JP6637896B2 - 電子デバイス用の可撓性を有するマルチパート封止ハウジングを備えるコンフォーマルなicデバイス - Google Patents
電子デバイス用の可撓性を有するマルチパート封止ハウジングを備えるコンフォーマルなicデバイス Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
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- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
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Description
この出願は、2014年3月4日に出願され、あらゆる目的のために参照によりその全体が本明細書に組み込まれる、米国仮特許出願第61/947,709号明細書の優先権の利益を主張する。
Claims (19)
- コンフォーマルな集積回路(IC)デバイスであって、
フレキシブル基板と、
前記フレキシブル基板に取り付けられた電子回路と
内部に前記電子回路および前記フレキシブル基板を少なくとも概ね収容する可撓性を有するマルチパート封止ハウジングであって、第2の封止ハウジング部品に取り付けられた第1の封止ハウジング部品を含み、前記第1の封止ハウジング部品が内部に前記電子回路を取り付けるための少なくとも1つの第1の凹状領域を有し、前記第2の封止ハウジング部品が内部に前記フレキシブル基板を取り付けるための少なくとも1つの第2の凹状領域を有する、可撓性を有するマルチパート封止ハウジングと、を含み、
前記電子回路が、複数のデバイスアイランドと、前記複数のデバイスアイランドのうちの2つ以上を電気的に接続する複数の伸縮可能な電気的相互接続部を含む、コンフォーマルなICデバイス。 - 請求項1に記載のコンフォーマルなICデバイスであって、前記第1の封止ハウジング部品の前記少なくとも1つの第1の凹状領域が、内部に前記フレキシブル基板を取り付けるための少なくとも1つの凹状の基板領域を含む、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記電子回路が電気的に相互接続された複数のICデバイスを含み、前記少なくとも1つの第1の凹状領域が内部に前記ICデバイスを取り付けるための複数のポケットを含む、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記フレキシブル基板が1つまたは複数の貫通孔を有し、前記第1の封止ハウジング部品が第1の突起部を有し、前記第1の突起部が前記1つまたは複数の貫通孔の第1の孔の中へ突出することにより前記第1の封止ハウジング部品を前記フレキシブル基板および前記電子回路と整列させかつ連動させる、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記フレキシブル基板が1つまたは複数の貫通孔を有し、前記第2の封止ハウジング部品が第2の突起部を有し、前記第2の突起部が前記1つまたは複数の貫通孔の第2の孔を通過し前記第1の封止ハウジング部品における相補的な開口部と係合することにより前記第1および前記第2の封止ハウジング部品を前記フレキシブル基板および前記電子回路と整列させかつ連動させる、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記可撓性を有するマルチパート封止ハウジングが、少なくとも約20ショアAのデュロメータ硬度等級と、少なくとも約36.3kg/25mm(1インチあたり約80ポンド(ppi))の引裂強度とを有する、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記可撓性を有するマルチパート封止ハウジングが、伸縮性がありかつ曲げることが可能な非導電性材料から製造される、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記第1および前記第2の封止ハウジング部品が、液状射出成形(LIM)工程において液状シリコーンゴム(LSR)材料から成形される、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記第1および前記第2の封止ハウジング部品が、前記フレキシブル基板および前記電子回路が前記第1の封止ハウジング部品と前記第2の封止ハウジング部品の間に挟まれるように、互いに接着される、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記フレキシブル基板および前記電子回路が、協働して、フレキシブルプリント回路基板アセンブリ(FPCBA)を形成する、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記可撓性を有するマルチパート封止ハウジングが、前記フレキシブル基板および前記電子回路を密閉封止するように構成される、コンフォーマルなICデバイス。
- 請求項1に記載のコンフォーマルなICデバイスであって、前記電子回路が、少なくとも1つの感知デバイスと少なくとも1つのコントローラデバイスとを有する集積回路センサシステムを含む、コンフォーマルなICデバイス。
- 封止されたコンフォーマルな電子デバイスであって、
フレキシブルプリント回路基板(FPCB)と、
前記FPCB上に搭載される集積回路(IC)デバイスとして構成される、複数の表面実装技術(SMT)部品と、
2つ以上の前記SMT部品を電気的に接続している、複数の伸縮可能な電気的相互接続部と、
内部に前記FPCB、前記SMT部品、および前記複数の伸縮可能な電気的相互接続部を収容している、可撓性を有する2部構成の封止ハウジングであって、上部および底部のハウジングセグメントを含み、上部封止ハウジングセグメントが内部に前記SMT部品および前記複数の伸縮可能な電気的相互接続部を取り付けるための第1の予備作製された凹状領域を有し、底部封止ハウジングセグメントが内部に前記FPCBを取り付けるための第2の予備作製された凹状領域を有する、可撓性を有する2部構成の封止ハウジングと、を含む、封止されたコンフォーマルな電子デバイス。 - コンフォーマルな電子デバイスを封止するための方法であって、
上部の可撓性を有する封止ハウジング部品を成形するステップと、
底部の可撓性を有する封止ハウジング部品を成形するステップと、
組立治具に前記底部の可撓性を有する封止ハウジング部品を載置するステップと、
前記底部の可撓性を有する封止ハウジング部品上に接着剤の第1のショットを分配するステップと、
前記組立治具内で、接着剤の前記第1のショットおよび前記底部の可撓性を有する封止ハウジング部品の上に、フレキシブルプリント回路基板アセンブリ(FPCBA)を載置するステップと、
前記FPCBAおよび前記底部の可撓性を有する封止ハウジング部品上に、接着剤の第2のショットを分配するステップと、
前記組立治具内で、前記FPCBAおよび接着剤の前記第2のショットの上に、前記上部の可撓性を有する封止ハウジング部品を載置して、スタックを生成することにより、前記上部の可撓性を有する封止ハウジング部品と前記底部の可撓性を有する封止ハウジング部品の間に前記FPCBAを収容するステップと、を含み、
前記FPCBAが、フレキシブル基板と、伸縮可能な電気的相互接続部によって電気的に接続された複数のデバイスアイランドとを含み、前記上部の可撓性を有する封止ハウジング部品が、内部に前記フレキシブル基板を取り付けるための第1の凹状の基板領域を含む、方法。 - 請求項14に記載の方法であって、前記スタックに圧力を印加することにより室温においてまたは室温の近傍で前記接着剤を硬化させるステップを更に含む、方法。
- 請求項14に記載の方法であって、前記スタック上でダイカットを実施するステップを更に含む、方法。
- 請求項14に記載の方法であって、接着剤の前記第2のショットを分配するのに先立って、前記FPCBAの表面の部分を、接着を向上させるためにプライミングするステップを更に含む、方法。
- 請求項14に記載の方法であって、前記複数のデバイスアイランドが、電気的相互接続部を介して電気的に接続された複数の離間したICデバイスを含み、前記上部の可撓性を有する封止ハウジング部品が内部に前記ICデバイスおよび前記電気的相互接続部を取り付けるための複数のポケットを含む、方法。
- 請求項14に記載の方法であって、前記底部の封止ハウジング部品が、内部に前記フレキシブル基板を取り付けるための第2の凹状の基板領域を含む、方法。
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2015
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- 2015-03-04 WO PCT/US2015/018704 patent/WO2015134588A1/en active Application Filing
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US11963295B2 (en) | 2021-10-29 | 2024-04-16 | Industrial Technology Research Institute | Circuit apparatus, manufacturing method thereof and circuit system |
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EP3114911A4 (en) | 2017-11-22 |
JP2017507493A (ja) | 2017-03-16 |
EP3114911A1 (en) | 2017-01-11 |
WO2015134588A1 (en) | 2015-09-11 |
CN106063392B (zh) | 2020-06-02 |
CN106063392A (zh) | 2016-10-26 |
EP3114911B1 (en) | 2023-05-03 |
US20200281082A1 (en) | 2020-09-03 |
KR20160129007A (ko) | 2016-11-08 |
CA2940539C (en) | 2022-10-04 |
US20170223846A1 (en) | 2017-08-03 |
US10485118B2 (en) | 2019-11-19 |
CA2940539A1 (en) | 2015-09-11 |
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