09 | 株式会社村田製作所 | アンテナ装置およびその製造方法 |
US10477354B2 (en) | 2015-02-20 | 2019-11-12 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
WO2016140961A1 (en) | 2015-03-02 | 2016-09-09 | Mc10, Inc. | Perspiration sensor |
US11025094B2 (en) * | 2015-04-16 | 2021-06-01 | Wits Co., Ltd. | Wireless power receiving device and apparatus including the same |
US10033101B2 (en) * | 2015-06-12 | 2018-07-24 | Samsung Electronics Co., Ltd. | Near field communication antenna, near field communication device and mobile system having the same |
US10653332B2 (en) | 2015-07-17 | 2020-05-19 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
US10063100B2 (en) | 2015-08-07 | 2018-08-28 | Nucurrent, Inc. | Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling |
US10658847B2 (en) | 2015-08-07 | 2020-05-19 | Nucurrent, Inc. | Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
US11205848B2 (en) * | 2015-08-07 | 2021-12-21 | Nucurrent, Inc. | Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling |
US10709384B2 (en) | 2015-08-19 | 2020-07-14 | Mc10, Inc. | Wearable heat flux devices and methods of use |
US10300371B2 (en) | 2015-10-01 | 2019-05-28 | Mc10, Inc. | Method and system for interacting with a virtual environment |
US10532211B2 (en) | 2015-10-05 | 2020-01-14 | Mc10, Inc. | Method and system for neuromodulation and stimulation |
JP5987963B2 (ja) * | 2015-10-15 | 2016-09-07 | 株式会社村田製作所 | アンテナ装置および通信端末装置 |
EP3420732B8 (en) | 2016-02-22 | 2020-12-30 | Medidata Solutions, Inc. | System, devices, and method for on-body data and power transmission |
WO2017147053A1 (en) | 2016-02-22 | 2017-08-31 | Mc10, Inc. | System, device, and method for coupled hub and sensor node on-body acquisition of sensor information |
CN107171058B (zh) * | 2016-03-07 | 2019-08-02 | 速码波科技股份有限公司 | 天线模块 |
CN109310340A (zh) | 2016-04-19 | 2019-02-05 | Mc10股份有限公司 | 用于测量汗液的方法和系统 |
JP6593274B2 (ja) * | 2016-08-03 | 2019-10-23 | 株式会社豊田自動織機 | 多層基板 |
US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
US11387033B2 (en) * | 2016-11-18 | 2022-07-12 | Hutchinson Technology Incorporated | High-aspect ratio electroplated structures and anisotropic electroplating processes |
US11521785B2 (en) * | 2016-11-18 | 2022-12-06 | Hutchinson Technology Incorporated | High density coil design and process |
KR102649484B1 (ko) * | 2017-01-18 | 2024-03-20 | 주식회사 위츠 | 이중 루프 안테나 |
KR102312002B1 (ko) * | 2017-04-12 | 2021-10-13 | 주식회사 위츠 | 무선 통신 안테나 및 그를 이용한 무선 통신 장치 |
CN108960392A (zh) * | 2017-05-27 | 2018-12-07 | 江峰 | 一种反向磁通的双天线rfid电子标签 |
US20200168393A1 (en) * | 2017-05-30 | 2020-05-28 | Momentum Dynamics Corporation | Wireless power transfer thin profile coil assembly |
KR101977046B1 (ko) * | 2017-11-03 | 2019-05-10 | 주식회사 아모텍 | 안테나 모듈 |
JP6781145B2 (ja) * | 2017-12-28 | 2020-11-04 | 日本発條株式会社 | 携帯型無線通信装置、および携帯型無線通信装置を用いた情報識別装置 |
JP7107105B2 (ja) * | 2018-08-30 | 2022-07-27 | Tdk株式会社 | アンテナ |
CN111313150A (zh) * | 2018-12-11 | 2020-06-19 | 航天信息股份有限公司 | 一种rfid天线 |
CN110165377B (zh) * | 2019-06-03 | 2021-04-27 | Oppo广东移动通信有限公司 | 一种天线组件及电子设备 |
CN114915173A (zh) * | 2021-02-08 | 2022-08-16 | 台达电子工业股份有限公司 | 柔切式电源转换器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008199588A (ja) * | 2007-01-19 | 2008-08-28 | Matsushita Electric Ind Co Ltd | アレーアンテナ装置及び無線通信装置 |
WO2009081719A1 (ja) * | 2007-12-20 | 2009-07-02 | Murata Manufacturing Co., Ltd. | 無線icデバイス |
Family Cites Families (373)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3364564A (en) | 1965-06-28 | 1968-01-23 | Gregory Ind Inc | Method of producing welding studs dischargeable in end-to-end relationship |
JPS5754964B2 (ja) | 1974-05-08 | 1982-11-20 | ||
JPS6193701A (ja) | 1984-10-13 | 1986-05-12 | Toyota Motor Corp | 自動車用アンテナ装置 |
JPS61284102A (ja) | 1985-06-11 | 1986-12-15 | Oki Electric Ind Co Ltd | 携帯形無線機のアンテナ |
JPS62127140U (ja) | 1986-02-03 | 1987-08-12 | ||
ZA89872B (en) | 1988-02-04 | 1990-10-31 | Uniscan Ltd | Concentrator |
JPH0744114B2 (ja) | 1988-12-16 | 1995-05-15 | 株式会社村田製作所 | 積層チップコイル |
US5253969A (en) | 1989-03-10 | 1993-10-19 | Sms Schloemann-Siemag Aktiengesellschaft | Feeding system for strip material, particularly in treatment plants for metal strips |
JP2662742B2 (ja) | 1990-03-13 | 1997-10-15 | 株式会社村田製作所 | バンドパスフィルタ |
JP2763664B2 (ja) | 1990-07-25 | 1998-06-11 | 日本碍子株式会社 | 分布定数回路用配線基板 |
JPH04150011A (ja) | 1990-10-12 | 1992-05-22 | Tdk Corp | 複合電子部品 |
JP2539367Y2 (ja) | 1991-01-30 | 1997-06-25 | 株式会社村田製作所 | 積層型電子部品 |
NL9100176A (nl) | 1991-02-01 | 1992-03-02 | Nedap Nv | Antenne met transformator voor contactloze informatieoverdracht vanuit integrated circuit-kaart. |
JP2558330Y2 (ja) | 1991-02-06 | 1997-12-24 | オムロン株式会社 | 電磁結合型電子機器 |
NL9100347A (nl) | 1991-02-26 | 1992-03-02 | Nedap Nv | Geintegreerde transformator voor een contactloze identificatiekaart. |
JPH04321190A (ja) * | 1991-04-22 | 1992-11-11 | Mitsubishi Electric Corp | 非接触型携帯記憶装置のアンテナ回路 |
JPH0745933Y2 (ja) | 1991-06-07 | 1995-10-18 | 太陽誘電株式会社 | 積層セラミックインダクタンス素子 |
EP0522806B1 (en) | 1991-07-08 | 1996-11-20 | Nippon Telegraph And Telephone Corporation | Retractable antenna system |
JPH05327331A (ja) | 1992-05-15 | 1993-12-10 | Matsushita Electric Works Ltd | プリントアンテナ |
JP3186235B2 (ja) | 1992-07-30 | 2001-07-11 | 株式会社村田製作所 | 共振器アンテナ |
JPH0677729A (ja) | 1992-08-25 | 1994-03-18 | Mitsubishi Electric Corp | アンテナ一体化マイクロ波回路 |
JPH06177635A (ja) | 1992-12-07 | 1994-06-24 | Mitsubishi Electric Corp | クロスダイポールアンテナ装置 |
JPH06260949A (ja) | 1993-03-03 | 1994-09-16 | Seiko Instr Inc | 無線機器 |
JPH07183836A (ja) | 1993-12-22 | 1995-07-21 | San'eisha Mfg Co Ltd | 配電線搬送通信用結合フィルタ装置 |
US5491483A (en) | 1994-01-05 | 1996-02-13 | Texas Instruments Incorporated | Single loop transponder system and method |
JP3427527B2 (ja) | 1994-12-26 | 2003-07-22 | 凸版印刷株式会社 | 生分解性積層体及び生分解性カード |
US6096431A (en) | 1994-07-25 | 2000-08-01 | Toppan Printing Co., Ltd. | Biodegradable cards |
JP2999374B2 (ja) | 1994-08-10 | 2000-01-17 | 太陽誘電株式会社 | 積層チップインダクタ |
JP3141692B2 (ja) | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | ミリ波用検波器 |
DE4431754C1 (de) | 1994-09-06 | 1995-11-23 | Siemens Ag | Trägerelement |
US5528222A (en) | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
JPH0887580A (ja) | 1994-09-14 | 1996-04-02 | Omron Corp | データキャリア及びボールゲーム |
EP0704928A3 (en) * | 1994-09-30 | 1998-08-05 | HID Corporation | RF transponder system with parallel resonant interrogation and series resonant response |
JP2837829B2 (ja) | 1995-03-31 | 1998-12-16 | 松下電器産業株式会社 | 半導体装置の検査方法 |
JPH08279027A (ja) | 1995-04-04 | 1996-10-22 | Toshiba Corp | 無線通信カード |
US5955723A (en) | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
JPH08307126A (ja) | 1995-05-09 | 1996-11-22 | Kyocera Corp | アンテナの収納構造 |
JP3637982B2 (ja) | 1995-06-27 | 2005-04-13 | 株式会社荏原電産 | インバータ駆動ポンプの制御システム |
US5629241A (en) | 1995-07-07 | 1997-05-13 | Hughes Aircraft Company | Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
GB2305075A (en) | 1995-09-05 | 1997-03-26 | Ibm | Radio Frequency Tag for Electronic Apparatus |
JPH0993029A (ja) | 1995-09-21 | 1997-04-04 | Matsushita Electric Ind Co Ltd | アンテナ装置 |
JP3882218B2 (ja) | 1996-03-04 | 2007-02-14 | ソニー株式会社 | 光ディスク |
JP3471160B2 (ja) | 1996-03-18 | 2003-11-25 | 株式会社東芝 | モノリシックアンテナ |
JPH09270623A (ja) | 1996-03-29 | 1997-10-14 | Murata Mfg Co Ltd | アンテナ装置 |
JPH09284038A (ja) | 1996-04-17 | 1997-10-31 | Nhk Spring Co Ltd | 非接触データキャリアのアンテナ装置 |
JP3427663B2 (ja) | 1996-06-18 | 2003-07-22 | 凸版印刷株式会社 | 非接触icカード |
AUPO055296A0 (en) | 1996-06-19 | 1996-07-11 | Integrated Silicon Design Pty Ltd | Enhanced range transponder system |
US6104311A (en) | 1996-08-26 | 2000-08-15 | Addison Technologies | Information storage and identification tag |
JPH10145267A (ja) * | 1996-09-13 | 1998-05-29 | Hitachi Ltd | 高効率アンテナコイル並びに無線カードおよび無線カードを用いた情報通信システム |
JP2001505682A (ja) | 1996-10-09 | 2001-04-24 | ペーアーファウ カード ゲームベーハ | スマートカードの製造方法及び製造のための接続配置 |
JPH10171954A (ja) | 1996-12-05 | 1998-06-26 | Hitachi Maxell Ltd | 非接触式icカード |
JP3279205B2 (ja) | 1996-12-10 | 2002-04-30 | 株式会社村田製作所 | 表面実装型アンテナおよび通信機 |
JPH10193851A (ja) | 1997-01-08 | 1998-07-28 | Denso Corp | 非接触カード |
DE19703029A1 (de) | 1997-01-28 | 1998-07-30 | Amatech Gmbh & Co Kg | Übertragungsmodul für eine Transpondervorrichtung sowie Transpondervorrichtung und Verfahren zum Betrieb einer Transpondervorrichtung |
US6181287B1 (en) | 1997-03-10 | 2001-01-30 | Precision Dynamics Corporation | Reactively coupled elements in circuits on flexible substrates |
JPH10293828A (ja) | 1997-04-18 | 1998-11-04 | Omron Corp | データキャリア、コイルモジュール、リーダライタ及び衣服データ取得方法 |
JP3900593B2 (ja) | 1997-05-27 | 2007-04-04 | 凸版印刷株式会社 | Icカードおよびicモジュール |
JPH11346114A (ja) | 1997-06-11 | 1999-12-14 | Matsushita Electric Ind Co Ltd | アンテナ装置 |
JPH1125244A (ja) | 1997-06-27 | 1999-01-29 | Toshiba Chem Corp | 非接触データキャリアパッケージ |
JP3621560B2 (ja) | 1997-07-24 | 2005-02-16 | 三菱電機株式会社 | 電磁誘導型データキャリアシステム |
JPH1185937A (ja) | 1997-09-02 | 1999-03-30 | Nippon Lsi Card Kk | 非接触式lsiカード及びその検査方法 |
JPH1188241A (ja) | 1997-09-04 | 1999-03-30 | Nippon Steel Corp | データキャリアシステム |
JP3800766B2 (ja) | 1997-11-14 | 2006-07-26 | 凸版印刷株式会社 | 複合icモジュールおよび複合icカード |
JP3800765B2 (ja) | 1997-11-14 | 2006-07-26 | 凸版印刷株式会社 | 複合icカード |
EP1031939B1 (en) | 1997-11-14 | 2005-09-14 | Toppan Printing Co., Ltd. | Composite ic card |
JPH11175678A (ja) | 1997-12-09 | 1999-07-02 | Toppan Printing Co Ltd | Icモジュールとそのモジュールを搭載したicカード |
JPH11220319A (ja) | 1998-01-30 | 1999-08-10 | Sharp Corp | アンテナ装置 |
JPH11219420A (ja) | 1998-02-03 | 1999-08-10 | Tokin Corp | Icカードモジュール、icカード及びそれらの製造方法 |
JP2001084463A (ja) | 1999-09-14 | 2001-03-30 | Miyake:Kk | 共振回路 |
JPH11261325A (ja) | 1998-03-10 | 1999-09-24 | Shiro Sugimura | コイル素子と、その製造方法 |
US6362784B1 (en) | 1998-03-31 | 2002-03-26 | Matsuda Electric Industrial Co., Ltd. | Antenna unit and digital television receiver |
JP4260917B2 (ja) | 1998-03-31 | 2009-04-30 | 株式会社東芝 | ループアンテナ |
US5936150A (en) | 1998-04-13 | 1999-08-10 | Rockwell Science Center, Llc | Thin film resonant chemical sensor with resonant acoustic isolator |
CA2293228A1 (en) | 1998-04-14 | 1999-10-21 | Robert A. Katchmazenski | Container for compressors and other goods |
JP4030651B2 (ja) | 1998-05-12 | 2008-01-09 | 三菱電機株式会社 | 携帯型電話機 |
JPH11328352A (ja) | 1998-05-19 | 1999-11-30 | Tokin Corp | アンテナとicチップとの接続構造、及びicカード |
US6107920A (en) | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US6018299A (en) | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
JP2000021639A (ja) | 1998-07-02 | 2000-01-21 | Sharp Corp | インダクター、これを用いた共振回路、整合回路、アンテナ回路及び発振回路 |
JP2000022421A (ja) | 1998-07-03 | 2000-01-21 | Murata Mfg Co Ltd | チップアンテナ及びそれを搭載した無線機器 |
JP2000021128A (ja) | 1998-07-03 | 2000-01-21 | Nippon Steel Corp | 円盤状記憶媒体及びその収納ケース |
JP2000311226A (ja) | 1998-07-28 | 2000-11-07 | Toshiba Corp | 無線icカード及びその製造方法並びに無線icカード読取り書込みシステム |
EP0977145A3 (en) | 1998-07-28 | 2002-11-06 | Kabushiki Kaisha Toshiba | Radio IC card |
JP2000059260A (ja) | 1998-08-04 | 2000-02-25 | Sony Corp | 記憶装置 |
CA2338522C (en) | 1998-08-14 | 2009-04-07 | 3M Innovative Properties Company | Radio frequency identification systems applications |
EP1298573A3 (en) | 1998-08-14 | 2003-09-17 | 3M Innovative Properties Company | Radio frequency identification system comprising a plurality of antennas |
JP4411670B2 (ja) | 1998-09-08 | 2010-02-10 | 凸版印刷株式会社 | 非接触icカードの製造方法 |
JP4508301B2 (ja) | 1998-09-16 | 2010-07-21 | 大日本印刷株式会社 | 非接触icカード |
JP3632466B2 (ja) | 1998-10-23 | 2005-03-23 | 凸版印刷株式会社 | 非接触icカード用の検査装置および検査方法 |
US6837438B1 (en) | 1998-10-30 | 2005-01-04 | Hitachi Maxell, Ltd. | Non-contact information medium and communication system utilizing the same |
JP2000137785A (ja) | 1998-10-30 | 2000-05-16 | Sony Corp | 非接触型icカードの製造方法および非接触型icカード |
JP2000137779A (ja) | 1998-10-30 | 2000-05-16 | Hitachi Maxell Ltd | 非接触情報媒体とその製造方法 |
JP3924962B2 (ja) | 1998-10-30 | 2007-06-06 | 株式会社デンソー | 皿状物品用idタグ |
JP2000148948A (ja) | 1998-11-05 | 2000-05-30 | Sony Corp | 非接触型icラベルおよびその製造方法 |
JP2000172812A (ja) | 1998-12-08 | 2000-06-23 | Hitachi Maxell Ltd | 非接触情報媒体 |
FR2787640B1 (fr) | 1998-12-22 | 2003-02-14 | Gemplus Card Int | Agencement d'une antenne dans un environnement metallique |
JP3088404B2 (ja) | 1999-01-14 | 2000-09-18 | 埼玉日本電気株式会社 | 移動無線端末および内蔵アンテナ |
JP2000228602A (ja) | 1999-02-08 | 2000-08-15 | Alps Electric Co Ltd | 共振線路 |
JP3967487B2 (ja) | 1999-02-23 | 2007-08-29 | 株式会社東芝 | Icカード |
JP4106673B2 (ja) | 1999-03-05 | 2008-06-25 | 株式会社エフ・イー・シー | コイルユニットを使用するアンテナ装置、プリント回路基板 |
JP4349597B2 (ja) | 1999-03-26 | 2009-10-21 | 大日本印刷株式会社 | Icチップの製造方法及びそれを内蔵したメモリー媒体の製造方法 |
JP2000286634A (ja) | 1999-03-30 | 2000-10-13 | Ngk Insulators Ltd | アンテナ装置及びアンテナ装置の製造方法 |
US6542050B1 (en) | 1999-03-30 | 2003-04-01 | Ngk Insulators, Ltd. | Transmitter-receiver |
JP3067764B1 (ja) | 1999-03-31 | 2000-07-24 | 株式会社豊田自動織機製作所 | 移動体通信用結合器、移動体及び移動体の通信方法 |
JP2000321984A (ja) | 1999-05-12 | 2000-11-24 | Hitachi Ltd | Rf−idタグ付きラベル |
JP4286977B2 (ja) | 1999-07-02 | 2009-07-01 | 大日本印刷株式会社 | 非接触型icカードとそのアンテナ特性調整方法 |
JP3557130B2 (ja) | 1999-07-14 | 2004-08-25 | 新光電気工業株式会社 | 半導体装置の製造方法 |
JP2001043340A (ja) | 1999-07-29 | 2001-02-16 | Toppan Printing Co Ltd | 複合icカード |
JP2001066990A (ja) | 1999-08-31 | 2001-03-16 | Sumitomo Bakelite Co Ltd | Icタグの保護フィルム及び保護方法 |
US6259369B1 (en) | 1999-09-30 | 2001-07-10 | Moore North America, Inc. | Low cost long distance RFID reading |
JP2001101369A (ja) | 1999-10-01 | 2001-04-13 | Matsushita Electric Ind Co Ltd | Rfタグ |
JP3451373B2 (ja) | 1999-11-24 | 2003-09-29 | オムロン株式会社 | 電磁波読み取り可能なデータキャリアの製造方法 |
JP4186149B2 (ja) | 1999-12-06 | 2008-11-26 | 株式会社エフ・イー・シー | Icカード用の補助アンテナ |
JP2001240046A (ja) | 2000-02-25 | 2001-09-04 | Toppan Forms Co Ltd | 容器及びその製造方法 |
JP2001257292A (ja) | 2000-03-10 | 2001-09-21 | Hitachi Maxell Ltd | 半導体装置 |
JP2001256457A (ja) | 2000-03-13 | 2001-09-21 | Toshiba Corp | 半導体装置及びその製造方法、icカード通信システム |
JP4624537B2 (ja) | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | 非接触式データキャリア装置、収納体 |
JP4624536B2 (ja) | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | 非接触式データキャリア装置 |
JP2001319380A (ja) | 2000-05-11 | 2001-11-16 | Mitsubishi Materials Corp | Rfid付光ディスク |
JP2001331976A (ja) | 2000-05-17 | 2001-11-30 | Casio Comput Co Ltd | 光記録型記録媒体 |
JP4223174B2 (ja) | 2000-05-19 | 2009-02-12 | Dxアンテナ株式会社 | フィルムアンテナ |
JP2001339226A (ja) | 2000-05-26 | 2001-12-07 | Nec Saitama Ltd | アンテナ装置 |
JP2001344574A (ja) | 2000-05-30 | 2001-12-14 | Mitsubishi Materials Corp | 質問器のアンテナ装置 |
JP2001352176A (ja) | 2000-06-05 | 2001-12-21 | Fuji Xerox Co Ltd | 多層プリント配線基板および多層プリント配線基板製造方法 |
AU2001275117A1 (en) | 2000-06-06 | 2001-12-17 | Battelle Memorial Institute | Remote communication system and method |
JP2002024776A (ja) | 2000-07-07 | 2002-01-25 | Nippon Signal Co Ltd:The | Icカード用リーダライタ |
JP2001076111A (ja) | 2000-07-12 | 2001-03-23 | Hitachi Kokusai Electric Inc | 共振回路 |
JP2002032731A (ja) | 2000-07-14 | 2002-01-31 | Sony Corp | 非接触式情報交換カード |
JP2002042076A (ja) | 2000-07-21 | 2002-02-08 | Dainippon Printing Co Ltd | 非接触型データキャリア及び非接触型データキャリアを有する冊子 |
JP3075400U (ja) | 2000-08-03 | 2001-02-16 | 昌栄印刷株式会社 | 非接触型icカード |
JP2002063557A (ja) | 2000-08-21 | 2002-02-28 | Mitsubishi Materials Corp | Rfid用タグ |
JP2002076750A (ja) | 2000-08-24 | 2002-03-15 | Murata Mfg Co Ltd | アンテナ装置およびそれを備えた無線機 |
JP3481575B2 (ja) | 2000-09-28 | 2003-12-22 | 寛児 川上 | アンテナ |
JP4615695B2 (ja) | 2000-10-19 | 2011-01-19 | 三星エスディーエス株式会社 | Icカード用のicモジュールと、それを使用するicカード |
US6634564B2 (en) | 2000-10-24 | 2003-10-21 | Dai Nippon Printing Co., Ltd. | Contact/noncontact type data carrier module |
JP4628611B2 (ja) | 2000-10-27 | 2011-02-09 | 三菱マテリアル株式会社 | アンテナ |
JP2002185358A (ja) | 2000-11-24 | 2002-06-28 | Supersensor Pty Ltd | 容器にrfトランスポンダを装着する方法 |
JP4641096B2 (ja) * | 2000-12-07 | 2011-03-02 | 大日本印刷株式会社 | 非接触式データキャリア装置とブースターアンテナ部用配線部材 |
JP2002183690A (ja) | 2000-12-11 | 2002-06-28 | Hitachi Maxell Ltd | 非接触icタグ装置 |
AU2002226093A1 (en) | 2000-12-15 | 2002-06-24 | Electrox Corp. | Process for the manufacture of novel, inexpensive radio frequency identificationdevices |
JP3788325B2 (ja) | 2000-12-19 | 2006-06-21 | 株式会社村田製作所 | 積層型コイル部品及びその製造方法 |
JP3621655B2 (ja) | 2001-04-23 | 2005-02-16 | 株式会社ハネックス中央研究所 | Rfidタグ構造及びその製造方法 |
TW531976B (en) | 2001-01-11 | 2003-05-11 | Hanex Co Ltd | Communication apparatus and installing structure, manufacturing method and communication method |
JP2002280821A (ja) | 2001-01-12 | 2002-09-27 | Furukawa Electric Co Ltd:The | アンテナ装置および端末機器 |
KR20020061103A (ko) | 2001-01-12 | 2002-07-22 | 후루까와덴끼고오교 가부시끼가이샤 | 안테나 장치 및 이 안테나 장치가 부착된 단말기기 |
JP2002232221A (ja) | 2001-01-30 | 2002-08-16 | Alps Electric Co Ltd | 送受信ユニット |
JP4662400B2 (ja) | 2001-02-05 | 2011-03-30 | 大日本印刷株式会社 | コイルオンチップ型の半導体モジュール付き物品 |
JP2002246828A (ja) * | 2001-02-15 | 2002-08-30 | Mitsubishi Materials Corp | トランスポンダのアンテナ |
ATE499725T1 (de) | 2001-03-02 | 2011-03-15 | Nxp Bv | Modul und elektronische vorrichtung |
JP2002298109A (ja) | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | 非接触型icメディアおよびその製造方法 |
JP3570386B2 (ja) | 2001-03-30 | 2004-09-29 | 松下電器産業株式会社 | 無線機能内蔵携帯用情報端末 |
JP3772778B2 (ja) | 2001-03-30 | 2006-05-10 | 三菱マテリアル株式会社 | アンテナコイル及びそれを用いた識別タグ、リーダライタ装置、リーダ装置及びライタ装置 |
JP2005236339A (ja) | 2001-07-19 | 2005-09-02 | Oji Paper Co Ltd | Icチップ実装体 |
JP2002362613A (ja) | 2001-06-07 | 2002-12-18 | Toppan Printing Co Ltd | 非接触icが積層された積層包装材及びこれを用いた包装容器、並びに包装容器の開封検出方法 |
JP2002366917A (ja) | 2001-06-07 | 2002-12-20 | Hitachi Ltd | アンテナを内蔵するicカード |
JP4710174B2 (ja) | 2001-06-13 | 2011-06-29 | 株式会社村田製作所 | バランス型lcフィルタ |
JP2002373029A (ja) | 2001-06-18 | 2002-12-26 | Hitachi Ltd | Icタグによるソフトウェアの不正コピーの防止方法 |
JP4882167B2 (ja) | 2001-06-18 | 2012-02-22 | 大日本印刷株式会社 | 非接触icチップ付きカード一体型フォーム |
JP4759854B2 (ja) | 2001-06-19 | 2011-08-31 | 株式会社寺岡精工 | Icタグの金属物への装着方法及びicタグ内蔵マーカー |
JP2003087008A (ja) | 2001-07-02 | 2003-03-20 | Ngk Insulators Ltd | 積層型誘電体フィルタ |
JP4058919B2 (ja) | 2001-07-03 | 2008-03-12 | 日立化成工業株式会社 | 非接触式icラベル、非接触式icカード、非接触式icラベルまたは非接触式icカード用icモジュール |
JP2003030612A (ja) | 2001-07-19 | 2003-01-31 | Oji Paper Co Ltd | Icチップ実装体 |
DE60131270T2 (de) | 2001-07-26 | 2008-08-21 | Irdeto Access B.V. | Zeitvaliderungssystem |
JP3629448B2 (ja) | 2001-07-27 | 2005-03-16 | Tdk株式会社 | アンテナ装置及びそれを備えた電子機器 |
JP4731060B2 (ja) | 2001-07-31 | 2011-07-20 | トッパン・フォームズ株式会社 | Rf−idの検査方法およびその検査システム |
JP2003058840A (ja) | 2001-08-14 | 2003-02-28 | Hirano Design Sekkei:Kk | Rfid搭載コンピュータ記録媒体利用の情報保護管理プログラム |
JP2003069335A (ja) | 2001-08-28 | 2003-03-07 | Hitachi Kokusai Electric Inc | 補助アンテナ |
JP2003067711A (ja) | 2001-08-29 | 2003-03-07 | Toppan Forms Co Ltd | Icチップ実装体あるいはアンテナ部を備えた物品 |
JP2003078333A (ja) | 2001-08-30 | 2003-03-14 | Murata Mfg Co Ltd | 無線通信機 |
JP4843885B2 (ja) | 2001-08-31 | 2011-12-21 | 凸版印刷株式会社 | Icメモリチップ付不正防止ラベル |
JP4514374B2 (ja) | 2001-09-05 | 2010-07-28 | トッパン・フォームズ株式会社 | Rf−idの検査システム |
JP4747467B2 (ja) | 2001-09-07 | 2011-08-17 | 大日本印刷株式会社 | 非接触icタグ |
JP2003085520A (ja) | 2001-09-11 | 2003-03-20 | Oji Paper Co Ltd | Icカードの製造方法 |
JP2003087044A (ja) | 2001-09-12 | 2003-03-20 | Mitsubishi Materials Corp | Rfid用アンテナ及び該アンテナを備えたrfidシステム |
JP4845306B2 (ja) | 2001-09-25 | 2011-12-28 | トッパン・フォームズ株式会社 | Rf−idの検査システム |
JP4698096B2 (ja) | 2001-09-25 | 2011-06-08 | トッパン・フォームズ株式会社 | Rf−idの検査システム |
JP2003110344A (ja) | 2001-09-26 | 2003-04-11 | Hitachi Metals Ltd | 表面実装型アンテナおよびそれを搭載したアンテナ装置 |
JP2003132330A (ja) | 2001-10-25 | 2003-05-09 | Sato Corp | Rfidラベルプリンタ |
JP2003134007A (ja) | 2001-10-30 | 2003-05-09 | Auto Network Gijutsu Kenkyusho:Kk | 車載機器間における信号送受信システム及び車載機器間における信号送受信方法 |
JP3984458B2 (ja) | 2001-11-20 | 2007-10-03 | 大日本印刷株式会社 | Icタグ付き包装体の製造方法 |
JP3908514B2 (ja) | 2001-11-20 | 2007-04-25 | 大日本印刷株式会社 | Icタグ付き包装体とicタグ付き包装体の製造方法 |
JP3894540B2 (ja) | 2001-11-30 | 2007-03-22 | トッパン・フォームズ株式会社 | 導電接続部を有するインターポーザ |
JP2003188338A (ja) | 2001-12-13 | 2003-07-04 | Sony Corp | 回路基板装置及びその製造方法 |
JP3700777B2 (ja) | 2001-12-17 | 2005-09-28 | 三菱マテリアル株式会社 | Rfid用タグの電極構造及び該電極を用いた共振周波数の調整方法 |
JP2003188620A (ja) | 2001-12-19 | 2003-07-04 | Murata Mfg Co Ltd | モジュール一体型アンテナ |
JP4028224B2 (ja) | 2001-12-20 | 2007-12-26 | 大日本印刷株式会社 | 非接触通信機能を有する紙製icカード用基材 |
JP3895175B2 (ja) | 2001-12-28 | 2007-03-22 | Ntn株式会社 | 誘電性樹脂統合アンテナ |
JP2003209421A (ja) | 2002-01-17 | 2003-07-25 | Dainippon Printing Co Ltd | 透明アンテナを有するrfidタグ、及びその製造方法 |
JP3915092B2 (ja) | 2002-01-21 | 2007-05-16 | 株式会社エフ・イー・シー | Icカード用のブースタアンテナ |
JP2003216919A (ja) | 2002-01-23 | 2003-07-31 | Toppan Forms Co Ltd | Rf−idメディア |
JP2003233780A (ja) | 2002-02-06 | 2003-08-22 | Mitsubishi Electric Corp | データ通信装置 |
JP3998992B2 (ja) | 2002-02-14 | 2007-10-31 | 大日本印刷株式会社 | ウェブに実装されたicチップへのアンテナパターン形成方法とicタグ付き包装体 |
JP2003243918A (ja) | 2002-02-18 | 2003-08-29 | Dainippon Printing Co Ltd | 非接触icタグ用アンテナと非接触icタグ |
JP2003249813A (ja) | 2002-02-25 | 2003-09-05 | Tecdia Kk | ループアンテナ付きrfid用タグ |
US7119693B1 (en) | 2002-03-13 | 2006-10-10 | Celis Semiconductor Corp. | Integrated circuit with enhanced coupling |
JP2003288560A (ja) | 2002-03-27 | 2003-10-10 | Toppan Forms Co Ltd | 帯電防止機能を有するインターポーザおよびインレットシート |
US7129834B2 (en) | 2002-03-28 | 2006-10-31 | Kabushiki Kaisha Toshiba | String wireless sensor and its manufacturing method |
JP2003309418A (ja) | 2002-04-17 | 2003-10-31 | Alps Electric Co Ltd | ダイポールアンテナ |
JP3879098B2 (ja) | 2002-05-10 | 2007-02-07 | 株式会社エフ・イー・シー | Icカード用のブースタアンテナ |
US6753814B2 (en) | 2002-06-27 | 2004-06-22 | Harris Corporation | Dipole arrangements using dielectric substrates of meta-materials |
JP3863464B2 (ja) | 2002-07-05 | 2006-12-27 | 株式会社ヨコオ | フィルタ内蔵アンテナ |
JP2004088218A (ja) | 2002-08-23 | 2004-03-18 | Tokai Univ | 平面アンテナ |
JP4107381B2 (ja) | 2002-08-23 | 2008-06-25 | 横浜ゴム株式会社 | 空気入りタイヤ |
JP4273724B2 (ja) | 2002-08-29 | 2009-06-03 | カシオ電子工業株式会社 | 消耗品不正使用防止システム |
JP2004096566A (ja) | 2002-09-02 | 2004-03-25 | Toenec Corp | 誘導通信装置 |
JP2004126750A (ja) | 2002-09-30 | 2004-04-22 | Toppan Forms Co Ltd | 情報書込/読出装置、アンテナ及びrf−idメディア |
JP3958667B2 (ja) | 2002-10-16 | 2007-08-15 | 株式会社日立国際電気 | リーダライタ用ループアンテナ、及びそれを備えた物品管理棚及び図書管理システム |
JP2006503504A (ja) | 2002-10-17 | 2006-01-26 | アンビエント・コーポレイション | 電力線通信のためのデータ結合器の構成 |
JP2004213582A (ja) | 2003-01-09 | 2004-07-29 | Mitsubishi Materials Corp | Rfidタグ及びリーダ/ライタ並びに該タグを備えたrfidシステム |
JP2004234595A (ja) | 2003-02-03 | 2004-08-19 | Matsushita Electric Ind Co Ltd | 情報記録媒体読取装置 |
DE602004026549D1 (de) | 2003-02-03 | 2010-05-27 | Panasonic Corp | Antenneneinrichtung und diese verwendende drahtlose kommunikationseinrichtung |
EP1445821A1 (en) | 2003-02-06 | 2004-08-11 | Matsushita Electric Industrial Co., Ltd. | Portable radio communication apparatus provided with a boom portion |
US7225992B2 (en) | 2003-02-13 | 2007-06-05 | Avery Dennison Corporation | RFID device tester and method |
JP2004253858A (ja) | 2003-02-18 | 2004-09-09 | Minerva:Kk | Icタグ用のブースタアンテナ装置 |
JP4010263B2 (ja) | 2003-03-14 | 2007-11-21 | 富士電機ホールディングス株式会社 | アンテナ、及びデータ読取装置 |
JP4034676B2 (ja) | 2003-03-20 | 2008-01-16 | 日立マクセル株式会社 | 非接触通信式情報担体 |
JP2004297249A (ja) | 2003-03-26 | 2004-10-21 | Matsushita Electric Ind Co Ltd | 異相線間カプラーとその装着方法、及び、異相線間のカップリング方法 |
JP2004297681A (ja) | 2003-03-28 | 2004-10-21 | Toppan Forms Co Ltd | 非接触型情報記録媒体 |
JP4236971B2 (ja) * | 2003-03-28 | 2009-03-11 | トッパン・フォームズ株式会社 | 非接触型情報記録媒体の製造方法 |
JP2004304370A (ja) | 2003-03-28 | 2004-10-28 | Sony Corp | アンテナコイル及び通信機器 |
JP4208631B2 (ja) | 2003-04-17 | 2009-01-14 | 日本ミクロン株式会社 | 半導体装置の製造方法 |
JP2004326380A (ja) | 2003-04-24 | 2004-11-18 | Dainippon Printing Co Ltd | Rfidタグ |
JP2004334268A (ja) | 2003-04-30 | 2004-11-25 | Dainippon Printing Co Ltd | 紙片icタグと紙片icタグ付き書籍・雑誌、紙片icタグ付き書籍 |
JP2004336250A (ja) | 2003-05-02 | 2004-11-25 | Taiyo Yuden Co Ltd | アンテナ整合回路、アンテナ整合回路を有する移動体通信装置、アンテナ整合回路を有する誘電体アンテナ |
JP2004343000A (ja) | 2003-05-19 | 2004-12-02 | Fujikura Ltd | 半導体モジュールとそれを備えた非接触icタグ及び半導体モジュールの製造方法 |
JP2004362190A (ja) | 2003-06-04 | 2004-12-24 | Hitachi Ltd | 半導体装置 |
JP4828088B2 (ja) | 2003-06-05 | 2011-11-30 | 凸版印刷株式会社 | Icタグ |
JP2005005866A (ja) | 2003-06-10 | 2005-01-06 | Alps Electric Co Ltd | アンテナ一体型モジュール |
JP2005033461A (ja) | 2003-07-11 | 2005-02-03 | Mitsubishi Materials Corp | Rfidシステム及び該システムにおけるアンテナの構造 |
JP3982476B2 (ja) | 2003-10-01 | 2007-09-26 | ソニー株式会社 | 通信システム |
JP4062233B2 (ja) | 2003-10-20 | 2008-03-19 | トヨタ自動車株式会社 | ループアンテナ装置 |
JP4680489B2 (ja) | 2003-10-21 | 2011-05-11 | 三菱電機株式会社 | 情報記録読取システム |
JP3570430B1 (ja) | 2003-10-29 | 2004-09-29 | オムロン株式会社 | ループコイルアンテナ |
JP4402426B2 (ja) | 2003-10-30 | 2010-01-20 | 大日本印刷株式会社 | 温度変化感知検出システム |
JP4343655B2 (ja) | 2003-11-12 | 2009-10-14 | 株式会社日立製作所 | アンテナ |
JP4451125B2 (ja) | 2003-11-28 | 2010-04-14 | シャープ株式会社 | 小型アンテナ |
JP2005165839A (ja) | 2003-12-04 | 2005-06-23 | Nippon Signal Co Ltd:The | リーダライタ、icタグ、物品管理装置、及び光ディスク装置 |
US7768405B2 (en) * | 2003-12-12 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and manufacturing method thereof |
JP4326936B2 (ja) | 2003-12-24 | 2009-09-09 | シャープ株式会社 | 無線タグ |
JP2005210676A (ja) | 2003-12-25 | 2005-08-04 | Hitachi Ltd | 無線用icタグ、無線用icタグの製造方法、及び、無線用icタグの製造装置 |
KR100995265B1 (ko) | 2003-12-25 | 2010-11-19 | 미쓰비시 마테리알 가부시키가이샤 | 안테나 장치 및 통신기기 |
JP4089680B2 (ja) | 2003-12-25 | 2008-05-28 | 三菱マテリアル株式会社 | アンテナ装置 |
JP4218519B2 (ja) | 2003-12-26 | 2009-02-04 | 戸田工業株式会社 | 磁界アンテナ、それを用いて構成したワイヤレスシステムおよび通信システム |
JP2005190417A (ja) | 2003-12-26 | 2005-07-14 | Taketani Shoji:Kk | 固定物管理システム及びこのシステムに用いる個体識別子 |
WO2005073937A2 (en) | 2004-01-22 | 2005-08-11 | Mikoh Corporation | A modular radio frequency identification tagging method |
KR101270180B1 (ko) | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 검사장치 및 검사방법과, 반도체장치 제작방법 |
JP4271591B2 (ja) | 2004-01-30 | 2009-06-03 | 双信電機株式会社 | アンテナ装置 |
JP2005229474A (ja) | 2004-02-16 | 2005-08-25 | Olympus Corp | 情報端末装置 |
JP4393228B2 (ja) | 2004-02-27 | 2010-01-06 | シャープ株式会社 | 小型アンテナ及びそれを備えた無線タグ |
JP2005252853A (ja) | 2004-03-05 | 2005-09-15 | Fec Inc | Rf−id用アンテナ |
KR20060135822A (ko) | 2004-03-24 | 2006-12-29 | 가부시끼가이샤 우찌다 요오꼬오 | 기록매체용 ic태그 부착 시트 및 기록매체 |
JP2005275870A (ja) | 2004-03-25 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 挿入型無線通信媒体装置および電子機器 |
JP4067510B2 (ja) | 2004-03-31 | 2008-03-26 | シャープ株式会社 | テレビジョン受信装置 |
US8139759B2 (en) | 2004-04-16 | 2012-03-20 | Panasonic Corporation | Line state detecting apparatus and transmitting apparatus and receiving apparatus of balanced transmission system |
JP2005311205A (ja) | 2004-04-23 | 2005-11-04 | Nec Corp | 半導体装置 |
JP2005340759A (ja) | 2004-04-27 | 2005-12-08 | Sony Corp | アンテナモジュール用磁芯部材、アンテナモジュールおよびこれを備えた携帯情報端末 |
JP2005322119A (ja) | 2004-05-11 | 2005-11-17 | Ic Brains Co Ltd | Icタグ付き物品の不正持ち出し防止装置 |
JP2005321305A (ja) | 2004-05-10 | 2005-11-17 | Murata Mfg Co Ltd | 電子部品測定治具 |
US7317396B2 (en) | 2004-05-26 | 2008-01-08 | Funai Electric Co., Ltd. | Optical disc having RFID tag, optical disc apparatus, and system for preventing unauthorized copying |
JP4551122B2 (ja) | 2004-05-26 | 2010-09-22 | 株式会社岩田レーベル | Rfidラベルの貼付装置 |
JP4360276B2 (ja) | 2004-06-02 | 2009-11-11 | 船井電機株式会社 | 無線icタグを有する光ディスク及び光ディスク再生装置 |
JP2005345802A (ja) | 2004-06-03 | 2005-12-15 | Casio Comput Co Ltd | 撮像装置、この撮像装置に用いられる交換ユニット、交換ユニット使用制御方法及びプログラム |
JP2005352858A (ja) | 2004-06-11 | 2005-12-22 | Hitachi Maxell Ltd | 通信式記録担体 |
JP4348282B2 (ja) | 2004-06-11 | 2009-10-21 | 株式会社日立製作所 | 無線用icタグ、及び無線用icタグの製造方法 |
JP4530140B2 (ja) | 2004-06-28 | 2010-08-25 | Tdk株式会社 | 軟磁性体及びそれを用いたアンテナ装置 |
JP4359198B2 (ja) | 2004-06-30 | 2009-11-04 | 株式会社日立製作所 | Icタグ実装基板の製造方法 |
JP4328682B2 (ja) | 2004-07-13 | 2009-09-09 | 富士通株式会社 | 光記録媒体用の無線タグアンテナ構造および無線タグアンテナ付き光記録媒体の収納ケース |
JP2006033312A (ja) | 2004-07-15 | 2006-02-02 | Matsushita Electric Ind Co Ltd | アンテナ及びアンテナ取り付け方法 |
JP2004362602A (ja) | 2004-07-26 | 2004-12-24 | Hitachi Ltd | Rfidタグ |
JP2006039947A (ja) | 2004-07-27 | 2006-02-09 | Daido Steel Co Ltd | 複合磁性シート |
JP2006039902A (ja) | 2004-07-27 | 2006-02-09 | Ntn Corp | Uhf帯無線icタグ |
JP2006042059A (ja) | 2004-07-28 | 2006-02-09 | Tdk Corp | 無線通信装置及びそのインピ−ダンス調整方法 |
JP2006042097A (ja) | 2004-07-29 | 2006-02-09 | Kyocera Corp | アンテナ配線基板 |
JP4653440B2 (ja) | 2004-08-13 | 2011-03-16 | 富士通株式会社 | Rfidタグおよびその製造方法 |
JP4482403B2 (ja) | 2004-08-30 | 2010-06-16 | 日本発條株式会社 | 非接触情報媒体 |
JP4186895B2 (ja) | 2004-09-01 | 2008-11-26 | 株式会社デンソーウェーブ | 非接触通信装置用コイルアンテナおよびその製造方法 |
JP4125275B2 (ja) | 2004-09-02 | 2008-07-30 | 日本電信電話株式会社 | 非接触ic媒体制御システム |
JP2006080367A (ja) | 2004-09-10 | 2006-03-23 | Brother Ind Ltd | インダクタンス素子、無線タグ回路素子、タグテープロール、及びインダクタンス素子の製造方法 |
JP2006092630A (ja) | 2004-09-22 | 2006-04-06 | Sony Corp | 光ディスクおよびその製造方法 |
JP4600742B2 (ja) | 2004-09-30 | 2010-12-15 | ブラザー工業株式会社 | 印字ヘッド及びタグラベル作成装置 |
GB2419779A (en) | 2004-10-29 | 2006-05-03 | Hewlett Packard Development Co | Document having conductive tracks for coupling to a memory tag and a reader |
EP1807814A1 (en) | 2004-11-05 | 2007-07-18 | Qinetiq Limited | Detunable rf tags |
JP4088797B2 (ja) | 2004-11-18 | 2008-05-21 | 日本電気株式会社 | Rfidタグ |
JP2006148518A (ja) | 2004-11-19 | 2006-06-08 | Matsushita Electric Works Ltd | 非接触icカードの調整装置および調整方法 |
US7545328B2 (en) | 2004-12-08 | 2009-06-09 | Electronics And Telecommunications Research Institute | Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedance matching method thereof |
JP4281683B2 (ja) | 2004-12-16 | 2009-06-17 | 株式会社デンソー | Icタグの取付構造 |
JP4541246B2 (ja) | 2004-12-24 | 2010-09-08 | トッパン・フォームズ株式会社 | 非接触icモジュール |
EP1829102A4 (en) | 2004-12-24 | 2014-08-13 | Semiconductor Energy Lab | SEMICONDUCTOR DEVICE |
JP4942998B2 (ja) | 2004-12-24 | 2012-05-30 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
DE102005001725A1 (de) * | 2005-01-13 | 2006-07-27 | Infineon Technologies Ag | Identifizierbare Verpackung |
JP4737505B2 (ja) | 2005-01-14 | 2011-08-03 | 日立化成工業株式会社 | Icタグインレット及びicタグインレットの製造方法 |
JP4711692B2 (ja) | 2005-02-01 | 2011-06-29 | 富士通株式会社 | メアンダラインアンテナ |
JP2006232292A (ja) | 2005-02-22 | 2006-09-07 | Nippon Sheet Glass Co Ltd | 電子タグ付き容器およびrfidシステム |
EP2333561A3 (en) | 2005-03-10 | 2014-06-11 | Gen-Probe Incorporated | System for performing multi-formatted assays |
JP4330575B2 (ja) | 2005-03-17 | 2009-09-16 | 富士通株式会社 | タグアンテナ |
JP4437965B2 (ja) | 2005-03-22 | 2010-03-24 | Necトーキン株式会社 | 無線タグ |
JP2006270681A (ja) | 2005-03-25 | 2006-10-05 | Sony Corp | 携帯機器 |
JP2006287659A (ja) * | 2005-03-31 | 2006-10-19 | Tdk Corp | アンテナ装置 |
CN101142711B (zh) | 2005-04-01 | 2012-07-04 | 富士通株式会社 | 适用于金属的rfid标签及其rfid标签部 |
JP2006302219A (ja) | 2005-04-25 | 2006-11-02 | Fujita Denki Seisakusho:Kk | Rfidタグ通信範囲設定装置 |
JP4771115B2 (ja) | 2005-04-27 | 2011-09-14 | 日立化成工業株式会社 | Icタグ |
US7688272B2 (en) | 2005-05-30 | 2010-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2007013120A (ja) | 2005-05-30 | 2007-01-18 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP4255931B2 (ja) | 2005-06-01 | 2009-04-22 | 日本電信電話株式会社 | 非接触ic媒体及び制御装置 |
JP2007018067A (ja) | 2005-07-05 | 2007-01-25 | Kobayashi Kirokushi Co Ltd | Rfidタグ、及びrfidシステム |
JP2007028002A (ja) | 2005-07-13 | 2007-02-01 | Matsushita Electric Ind Co Ltd | リーダライタのアンテナ、及び通信システム |
JP4720348B2 (ja) | 2005-08-04 | 2011-07-13 | パナソニック株式会社 | Rf−idリーダーライター装置用アンテナ及びそれを用いたrf−idリーダーライター装置並びにrf−idシステム |
JP4801951B2 (ja) | 2005-08-18 | 2011-10-26 | 富士通フロンテック株式会社 | Rfidタグ |
JP2007065822A (ja) | 2005-08-30 | 2007-03-15 | Sofueru:Kk | 無線icタグ、中間icタグ体、中間icタグ体セットおよび無線icタグの製造方法 |
DE102005042444B4 (de) | 2005-09-06 | 2007-10-11 | Ksw Microtec Ag | Anordnung für eine RFID - Transponder - Antenne |
JP4725261B2 (ja) | 2005-09-12 | 2011-07-13 | オムロン株式会社 | Rfidタグの検査方法 |
JP4384102B2 (ja) | 2005-09-13 | 2009-12-16 | 株式会社東芝 | 携帯無線機およびアンテナ装置 |
JP4826195B2 (ja) | 2005-09-30 | 2011-11-30 | 大日本印刷株式会社 | Rfidタグ |
JP2007116347A (ja) | 2005-10-19 | 2007-05-10 | Mitsubishi Materials Corp | タグアンテナ及び携帯無線機 |
JP4774273B2 (ja) | 2005-10-31 | 2011-09-14 | 株式会社サトー | Rfidラベルおよびrfidラベルの貼付方法 |
JP2007159083A (ja) | 2005-11-09 | 2007-06-21 | Alps Electric Co Ltd | アンテナ整合回路 |
JP2007150642A (ja) | 2005-11-28 | 2007-06-14 | Hitachi Ulsi Systems Co Ltd | 無線タグ用質問器、無線タグ用アンテナ、無線タグシステムおよび無線タグ選別装置 |
JP2007150868A (ja) | 2005-11-29 | 2007-06-14 | Renesas Technology Corp | 電子装置およびその製造方法 |
JP4560480B2 (ja) | 2005-12-13 | 2010-10-13 | Necトーキン株式会社 | 無線タグ |
JP4815211B2 (ja) | 2005-12-22 | 2011-11-16 | 株式会社サトー | Rfidラベルおよびrfidラベルの貼付方法 |
JP4848764B2 (ja) | 2005-12-26 | 2011-12-28 | 大日本印刷株式会社 | 非接触式データキャリア装置 |
CN106599980A (zh) * | 2006-01-19 | 2017-04-26 | 株式会社村田制作所 | 无线ic器件 |
US7519328B2 (en) | 2006-01-19 | 2009-04-14 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
CN101901955B (zh) | 2006-01-19 | 2014-11-26 | 株式会社村田制作所 | 供电电路 |
WO2007083575A1 (ja) | 2006-01-19 | 2007-07-26 | Murata Manufacturing Co., Ltd. | 無線icデバイス |
WO2007086130A1 (ja) | 2006-01-27 | 2007-08-02 | Totoku Electric Co., Ltd. | タグ装置、トランシーバ装置およびタグシステム |
EP1988601B1 (en) | 2006-02-19 | 2012-10-10 | Nissha Printing Co., Ltd. | Feeding structure of housing with antenna |
EP2690586B1 (en) | 2006-02-22 | 2017-07-19 | Toyo Seikan Kaisha, Ltd. | RFID tag substrate for metal component |
JP4026080B2 (ja) | 2006-02-24 | 2007-12-26 | オムロン株式会社 | アンテナ、およびrfidタグ |
KR20080098412A (ko) | 2006-03-06 | 2008-11-07 | 미쓰비시덴키 가부시키가이샤 | Rfid태그, rfid태그의 제조 방법 및 rfid태그의 설치 방법 |
JP3933191B1 (ja) | 2006-03-13 | 2007-06-20 | 株式会社村田製作所 | 携帯電子機器 |
JP2007287128A (ja) | 2006-03-22 | 2007-11-01 | Orient Sokki Computer Kk | 非接触ic媒体 |
JP4735368B2 (ja) | 2006-03-28 | 2011-07-27 | 富士通株式会社 | 平面アンテナ |
JP4854362B2 (ja) | 2006-03-30 | 2012-01-18 | 富士通株式会社 | Rfidタグ及びその製造方法 |
JP4927625B2 (ja) | 2006-03-31 | 2012-05-09 | ニッタ株式会社 | 磁気シールドシート、非接触icカード通信改善方法および非接触icカード収容容器 |
CN101416353B (zh) * | 2006-04-10 | 2013-04-10 | 株式会社村田制作所 | 无线集成电路设备 |
JP4572983B2 (ja) | 2006-04-14 | 2010-11-04 | 株式会社村田製作所 | 無線icデバイス |
BRPI0702888B1 (pt) * | 2006-04-14 | 2019-09-17 | Murata Manufacturing Co., Ltd | Antena |
EP2012258B2 (en) | 2006-04-26 | 2014-10-22 | Murata Manufacturing Co. Ltd. | Article provided with electromagnetically coupled module |
US9064198B2 (en) * | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
US7589675B2 (en) | 2006-05-19 | 2009-09-15 | Industrial Technology Research Institute | Broadband antenna |
JP2007324865A (ja) | 2006-05-31 | 2007-12-13 | Sony Chemical & Information Device Corp | アンテナ回路及びトランスポンダ |
EP2023275B1 (en) * | 2006-06-01 | 2011-04-27 | Murata Manufacturing Co. Ltd. | Radio frequency ic device and composite component for radio frequency ic device |
WO2008007606A1 (fr) | 2006-07-11 | 2008-01-17 | Murata Manufacturing Co., Ltd. | Dispositif à antenne et circuit résonnant |
JP2008033716A (ja) | 2006-07-31 | 2008-02-14 | Sankyo Kk | コイン型rfidタグ |
JP4836899B2 (ja) | 2006-09-05 | 2011-12-14 | パナソニック株式会社 | 磁性体ストライプ状配列シート、rfid磁性シート、電磁遮蔽シートおよびそれらの製造方法 |
US7981528B2 (en) | 2006-09-05 | 2011-07-19 | Panasonic Corporation | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same |
JP4770655B2 (ja) | 2006-09-12 | 2011-09-14 | 株式会社村田製作所 | 無線icデバイス |
JP2008083867A (ja) | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | メモリカード用ソケット |
JP4913529B2 (ja) | 2006-10-13 | 2012-04-11 | トッパン・フォームズ株式会社 | Rfidメディア |
JP2008107947A (ja) | 2006-10-24 | 2008-05-08 | Toppan Printing Co Ltd | Rfidタグ |
WO2008081699A1 (ja) | 2006-12-28 | 2008-07-10 | Philtech Inc. | 基体シート |
JP2008197714A (ja) | 2007-02-08 | 2008-08-28 | Dainippon Printing Co Ltd | 非接触データキャリア装置及び非接触データキャリア用補助アンテナ |
JP5061657B2 (ja) | 2007-03-05 | 2012-10-31 | 大日本印刷株式会社 | 非接触式データキャリア装置 |
JP5024372B2 (ja) | 2007-04-06 | 2012-09-12 | 株式会社村田製作所 | 無線icデバイス |
WO2008133018A1 (ja) | 2007-04-13 | 2008-11-06 | Murata Manufacturing Co., Ltd. | 磁界結合型アンテナ、磁界結合型アンテナモジュールおよび磁界結合型アンテナ装置、ならびにこれらの製造方法 |
JP4525859B2 (ja) | 2007-05-10 | 2010-08-18 | 株式会社村田製作所 | 無線icデバイス |
JP4666102B2 (ja) | 2007-05-11 | 2011-04-06 | 株式会社村田製作所 | 無線icデバイス |
JP4770792B2 (ja) | 2007-05-18 | 2011-09-14 | パナソニック電工株式会社 | アンテナ装置 |
JP2009017284A (ja) | 2007-07-05 | 2009-01-22 | Panasonic Corp | アンテナ装置 |
CN104540317B (zh) | 2007-07-17 | 2018-11-02 | 株式会社村田制作所 | 印制布线基板 |
JP5167709B2 (ja) | 2007-07-17 | 2013-03-21 | 株式会社村田製作所 | 無線icデバイス、その検査システム及び該検査システムを用いた無線icデバイスの製造方法 |
JP4867830B2 (ja) | 2007-07-18 | 2012-02-01 | 株式会社村田製作所 | 無線icデバイス |
US7830311B2 (en) | 2007-07-18 | 2010-11-09 | Murata Manufacturing Co., Ltd. | Wireless IC device and electronic device |
US20090021352A1 (en) | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | Radio frequency ic device and electronic apparatus |
KR101006808B1 (ko) | 2007-07-18 | 2011-01-10 | 가부시키가이샤 무라타 세이사쿠쇼 | 무선 ic 디바이스 |
EP2568419B1 (en) | 2007-07-18 | 2015-02-25 | Murata Manufacturing Co., Ltd. | Apparatus comprising an RFID device |
JP2009182630A (ja) | 2008-01-30 | 2009-08-13 | Dainippon Printing Co Ltd | ブースタアンテナ基板、ブースタアンテナ基板シート及び非接触式データキャリア装置 |
JP5267463B2 (ja) | 2008-03-03 | 2013-08-21 | 株式会社村田製作所 | 無線icデバイス及び無線通信システム |
EP2840648B1 (en) | 2008-05-21 | 2016-03-23 | Murata Manufacturing Co., Ltd. | Wireless IC device |
JP4557186B2 (ja) | 2008-06-25 | 2010-10-06 | 株式会社村田製作所 | 無線icデバイスとその製造方法 |
JP3148168U (ja) | 2008-10-21 | 2009-02-05 | 株式会社村田製作所 | 無線icデバイス |
CN102474009B (zh) | 2009-07-03 | 2015-01-07 | 株式会社村田制作所 | 天线及天线模块 |
-
2010
- 2010-03-04 CN CN201080030228.5A patent/CN102474009B/zh not_active Expired - Fee Related
- 2010-03-04 WO PCT/JP2010/053496 patent/WO2011001709A1/ja active Application Filing
- 2010-03-04 JP JP2011516183A patent/JP4788850B2/ja not_active Expired - Fee Related
- 2010-07-01 CN CN201080027007.2A patent/CN102474008B/zh not_active Expired - Fee Related
- 2010-07-01 JP JP2011520973A patent/JP5516581B2/ja active Active
- 2010-07-01 WO PCT/JP2010/061232 patent/WO2011002050A1/ja active Application Filing
- 2010-07-01 WO PCT/JP2010/061230 patent/WO2011002049A1/ja active Application Filing
-
2011
- 2011-12-22 US US13/334,462 patent/US8847831B2/en not_active Expired - Fee Related
- 2011-12-29 US US13/339,393 patent/US20120098728A1/en not_active Abandoned
- 2011-12-29 US US13/339,544 patent/US8847844B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008199588A (ja) * | 2007-01-19 | 2008-08-28 | Matsushita Electric Ind Co Ltd | アレーアンテナ装置及び無線通信装置 |
WO2009081719A1 (ja) * | 2007-12-20 | 2009-07-02 | Murata Manufacturing Co., Ltd. | 無線icデバイス |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2518904B1 (en) * | 2011-04-27 | 2019-06-19 | Samsung Electro-Mechanics Co., Ltd | Contactless power transmission device |
CN102956991A (zh) * | 2011-08-17 | 2013-03-06 | 泰科电子日本合同会社 | 天线 |
CN102956991B (zh) * | 2011-08-17 | 2016-12-07 | 泰科电子日本合同会社 | 天线 |
CN103107416A (zh) * | 2011-11-15 | 2013-05-15 | 财团法人工业技术研究院 | 射频辨识标签天线 |
US8910878B2 (en) | 2011-11-15 | 2014-12-16 | Industrial Technology Research Institute | RFID tag antenna |
CN103107416B (zh) * | 2011-11-15 | 2015-06-10 | 财团法人工业技术研究院 | 射频辨识标签天线 |
TWI488367B (zh) * | 2011-11-15 | 2015-06-11 | Ind Tech Res Inst | 射頻辨識標籤天線 |
US20140203985A1 (en) * | 2012-04-27 | 2014-07-24 | Murata Manufacturing Co., Ltd. | Coil antenna and communication terminal device |
US9214728B2 (en) * | 2012-04-27 | 2015-12-15 | Murata Manufacturing Co., Ltd. | Coil antenna and communication terminal device |
WO2014083916A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社村田製作所 | アンテナモジュール |
US9330353B2 (en) | 2012-11-30 | 2016-05-03 | Murata Manufacturing Co., Ltd. | Antenna module |
JP2014199979A (ja) * | 2013-03-29 | 2014-10-23 | ソニー株式会社 | 非接触通信アンテナ、通信装置及び非接触通信アンテナの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2011001709A1 (ja) | 2012-12-13 |
US20120098728A1 (en) | 2012-04-26 |
CN102474009B (zh) | 2015-01-07 |
WO2011002050A1 (ja) | 2011-01-06 |
CN102474008B (zh) | 2014-12-10 |
CN102474008A (zh) | 2012-05-23 |
JP4788850B2 (ja) | 2011-10-05 |
US20120098729A1 (en) | 2012-04-26 |
US8847844B2 (en) | 2014-09-30 |
US20120092222A1 (en) | 2012-04-19 |
CN102474009A (zh) | 2012-05-23 |
JPWO2011002049A1 (ja) | 2012-12-13 |
US8847831B2 (en) | 2014-09-30 |
JP5516581B2 (ja) | 2014-06-11 |
WO2011001709A1 (ja) | 2011-01-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5516581B2 (ja) | アンテナおよびアンテナモジュール | |
JP5392382B2 (ja) | 無線icデバイス | |
JP6070895B2 (ja) | 積層型コイル素子、アンテナモジュール、および、無線通信モジュール | |
TWI545841B (zh) | Antenna devices and wireless communication devices | |
JP5234216B2 (ja) | アンテナ装置および通信端末装置 | |
JP5024366B2 (ja) | アンテナコイルおよびアンテナ装置 | |
WO2016002423A1 (ja) | アンテナ装置、アンテナモジュールおよび通信端末装置 | |
JP5464306B2 (ja) | アンテナ素子およびアンテナモジュール | |
WO2013094667A1 (ja) | 磁性体アンテナ、アンテナ装置及び電子機器 | |
JP2007214754A (ja) | アンテナ装置 | |
JP2007325054A (ja) | アンテナ装置 | |
WO2017018134A1 (ja) | 多層基板および電子機器 | |
US11942701B2 (en) | Module substrate antenna and module substrate using same | |
US20190266467A1 (en) | Rfid tag and article having rfid tag attached thereto | |
JP2013141164A (ja) | アンテナ装置および通信端末装置 | |
JP2015012137A (ja) | 電力伝送コイルユニット | |
US10020107B1 (en) | Hybrid inductor | |
JP5884538B2 (ja) | 表面実装型アンテナ | |
JP7013716B2 (ja) | Rfidタグおよびそれを備えた物品 | |
WO2015129598A1 (ja) | 積層型コイル素子、および、無線通信モジュール | |
JP6590119B1 (ja) | Rfidタグ及びrfid付き物品 | |
JP6303440B2 (ja) | インダクタ素子 | |
JP2015186011A (ja) | コイル素子および通信端末装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080027007.2 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10794217 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011520973 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10794217 Country of ref document: EP Kind code of ref document: A1 |