m4333 100年04月15日核正替換寊 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子裝置殼體及其製造方法。 【先前技林ί】 [0002] 隨著電子技術之迅速發展，筆記本電腦、移動電話、個 人數位助理（PDA)等電子裝置得到了越來越廣泛地應用 。同時，人們對於電子裝置之外觀要求亦越來越高。電 子裝置殼體一般由金屬或塑膠製成，由於金屬殼體具有 強度高、電磁遮罩效果好等特點而被廣泛應用於電子裝 置中。 [〇〇〇3]當採用金屬殼體時，為了防_*^^_號收發， 電子裝置殼體之天線蓋部位，然後藉 ·?. ·>*ΐ .·· ^3,- ·'.· · >： I \···'- 由卡勾卡合或鉚接等方式將塑膠製造之天線蓋固定於金 屬殼體上即可。惟，卡勾卡合及鉚接之方式容易產生間 隙大、易鬆動等缺陷，而影響產品強度。隨著電子產品 曰趨輕、薄、短、小之發展趨勢，電子裝置殼體之厚度 亦將越來越趨向於薄型化，當電子裝置殼體之厚度減小 到一定程度，採用卡勾卡合及鉚接之方式容易產生斷裂 應力而影響產品之強度。上述結合方式之缺陷及局限性 會伴隨電子產品薄型化之趨勢愈發突出。 【發明内容】 [0004] 鑒於上述狀況，有必要提供一種電子裝置殼體及其製造 方法，尤其係一種強度高且適於薄型化設計之電子裝置 殼體及其製造方法。 [0005] 一種電子裝置殼體，包括金屬本體及塑膠天線蓋，該金 097117990 表單編號A0101 第4頁/共17頁 1003128718-0 1344333 _-_ 100年04月15日梭正替换頁 屬本體之一側邊相鄰間隔地設置有複數扣合部，塑膠天 線蓋採用嵌入成型技術一體成型於金屬本體設置有扣合 部之一側邊處，且該金屬本體與該塑膠天線蓋結合處形 成複數相互間隔設置的扣合結構。 [0006] —種電子裝置殼體之製造方法，包括以下步驟：提供一 金屬本體且該金屬本體之一側邊處相鄰間隔地形成有複 數扣合部；將該金屬本體作為嵌件，藉由嵌入成型技術 將一塑膠天線蓋與該金屬本體一體成型，同時該金屬本 體與該塑膠天線蓋結合處形成複數相互間隔設置的扣合 結構。 [0007] 上述電子裝置殼體之金屬本體與塑膠天線蓋之結合處形 成有至少一扣合結構，從而使得金屬本體與塑膠天線蓋 ' 具有較高之結合強度。另，由於嵌入成型技術可以滿足 較為多樣化之產品設計需求，適於製造具有較薄厚度之 電子裝置殼體，同時金屬本體與塑膠天線蓋結合處之扣 合結構可保證較薄之電子裝置殼體具有較高之強度。 【實施方式】 [0008] 下面將結合附圖及較佳實施例對本發明之電子裝置殼體 及其製造方法作進一步之詳細說明。 [0009] 請參見圖1，所示為本發明較佳實施例之電子裝置殼體10 ，其包括一金屬本體11及一塑膠天線蓋12。 [0010] 金屬本體11大體為一矩形金屬蓋板，其一側邊設置有複 數扣合部110，用以於成型過程中與塑膠天線蓋12緊密扣 合而形成扣合結構。金屬本體11採用合金材料製造，優 097117990 表單編號A0101 第5頁/共17頁 1003128718-0 1344333 100年04月15日修正 選採用鎂合金、鋁合金或鈦合金製造。 [0011] 塑膠天線蓋12大體為一長條狀蓋板，其可成型於金屬本 體11設置有扣合部11 〇之一側邊處。塑膠天線蓋1 2之材料 要求與金屬本體11之材料具有較好之融合性，例如具有 較小之縮水率及與金屬本體11之材料近似之線膨脹係數 。故，塑膠天線蓋12優選採用液晶高分子聚合物（LCP) 、聚苯硫醚（PPS)、聚對苯二甲酸丁二醇酯（PBT)等工 程塑料製造。 [0012] 請同時參見圖2與圖3，電子裝置殼體10之金屬本體11與 塑膠天線蓋12之結合處貼合緊炙，擧間隙存在。同時， 為了增強金屬本體11與塑_議罐蓋結霉知度，其結 •n 馨:^ ' v ::Γ” 合處形成有第一扣合結構、第三扣 合結構15以及第四扣合結構16。 [0013] 該電子裝置殼體10之製造方法包括以下步驟： [0014] (1)提供一金屬本體11且金屬本體11之一側邊處形成至 少一扣合部110。提供金屬本體11之方法可為：利用鑄造 、擠出、鍛造、沖壓等各種金屬生產方法製備金屬本體 11，優選採用壓鑄方法製備該金屬本體u ◊扣合部110可 採用數控機床（Computer Number Control，CNC)加工 形成，亦可於採用鑄造方式製備金屬本體丨丨之過程中直 接形成。 [0015] (2)將金屬本體11作為嵌件，藉由嵌入成型技術將一塑 膠天線蓋12與该金屬本體11 一體成型，同時金屬本體η 與塑耀天線蓋12結合處形成至少一扣合結構。即將該金 097117990 表單編號Α0101 第6頁/共17頁 1003128718-0 1344333 100年04月15日修正替換頁 屬本體11作為嵌件放入射出成型模具之模腔内，然後將 溶融之塑膠注入射出成型模具之模腔内，熔融之塑膠與 金屬本體11接合固化即形成塑膠天線蓋12。同時，熔融 之塑膠注入扣合部1 10内或包覆扣合部1〗〇，而於金屬本 體11與塑膠天線蓋12之結合處形成該第一扣合結構13、 第二扣合結構14、第三扣合結構15以及第四扣合結構16 〇 [0016] 可以理解，步驟（1)後，可首先對金屬本體n進行打磨去 除毛邊，並對金屬本體11進行化學處理，如微弧氧化、 陽極氧化等，用以於金屬本體11與塑膠天線蓋12之結合 面上形成一層接合膜’從而增強其結合力。步驟（2)後， 可對一體成型後之金屬本體11及塑膠天線蓋12進行打磨 ，去除塑膠天線蓋12之澆口及毛邊。為了使電子裝置殼 體10之外形更為美觀，還可對電子裝置殼體1〇之外表面 進行塗裝》 [0017] 請同時參見圖3與圖4，第一扣合結構13藉由以下方式形 成：採用數控機床於金屬本體11之一側邊處加工形成至 少一階梯孔111，階梯孔111位於電子裝置殼體1〇内表面 一端之孔徑大於位於電子裝置殼體1〇外表面一端之孔徑 ;嵌入成型時，熔融之塑膠流入階梯孔1丨丨中並將階梯孔 111充滿，冷卻後即於金屬本體11與塑膠天線蓋12之結合 處形成第一扣合結構13。第一扣合結構13可實現塑膠天 線蓋12相對於金屬本體11於X、γ、z三方向上之定位。 請同時參見圖3與圖5，第二扣合結構14藉由以下方式形 成：採用數控機床於金屬本體11之一侧邊處加工形成至 097117990 1003128718-0 表單編珑A010I 第7頁/共17頁 [0018] 1344333 100年04月15日修正替換亩 少一卡勾112 ;嵌入成型時，熔融之塑膠包覆該卡勾112 ，冷卻後即於金屬本體】1與塑膠天線蓋12之結合處形成 第二扣合結構14。第二扣合結構14可實現塑膠天線蓋12 相對於金屬本體11於X、Y二方向上之定位。 [0G19] 請同時參見圖3與圖6，第三扣合結構1 5藉由以下方式形 成：採用數控機床於金屬本體11之一側邊處加工形成至 少一通孔113 ;嵌入成型時，熔融之塑膠流入通孔丨13内 並將通孔113充滿’冷卻後即於金屬本體11與塑膠天線蓋 12之結合處形成第三扣合結構15。第三扣合結構15可實 現塑膠天線蓋12相對於金屬本體11於χ、γ、ζ三方向上之 七，»·'·- »· .. ‘ - 定位。 _ f:广： [〇〇2〇] 請同時參見圖3與圖7，第四 成：採用數控機床於金屬本體11之一側邊處加工形成至 少一凸台114,該凸台114上形成有二卡勾1141 ;嵌入成 型時，熔融之塑膠包覆該凸台114之外表面，並包覆二卡 勾1141 ’冷卻後即於金屬本體11與塑膠天線蓋12之結合 處形成第四扣合結構16。第四扣合結構1.6可實現塑膠天 線蓋12相對於金屬本體丨丨於乂、γ、z三方向上之定位。 [0021] 可以理解，階梯孔111、卡勾112、通孔113以及凸台114 除採用數控機床加工形成以外，亦可於採用鑄造方式製 饰:屬令姐1 1之過程中直接形成„ [0022] 由於電子裝置殼體10之金屬本體11與塑膠天線蓋12之結 合處开> 成有複數第一扣合結構13、第二扣合結構14、第 二扣合結構15以及第四扣合結構16，從而使得金屬本體 097117990 表單編號Α0101 第8頁/共17頁 1003128718-0 1344333 __ 100年04月15日修正替換頁 11與塑勝天線蓋12具有較高之結合強度。且由於嵌入成 型技術可以滿足較為多樣化之產品設計需求，適於製造 具有較薄厚度之電子裝置殼體，同時金屬本體11與塑膠 天線蓋12結合處之第一扣合結構13、第二扣合結構丨4、 第三扣合結搆15以及第四扣合結構16可保證較薄之電子 裝置殼體具有較高之強度。 [0023] 可以理解，根據產品之設計要求，金屬本體11與塑膠天 線蓋12結合處可選用第一扣合結構13 '第二扣合結構14 、第二扣合結構15以及第四扣合結構16中之至少一種或 其組合《同時，扣合部110除階梯孔111、卡勾112、通 孔113以及凸台11 4以外還可變更為其他結構，以滿足產 • 品多樣化之結合方式。 [0024] 綜上所述，本發明確已符合發明專利要件，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施例， 舉凡熟悉本案技藝之人士，於援依本案發明精神所作之 等效修飾或變化，皆應包含於以下之申請專利範圍内β 【圖式簡單說明】 [0025] 圖1係本發明電子裝置殼體之立體分解圖。 [0026] 圖2係本發明電子裝置殼體之立體組裝圖。 [0027] 圖3係圖2所示電子裝置殼體另一方向之局部放大圖ρ [讎]圖4係圖3所示電子裝置殼體沿IV-IV線之局部剖視圖。 [0029] 圖5係圖3所示電子裝置殼體沿V-V線之局部剖視圖。 [0030] 圖6係圖3所示電子裝置殼體沿VI-V1線之局部剖視圓。 097117990 表單編號Α0101 第9頁/共17頁 1003128718-0 «44333 100年04月15日核正替换亥 [0031] 圖7係圖3所示電子裝置殼體沿V I I -V I I線之局部剖視圖 〇 【主要元件符號說明】 [0032] 電子裝置殼體 ：10 [0033] 金屬本體：11 [0034] 扣合部：110 [0035] 塑膠天線蓋： 12 [0036] 第一扣合結構 ：13 [0037] 第二扣合結構 ：14 [0038] 第三扣合結構 ：15 [0039] 第四扣合結構 :16 [0040] 階梯孔：111 [0041] 卡勾：112 [0042] 通孔：113 [0043] 凸台：114 [0044] 卡勾：1141 097117990 表單編號A0101 第10頁/共17頁 1003128718-0M4333 April 15th, 100th, nuclear replacement 寊 6. Description of the invention: [Technical field of invention] [0001] The present invention relates to an electronic device housing and a method of manufacturing the same. [Previous Technology] [0002] With the rapid development of electronic technology, electronic devices such as notebook computers, mobile phones, and PDAs have become more and more widely used. At the same time, people are increasingly demanding the appearance of electronic devices. The housing of the electronic device is generally made of metal or plastic, and is widely used in electronic devices due to its high strength and good electromagnetic shielding effect. [〇〇〇3] When using a metal case, in order to prevent the _*^^_ number from being transmitted and received, the antenna cover part of the electronic device housing is then borrowed. ···gt;*ΐ .·· ^3,- '.· · >: I \···'- The plastic antenna cover can be fixed to the metal case by snapping or riveting. However, the manner in which the hooks are engaged and riveted is prone to defects such as large gaps and looseness, which affect the strength of the product. As electronic products become lighter, thinner, shorter, and smaller, the thickness of the electronic device housing will become thinner and thinner. When the thickness of the electronic device housing is reduced to a certain extent, the card is used. The method of jointing and riveting is prone to break stress and affects the strength of the product. The shortcomings and limitations of the above-mentioned combination methods are accompanied by the trend of thinning electronic products. SUMMARY OF THE INVENTION In view of the above circumstances, it is necessary to provide an electronic device housing and a method of manufacturing the same, and more particularly to an electronic device housing having high strength and being suitable for a thin design and a method of manufacturing the same. [0005] An electronic device housing comprising a metal body and a plastic antenna cover, the gold 097117990 Form No. A0101 Page 4 of 17 page 1003128718-0 1344333 _-_ 100 years on April 15th, the shuttle is replacing the page body A plurality of fastening portions are disposed adjacent to one side of the one side, and the plastic antenna cover is integrally formed on the side of the metal body provided with the fastening portion by insert molding technology, and the metal body and the plastic antenna cover are combined to form a plurality of portions A snap-fit structure that is spaced apart from each other. [0006] A method of manufacturing an electronic device housing, comprising the steps of: providing a metal body and forming a plurality of fastening portions adjacent to each other at one side of the metal body; and using the metal body as an insert A plastic antenna cover is integrally formed with the metal body by an insert molding technique, and a joint structure of the plurality of mutually spaced apart structures is formed at a joint of the metal body and the plastic antenna cover. [0007] The combination of the metal body of the electronic device housing and the plastic antenna cover forms at least one fastening structure, so that the metal body and the plastic antenna cover have a high bonding strength. In addition, since the insert molding technology can meet a variety of product design requirements, it is suitable for manufacturing an electronic device housing having a relatively thin thickness, and the fastening structure of the joint between the metal body and the plastic antenna cover can ensure a thin electronic device housing. The body has a higher strength. [Embodiment] Hereinafter, an electronic device casing and a method of manufacturing the same according to the present invention will be further described in detail with reference to the accompanying drawings and preferred embodiments. Referring to FIG. 1, an electronic device housing 10 according to a preferred embodiment of the present invention includes a metal body 11 and a plastic antenna cover 12. [0010] The metal body 11 is generally a rectangular metal cover plate, and a plurality of fastening portions 110 are disposed at one side thereof for tightly engaging the plastic antenna cover 12 during the molding process to form a fastening structure. The metal body 11 is made of an alloy material, excellent 097117990 Form No. A0101 Page 5 of 17 1003128718-0 1344333 Correction of April 15, 2014 It is made of magnesium alloy, aluminum alloy or titanium alloy. [0011] The plastic antenna cover 12 is generally a long strip-shaped cover which can be formed at a side of the metal body 11 provided with one of the engaging portions 11 . The material of the plastic antenna cover 12 is required to have a good fusion with the material of the metal body 11, for example, a small shrinkage ratio and a linear expansion coefficient similar to that of the metal body 11. Therefore, the plastic antenna cover 12 is preferably made of a process plastic such as liquid crystal polymer (LCP), polyphenylene sulfide (PPS), or polybutylene terephthalate (PBT). [0012] Referring to FIG. 2 and FIG. 3 at the same time, the joint of the metal body 11 of the electronic device housing 10 and the plastic antenna cover 12 is closely attached, and a gap exists. At the same time, in order to enhance the moldy degree of the metal body 11 and the plastic can lid, the knot is formed by the first fastening structure, the third fastening structure 15 and the fourth. The fastening structure of the electronic device housing 10 includes the following steps: [0014] (1) A metal body 11 is provided and at least one fastening portion 110 is formed at one side of the metal body 11. The method of the metal body 11 may be: preparing the metal body 11 by various metal production methods such as casting, extrusion, forging, stamping, etc., preferably by using a die casting method to prepare the metal body. The ◊ fastening portion 110 may be a CNC machine tool (Computer Number Control, The CNC is formed by machining, and can also be directly formed in the process of preparing the metal body by casting. [0015] (2) Using the metal body 11 as an insert, a plastic antenna cover 12 and the metal are formed by insert molding technology. The body 11 is integrally formed, and at least a fastening structure is formed at the joint of the metal body η and the glare antenna cover 12. The gold 097117990 form number Α 0101 page 6 / 17 pages 1003128718-0 1344333 revised on April 15, 100 The sheet changing body 11 is placed as an insert into the cavity of the molding die, and then the molten plastic is injected into the cavity of the injection molding die, and the molten plastic is bonded to the metal body 11 to form a plastic antenna cover 12. At the same time, the melting The first injection structure 13 , the second fastening structure 14 , and the third portion are formed in the metal injection 11 and the plastic antenna cover 12 at the junction of the metal body 11 and the plastic antenna cover 12 . The fastening structure 15 and the fourth fastening structure 16 〇 [0016] It can be understood that after the step (1), the metal body n can be first polished to remove the burrs, and the metal body 11 is chemically treated, such as micro-arc oxidation, anode Oxidation, etc., for forming a bonding film on the bonding surface of the metal body 11 and the plastic antenna cover 12 to enhance the bonding force. After the step (2), the integrally formed metal body 11 and the plastic antenna cover 12 can be performed. Grinding, removing the gate and the burr of the plastic antenna cover 12. In order to make the electronic device casing 10 more beautiful, the outer surface of the electronic device casing 1 can be painted. [0017] Please also refer to FIG. 4, the first fastening structure 13 is formed by processing at least one stepped hole 111 at one side of the metal body 11 by using a numerical control machine tool, and the stepped hole 111 is located at an end of the inner surface of the inner surface of the electronic device housing 1 The hole is larger than the one end of the outer surface of the outer casing of the electronic device casing; when insert molding, the molten plastic flows into the stepped hole 1丨丨 and fills the stepped hole 111, and is cooled at the junction of the metal body 11 and the plastic antenna cover 12 The first fastening structure 13 is formed. The first fastening structure 13 can position the plastic antenna cover 12 relative to the metal body 11 in three directions of X, γ, and z. Referring to FIG. 3 and FIG. 5 simultaneously, the second fastening structure 14 is formed by machining a side surface of the metal body 11 to a 097117990 1003128718-0 by a numerically controlled machine tool. Form Editing A010I Page 7 of 17 Page [0018] 1344333 On April 15, 100, the replacement of the mu is less than one card hook 112; when insert molding, the molten plastic covers the hook 112, and after cooling, the joint between the metal body 1 and the plastic antenna cover 12 A second fastening structure 14 is formed. The second fastening structure 14 can position the plastic antenna cover 12 relative to the metal body 11 in the X and Y directions. [0G19] Please refer to FIG. 3 and FIG. 6 at the same time, the third fastening structure 15 is formed by forming at least one through hole 113 at one side of the metal body 11 by using a numerical control machine tool; The plastic flows into the through hole 13 and fills the through hole 113 to form a third fastening structure 15 at the junction of the metal body 11 and the plastic antenna cover 12 after cooling. The third fastening structure 15 can realize the seventh of the plastic antenna cover 12 with respect to the metal body 11 in the directions of χ, γ, ζ, »···· »·.. ‘- positioning. _ f: wide: [〇〇2〇] Please refer to FIG. 3 and FIG. 7 at the same time, and the fourth embodiment: at least one boss 114 is formed on one side of the metal body 11 by using a numerical control machine tool, and the boss 114 is formed. There is two hooks 1141; during the insert molding, the molten plastic covers the outer surface of the boss 114, and is covered with the two hooks 1141' to form a fourth buckle at the junction of the metal body 11 and the plastic antenna cover 12 after cooling. Structure 16. The fourth fastening structure 1.6 can realize the positioning of the plastic antenna cover 12 in the three directions of 乂, γ, and z with respect to the metal body. [0021] It can be understood that the stepped hole 111, the hook 112, the through hole 113, and the boss 114 are formed by using a numerically-controlled machine tool, and can also be formed by casting: directly formed in the process of the sister 1 1 [ 0022] Since the joint of the metal body 11 of the electronic device housing 10 and the plastic antenna cover 12 is opened, the first first fastening structure 13, the second fastening structure 14, the second fastening structure 15, and the fourth buckle are formed. Structure 16 so that the metal body 097117990 Form No. 1010101 Page 8 of 17 Page 1003128718-0 1344333 __ Correction replacement page 11 of April 15 has a higher bonding strength with the plastic antenna cover 12, and due to embedding The molding technology can meet the requirements of more diversified product design, and is suitable for manufacturing the electronic device housing having a relatively thin thickness, and the first fastening structure 13 and the second fastening structure of the metal body 11 and the plastic antenna cover 12 are combined. 4. The third fastening structure 15 and the fourth fastening structure 16 can ensure a relatively high strength of the thin electronic device housing. [0023] It can be understood that the metal body 11 and the plastic antenna cover 12 according to the design requirements of the product. At least one of the first fastening structure 13 'the second fastening structure 14 , the second fastening structure 15 and the fourth fastening structure 16 or a combination thereof may be selected at the joint portion. Meanwhile, the fastening portion 110 has a stepped hole 111 , In addition to the hook 112, the through hole 113, and the boss 11 4, other structures can be changed to meet the diversified combination of products and products. [0024] In summary, the present invention has indeed met the requirements of the invention patent, The patent application is filed. The above is only the preferred embodiment of the present invention. Those skilled in the art will be able to include the equivalent modifications or variations of the invention in the spirit of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0025] Fig. 1 is an exploded perspective view of an electronic device housing of the present invention. [0026] Fig. 2 is an assembled perspective view of an electronic device housing of the present invention. [0027] FIG. FIG. 4 is a partial cross-sectional view of the electronic device housing of FIG. 3 taken along the line IV-IV. [0029] FIG. A partial cross-sectional view of the body along the VV line. [0030] FIG. 6 is a diagram of FIG. Part of the sub-device housing along the line VI-V1. 097117990 Form No. 1010101 Page 9 of 17 1003128718-0 «44333 April 15th, 100th Nuclear Replacement [0031] Figure 7 is Figure 3 A partial cross-sectional view of the electronic device housing along the line VII-VII 〇 [Main component symbol description] [0032] Electronic device housing: 10 [0033] Metal body: 11 [0034] Fastening portion: 110 [0035] Plastic antenna cover : 12 [0036] First fastening structure: 13 [0037] Second fastening structure: 14 [0038] Third fastening structure: 15 [0039] Fourth fastening structure: 16 [0040] Stepped hole: 111 [ 0041] Card hook: 112 [0042] Through hole: 113 [0043] Boss: 114 [0044] Card hook: 1141 097117990 Form number A0101 Page 10 of 17 1003128718-0