CN108602299B - 用于电子设备外壳的多层结构 - Google Patents
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Abstract
在一个示例中,可公开一种用于电子设备的外壳,其可包括第一多层结构。所述第一多层结构可包括第一层和形成在所述第一层上的第二层。所述第一层和所述第二层中的每个均可包括在所述第一层和所述第二层的边缘上的多个凸出特征部和多个凹进特征部。一层的所述多个凹进特征部中的至少一个可与另一层的所述多个凸出特征部中的至少一个相交。
Description
技术领域
本公开涉及用于电子设备外壳的多层结构、用于电子设备的外壳和便携式电子设备。
背景技术
电子设备可包括用于封装或固定各种设备部件和电路的外壳。外壳的特性可能因设备而异。例如,用于计算机、电话和键盘的外壳通常是不同的,并且可以使用不同的材料和组装技术形成。
发明内容
根据本公开的一方面,提供一种用于电子设备的外壳,其包括:第一多层结构,包括:第一层;和形成在所述第一层上的第二层,其中所述第一层和所述第二层中的每个均包括在所述第一层和所述第二层的边缘上的多个凸出特征部和多个凹进特征部,其中一层的所述多个凹进特征部中的至少一个与另一层的所述多个凸出特征部中的至少一个相交。
根据本公开的另一方面,提供一种组件,其包括:第一多层结构,该第一多层结构包括:第一层;和一体形成在所述第一层上的第二层,其中所述第一层和所述第二层中的每个均包括在所述第一层和所述第二层的边缘上的至少一个凸出特征部和至少一个凹进特征部,其中一层的所述至少一个凹进特征部与另一层的所述至少一个凸出特征部相交;以及第二多层结构,经由所述第一层和所述第二层的边缘上的所述至少一个凸出特征部和所述至少一个凹进特征部结合到所述第一多层结构,以提供结合力。
根据本公开的又一方面,提供一种便携式电子设备,包括:至少一个电子部件;以及布置用以大致容纳所述至少一个电子部件的外壳,其中所述外壳包括:第一多层结构,包括:第一层,包括在所述第一层的边缘上的至少一个凸出特征部和至少一个凹进特征部;和一体形成在所述第一层上的第二层,其中所述第二层包括在所述第二层的边缘上的至少一个凸出特征部和至少一个凹进特征部,其中所述第一层的所述至少一个凹进特征部与所述第二层的所述至少一个凸出特征部相交。
附图说明
在以下详细描述中参考附图描述各示例,其中:
图1A是描绘多层结构的示例外壳的透视图;
图1B描绘图1所示的示例多层结构的一部分的俯视图;
图1C描绘图1所示的示例多层结构的一部分的仰视图;
图2描绘示例多层结构组件的透视图;和
图3描绘包括用多层结构组件形成的外壳的示例便携式电子设备。
具体实施方式
用于计算机、电话和键盘的外壳通常可以是不同的,并且可以使用不同的材料和组装技术形成。外壳可以由金属和塑料结合形成,以节省成本并使设备保持更轻。在一些电子设备中,外壳可以由金属和塑料结合形成,以允许无线天线信号的发送/接收。无论结构怎样变化,一些外壳通常可以由固定在一起的两个或更多个外壳部件形成,这可能由于外壳部件之间的材料结合力低于外部负载而导致外观问题(例如,结合可能随时间逐渐失效)。例如,在笔记本电脑中,由于外壳部件之间的嵌件成型拉链结构的间距较小、各种不同的外观涂装过程或在精加工过程中涉及的高温而可能引起外观问题。
在此描述的示例可以描述用于电子设备的外壳,其可包括第一多层结构和第二多层结构。在一个示例中,第一多层结构可包括第一层和形成在第一层上的第二层。第一层和第二层中的每个均可包括在第一多层结构的边缘上的多个凸出特征部和多个凹进特征部。第一层和第二层上的示例凸出特征部和凹进特征部可以是T形的、蘑菇形的、矩形的或其组合。
在一个示例中,一层的凹进特征部中的至少一个可以与另一层的凸出特征部中的至少一个相交。例如,第一层的至少一个凹进特征部可以与第二层的至少一个凸出特征部相交。第二多层结构可以通过第一多层结构的边缘上的多个凸出特征部和多个凹进特征部结合到第一多层结构,以在x、y和z方向上提供结合力。
第一层和第二层的相交部分可帮助约束第一层和第二层中的每个,并增强第一多层结构和第二多层结构之间的结合力。在此所述的多层结构还可防御外部负载,并因此可减少/克服外观问题。
图1A-图1C示出描绘多层结构102的示例外壳100。具体地,图1A是描绘多层结构102的示例外壳100的透视图。图1B描绘图1A中所示的示例多层结构102的一部分的俯视图。图1C描绘图1A中所示的示例多层结构102的一部分的仰视图。多层结构102可以例如表示用作电子设备的外壳的材料。外壳100可包括第一多层结构102。第一多层结构102可包括第一层106和形成在第一层106上的第二层104。例如,第一多层结构102的不同层可以由不同材料(例如,不同金属)或相同材料制成。作为外壳100的一部分的第一多层结构102可以是外壳100的边框部分、前部和/或后部。
第一层106可包括在第一层106的边缘上的凸出特征部112和凹进特征部114。第二层104可包括在第二层104的边缘上的凸出特征部108和凹进特征部110。在一个示例中,一层(例如,第一层106)的凹进特征部114中的至少一个可与另一层(例如,第二层104)的凸出特征部108中的至少一个相交(例如,在相交部分116所示)。在另一示例中,第一层106的凹进特征部114的至少一些部分可以与第二层104的凸出特征部108的至少一些部分重叠。第一层106和第二层104的凸出特征部108、112和凹进特征部110、114可形成双层拉链结构。在每层中,凹进特征部(例如,110、114)可被形成在两个凸出特征部(例如,108、112)之间以形成拉链结构。
此外,外壳100可包括第二多层结构(例如,如图2中所示的204)。在一个示例中,第二多层结构可以使用第一层106和第二层104的边缘上的凸出特征部108、112和凹进特征部110、114被结合到第一多层结构102。这在图2中详细解释。
现在参见图2,其描绘了示例多层结构组件200的透视图。组件200可包括第一多层结构202和第二多层结构204,第二多层结构204可被结合到第一多层结构202。第一多层结构202可包括第一层208和一体形成在第一层208上的第二层206。第一层208和第二层206可以是层压在一起的金属层。第一层208和第二层206可使用不同的金属。第一多层结构202可通过诸如压缩成型、铸造、压制成形、锻造和冲压之类的金属制造方法制成。
第一层208和第二层206中的每个均可包括在第一多层结构202的边缘上的至少一个凸出特征部210、214和至少一个凹进特征部212、216。第一层208的凸出特征部214可大致偏离于第二层206的凸出特征部210,并且第一层208的凹进特征部216可大致偏离于第二层206的凹进特征部212。在一个示例中,一层(例如,第一层208)的凹进特征部216可以与另一层(例如,第二层206)的凸出特征部210相交(例如相交部分218所示)。
第二多层结构204可以经由第一多层结构202的边缘上的凸出特征部210、214和凹进特征部212、216结合到第一多层结构202,以提供结合力。在一个示例中,第二多层结构204可被嵌件成型到第一多层结构202的边缘上的凸出特征部210、214和凹进特征部212、216上。第一多层结构202和第二多层结构204可以无间隙地接合在一起。例如,在嵌件成型过程中,金属多层结构(例如,202)可允许熔化的塑料多层结构(例如,204)流入凹进特征部中,并且当熔化的塑料多层结构处于该凹进特征部内部时,塑料可硬化,从而将塑料多层结构附接到金属多层结构。用于附接第一多层结构和第二多层结构的示例可以不限于嵌件成型,并且可以使用任何其它工艺(例如,超声波结合)来附接第一多层结构和第二多层结构,使得第一多层结构和第二多层结构可形成用于电子设备的外壳。
例如,第二多层结构204可包括第一层226和第二层228,第一层226和第二层228中的每个均具有凸出特征部220、224和凹进特征部222。第二多层结构204的凸出特征部220、224可被设置在第一多层结构202的对应的凹进特征部212、216内。类似地,第一多层结构202的凸出特征部210、214可被设置在第二多层结构204的第一层226和第二层228的对应的凹进特征部(例如,222)内。在图2所示的示例中,内层(例如,第一层226)的凹进特征部可能不可见。
第一多层结构202和第二多层结构204可由相同材料或不同材料制成。在一个示例中,第一多层结构202可由金属材料制成,并且第二多层结构204可由塑料材料制成。例如,第一多层结构202可由从由铝、镁、锂、锌、钛、铝合金、镁合金、锂合金、锌合金和钛合金组成的组中选择的金属材料制成。第二多层结构204可由从由液晶聚合物、聚苯硫醚和聚对苯二甲酸丁二醇酯组成的组中选择的塑料材料制成。而且,第二多层结构204的材料可被选择为与第一多层结构202的材料具有良好的结合能力。例如,塑料部分可大致是与金属主体的一个边缘相邻的长形部分。塑料部分可由能够与金属主体牢固结合的材料制成,例如,具有相对较低的收缩率和与第一多层结构202的金属材料的线膨胀系数大致相等的线膨胀系数的材料。例如,从金属部分的边缘延伸的凸出特征部(例如,210、214)可允许可模制塑料材料附着到该凸出特征部,因此,可具有增加的结合面积,该增加的结合面积允许可模制塑料材料结合到金属部分上。虽然图1和图2中的示例可将多层结构描述为包括两层,但是多层结构可以包括多于两层。
此外,可以在第一多层结构202和第二多层结构204上执行涂装过程以形成无影(shadowless)外壳。例如,涂装过程可包括粉末涂布、底基涂布和表层涂布(例如,涂料涂布)。
图3例示示例便携式电子设备300。电子设备300可包括基座304和显示器302。基座304可包括键盘、触摸板和其它电子部件,例如处理器、电池、存储器、主板等。基座304可包括布置用以大致容纳电子部件的外壳306。示例电子设备300可包括笔记本电脑、平板电脑、移动电话、媒体播放器、个人数字助理(PDA)等。
在一个示例中,外壳306可由第一多层结构308和使用嵌件成型工艺附接到第一多层结构308的第二多层结构310形成。第一多层结构308和第二多层结构310参照图1和图2描述。第一多层结构308可包括第一层,该第一层包括在第一层的边缘上的至少一个凸出特征部和至少一个凹进特征部。第一多层结构308可包括一体形成在第一层上的第二层。如图3所示,一旦外壳被制造,内层(例如第一层)可能不可见。第二层可包括在第二层的边缘上的至少一个凸出特征部312和至少一个凹进特征部314。第一层的凹进特征部可以与第二层的凸出特征部312相交/重叠。第二多层结构310可通过第一层和第二层的边缘上的凸出特征部和凹进特征部附接到第一多层结构308,以在x、y和z方向上提供结合力。例如,结合结构可防止第二多层结构(例如,塑料部分)沿X-轴、Y-轴和Z-轴相对于第一多层结构(例如,金属主体)移动。例如,在此所述的结合结构(例如,拉链结构)可提高金属结构和塑料结构之间的结合强度。例如,图3中的(例如通过凸出特征部312和316以及凹进特征部314和318形成的)多层结构可以为例示的目的示出,并且在对外壳306执行涂装过程后可能不可见。虽然图3描绘基座的顶部上的组装结构/结合结构,但是该组装结构可适用于电子设备的任何其它部分,诸如显示器盖、基座的底部等。
可以注意到,本方案的上述示例仅用于例示的目的。尽管该方案已经结合其具体实施例被描述,但是在不实质脱离在此描述的主题的教导和优点的情况下,可以进行多种修改。在不脱离本方案的精神的情况下,可以进行其它替换、修改和改变。本说明书中公开的所有特征(包括任何所附权利要求、摘要和附图),和/或如此公开的任何方法或过程的所有步骤可以以任意组合进行组合,除了其中至少一些这样的特征和/或步骤互斥的组合之外。
如在此所用,术语“包括”、“具有”及其变型具有与术语“包含”或其适当变型相同的含义。此外,如在此所用,术语“基于”表示“至少部分地基于”。因此,基于一些刺激描述的特征可基于该刺激或包括该刺激的刺激的组合。
已经参考前述示例示出并描述了本说明书。然而,应理解,在不脱离所附权利要求书中限定的本主题的精神和范围的情况下,可以做出其它形式、细节和示例。
Claims (15)
1.一种用于电子设备的外壳,包括:
第一多层结构,包括:
第一层;和
形成在所述第一层上的第二层,其中所述第一层和所述第二层中的每个均包括在所述第一层和所述第二层的边缘上的多个凸出特征部和多个凹进特征部,其中一层的所述多个凹进特征部中的至少一个与另一层的所述多个凸出特征部中的至少一个相交。
2.根据权利要求1所述的外壳,进一步包括:
使用所述第一层和所述第二层的边缘上的所述多个凸出特征部和所述多个凹进特征部结合到所述第一多层结构的第二多层结构。
3.根据权利要求2所述的外壳,其中所述第一多层结构和所述第二多层结构由相同材料或不同材料制成。
4.根据权利要求2所述的外壳,其中所述第二多层结构由从由液晶聚合物、聚苯硫醚和聚对苯二甲酸丁二醇酯组成的组中选择的塑料材料制成。
5.根据权利要求1所述的外壳,其中所述第一多层结构由从由铝、镁、锂、锌、钛、铝合金、镁合金、锂合金、锌合金和钛合金组成的组中选择的金属材料制成。
6.根据权利要求1所述的外壳,其中所述第一层和所述第二层的所述多个凸出特征部和所述多个凹进特征部形成双层拉链结构。
7.一种组件,包括:
第一多层结构,包括:
第一层;和
一体形成在所述第一层上的第二层,其中所述第一层和所述第二层中的每个均包括在所述第一层和所述第二层的边缘上的至少一个凸出特征部和至少一个凹进特征部,其中一层的所述至少一个凹进特征部与另一层的所述至少一个凸出特征部相交;以及
第二多层结构,经由所述第一层和所述第二层的边缘上的所述至少一个凸出特征部和所述至少一个凹进特征部结合到所述第一多层结构,以提供结合力。
8.根据权利要求7所述的组件,其中所述第二多层结构被嵌件成型到所述第一层和所述第二层的边缘上的所述至少一个凸出特征部和所述至少一个凹进特征部上。
9.根据权利要求7所述的组件,其中所述第一多层结构由金属材料制成。
10.根据权利要求7所述的组件,其中所述第二多层结构由塑料材料制成。
11.根据权利要求7所述的组件,其中所述第一层的所述至少一个凸出特征部偏离于所述第二层的所述至少一个凸出特征部。
12.根据权利要求7所述的组件,其中所述第一层的所述至少一个凹进特征部偏离于所述第二层的所述至少一个凹进特征部。
13.一种便携式电子设备,包括:
至少一个电子部件;以及
布置用以大致容纳所述至少一个电子部件的外壳,其中所述外壳包括:
第一多层结构,包括:
第一层,包括在所述第一层的边缘上的至少一个凸出特征部和至少一个凹进特征部;和
一体形成在所述第一层上的第二层,其中所述第二层包括在所述第二层的边缘上的至少一个凸出特征部和至少一个凹进特征部,其中所述第一层的所述至少一个凹进特征部与所述第二层的所述至少一个凸出特征部相交。
14.根据权利要求13所述的便携式电子设备,其中所述外壳包括:
第二多层结构,该第二多层结构通过所述第一层和所述第二层的边缘上的所述至少一个凸出特征部和所述至少一个凹进特征部附接到所述第一多层结构,以在x、y和z方向上提供结合力。
15.根据权利要求13所述的便携式电子设备,其中所述第一层的所述至少一个凸出特征部偏离于所述第二层的所述至少一个凸出特征部,并且其中所述第一层的所述至少一个凹进特征部偏离于所述第二层的所述至少一个凹进特征部。
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TW201740782A (zh) | 2017-11-16 |
US20190016082A1 (en) | 2019-01-17 |
TWI630859B (zh) | 2018-07-21 |
EP3439863A4 (en) | 2019-11-13 |
EP3439863B1 (en) | 2021-03-03 |
CN108602299A (zh) | 2018-09-28 |
WO2017176250A1 (en) | 2017-10-12 |
US10543657B2 (en) | 2020-01-28 |
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