CN101573009A - Electronic device shell and manufacturing method thereof - Google Patents

Electronic device shell and manufacturing method thereof Download PDF

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Publication number
CN101573009A
CN101573009A CN200810301382.6A CN200810301382A CN101573009A CN 101573009 A CN101573009 A CN 101573009A CN 200810301382 A CN200810301382 A CN 200810301382A CN 101573009 A CN101573009 A CN 101573009A
Authority
CN
China
Prior art keywords
electronic device
metal body
case
plastic antennas
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200810301382.6A
Other languages
Chinese (zh)
Inventor
李翰明
洪志谦
周祥生
张清贤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN200810301382.6A priority Critical patent/CN101573009A/en
Priority to US12/187,396 priority patent/US20090267266A1/en
Priority to JP2008243363A priority patent/JP2009262530A/en
Publication of CN101573009A publication Critical patent/CN101573009A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention discloses an electronic device shell, which comprises a metal body and a plastic antenna cover; the metal body and the plastic antenna cover are formed integrally by insert molding technology; and the outer surface of a combined position of the metal body and the plastic antenna cover is a smooth surface on which a connected coating is formed. The invention also provides a manufacturing method for the electronic device shell, which comprises the following steps: providing the metal body; and taking the metal body as an insert part, integrally forming the plastic antenna cover and the metal body by the insert molding technology, and making the outer surface of the combined position of the metal body and the plastic antenna cover be the smooth surface; and coating the outer surface of the integrally formed electronic device shell to form the connected coating on the smooth surface. The electronic device shell has the advantages of high strength, beautiful appearance and suitability for thinning design.

Description

Case of electronic device and manufacture method thereof
Technical field
The present invention relates to a kind of case of electronic device and manufacture method thereof.
Background technology
Along with developing rapidly of electronic technology, electronic installations such as notebook computer, mobile phone, PDA(Personal Digital Assistant) have obtained application more and more widely.Simultaneously, people are also more and more higher for the appearance requirement of electronic installation.Case of electronic device is generally made by metal or plastics, is widely used in the electronic installation owing to metal shell has characteristics such as intensity height, effectiveness be good.
When adopting metal shell, influence signal transmitting and receiving in order to prevent electromagnetic shielding, the plastics manufacturing is adopted at the antenna cover position of case of electronic device usually, engages by trip then or mode such as riveted joint is fixed in the antenna cover of plastics manufacturing on the metal shell and gets final product.Yet trip engaging and riveted way are easy to generate big, the easy defective such as loosening in gap, and influence the intensity and the outward appearance of product.Along with light, thin, short, the little day by day development trend of electronic product, the thickness of case of electronic device also will more and more trend towards slimming, when the thickness of case of electronic device is reduced to a certain degree, adopts trip engaging and riveted way to be easy to generate fracture strength and influence the intensity of product.The defective of above-mentioned combination and limitation can follow the trend of electronic product slimming more outstanding.
Summary of the invention
In view of above-mentioned condition, be necessary to provide a kind of case of electronic device and manufacture method thereof, especially a kind of intensity height, good looking appearance and be suitable for the case of electronic device and the manufacture method thereof of slimming design.
A kind of case of electronic device comprises metal body and plastic antennas lid, and this metal body and this plastic antennas lid adopt the embedding forming technique one-body molded, and the outer surface of its junction is an even surface, and is formed with a coating that links up on this even surface.
A kind of manufacture method of case of electronic device may further comprise the steps: a metal body is provided; This metal body is as inserts, one-body molded with this metal body with a plastic antennas lid by embedding forming technique, and the outer surface of the junction of this metal body and this plastic antennas lid is an even surface; The outer surface of the case of electronic device to this after one-body molded carries out application, and forms a coating that links up on this even surface.
The metal body of above-mentioned case of electronic device and plastic antennas lid are one-body molded by embedding forming technique, have higher binding strength.And the outer surface of the junction of metal body and plastic antennas lid is an even surface; and be formed with a coating that links up; this coating plays protection and decoration function to case of electronic device, makes the junction of metal body and plastic antennas lid can't see joint mark, and product design is attractive in appearance.Simultaneously, embed forming technique and can satisfy comparatively diversified product design demand, be suitable for making the case of electronic device that has than minimal thickness.
Description of drawings
Fig. 1 is the three-dimensional exploded view of case of electronic device of the present invention.
Fig. 2 is the front schematic view of case of electronic device of the present invention after one-body molded.
Fig. 3 is the partial perspective cutaway view of case of electronic device shown in Figure 2.
Fig. 4 is the schematic rear view of case of electronic device of the present invention after one-body molded.
Fig. 5 is the partial enlarged drawing of case of electronic device other direction shown in Figure 4.
Fig. 6 is the partial sectional view of case of electronic device shown in Figure 5 along the VI-VI line.
Fig. 7 is the partial sectional view of case of electronic device shown in Figure 5 along the VII-VII line.
Fig. 8 is the partial sectional view of case of electronic device shown in Figure 5 along the VIII-VIII line.
Fig. 9 is the partial sectional view of case of electronic device shown in Figure 5 along the IX-IX line.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment case of electronic device of the present invention and manufacture method thereof are described in further detail.
See also Fig. 1, be depicted as the case of electronic device 10 of preferred embodiment of the present invention, it comprises a metal body 11 and plastic antennas lid 12.
Metal body 11 is roughly a rectangular metal cover plate, and an one side is provided with some buckling partss 110, in order to closely to fasten and the formation fastening structure with plastic antennas lid 12 in forming process.Metal body 11 adopts the alloy material manufacturing, preferably adopts magnesium alloy, aluminium alloy or titanium alloy manufacturing.
Plastic antennas lid 12 is roughly a rectangular dress cover plate, its plastic side edge that is provided with buckling parts 110 in metal body 11.The material requirements of plastic antennas lid 12 and the material of metal body 11 have amalgamation preferably, for example have less washing shrinkage and with the coefficient of linear expansion of the material proximate of metal body 11.Therefore, plastic antennas lid 12 preferred employing polymeric liquid crystal copolymers (LCP), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) engineering plastics manufacturings such as (PBT).
Please be simultaneously referring to Fig. 2 and Fig. 3, the metal body 11 of case of electronic device 10 is an even surface with the outer surface of the junction of plastic antennas lid 12, and is formed with a coating 13 that links up, and makes the metal body 11 and the junction of plastic antennas lid 12 can't see joint mark.Simultaneously, metal body 11 is a step surface 14 with the faying face of plastic antennas lid 12, and employing step surface 14 can effectively increase the bonded area between metal body 11 and the plastic antennas lid 12, thereby helps to improve its bond strength.
The thickness of coating 13 is 30 microns to 90 microns, and its main component comprises film forming matter, pigment and solvent, auxiliary agent etc.Film forming matter is mainly resin, and is optional from polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS), polyurethane (PU), Lauxite (UF), phenolic resins (PF), ethene rubber (ER), acrylonitrile-butadiene propylene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polycarbonate (PC), polytetrafluoroethylene (PTFE), polyimides (PI) etc.Pigment can be selected from titanium dioxide, carbon black and iron oxide red etc.Solvent is optional from organic solvent, as organic solvents such as ethanol, acetone, lipid and benzene classes.Auxiliary agent can be blowing agent, plasticizer, lubricant, stabilizer, fire retardant, colorant, crosslinking agent etc., in order to improve the individual features of coating.For example, add blowing agent and can change characteristics such as the density, hardness, sound insulation, absorbing of coating, heat insulation and light weight.Adding fire retardant can make coating produce anti-combustion characteristic.
The manufacture method of above-mentioned case of electronic device 10 may further comprise the steps:
(1) provides a metal body 11.Provide the method for this metal body 11 can be: utilize cast, extrude, various Metal Production methods such as forging, punching press prepare this metal body 11, preferably adopt pressure casting method to prepare this metal body 11.
(2) with metal body 11 as inserts, by embedding forming technique that a plastic antennas lid 12 is one-body molded with this metal body 11, and the outer surface of metal body 11 and the junction of plastic antennas lid 12 is an even surface.Be about to metal body 11 and put into the die cavity of ejection shaping die as inserts, the plastics with fusion inject in the die cavity of ejection shaping die then, and the plastics of fusion engage curing and promptly form plastic antennas and cover 12 with metal body 11.
(3) outer surface to the case of electronic device after one-body molded 10 carries out application, and forms a coating 13 that links up at the outer surface of this case of electronic device 10.At first to case of electronic device 10 clean, degreasing, and change into processing to form the bottom before the application, and then the outer surface of case of electronic device 10 carried out application, coating process can adopt baking vanish or mode such as spray paint, and preferably the mode with baking vanish forms coherent coating 13 at the outer surface of case of electronic device 10.
After being appreciated that step (1), can be at first to the metal body 11 removal burr of polishing, and metal body 11 carried out chemical treatment, as differential arc oxidation, anodic oxidation etc.,, thereby strengthen its adhesion in order to formation one deck junction film on the faying face of metal body 11 and plastic antennas lid 12.After the step (2), can polish, remove the cast gate and the burr of plastic antennas lid 12 metal body after one-body molded 11 and plastic antennas lid 12.
Please be simultaneously referring to Fig. 4 to Fig. 6, in order further to strengthen the bond strength between metal body 11 and the plastic antennas lid 12, its junction also is formed with first fastening structure 15, second fastening structure 16, the 3rd fastening structure 17 and the 4th fastening structure 18.This first fastening structure 15 forms in the following manner: after the step (1), adopt Digit Control Machine Tool (Computer NumberControl, CNC) side at metal body 11 is processed to form a shoulder hole 111, and shoulder hole 111 is positioned at the aperture of case of electronic device 10 inner surfaces one end greater than the aperture that is positioned at case of electronic device 10 outer surfaces one end; When embedding moulding, the plastics of fusion flow in the shoulder hole 111 and with shoulder hole 111 and are full of, and promptly form first fastening structure 15 in the junction of metal body 11 and plastic antennas lid 12 after the cooling.
Please be simultaneously referring to Fig. 5 and Fig. 7, this second fastening structure 16 forms in the following manner: adopt Digit Control Machine Tool to be processed to form at least one trip 112 in a side edge of metal body 11; When embedding moulding, this trip 112 of the plastic overmold of fusion promptly forms second fastening structure 16 in the junction of metal body 11 and plastic antennas lid 12 after the cooling.
Please be simultaneously referring to Fig. 5 and Fig. 8, the 3rd fastening structure 17 forms in the following manner: adopt Digit Control Machine Tool to be processed to form at least one through hole 113 in a side edge of metal body 11; When embedding moulding, the plastics of fusion flow in the through hole 113 and with through hole 113 and are full of, and promptly form the 3rd fastening structure 17 in the junction of metal body 11 and plastic antennas lid 12 after the cooling.
Please be simultaneously referring to Fig. 5 and Fig. 9, the 4th fastening structure 18 forms in the following manner: adopt Digit Control Machine Tool to be processed to form at least one boss 114 in a side edge of metal body 11, be formed with two trips 1141 on this boss 114; When embedding moulding, the outer surface of this boss 114 of the plastic overmold of fusion, and coat two trips 1141, promptly form the 4th fastening structure 18 after the cooling in the junction of metal body 11 and plastic antennas lid 12.
Be appreciated that shoulder hole 111, trip 112, through hole 113 and boss 114 except that adopting Digit Control Machine Tool is processed to form, also can directly form adopting forging type to prepare in the process of metal body 11.
Because the metal body 11 of case of electronic device 10 is one-body molded by embedding forming technique with plastic antennas lid 12, fit closely in its junction, no gap, thus have higher binding strength.And metal body 11 is a step surface 14 with the faying face of plastic antennas lid 12, and bonded area is bigger, helps to improve its bond strength.Further, metal body 11 also is formed with first fastening structure 15, second fastening structure 16, the 3rd fastening structure 17 and the 4th fastening structure 18 with the junction of plastic antennas lid 12, guarantees that case of electronic device 10 has higher intensity.Simultaneously; metal body 11 is an even surface with the outer surface of the junction of plastic antennas lid 12; and be formed with a coating 13 that links up; 13 pairs of case of electronic device 10 of this coating play protection and decoration function; make the metal body 11 and the junction of plastic antennas lid 12 can't see joint mark, product design is attractive in appearance.In addition, embed forming technique and can satisfy comparatively diversified product design demand, be suitable for making thin case of electronic device.Metal body 11 can guarantee that with step surface 14 and first fastening structure 15, second fastening structure 16, the 3rd fastening structure 17 and the 4th fastening structure 18 of the junction of plastic antennas lid 12 thin case of electronic device has higher intensity simultaneously.
Be appreciated that buckling parts 110 except that shoulder hole 111, trip 112, through hole 113 and boss 114, also variable more other structures are to satisfy the combination of product diversification.According to the designing requirement of product, metal body 11 and plastic antennas cover 12 junctions can select a kind of or its combination in step surface 14, first fastening structure 15, second fastening structure 16, the 3rd fastening structure 17 and the 4th fastening structure 18 for use.
In addition, those skilled in the art also can do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included in the present invention's scope required for protection.

Claims (10)

1. case of electronic device, comprise metal body and plastic antennas lid, it is characterized in that: this metal body and this plastic antennas lid adopt the embedding forming technique one-body molded, and the outer surface of its junction is an even surface, and are formed with a coating that links up on this even surface.
2. case of electronic device as claimed in claim 1 is characterized in that: the faying face of this metal body and this plastic antennas lid is a step surface.
3. case of electronic device as claimed in claim 1, it is characterized in that: a side of this metal body is provided with at least one buckling parts, and this at least one buckling parts and this plastic antennas lid fasten and form at least one fastening structure in the junction of this metal body and this plastic antennas lid; This buckling parts is wherein a kind of in shoulder hole, trip, through hole and the boss.
4. case of electronic device as claimed in claim 1 is characterized in that: the material of this metal body is wherein a kind of in magnesium alloy, aluminium alloy or the titanium alloy.
5. case of electronic device as claimed in claim 1 is characterized in that: the material of this plastic antennas lid is wherein a kind of in polymeric liquid crystal copolymer, polyphenylene sulfide or the polybutylene terephthalate (PBT).
6. case of electronic device as claimed in claim 1 is characterized in that: the thickness of this coating is 30 microns to 90 microns.
7. case of electronic device as claimed in claim 1, it is characterized in that: the main component of this coating comprises film forming matter, this film forming matter be selected from following one or more: polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyurethane, Lauxite, phenolic resins, ethene rubber, acrylonitrile-butadiene propylene-styrene copolymer, polymethyl methacrylate, polycarbonate, polytetrafluoroethylene and polyimides.
8. the manufacture method of a case of electronic device may further comprise the steps: a metal body is provided; This metal body is as inserts, one-body molded with this metal body with a plastic antennas lid by embedding forming technique, and the outer surface of the junction of this metal body and this plastic antennas lid is an even surface; The outer surface of the case of electronic device to this after one-body molded carries out application, and forms a coating that links up on this even surface.
9. the manufacture method of case of electronic device as claimed in claim 8 is characterized in that: after a metal body is provided, at first it is carried out differential arc oxidation or anodic oxidation, thereby form one deck junction film on the faying face of this metal body and this plastic antennas lid.
10. the manufacture method of case of electronic device as claimed in claim 8, it is characterized in that: elder generation is to this case of electronic device cleaning, degreasing before the application, and change into processing to form the bottom before the application, and again this case of electronic device is carried out application, the mode of application is baking vanish or sprays paint.
CN200810301382.6A 2008-04-28 2008-04-28 Electronic device shell and manufacturing method thereof Pending CN101573009A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200810301382.6A CN101573009A (en) 2008-04-28 2008-04-28 Electronic device shell and manufacturing method thereof
US12/187,396 US20090267266A1 (en) 2008-04-28 2008-08-07 Insert-molded cover and method for manufacturing same
JP2008243363A JP2009262530A (en) 2008-04-28 2008-09-22 Casing for electronic device, and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810301382.6A CN101573009A (en) 2008-04-28 2008-04-28 Electronic device shell and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN101573009A true CN101573009A (en) 2009-11-04

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US (1) US20090267266A1 (en)
JP (1) JP2009262530A (en)
CN (1) CN101573009A (en)

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