JP2009262530A - Casing for electronic device, and manufacturing method thereof - Google Patents

Casing for electronic device, and manufacturing method thereof Download PDF

Info

Publication number
JP2009262530A
JP2009262530A JP2008243363A JP2008243363A JP2009262530A JP 2009262530 A JP2009262530 A JP 2009262530A JP 2008243363 A JP2008243363 A JP 2008243363A JP 2008243363 A JP2008243363 A JP 2008243363A JP 2009262530 A JP2009262530 A JP 2009262530A
Authority
JP
Japan
Prior art keywords
antenna cover
electronic device
plastic antenna
main body
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008243363A
Other languages
Japanese (ja)
Inventor
Han-Ming Lee
翰明 李
Chih-Chien Hung
誌謙 洪
Hsiang-Sheng Chou
祥生 周
Ching-Hsien Chang
清賢 張
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Publication of JP2009262530A publication Critical patent/JP2009262530A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Abstract

<P>PROBLEM TO BE SOLVED: To provide a casing for electronic devices having a high mechanical strength and a beautiful appearance and realizing reduction of thickness, and its manufacturing process. <P>SOLUTION: The casing for electronics devices is made by integrally molding a metal body and a plastic antenna cover by an insert molding method. The outer surface at a site of engaging the metal body with the plastic antenna cover is smooth, and a continuous coating layer is formed on the whole smooth surface. The manufacturing method of a casing for electronic devices made by integrally molding a metal body and a plastic antenna cover by an insert molding method includes a step of preparing the metal body used as an insert material, a step of conducting an insert molding of the metal body and the plastic antenna cover and a step of forming a continuous coating layer on the whole outer surface at the site of engaging the metal body with the plastic antenna cover. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、電子装置用筐体及びその製造方法に関し、特に機械的強度が高く、外観が美しく、且つ薄型化を実現することができる電子装置用筐体及びその製造方法に関する。   The present invention relates to a casing for an electronic device and a method for manufacturing the same, and particularly relates to a casing for an electronic device that has high mechanical strength, has a beautiful appearance, and can be thinned, and a method for manufacturing the same.

電子技術の発展に伴って、ノートパソコン、携帯電話、携帯用個人情報端末（ＰＤＡ）等の電子装置が広く用いられている。これに伴い、人々の電子装置に対する要求もますます高くなっている。   With the development of electronic technology, electronic devices such as notebook personal computers, mobile phones, and portable personal information terminals (PDAs) are widely used. Along with this, people's demands for electronic devices are also increasing.

電子装置用筐体は、一般的に金属或いはプラスチックから製造される。金属製筐体は、機械的強度が高く、電磁シールド性に優れるので、電子装置に広く採用されている。   The housing for electronic devices is generally manufactured from metal or plastic. Metal casings are widely used in electronic devices because of their high mechanical strength and excellent electromagnetic shielding properties.

ところが、筐体の全体を金属から製造すれば、電子製品の信号を正常に伝送、且つ受信することができなくなる。信号を正常に伝送、且つ受信するためには、アンテナカバーをプラスチックから製造し、係合構造或いはリベット構造を介してそのアンテナカバーを前記金属製筐体の所定の位置に固定させる。   However, if the entire casing is made of metal, the signal of the electronic product cannot be normally transmitted and received. In order to transmit and receive signals normally, the antenna cover is manufactured from plastic, and the antenna cover is fixed to a predetermined position of the metal casing through an engagement structure or a rivet structure.

係合構造或いはリベット構造により前記プラスチック製アンテナカバーを前記金属製筐体に固定させると、係合部位に隙間が容易に発生する。また、前記電子装置を長時間用いると、金属製筐体とプラスチック製アンテナカバーとの間の係合状態が緩む現像も容易に発生するので、製品の強度及び外観に悪影響を及ぼす。   When the plastic antenna cover is fixed to the metal casing by an engagement structure or a rivet structure, a gap is easily generated at the engagement site. Further, when the electronic device is used for a long time, development in which the engagement state between the metal casing and the plastic antenna cover is loosened easily occurs, which adversely affects the strength and appearance of the product.

また、現在の電子製品は軽く、薄く、短く、且つ小さい方向へ発展しているので、電子装置用筐体の厚さもますます薄くなる。しかしながら、前記電子装置用筐体がある程度薄くなれば、金属製筐体とプラスチック製アンテナカバーとの間の係合構造が容易に破損されてしまう。即ち、電子装置の薄型化に従って、係合構造又はリベット構造の欠陷及び局限性が顕著になる。   In addition, since current electronic products are light, thin, short, and have developed in a small direction, the thickness of the casing for electronic devices is also becoming thinner. However, if the electronic device casing is thinned to some extent, the engagement structure between the metal casing and the plastic antenna cover is easily broken. That is, as the electronic device is made thinner, the lack and the locality of the engagement structure or the rivet structure become conspicuous.

本発明の目的は、機械的強度が高く、外観が美しく、且つ薄型化を実現することができる電子装置用筐体及びその製造方法を提供することである。   An object of the present invention is to provide a casing for an electronic device that has high mechanical strength, has a beautiful appearance, and can be thinned, and a method for manufacturing the same.

金属製本体と、プラスチック製アンテナカバーとがインサート成型方法により一体に成型される電子装置用筐体において、前記金属製本体とプラスチック製アンテナカバーとが係合される箇所の外表面は平坦な面であり、その平坦な面の全体に連続的な塗装層が形成されている。   In an electronic device casing in which a metal main body and a plastic antenna cover are integrally formed by an insert molding method, an outer surface of a portion where the metal main body and the plastic antenna cover are engaged is flat. A continuous coating layer is formed on the entire flat surface.

金属製本体と、プラスチック製アンテナカバーとがインサート成型方法により一体に成型される電子装置用筐体の製造方法は、インサート材にする金属製本体を準備するステップと、前記金属製本体とプラスチック製アンテナカバーとをインサート成型するステップと、前記金属製本体とプラスチック製アンテナカバーとが係合される箇所の外表面の全体に連続的な塗装層を形成するステップと、を含む。   A method for manufacturing a casing for an electronic device in which a metal main body and a plastic antenna cover are integrally formed by an insert molding method includes a step of preparing a metal main body as an insert material, and the metal main body and plastic Insert-molding the antenna cover, and forming a continuous coating layer on the entire outer surface of the portion where the metal body and the plastic antenna cover are engaged.

本発明の電子装置用筐体は、金属製本体と、プラスチック製アンテナカバーとがインサート成型方法により一体に成型されるので、前記電子装置用筐体の接着強度を向上させることができる。   In the electronic device casing of the present invention, the metal main body and the plastic antenna cover are integrally formed by an insert molding method, and therefore the adhesive strength of the electronic device casing can be improved.

また、前記金属製本体とプラスチック製アンテナカバーとが接着される箇所の外表面の全体に連続的に被覆された塗装層が形成されている。前記塗装層は、本発明の電子装置用筐体に対して保護、且つ装飾の作用を奏する。即ち、前記金属製本体とプラスチック製アンテナカバーとが接着される箇所の係合痕跡が見えないため、製品の外観が美しくなる。同時に、インサート成型方法は、構造が比較的複雑であり、多様な製品の設計の要求を満足させることができるので、厚さが比較的薄い電子装置用筐体の製造に適用することができる。   In addition, a coating layer continuously formed on the entire outer surface of the portion where the metal main body and the plastic antenna cover are bonded is formed. The coating layer protects and decorates the electronic device casing of the present invention. That is, the appearance of the product becomes beautiful because the trace of engagement where the metal body and the plastic antenna cover are bonded is not visible. At the same time, the insert molding method has a relatively complicated structure and can satisfy various product design requirements, and therefore can be applied to the manufacture of a casing for an electronic device having a relatively small thickness.

以下、図面に基づいて、本発明の実施形態に係る電子装置用筐体及びその製造方法について詳細に説明する。   Hereinafter, based on the drawings, a case for an electronic device and a method for manufacturing the same according to an embodiment of the present invention will be described in detail.

図１は、本発明の電子装置用筐体１０を示す分解図である。図１に示すように、本実施形態の電子装置用筐体１０は、金属製本体１１と、プラスチック製アンテナカバー１２とを含む。   FIG. 1 is an exploded view showing an electronic device casing 10 of the present invention. As shown in FIG. 1, the electronic device casing 10 of the present embodiment includes a metal main body 11 and a plastic antenna cover 12.

前記金属製本体１１は、略矩形の金属蓋板である。前記金属本体１１の１つの側辺には、複数の係合部１１０が形成されている。前記係合部１１０は、段差孔１１１と、係合爪１１２と、貫通孔１１３と、凸部１１４とを含む。前記係合部１１０は、前記プラスチック製アンテナカバー１２を前記金属製本体１１に係合させる。前記金属製本体１１の材料として、合金材料を採用する。好ましくは、マグネシウム合金、アルミニウム合金或いはチタン合金を採用する。   The metal main body 11 is a substantially rectangular metal cover plate. A plurality of engaging portions 110 are formed on one side of the metal body 11. The engaging part 110 includes a step hole 111, an engaging claw 112, a through hole 113, and a convex part 114. The engaging portion 110 engages the plastic antenna cover 12 with the metal main body 11. An alloy material is employed as the material of the metal main body 11. Preferably, a magnesium alloy, an aluminum alloy, or a titanium alloy is employed.

前記プラスチック製アンテナカバー１２は、略長条状の蓋板である。前記プラスチック製アンテナカバー１２は、前記金属本体１１の係合部１１０の側辺に成型される。前記プラスチック製アンテナカバー１２の材料として、前記金属本体１１の材料と接着性が優れる材料を採用する。例えば、熱収縮率が小さく、線膨張係数が前記金属本体１１の材料と似ている材料を採用する。好ましくは、液晶ポリマー（ＬＣＰ）、ポリフェニレンサルファイド（ＰＰＳ）、ポリブチレンテレフタレト(ＰＢＴ)等のエンジニアリングプラスチック（Engineering Plastic）を採用する。   The plastic antenna cover 12 is a substantially elongated cover plate. The plastic antenna cover 12 is molded on the side of the engaging portion 110 of the metal body 11. As the material of the plastic antenna cover 12, a material having excellent adhesiveness with the material of the metal body 11 is employed. For example, a material having a small thermal shrinkage and a linear expansion coefficient similar to that of the metal body 11 is employed. Preferably, engineering plastics such as liquid crystal polymer (LCP), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) are employed.

図２は、本発明の一体に成型された電子装置用筐体１０の正面を示す斜視図であり、図３は、図２の電子装置用筐体１０の正面の局部を示す斜視断面図である。   FIG. 2 is a perspective view showing the front of the electronic device casing 10 molded integrally according to the present invention, and FIG. 3 is a perspective sectional view showing a local portion of the front of the electronic device casing 10 of FIG. is there.

図２及び図３に示すように、前記金属製本体１１と、その金属製本体１１に接続される前記プラスチック製アンテナカバー１２とにより、電子装置用筐体１０の外表面が平坦な面になっている。前記電子装置用筐体１０の全体の外表面には、連続的に塗装される塗装層１３が形成されている。前記塗装層１３により、前記金属製本体１１と前記プラスチック製アンテナカバー１２との間の係合痕跡が見えない。   As shown in FIG. 2 and FIG. 3, the outer surface of the electronic device housing 10 becomes a flat surface by the metal main body 11 and the plastic antenna cover 12 connected to the metal main body 11. ing. A coating layer 13 that is continuously coated is formed on the entire outer surface of the electronic device casing 10. Due to the coating layer 13, no trace of engagement between the metal main body 11 and the plastic antenna cover 12 can be seen.

前記プラスチック製アンテナカバー１２が係合される前記金属製本体１１の接続面は、湾曲する段差面１４に形成されている。前記段差面１４は、前記金属製本体１１とプラスチック製アンテナカバー１２との結合面積を増加させるため、両者の係合強度を向上させることができる。   The connection surface of the metal main body 11 with which the plastic antenna cover 12 is engaged is formed on a curved step surface 14. Since the stepped surface 14 increases the coupling area between the metal main body 11 and the plastic antenna cover 12, the engagement strength between the two can be improved.

前記塗装層１３の厚さは、３０〜９０μｍである。前記塗装層１３の主要成分は、成膜物質、顔料、溶剤及び補助剤等を含む。   The coating layer 13 has a thickness of 30 to 90 μm. The main components of the coating layer 13 include a film forming material, a pigment, a solvent, an auxiliary agent, and the like.

前記成膜物質としては、ポリエチレン樹脂(ＰＥ)、ポリプロピレン樹脂（ＰＰ）、塩化ビニル樹脂（ＰＶＣ）、ポリスチレン樹脂(ＰＳ)、ポリウレタン樹脂（ＰＵ）、ユリア樹脂（ＵＦ）、フェノール樹脂（ＰＦ）、アクリロニトリル・ブタジエン・スチレン樹脂（ＡＢＳ）、アクリル樹脂(ＰＭＭＡ)、ポリカーボネート樹脂（ＰＣ）、四フッ化エチレン樹脂（ＰＴＦＥ）、ポリイミド樹脂（ＰＩ）等を単独或いは混合して用いることができる。   Examples of the film forming material include polyethylene resin (PE), polypropylene resin (PP), vinyl chloride resin (PVC), polystyrene resin (PS), polyurethane resin (PU), urea resin (UF), phenol resin (PF), Acrylonitrile / butadiene / styrene resin (ABS), acrylic resin (PMMA), polycarbonate resin (PC), tetrafluoroethylene resin (PTFE), polyimide resin (PI), or the like can be used alone or in combination.

前記顔料としては、チタンホワイト（Titanium White）、カーボンブラック （Carbon Black）、酸化鉄赤等を用いることができる。   Examples of the pigment include titanium white, carbon black, and iron oxide red.

前記溶剤としては、エタノール（Ethanol）、アセトン（Acetone）、脂肪族類、ベンゼン（Benzene）類等の有機溶剤を用いることができる。   As the solvent, organic solvents such as ethanol (Athtone), acetone (Acetone), aliphatics, benzene (Benzene) can be used.

前記補助剤としては、発泡剤、可塑剤（Plasticizer）、潤滑剤（Lubricant）、安定剤、防火難燃剤、着色剤、架橋剤（Cross-Linking Agent）等を用いることができる。以上の補助剤を用いることにより、対応する塗装層１３の特性を改善することができる。例えば、発泡剤を用いれば、前記塗装層１３の密度、硬度、遮音、防振、断熱及び軽量等の特性を改善することができ、防火難燃剤を用いれば、前記塗装層１３の防火難燃性を改善することができる。   Examples of the auxiliary agent include foaming agents, plasticizers, lubricants, stabilizers, fire retardant flame retardants, colorants, and cross-linking agents. By using the above adjuvant, the characteristics of the corresponding coating layer 13 can be improved. For example, if a foaming agent is used, the properties of the coating layer 13 such as density, hardness, sound insulation, vibration isolation, heat insulation and light weight can be improved. If a fireproofing flame retardant is used, the fireproofing and flameproofing of the coating layer 13 is achieved. Can improve sex.

以下、第一実施の形態に係る電子装置用筐体１０の製造方法について詳しく説明する。   Hereinafter, a method for manufacturing the electronic device casing 10 according to the first embodiment will be described in detail.

（１）金属本体１１を提供する。前記金属本体１１の製造方法は、キャスディング（Casting）、プレス（Press）、鍛造、打ち抜き或いは押し抜き等の方法を採用することができる。好ましくは、キャスディングを採用する。   (1) The metal main body 11 is provided. As the manufacturing method of the metal main body 11, methods such as casting, pressing, forging, punching or punching can be employed. Preferably, casting is employed.

（２）インサート成型方法により、プラスチック製アンテナカバー１２を前記金属本体１１に一体に成型する。即ち、インサート材にする前記金属本体１１を射出成型用金型内に挿入した後、前記射出成型用金型内へプラスチックの溶湯を射出する。次に、前記プラスチックの溶湯を固化させると、プラスチック製アンテナカバー１２が前記金属本体１１に一体に成型される。前記金属本体１１とプラスチック製アンテナカバー１２とにより、電子装置用筐体１０の外表面が平坦な面として形成される。   (2) The plastic antenna cover 12 is molded integrally with the metal body 11 by an insert molding method. That is, after inserting the metal body 11 to be an insert material into an injection mold, a molten plastic is injected into the injection mold. Next, when the molten metal of the plastic is solidified, the plastic antenna cover 12 is formed integrally with the metal body 11. The metal body 11 and the plastic antenna cover 12 form an outer surface of the electronic device casing 10 as a flat surface.

（３）前記金属本体１１とプラスチック製アンテナカバー１２とが一体に成型された電子装置用筐体１０の外表面に塗装工程を実施して、全体の外表面に連続的な塗装層１３を形成する。前記塗装層１３の品質を高めるために、塗装工程を実施する前、電子装置用筐体１０の外表面に洗浄及び脱脂工程を実施する。次に、化成処理を実施して塗装層１３を形成するための底層を形成する。塗装工程は、焼付け塗装或いはスプレー塗装等を採用する。好ましくは、焼付け塗装を採用する。   (3) A coating process is performed on the outer surface of the electronic device casing 10 in which the metal main body 11 and the plastic antenna cover 12 are integrally molded to form a continuous coating layer 13 on the entire outer surface. To do. In order to improve the quality of the coating layer 13, a cleaning and degreasing process is performed on the outer surface of the casing 10 for the electronic device before the coating process is performed. Next, a chemical conversion treatment is performed to form a bottom layer for forming the coating layer 13. The painting process employs baking painting or spray painting. Preferably, baked paint is employed.

前記ステップ（１）が完了すると、前記金属本体１１を研磨して、金属本体１１に形成されるバリ（Burr）を除去することができる。前記金属製本体１１とプラスチック製アンテナカバー１２との接着力を向上させるために、前記金属本体１１に対して化学処理加工を実施して、前記金属製本体１１の接続面に接着用膜を形成することができる。前記化学処理加工として、マイクロアーク酸化（Microarc Oxidation）或いは陽極酸化等を採用することができる。   When the step (1) is completed, the metal body 11 can be polished to remove burrs formed on the metal body 11. In order to improve the adhesive force between the metal main body 11 and the plastic antenna cover 12, the metal main body 11 is subjected to chemical treatment to form an adhesive film on the connection surface of the metal main body 11. can do. As the chemical treatment, microarc oxidation or anodization can be employed.

前記ステップ（２）が完了すると、前記金属製本体１１とプラスチック製アンテナカバー１２とが一体に成型された電子装置用筐体１０に研磨工程を実施して、電子装置用筐体１０に形成される成型痕跡及びバリを除去することができる。   When the step (2) is completed, a polishing process is performed on the electronic device casing 10 in which the metal main body 11 and the plastic antenna cover 12 are integrally molded to form the electronic device casing 10. Molding traces and burrs can be removed.

図４乃至図９に示すように、前記金属製本体１１とプラスチック製アンテナカバー１２との間の接着力をさらに向上させるために、接続箇所に第一係合手段１５、第二係合手段１６、第三係合手段１７及び第四係合手段１８を形成することができる。   As shown in FIGS. 4 to 9, in order to further improve the adhesive force between the metal main body 11 and the plastic antenna cover 12, a first engagement means 15 and a second engagement means 16 are provided at the connection locations. The third engagement means 17 and the fourth engagement means 18 can be formed.

図５及び図６に示したように、前記第一係合手段１５は、以下の方式で形成される。   As shown in FIGS. 5 and 6, the first engagement means 15 is formed in the following manner.

前記ステップ（１）が完了した後、数値制御装置（Computer Number Control，ＣＮＣ）を用いて、前記金属製本体１１の１つの側辺に段差孔１１１を形成する。前記段差孔１１１は、前記金属製本体１１の内表面側の内径が、外表面側の内径より大きい穴部である。インサート成型方法で前記プラスチック製アンテナカバー１２を形成する時、プラスチックの溶湯が前記段差孔１１１の内に充填される。前記プラスチックの溶湯を冷却させると、前記金属製本体１１とプラスチック製アンテナカバー１２とが接着する箇所に、前記第一係合手段１５が形成される。   After the step (1) is completed, a step hole 111 is formed on one side of the metal body 11 using a numerical controller (Computer Number Control, CNC). The step hole 111 is a hole having an inner diameter on the inner surface side of the metal main body 11 larger than the inner diameter on the outer surface side. When the plastic antenna cover 12 is formed by an insert molding method, a molten plastic is filled into the step hole 111. When the molten metal is cooled, the first engagement means 15 is formed at a location where the metal main body 11 and the plastic antenna cover 12 are bonded.

図５及び図７に示したように、前記第二係合手段１６は、以下の方式で形成される。   As shown in FIGS. 5 and 7, the second engagement means 16 is formed in the following manner.

前記ステップ（１）が完了した後、数値制御装置を用いて、前記金属製本体１１の１つの側辺に係合爪１１２を形成する。インサート成型方法で前記プラスチック製アンテナカバー１２を形成する時、プラスチックの溶湯が前記係合爪１１２を包囲する。前記プラスチック溶湯を冷却させると、前記金属製本体１１とプラスチック製アンテナカバー１２とが接着する箇所に、前記第二係合手段１６が形成される。   After the step (1) is completed, the engaging claws 112 are formed on one side of the metal main body 11 using a numerical control device. When the plastic antenna cover 12 is formed by the insert molding method, the molten plastic surrounds the engaging claws 112. When the molten metal is cooled, the second engaging means 16 is formed at a location where the metal main body 11 and the plastic antenna cover 12 are bonded.

図５及び図８に示したように、前記第三係合手段１７は、以下の方式で形成される。   As shown in FIGS. 5 and 8, the third engagement means 17 is formed in the following manner.

前記ステップ（１）が完了した後、数値制御装置を用いて、前記金属製本体１１の１つの側辺に少なくとも１つの貫通孔１１３を形成する。インサート成型方法で前記プラスチック製アンテナカバー１２を形成する時、プラスチック溶湯が前記貫通孔１１３の内に充填される。前記プラスチック溶湯を冷却させると、前記金属製本体１１とプラスチック製アンテナカバー１２とが接着する箇所に、前記第三係合手段１７が形成される。   After the step (1) is completed, at least one through hole 113 is formed on one side of the metal main body 11 using a numerical control device. When the plastic antenna cover 12 is formed by the insert molding method, the molten plastic is filled in the through hole 113. When the molten plastic is cooled, the third engagement means 17 is formed at a location where the metal main body 11 and the plastic antenna cover 12 are bonded.

図５及び図９に示したように、前記第四係合手段１８は、以下の方式で形成される。   As shown in FIGS. 5 and 9, the fourth engaging means 18 is formed in the following manner.

前記ステップ（１）が完了した後、数値制御装置を用いて、前記金属製本体１１の１つの側辺に少なくとも１つの凸部１１４を形成する。前記凸部１１４に２つの係合爪１１４１が形成されている。インサート成型方法で前記プラスチック製アンテナカバー１２を形成する時、プラスチックの溶湯が前記凸部１１４の外表面及び前記係合爪１１４１を包囲する。前記プラスチックの溶湯を冷却させると、前記金属製本体１１とプラスチック製アンテナカバー１２とが接着する箇所に、前記第四係合手段１８が形成される。   After the step (1) is completed, at least one convex portion 114 is formed on one side of the metal main body 11 using a numerical controller. Two engaging claws 1141 are formed on the convex portion 114. When the plastic antenna cover 12 is formed by the insert molding method, the molten plastic surrounds the outer surface of the convex portion 114 and the engaging claw 1141. When the molten metal is cooled, the fourth engaging means 18 is formed at a location where the metal main body 11 and the plastic antenna cover 12 are bonded.

また、前記段差孔１１１、係合爪１１２、貫通孔１１３及び凸部１１４は、キャスディング方法で前記金属本体１１を製造する過程中で直接形成することもできる。   Further, the step hole 111, the engaging claw 112, the through hole 113, and the protrusion 114 can be directly formed in the process of manufacturing the metal body 11 by a casting method.

本発明の電子装置用筐体１０において、前記金属製本体１１と前記プラスチック製アンテナカバー１２とがインサート成型方法により一体に成型されているので、両者が接続する箇所に隙間が形成されない。従って、前記金属製本体１１とプラスチック製アンテナカバー１２との接着強度を向上させることができる。   In the electronic device casing 10 of the present invention, since the metal main body 11 and the plastic antenna cover 12 are integrally formed by an insert molding method, no gap is formed at a location where they are connected. Therefore, the adhesive strength between the metal main body 11 and the plastic antenna cover 12 can be improved.

前記金属製本体１１とプラスチック製アンテナカバー１２との接続面に段差面が形成されているので、両者の接続面積が大きくなる。従って、前記金属製本体１１とプラスチック製アンテナカバー１２との間の接着力を向上させることができる。   Since the step surface is formed on the connection surface between the metal main body 11 and the plastic antenna cover 12, the connection area between the two is increased. Therefore, the adhesive force between the metal main body 11 and the plastic antenna cover 12 can be improved.

金属製本体１１とプラスチック製アンテナカバー１２とが接着する箇所に第一係合手段１５、第二係合手段１６、第三係合手段１７及び第四係合手段１８がさらに形成されているので、前記金属製本体１１とプラスチック製アンテナカバー１２との間の接着力をさらに向上させることができる。   Since the first engaging means 15, the second engaging means 16, the third engaging means 17 and the fourth engaging means 18 are further formed at the location where the metal main body 11 and the plastic antenna cover 12 are bonded. The adhesive force between the metal body 11 and the plastic antenna cover 12 can be further improved.

前記電子装置用筐体の全体の外表面に連続に形成されている塗装層１３は、前記電子装置用筐体を保護、且つ装飾する作用を奏することができる。即ち、前記塗装層１３は、前記金属製本体１１とプラスチック製アンテナカバー１２との接着部位に形成される成型痕跡が見えないため、製品の外観が美しくなる。   The coating layer 13 formed continuously on the entire outer surface of the electronic device casing can act to protect and decorate the electronic device casing. That is, since the coating layer 13 does not show molding traces formed at the bonding portion between the metal main body 11 and the plastic antenna cover 12, the appearance of the product becomes beautiful.

また、インサート成型方法は、構造が比較的複雑であり、多様化な製品設計の要求を満足させることができることから、厚さが比較的薄い電子装置用筐体１０の製造に適する。   Further, the insert molding method is relatively complicated in structure and can satisfy diversified product design requirements. Therefore, the insert molding method is suitable for manufacturing the electronic device casing 10 having a relatively small thickness.

製品の多様化の要求に従って、前記係合部１１０を変更することができる。即ち、前記段差孔１１１、係合爪１１２、貫通孔１１３及び凸部１１４などを他の形状に形成することができる。また、製品の設計の要求に従って、前記金属製本体１１とプラスチック製アンテナカバー１２とが結合される箇所の構造は、段差面１４、第一係合手段１５、第二係合手段１６、第三係合手段１７及び第四係合手段１８等構造の単独または組み合わせの形態で形成することもできる。   The engaging part 110 can be changed according to the demand for diversification of products. That is, the step hole 111, the engaging claw 112, the through hole 113, the convex portion 114, and the like can be formed in other shapes. Further, according to the design requirements of the product, the structure of the place where the metal main body 11 and the plastic antenna cover 12 are coupled includes the stepped surface 14, the first engaging means 15, the second engaging means 16, and the third. The engaging means 17 and the fourth engaging means 18 can also be formed in the form of single or combined structures.

以上、本発明の好適な実施の形態について詳細に説明したが、本発明は前記実施形態に限定されるものではなく、本発明の範囲内で種々の変形又は修正が可能であり、該変形又は修正も又、本発明の特許請求の範囲内に含まれるものであることは、いうまでもない。   The preferred embodiment of the present invention has been described in detail above. However, the present invention is not limited to the above-described embodiment, and various modifications or corrections are possible within the scope of the present invention. It goes without saying that modifications are also included in the scope of the claims of the present invention.

本発明の電子装置用筐体を示す分解図である。It is an exploded view which shows the housing | casing for electronic devices of this invention. 本発明の一体に成型された電子装置用筐体の正面を示す斜視図である。It is a perspective view which shows the front of the housing | casing for electronic devices integrally molded of this invention. 図２の電子装置用筐体の正面局部を示す斜視断面図である。FIG. 3 is a perspective sectional view showing a front local part of the electronic device casing of FIG. 2. 本発明の電子装置の一体成型した筐体の背面を示す斜視図である。It is a perspective view which shows the back surface of the housing | casing integrally molded of the electronic device of this invention. 図４の電子装置用筐体の背面局部を拡大して示す斜視図である。It is a perspective view which expands and shows the back local part of the housing | casing for electronic devices of FIG. 図５の電子装置用筐体のＶＩ−ＶＩに沿う断面図する。Sectional drawing which follows VI-VI of the housing | casing for electronic devices of FIG. 図５の電子装置用筐体のＶＩＩ−ＶＩＩに沿う断面図する。Sectional drawing which follows the VII-VII of the housing | casing for electronic devices of FIG. 図５の電子装置用筐体のＶＩＩＩ−ＶＩＩＩに沿う断面図する。Sectional drawing which follows the VIII-VIII of the housing | casing for electronic devices of FIG. 図５の電子装置用筐体のＩＸ−ＩＸに沿う断面図する。FIG. 6 is a cross-sectional view taken along the line IX-IX of the electronic device casing of FIG. 5.

符号の説明Explanation of symbols

１０ 筐体
１１ 金属製本体
１１０ 係合部
１１１ 段差孔
１１２ 係合爪
１１３ 貫通孔
１１４ 凸部
１１４１ 係合爪
１２ プラスチック製アンテナカバー
１３ 塗装層
１４ 段差面
１５ 第一係合手段
１６ 第二係合手段
１７ 第三係合手段
１８ 第四係合手段 DESCRIPTION OF SYMBOLS 10 Case 11 Metal main body 110 Engagement part 111 Step hole 112 Engagement nail 113 Through-hole 114 Protrusion part 1141 Engagement nail 12 Plastic antenna cover 13 Paint layer 14 Step surface 15 First engagement means 16 Second engagement Means 17 Third engagement means 18 Fourth engagement means

Claims (10)

金属製本体と、プラスチック製アンテナカバーとがインサート成型方法により一体に成型される電子装置用筐体において、
前記金属製本体と前記プラスチック製アンテナカバーとが係合される箇所の外表面は平坦な面であり、その平坦な面の全体に連続的な塗装層が形成されていることを特徴とする電子装置用筐体。 In the housing for an electronic device in which the metal main body and the plastic antenna cover are integrally molded by an insert molding method,
An outer surface of a portion where the metal main body and the plastic antenna cover are engaged is a flat surface, and a continuous paint layer is formed on the entire flat surface. Device casing. 前記金属製本体と前記プラスチック製アンテナカバーとの接着面が、段差面であることを特徴とする請求項１に記載の電子装置用筐体。   The housing for an electronic device according to claim 1, wherein a bonding surface between the metal main body and the plastic antenna cover is a stepped surface. 前記金属製本体の１つの側辺には少なくとも１つの係合部が形成され、前記少なくとも１つの係合部が前記プラスチック製アンテナカバーと係合され、前記金属製本体と前記プラスチック製アンテナカバーとが係合する箇所に少なくとも１つの係合構造を形成し、前記係合部は、段差孔、係合爪、貫通孔、凸部のうちの一つ、或いはその組み合わせから構成されることを特徴とする請求項１に記載の電子装置用筐体。   At least one engaging portion is formed on one side of the metal main body, the at least one engaging portion is engaged with the plastic antenna cover, and the metal main body and the plastic antenna cover are provided. At least one engaging structure is formed at a position where the engaging portion engages, and the engaging portion is formed of one of a step hole, an engaging claw, a through hole, a convex portion, or a combination thereof. The housing for an electronic device according to claim 1. 前記金属製本体の材料として、マグネシウム合金、アルミニウム合金或いはチタン合金を採用することを特徴とする請求項１に記載の電子装置用筐体。   2. The electronic device casing according to claim 1, wherein a magnesium alloy, an aluminum alloy, or a titanium alloy is adopted as a material of the metal main body. 前記プラスチック製アンテナカバーの材料として、液晶ポリマー、ポリフェニレンサルファイド、ポリブチレンテレフタレートのエンジニアリングプラスチックを採用することを特徴とする請求項１に記載の電子装置用筐体。   2. The electronic device casing according to claim 1, wherein an engineering plastic of liquid crystal polymer, polyphenylene sulfide, or polybutylene terephthalate is adopted as a material for the plastic antenna cover. 前記塗装層の厚さが３０〜９０μｍであることを特徴とする請求項１に記載の電子装置用筐体。   2. The electronic device casing according to claim 1, wherein the coating layer has a thickness of 30 to 90 μm. 前記塗装層の主要成分は成膜物質を含み、前記成膜物質としては、ポリエチレン樹脂、ポリプロピレン樹脂、塩化ビニル樹脂、ポリスチレン樹脂、ポリウレタン樹脂、ユリア樹脂、フェノール樹脂、アクリロニトリル・ブタジエン・スチレン樹脂、アクリル樹脂、ポリカーボネート樹脂、四フッ化エチレン樹脂、ポリイミド樹脂のうち一つ、或いは混合して用いることを特徴とする請求項１に記載の電子装置用筐体。   The main component of the coating layer contains a film-forming substance, which includes polyethylene resin, polypropylene resin, vinyl chloride resin, polystyrene resin, polyurethane resin, urea resin, phenol resin, acrylonitrile / butadiene / styrene resin, acrylic resin. 2. The electronic device casing according to claim 1, wherein one or a mixture of resin, polycarbonate resin, tetrafluoroethylene resin, and polyimide resin is used. 前記金属製本体と、前記プラスチック製アンテナカバーとがインサート成型方法により一体に成型される電子装置用筐体の製造方法において、
インサート材にする前記金属製本体を準備するステップと、
前記金属製本体と前記プラスチック製アンテナカバーとをインサート成型するステップと、
前記金属製本体と前記プラスチック製アンテナカバーとが係合される箇所の外表面の全体に連続的な塗装層を形成するステップと、
を含むことを特徴とする請求項５に記載の電子装置用筐体の製造方法。 In the manufacturing method of the housing for an electronic device in which the metal main body and the plastic antenna cover are integrally molded by an insert molding method,
Preparing the metal body to be an insert material;
Insert molding the metal body and the plastic antenna cover;
Forming a continuous paint layer on the entire outer surface of the place where the metal body and the plastic antenna cover are engaged;
The manufacturing method of the housing | casing for electronic devices of Claim 5 characterized by the above-mentioned. 前記金属製本体に対してマイクロアーク酸化或いは陽極酸化を実施して、前記プラスチック製アンテナカバーと係合される接着面に接着用膜を形成することを特徴とする請求項８に記載の電子装置用筐体の製造方法。   9. The electronic device according to claim 8, wherein the metal main body is subjected to micro arc oxidation or anodization to form an adhesive film on an adhesive surface engaged with the plastic antenna cover. Manufacturing method for the housing. 塗装を実施する前、前記電子装置用筐体の外表面を洗浄及び脱脂し、且つ前記外表面に化成処理を実施して底層を形成し、その後、前記電子装置用筐体の外表面に対して焼付け塗装或いはスプレー塗装の方式で塗装を実施することを特徴とする請求項８に記載の電子装置用筐体の製造方法。   Prior to coating, the outer surface of the electronic device casing is cleaned and degreased, and a chemical conversion treatment is performed on the outer surface to form a bottom layer. 9. The method of manufacturing a casing for an electronic device according to claim 8, wherein the coating is performed by a baking coating or spray coating method.
JP2008243363A 2008-04-28 2008-09-22 Casing for electronic device, and manufacturing method thereof Pending JP2009262530A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810301382.6A CN101573009A (en) 2008-04-28 2008-04-28 Electronic device shell and manufacturing method thereof

Publications (1)

Publication Number Publication Date
JP2009262530A true JP2009262530A (en) 2009-11-12

Family

ID=41214211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008243363A Pending JP2009262530A (en) 2008-04-28 2008-09-22 Casing for electronic device, and manufacturing method thereof

Country Status (3)

Country Link
US (1) US20090267266A1 (en)
JP (1) JP2009262530A (en)
CN (1) CN101573009A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012000810A (en) * 2010-06-15 2012-01-05 Kyocera Chemical Corp Housing for electronic device, and method for producing the same
JP2012038267A (en) * 2010-08-11 2012-02-23 Toshiba Corp Electronic apparatus
JP2013516690A (en) * 2010-01-06 2013-05-13 アップル インコーポレイテッド Handheld computing devices
JP2013232052A (en) * 2012-04-27 2013-11-14 Lenovo Singapore Pte Ltd Casing material, manufacturing method of said casing material, electronic apparatus casing using said casing material, manufacturing method of said electronic apparatus casing, and electronic apparatus using said electronic apparatus casing
JP2014051044A (en) * 2012-09-07 2014-03-20 Panasonic Corp Tabular housing member, and insert injection molding method thereof
JP2015533194A (en) * 2012-10-05 2015-11-19 ノキア テクノロジーズ オサケユイチア Metallization and anodization of plastic and conductive parts of the device body
US9363459B2 (en) 2012-06-14 2016-06-07 Kabushiki Kaisha Toshiba Electronic apparatus
DE102017101088A1 (en) 2016-02-16 2017-08-17 Lenovo (Singapore) Pte. Ltd. Housing part, electronic device and method for producing the housing part
KR101765150B1 (en) * 2016-01-08 2017-08-23 후앙 치에 메탈 테크놀로지 코., 엘티디. Radio waves guiding window for metal case and manufacturing method thereof
US9829916B2 (en) 2010-01-06 2017-11-28 Apple Inc. Component assembly
WO2019027121A1 (en) * 2017-08-04 2019-02-07 이성수 Method for manufacturing titanium alloy having high radio wave transmittance
KR20210143229A (en) * 2019-04-22 2021-11-26 미쯔이가가꾸가부시끼가이샤 Electronic device housing, manufacturing method thereof, and metal-resin composite
JP7394339B2 (en) 2019-10-03 2023-12-08 パナソニックＩｐマネジメント株式会社 Electronics

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8857128B2 (en) * 2009-05-18 2014-10-14 Apple Inc. Reinforced device housing
JP2011143683A (en) * 2010-01-18 2011-07-28 Sumitomo Electric Ind Ltd Composite structural member
US8408972B2 (en) * 2010-01-25 2013-04-02 Apple Inc. Apparatus and method for intricate cuts
US8511498B2 (en) * 2010-01-25 2013-08-20 Apple Inc. Method for manufacturing an electronic device enclosure
CN102196687A (en) * 2010-03-15 2011-09-21 深圳富泰宏精密工业有限公司 Electronic device shell and manufacture method thereof
CN201655949U (en) * 2010-03-18 2010-11-24 中兴通讯股份有限公司 Antenna connector and its applied mobile terminal
US8372495B2 (en) 2010-05-26 2013-02-12 Apple Inc. Electronic device enclosure using sandwich construction
US9120272B2 (en) 2010-07-22 2015-09-01 Apple Inc. Smooth composite structure
CN102480869B (en) * 2010-11-29 2015-02-04 富泰华工业（深圳）有限公司 Shell component and electronic device with shell component
US9011623B2 (en) 2011-03-03 2015-04-21 Apple Inc. Composite enclosure
CN102673041B (en) * 2011-03-15 2016-03-02 联想(北京)有限公司 A kind of preparation method of workpiece
CN102189385B (en) * 2011-05-19 2014-06-04 戴护民 Composite manufacturing process for handy terminal exterior piece, and product thereof
CN102350827A (en) * 2011-07-07 2012-02-15 昆山金利表面材料应用科技股份有限公司 Light metal material or light metal alloy material and preparation method thereof
WO2013052269A2 (en) 2011-09-20 2013-04-11 Ticona Llc Housing for a portable electronic device
CN103890098B (en) 2011-09-20 2016-08-17 提克纳有限责任公司 Poly (arylene sulfide)/Liquid Crystal Polymer alloys and the compositions including it
CN103987769A (en) 2011-09-20 2014-08-13 提克纳有限责任公司 Low chlorine filled melt processed polyarylene sulfide composition
KR20140063838A (en) * 2011-09-20 2014-05-27 티코나 엘엘씨 Overmolded composite structure for an electronic device
US8921513B2 (en) 2011-09-20 2014-12-30 Ticona Llc Low halogen content disulfide washed polyarylene sulfide
TWI551208B (en) * 2011-10-26 2016-09-21 仁寶電腦工業股份有限公司 Casing
TW201343043A (en) * 2012-04-11 2013-10-16 Msi Electronic Kun Shan Co Ltd Method of manufacturing an upper cover of a portable computer device and upper cover thereof
US9394430B2 (en) 2012-04-13 2016-07-19 Ticona Llc Continuous fiber reinforced polyarylene sulfide
CN103379756A (en) * 2012-04-20 2013-10-30 深圳富泰宏精密工业有限公司 Shell of electronic device
US9545024B2 (en) 2012-05-29 2017-01-10 Apple Inc. Diamond cutting tools
DE102013201372B4 (en) * 2013-01-29 2018-06-07 Ecom Instruments Gmbh Portable electronic device with protection against static charge
US10407955B2 (en) 2013-03-13 2019-09-10 Apple Inc. Stiff fabric
US9983622B2 (en) 2013-10-31 2018-05-29 Hewlett-Packard Development Company, L.P. Method of applying a transfer film to metal surfaces
TWI626345B (en) 2013-12-20 2018-06-11 蘋果公司 Woven fibric band, method of generating a securement mechanism for a woven fibric band and method for generating a woven fibric band for securement to an object
JP6264905B2 (en) * 2014-01-31 2018-01-24 住友電気工業株式会社 Composite member and method of manufacturing composite member
KR101695709B1 (en) * 2014-08-12 2017-01-12 삼성전자주식회사 Housing, manufacturing method thereof, and electronic device having it
CN105530782A (en) * 2014-12-26 2016-04-27 比亚迪股份有限公司 Communication equipment metal shell and preparation method thereof
CN104812192B (en) * 2015-04-08 2018-09-14 广东欧珀移动通信有限公司 A kind of method and injection molding metal shell of optimization injection molding metal shell appearance
US20180319060A1 (en) * 2015-10-26 2018-11-08 Huawei Technologies Co., Ltd. Appearance mechanical part and method for manufacturing appearance mechanical part
CN105263286B (en) * 2015-11-30 2018-06-29 英业达科技有限公司 Dual gauge Universal machine cabinet
CN105704273B (en) * 2016-03-31 2019-05-21 努比亚技术有限公司 A kind of mask frame and terminal
US10899050B2 (en) 2016-04-04 2021-01-26 Hewlett-Packard Development Company, L.P. Insert-molded components
WO2017221921A1 (en) * 2016-06-23 2017-12-28 東レ株式会社 Case and method for producing case
CN106210201B (en) * 2016-08-26 2018-03-27 广东欧珀移动通信有限公司 Phone housing processing technology, phone housing and mobile phone
CN106622912A (en) * 2016-10-11 2017-05-10 安徽卡塔门窗有限公司 Anti-wear aluminum alloy door and window and manufacturing method thereof
CN106475290A (en) * 2016-10-11 2017-03-08 安徽卡塔门窗有限公司 Anticorrosion aluminium door and window and preparation method thereof
CN106514153B (en) * 2016-12-08 2023-08-01 福建省石狮市通达电器有限公司 Antenna hidden type mobile phone rear cover and manufacturing process thereof
CN107088739B (en) * 2017-05-10 2021-07-02 苏州胜利精密制造科技股份有限公司 Processing method of electronic product component
US10864686B2 (en) 2017-09-25 2020-12-15 Apple Inc. Continuous carbon fiber winding for thin structural ribs
CN108284565A (en) * 2018-01-26 2018-07-17 东莞市锐准精密金属有限公司 The built-in suspended metal moulding process of nanometer injection molding
CN108274687A (en) * 2018-03-27 2018-07-13 东莞市坚野材料科技有限公司 A kind of non-crystaline amorphous metal combined housing and its forming method and application
US11139630B2 (en) * 2019-12-30 2021-10-05 Electra Shield, Inc. Methods and materials for conduit apparatus and electrical enclosures
WO2021138840A1 (en) * 2020-01-08 2021-07-15 Hewlett-Packard Development Company, L.P. Covers for electronic devices

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05124060A (en) * 1991-11-07 1993-05-21 Fujitsu Ltd Resin molded form and manufacture thereof
JPH07124995A (en) * 1993-09-07 1995-05-16 Fujitsu Ltd Preparation of box for electronic instrument
JPH0889892A (en) * 1994-09-21 1996-04-09 Sumitomo Light Metal Ind Ltd Coated aluminum material and manufacture of the same
JPH0944269A (en) * 1995-07-25 1997-02-14 Fujitsu Ltd Electronic equipment, casing for electronic equipment and manufacture of the casing
JPH11147286A (en) * 1997-09-12 1999-06-02 Toray Ind Inc Composite molded product and members for electric and electronic machinery and apparatus
JP2002032150A (en) * 2000-05-09 2002-01-31 Sony Corp Information processor
JP2002275649A (en) * 2001-03-16 2002-09-25 Nippon Paint Co Ltd Surface treatment method for aluminum or aluminum alloy
WO2004055248A1 (en) * 2002-12-16 2004-07-01 Corona International Corporation Composite of aluminum material and synthetic resin molding and process for producing the same
JP2006210526A (en) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd Electromagnetic shield housing
JP2007050630A (en) * 2005-08-19 2007-03-01 Tosoh Corp Complex and its manufacturing method
JP2008003714A (en) * 2006-06-20 2008-01-10 Toshiba Corp Component coupling structure and electronic apparatus
JP2009266195A (en) * 2008-04-28 2009-11-12 Kojun Seimitsu Kogyo Kofun Yugenkoshi Casing for electronic device, and method for manufacturing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960047B1 (en) * 1998-04-13 1999-10-06 東北ムネカタ株式会社 Composite housing
ATE450507T1 (en) * 2002-08-10 2009-12-15 Sherwin Williams Co AEROSOL PAINT COMPOSITION ADHESIVE TO PLASTIC
JP4789670B2 (en) * 2006-03-27 2011-10-12 富士通株式会社 Resin molded product and manufacturing method thereof
CN101372143A (en) * 2007-08-24 2009-02-25 深圳富泰宏精密工业有限公司 Insert formed article

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05124060A (en) * 1991-11-07 1993-05-21 Fujitsu Ltd Resin molded form and manufacture thereof
JPH07124995A (en) * 1993-09-07 1995-05-16 Fujitsu Ltd Preparation of box for electronic instrument
JPH0889892A (en) * 1994-09-21 1996-04-09 Sumitomo Light Metal Ind Ltd Coated aluminum material and manufacture of the same
JPH0944269A (en) * 1995-07-25 1997-02-14 Fujitsu Ltd Electronic equipment, casing for electronic equipment and manufacture of the casing
JPH11147286A (en) * 1997-09-12 1999-06-02 Toray Ind Inc Composite molded product and members for electric and electronic machinery and apparatus
JP2002032150A (en) * 2000-05-09 2002-01-31 Sony Corp Information processor
JP2002275649A (en) * 2001-03-16 2002-09-25 Nippon Paint Co Ltd Surface treatment method for aluminum or aluminum alloy
WO2004055248A1 (en) * 2002-12-16 2004-07-01 Corona International Corporation Composite of aluminum material and synthetic resin molding and process for producing the same
JP2006210526A (en) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd Electromagnetic shield housing
JP2007050630A (en) * 2005-08-19 2007-03-01 Tosoh Corp Complex and its manufacturing method
JP2008003714A (en) * 2006-06-20 2008-01-10 Toshiba Corp Component coupling structure and electronic apparatus
JP2009266195A (en) * 2008-04-28 2009-11-12 Kojun Seimitsu Kogyo Kofun Yugenkoshi Casing for electronic device, and method for manufacturing the same

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9829916B2 (en) 2010-01-06 2017-11-28 Apple Inc. Component assembly
JP2013516690A (en) * 2010-01-06 2013-05-13 アップル インコーポレイテッド Handheld computing devices
US10642316B2 (en) 2010-01-06 2020-05-05 Apple Inc. Component assembly
US10289167B2 (en) 2010-01-06 2019-05-14 Apple Inc. Component assembly
US10048721B2 (en) 2010-01-06 2018-08-14 Apple Inc. Component assembly
JP2012000810A (en) * 2010-06-15 2012-01-05 Kyocera Chemical Corp Housing for electronic device, and method for producing the same
JP2012038267A (en) * 2010-08-11 2012-02-23 Toshiba Corp Electronic apparatus
US8675373B2 (en) 2010-08-11 2014-03-18 Kabushiki Kaisha Toshiba Electronic apparatus
JP2013232052A (en) * 2012-04-27 2013-11-14 Lenovo Singapore Pte Ltd Casing material, manufacturing method of said casing material, electronic apparatus casing using said casing material, manufacturing method of said electronic apparatus casing, and electronic apparatus using said electronic apparatus casing
US9326396B2 (en) 2012-04-27 2016-04-26 Lenovo (Singapore) Pte Ltd Electronic equipment casing
US9363459B2 (en) 2012-06-14 2016-06-07 Kabushiki Kaisha Toshiba Electronic apparatus
JP2014051044A (en) * 2012-09-07 2014-03-20 Panasonic Corp Tabular housing member, and insert injection molding method thereof
JP2015533194A (en) * 2012-10-05 2015-11-19 ノキア テクノロジーズ オサケユイチア Metallization and anodization of plastic and conductive parts of the device body
KR101727841B1 (en) * 2012-10-05 2017-04-17 노키아 테크놀로지스 오와이 Metallization and anodization of plastic and conductive parts of the body of an apparatus
US9413861B2 (en) 2012-10-05 2016-08-09 Nokia Technologies Oy Metallization and anodization of plastic and conductive parts of the body of an apparatus
KR101765150B1 (en) * 2016-01-08 2017-08-23 후앙 치에 메탈 테크놀로지 코., 엘티디. Radio waves guiding window for metal case and manufacturing method thereof
DE102017101088A1 (en) 2016-02-16 2017-08-17 Lenovo (Singapore) Pte. Ltd. Housing part, electronic device and method for producing the housing part
US10285294B2 (en) 2016-02-16 2019-05-07 Lenovo (Singapore) Pte Ltd Method for producing a chassis member usable in a chassis of an electronic device
WO2019027121A1 (en) * 2017-08-04 2019-02-07 이성수 Method for manufacturing titanium alloy having high radio wave transmittance
KR20210143229A (en) * 2019-04-22 2021-11-26 미쯔이가가꾸가부시끼가이샤 Electronic device housing, manufacturing method thereof, and metal-resin composite
JPWO2020218277A1 (en) * 2019-04-22 2021-12-02 三井化学株式会社 Electronic device housing, its manufacturing method and metal resin composite
JP7299974B2 (en) 2019-04-22 2023-06-28 三井化学株式会社 ELECTRONIC DEVICE CASE, MANUFACTURING METHOD THEREOF, AND METAL-RESIN COMPOSITE
KR102601050B1 (en) * 2019-04-22 2023-11-10 미쯔이가가꾸가부시끼가이샤 Electronic device housing, manufacturing method thereof and metal resin composite
JP7394339B2 (en) 2019-10-03 2023-12-08 パナソニックＩｐマネジメント株式会社 Electronics

Also Published As

Publication number Publication date
US20090267266A1 (en) 2009-10-29
CN101573009A (en) 2009-11-04

Similar Documents

Publication Publication Date Title
JP2009262530A (en) Casing for electronic device, and manufacturing method thereof
JP2009266195A (en) Casing for electronic device, and method for manufacturing the same
JP5210464B2 (en) Portable computing system
US9649733B2 (en) Methods for securing features to housings
US11744028B2 (en) Electronic device including thin housing, and manufacturing method therefor
US20090280316A1 (en) Joining structure and insert-molded cover using same
US20090280347A1 (en) Insert-molded member made of metal and plastic and method for making same
JP2009269396A (en) Casing for electronic device and its method for manufacturing
US20110223382A1 (en) Housing structure
CN101730410A (en) Shell and manufacture method thereof
US10688624B2 (en) Electronic device structure formed from porous metal bonded to plastic
JPWO2007072603A1 (en) Metal material having joint part with different material and its processing method using laser
JP2008290295A (en) Plastic plated product and its manufacturing process
EP2080426A1 (en) Electronic equipment housing and process for manufacturing the same
KR20170006709A (en) Electronic device having a full metal housing and method for manufacturing the same
JP2007260965A (en) Resin molded product and its manufacturing method
JP5091947B2 (en) Heat dissipating device for composite housing using biodegradable plastic
TW200902282A (en) In-mold decoration injection molding case and method thereof
JP2007223323A (en) Electronic device housing and its molding method
CN111491469B (en) Core-shell with various filler materials for enhanced thermal conductivity
TWI376185B (en) Housing for electronic device and method for manufacturing the same
JP2009119672A (en) Molded product of biodegradable resin and its manufacturing method
JP2007176108A (en) Insert molding method of cabinet of electronic device and electronic device having cabinet covered with leather cover
JP2004330509A (en) Electronic device housing and its molding method
CN102029682B (en) Housing, production method therefor and electronic device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100525

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120116

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120403

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120702

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130416