JPH05124060A - Resin molded form and manufacture thereof - Google Patents

Resin molded form and manufacture thereof

Info

Publication number
JPH05124060A
JPH05124060A JP29173391A JP29173391A JPH05124060A JP H05124060 A JPH05124060 A JP H05124060A JP 29173391 A JP29173391 A JP 29173391A JP 29173391 A JP29173391 A JP 29173391A JP H05124060 A JPH05124060 A JP H05124060A
Authority
JP
Japan
Prior art keywords
resin
metal plate
molding
integrally
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29173391A
Other languages
Japanese (ja)
Inventor
Koichi Kimura
浩一 木村
Makoto Usui
誠 臼居
Kota Nishii
耕太 西井
Takashi Muratani
孝 村谷
Masanobu Ishizuka
賢伸 石塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP29173391A priority Critical patent/JPH05124060A/en
Publication of JPH05124060A publication Critical patent/JPH05124060A/en
Pending legal-status Critical Current

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  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To provide a resin molded form, which has high strength, is thinned and lightened, and a resin molded form, in which the surface of the resin molded form is decorated, and manufacture thereof. CONSTITUTION:An aluminum plate 3 with through-holes and a resin section 2 are monolithic-molded, and ribs 5 and bosses 6 integrally connected by the through-holes are formed simultaneously on the reverse side of the resin section 2. Structure in which an outer frame 4 is also monolithic-molded simultaneously so that the aluminum plate 3 intrudes to a root in specified size along the end sections of the aluminum plate 3 is formed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は樹脂成形体及びその製造
方法に係り、特に金属板により補強される樹脂成形体及
びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding and a method for manufacturing the same, and more particularly to a resin molding reinforced by a metal plate and a method for manufacturing the same.

【0002】近年、ノート型パーソナルコンピュータ
(以下ノートパソコンという)、電子手帳、電話器など
のOA(オフィスオートメーション)機器は携帯性が要
求されているため、製品軽量化、薄肉化が重要になって
いる。
In recent years, OA (office automation) devices such as notebook personal computers (hereinafter referred to as "notebook personal computers"), electronic organizers, and telephones are required to be portable, so that it is important to reduce the weight and thickness of products. There is.

【0003】[0003]

【従来の技術】従来、ノートパソコン、電子手帳、電話
器等に代表される携帯用機器においては、軽量化、美観
性、絶縁性等の点から、その筐体に樹脂を使用してい
る。
2. Description of the Related Art Conventionally, a resin is used for a housing of a portable device represented by a notebook computer, an electronic notebook, a telephone and the like, from the viewpoint of weight reduction, aesthetics and insulation.

【0004】これ等製品の重量の中で筐体の重量は通常
30から50%を占めており、この筐体をさらに軽量化
できれば製品の軽量化に大きく貢献できる。
The weight of the case usually accounts for 30 to 50% of the weight of these products, and if the case can be made lighter, it can greatly contribute to the weight reduction of the product.

【0005】このため、筐体を軽量化するために筐体の
薄肉化が進められいるが、通常筐体に使用されている汎
用プラスチックのABS樹脂(アクリロニトリル・ブタ
ジエン・スチレン樹脂)では、強度不足の問題により薄
肉化に限界があった。
For this reason, the housing is being made thinner in order to reduce the weight of the housing. However, the strength of general-purpose plastic ABS resin (acrylonitrile-butadiene-styrene resin), which is commonly used for housings, is insufficient. There was a limit to thinning due to the problem of.

【0006】そこで、芳香族ポリアミド、PPS(ポリ
フェニレンサルファイド)などの高強度のエンジニアリ
ングプラスチックを使用し、薄肉の筐体を製造してい
る。
Therefore, a thin-walled housing is manufactured by using high-strength engineering plastics such as aromatic polyamide and PPS (polyphenylene sulfide).

【0007】[0007]

【発明が解決しようとする課題】しかし、上記エンジニ
アリングプラスチックはABS樹脂に比較すると金型に
よる射出成形が難しく、そのうえ成形後の表面に塗装、
メッキがしにくいという問題がある。
However, compared with ABS resin, the above-mentioned engineering plastics are more difficult to be injection-molded by a mold, and furthermore, the surface after molding is coated,
There is a problem that it is difficult to plate.

【0008】また、上記エンジニアリングプラスチック
を使用してもまだ強度が不足しているという問題もあ
る。
Further, there is a problem that the strength is still insufficient even if the above engineering plastic is used.

【0009】そこで本発明は上記課題に鑑みなされたも
ので、携帯用OA機器等の筐体に好適な強度の高い薄型
化され軽量化された樹脂成形体とその表面が装飾された
前記樹脂成形体及びその製造方法を提供することを目的
とする。
Therefore, the present invention has been made in view of the above problems, and is a thin and lightweight resin molded product having high strength, which is suitable for a housing of portable OA equipment and the like, and the resin molded product whose surface is decorated. An object is to provide a body and a method for producing the body.

【0010】[0010]

【課題を解決するための手段】上記課題は、金属板と、
該金属板の片側表面を覆うように樹脂層が一体成形され
た構造の樹脂成形体により解決される。
[Means for Solving the Problems] The above problems include a metal plate,
This is solved by a resin molded body having a structure in which a resin layer is integrally molded so as to cover one surface of the metal plate.

【0011】前記金属板は貫通孔を有しており、前記金
属板の樹脂層が形成された面の反対側に、前記貫通孔で
一体的に連結した突設部を有する構造としてもよい。
The metal plate may have a through hole, and the metal plate may have a projecting portion integrally connected to the through hole on the side opposite to the surface on which the resin layer is formed.

【0012】また、前記樹脂層は前記金属板の端部か
ら、前記樹脂層と一体的に形成された立ち上り部を有
し、前記金属板の端部は前記立ち上り部に所定寸法くい
込んだ構造とすることもできる。
Further, the resin layer has a rising portion integrally formed with the resin layer from an end portion of the metal plate, and the end portion of the metal plate has a structure in which the rising portion is bite into the rising portion by a predetermined dimension. You can also do it.

【0013】そして前記突設部上で、前記金属板の貫通
孔近傍に、射出成形用金型の樹脂注入用ゲートを配して
成形した構造としてもよい。
A resin injection gate of an injection molding die may be arranged near the through hole of the metal plate on the projecting portion for molding.

【0014】さらに、上記課題は金属板と、該金属板の
片面表面を覆うように樹脂層と、該樹脂層の前記金属板
と反対側表面を覆う表皮材とが一体成形された構造とす
ることによっても解決される。
Further, the above-mentioned problem is a structure in which a metal plate, a resin layer covering one surface of the metal plate, and a skin material covering the surface of the resin layer opposite to the metal plate are integrally formed. It can also be solved.

【0015】また前記表皮材は成形用樹脂と同材質のフ
ィルムとしてもよい。
The skin material may be a film made of the same material as the molding resin.

【0016】そして前記樹脂成形体は上型及び下型より
構成される金型の一方に前記表皮材を配し、もう一方の
金型に前記金属板を配する工程と、前記金型を組み合わ
せ前記表皮材と金属板との間に形成された空間に成形用
樹脂を注入する工程と、前記樹脂により一体成形された
樹脂成形体を前記2つの金型より取り出す工程とを含む
製造方法によって製造することができる。
The resin molding is combined with a step of arranging the skin material on one of dies composed of an upper die and a lower die and arranging the metal plate on the other die, and the die. Manufactured by a manufacturing method including a step of injecting a molding resin into a space formed between the skin material and a metal plate, and a step of taking out a resin molded body integrally molded of the resin from the two molds. can do.

【0017】[0017]

【作用】上述のように金属板と樹脂部が一体成形された
構造において、金属板は樹脂を補強するよう作用する。
In the structure in which the metal plate and the resin portion are integrally molded as described above, the metal plate acts to reinforce the resin.

【0018】前記金属板が貫通孔を有することは、射出
成形時に前記金属板の両面に樹脂が前記貫通孔を通じて
流れることを可能にする。
The fact that the metal plate has the through holes enables the resin to flow through the through holes on both surfaces of the metal plate during injection molding.

【0019】また金属板の端部を樹脂部に所定寸法くい
込ませることにより樹脂部分が金属板を抱き抱えるよう
な構造とすることができる。
Further, by making the end portion of the metal plate bite into the resin portion by a predetermined size, the resin portion can hold the metal plate.

【0020】そして、金属板の貫通孔近傍からの突設部
から樹脂を注入することにより樹脂はこの貫通孔を流れ
て金属板を挟んだ反対側の樹脂部分を形成することがで
き、樹脂注入用ゲートが突設部側だけに配置されていて
も樹脂が金型内全体に完全に充填されることとなる。
By injecting the resin from the protruding portion of the metal plate near the through hole, the resin can flow through the through hole to form a resin portion on the opposite side sandwiching the metal plate. Even if the use gate is arranged only on the protruding portion side, the resin will be completely filled in the mold.

【0021】さらに金属板と樹脂部が一体成形され、前
記金属板の反対側の樹脂部表面に表皮材を一体成形した
構造は金属板が樹脂部を補強すると同時に表皮材が樹脂
成形体の表面として機能することとなる。
Further, in the structure in which the metal plate and the resin portion are integrally molded, and the skin material is integrally molded on the surface of the resin portion on the opposite side of the metal plate, the metal plate reinforces the resin portion and at the same time the skin material is the surface of the resin molded body. Will function as.

【0022】また表皮材を成形用樹脂と同材質とするこ
とは表皮材が成形用樹脂に強固に接着するよう作用す
る。
When the surface material is made of the same material as the molding resin, the surface material acts so as to firmly adhere to the molding resin.

【0023】そしてこの樹脂成形体を製造する時に金型
に表皮材と金属板を配して成形することは、表皮材、樹
脂部、金属板の順にこれ等を一体成形することを可能に
する。
By disposing and molding the skin material and the metal plate in the mold when manufacturing this resin molded body, it becomes possible to integrally mold the skin material, the resin portion and the metal plate in this order. ..

【0024】[0024]

【実施例】図1は本発明の第1実施例であるノートパソ
コンの筐体の斜視図であり、内部の構造がわかるように
一部が断面してある。図2は図1における金属板を示し
た図であり、図3(A)は図1のボス部の拡大断面図、
(B)はリブ部の拡大平面図、(C)はリブ部の拡大断
面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of a casing of a notebook computer according to a first embodiment of the present invention, a part of which is sectioned so that the internal structure can be seen. 2 is a view showing the metal plate in FIG. 1, and FIG. 3 (A) is an enlarged sectional view of the boss portion in FIG.
(B) is an enlarged plan view of the rib portion, and (C) is an enlarged sectional view of the rib portion.

【0025】図1の断面部分で示したように、筐体1は
厚さ0.4mmのアルミ板3と樹脂部2を一体成形して
厚さ1mmとした構成であり、前記アルミ板3の片面は
リブ5及びボス6が設けられた部分を除いて全面にわた
って金属面が露出し、もう片側の面はその全面が、前記
樹脂部2で覆われている。
As shown in the sectional view of FIG. 1, the housing 1 has a structure in which an aluminum plate 3 having a thickness of 0.4 mm and a resin portion 2 are integrally molded to have a thickness of 1 mm. A metal surface is exposed over the entire surface except for the portion where the rib 5 and the boss 6 are provided, and the entire surface of the other surface is covered with the resin portion 2.

【0026】前記樹脂部2は前記アルミ板3より大きく
形成され、前記アルミ板3からはみ出した部分からは前
記アルミ板3を囲むように外枠4が全周にわたって前記
樹脂部2に一体的に形成されている。
The resin portion 2 is formed to be larger than the aluminum plate 3, and an outer frame 4 is integrally formed with the resin portion 2 over the entire circumference so as to surround the aluminum plate 3 from a portion protruding from the aluminum plate 3. Has been formed.

【0027】前記アルミ板3には図2に示すように、所
定位置に貫通孔7,8が設けられ、その位置に対応して
ボス6及びリブ5が前記アルミ板3上に形成されてい
る。
As shown in FIG. 2, the aluminum plate 3 is provided with through holes 7 and 8 at predetermined positions, and bosses 6 and ribs 5 are formed on the aluminum plate 3 corresponding to the positions. ..

【0028】すなわち、図3(A),(C)に示すよう
にボス6及びリブ5は貫通孔7,8を通じて前記樹脂部
2と一体的に連結成形されており、前記アルミ板3を前
記樹脂部3とともに挟んで固定する働きがある。
That is, as shown in FIGS. 3A and 3C, the boss 6 and the rib 5 are integrally connected and molded with the resin portion 2 through the through holes 7 and 8, and the aluminum plate 3 is It has a function of sandwiching and fixing together with the resin portion 3.

【0029】さらに、図3(A)で示すように、前記ア
ルミ板3の外周端部3aは、前記樹脂部2から前記アル
ミ板3の方向に立ち上った外枠4の根元にくい込んだ構
造となっており、前記アルミ板3は、その外周も前記樹
脂部2と前記外枠4によって挟まれ固定されている。
Further, as shown in FIG. 3 (A), the outer peripheral edge 3a of the aluminum plate 3 has a structure in which the outer frame 4 rising from the resin portion 2 toward the aluminum plate 3 is not easily rooted. The outer periphery of the aluminum plate 3 is also sandwiched and fixed by the resin portion 2 and the outer frame 4.

【0030】以上のように筐体1は樹脂部2、アルミ板
3、外枠4、リブ5、ボス6が一体的に成形され、前記
アルミ板3は前記樹脂部2と外枠4、リブ5、ボス6に
よって挟まれ固定されているので、外部からの力に対し
て強い構造となっている。
As described above, the housing 1 is integrally formed with the resin portion 2, the aluminum plate 3, the outer frame 4, the ribs 5 and the boss 6, and the aluminum plate 3 has the resin portion 2, the outer frame 4 and the ribs. Since it is sandwiched and fixed by the boss 6 and 5, the structure is strong against external force.

【0031】図5は本実施例による筐体(実施例)と本
実施例のアルミ板3を一体成形しないで厚さは同じと
し、樹脂のみとして成形した場合の筐体(比較例)との
強度を比較した、グラフである。
FIG. 5 shows a case (comparative example) in which the case according to the present example (the example) and the aluminum plate 3 according to the present example are not integrally formed, but have the same thickness, and only the resin is formed. It is a graph which compared intensity.

【0032】同図中、横軸の荷重は前記両筐体の中央部
に集中的に加えた荷重であり、縦軸の変位は、その加重
を加えた部分のたわみ量である。同図によって明らかな
ように本実施例による筐体の変位は、アルミ板3を一体
成形していない筐体の変位の約1/3であり、本実施例
による筐体は著しく強度が向上していることがわかる。
In the figure, the load on the horizontal axis is the load concentratedly applied to the central portions of the two housings, and the displacement on the vertical axis is the deflection amount of the part to which the weight is applied. As is clear from the figure, the displacement of the casing according to the present embodiment is about 1/3 of the displacement of the casing without the aluminum plate 3 integrally molded, and the casing according to the present embodiment has significantly improved strength. You can see that

【0033】以上のような構造を有した本実施例による
ノートパソコンの筐体1の板厚は約1mmであるが、一
体成形するアルミ板3の板厚としては、筐体1の全体の
重量への影響および補強の効果を考慮すると0.2〜
0.6mmが適当である。
The thickness of the casing 1 of the notebook computer according to this embodiment having the above structure is about 1 mm, but the thickness of the integrally molded aluminum plate 3 is the weight of the entire casing 1. 0.2-
0.6 mm is suitable.

【0034】前記アルミ板以外に、アルミ合金板あるい
はマグネシウム等の軽金属板を使用しても同様の効果が
得られる。
Similar effects can be obtained by using an aluminum alloy plate or a light metal plate such as magnesium other than the aluminum plate.

【0035】また、前記アルミ板3のかわりにステンレ
ス板を使用すればさらに強度を向上することが可能であ
る。さらに本実施例による筐体1は、そのほぼ全面にわ
たって金属板が埋め込まれているため、電磁波シールド
性にも優れているという効果もある。
If a stainless steel plate is used instead of the aluminum plate 3, the strength can be further improved. Further, the casing 1 according to the present embodiment has an effect that it is also excellent in electromagnetic wave shielding property because the metal plate is embedded over substantially the entire surface thereof.

【0036】ここで前記筐体1は金型を用いて射出成形
する際に、樹脂の注入口はいわゆるピンゲートを用いて
いる。
Here, when the casing 1 is injection-molded by using a mold, a so-called pin gate is used as a resin injection port.

【0037】そしてそのピンゲートは前記ボス6の頂面
6a及び前記リブ5の頂面5a上で前記貫通孔7,8に
近い部分に配置されている。
The pin gate is arranged on the top surface 6a of the boss 6 and the top surface 5a of the rib 5 at a portion close to the through holes 7 and 8.

【0038】このようにすると、成形時金型注入された
樹脂は、まず前記ボス6及びリブ5が形成される空間に
入り、すぐに前記貫通孔7,8を通って前記金型内の前
記樹脂部2が形成される空間内に充填されることとな
り、金型全体に樹脂が回り易くなる。
In this way, the resin injected into the mold at the time of molding first enters the space in which the boss 6 and the rib 5 are formed, and immediately passes through the through holes 7 and 8 and the above-mentioned resin in the mold. The resin is filled in the space in which the resin portion 2 is formed, and the resin easily flows around the mold.

【0039】したがって、射出成形時に形成されるラン
ナは図4に示すように、前記ボス6及びリブ5の側に形
成され、このランナを切り取った部分は前記樹脂部2の
表面側には出てこない。
Therefore, as shown in FIG. 4, the runner formed at the time of injection molding is formed on the side of the boss 6 and the rib 5, and the cut-out portion of the runner is exposed on the surface side of the resin portion 2. Don't come

【0040】このため、前記筐体1の表面は射出成形後
に後処理をしなくても、そのままの状態で十分製品とし
ての外観を保つことができる。
For this reason, the surface of the casing 1 can sufficiently maintain its appearance as a product without any post-treatment after injection molding.

【0041】次に本発明の第2実施例を図6とともに説
明する。同図中(A)は金型による射出成形前の状態を
示す図、(B)は成形中の状態を示す図、(C)は成形
後の筐体の断面を示す図である。尚、本図において、図
1に示した第1実施例と同じ構成部には同一の符号を付
し、その説明は省略する。
Next, a second embodiment of the present invention will be described with reference to FIG. In the figure, (A) is a diagram showing a state before injection molding by a mold, (B) is a diagram showing a state during molding, and (C) is a diagram showing a cross section of the casing after molding. In the figure, the same components as those in the first embodiment shown in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.

【0042】本実施例による筐体10は図6(C)に示
すように上述の第1実施例の樹脂部2の外側にさらにフ
ィルム9を一体成形して張り合わせる構造として成形さ
れている。ここで一体成形とは前記フィルム9とアルミ
板3を樹脂により一体的に形成することを意味する。
As shown in FIG. 6C, the housing 10 according to the present embodiment is formed as a structure in which a film 9 is integrally formed on the outside of the resin portion 2 of the above-mentioned first embodiment and laminated. Here, the integral molding means that the film 9 and the aluminum plate 3 are integrally formed of resin.

【0043】すなわち、前記筐体10は図6(A)に示
すように、まず樹脂射出成形用の金型11(上型)に表
面塗装用のフィルム9を配し、もう一方の金型12(下
型)には、アルミ板3を配してから、図6(B)に示す
ように樹脂(ポリカ−ボネート樹脂)を注入して、前記
フィルム9、樹脂部2、アルミ板3、外枠4、ボス6を
一体成形したものである。
That is, as shown in FIG. 6A, in the case 10, first, a resin injection molding die 11 (upper die) is provided with a film 9 for surface coating, and the other die 12 is placed. The aluminum plate 3 is placed on the (lower mold), and then a resin (polycarbonate resin) is injected as shown in FIG. 6 (B) to form the film 9, the resin portion 2, the aluminum plate 3, and the outside. The frame 4 and the boss 6 are integrally molded.

【0044】このフィルム9にはあらかじめ模様、色彩
が施されているので筐体10の外観を、筐体10の成形
後に塗装加工をしなくても、美しく装飾することができ
る。前記フィルム9の材質としては前記樹脂部2と同材
質のポリカーボネートフィルムを使用すれば、前記樹脂
部2との接着性は向上する。
Since the film 9 is pre-patterned and colored, the appearance of the housing 10 can be beautifully decorated without any coating process after the housing 10 is molded. If a polycarbonate film made of the same material as the resin portion 2 is used as the material of the film 9, the adhesiveness with the resin portion 2 is improved.

【0045】本実施例では前記フィルム9の厚さを50
μmとしたが、このフィルムの厚さは10〜100μm
程度が望ましい。この理由は10μm以下では薄すぎて
強度が足らず、100μm以上では厚すぎて、樹脂注入
時の成形性が低下するからである。
In this embodiment, the film 9 has a thickness of 50.
The thickness of this film is 10-100 μm.
The degree is desirable. The reason for this is that if the thickness is 10 μm or less, the strength is too thin and the strength is insufficient, and if it is 100 μm or more, the thickness is too large and the moldability at the time of resin injection is lowered.

【0046】[0046]

【発明の効果】上述の如く、本発明による樹脂成形体は
金属板と樹脂部が一体成形された構造のため、樹脂だけ
の成形体の外観はそのままに保ちながら強度が高く薄型
化された樹脂成形体を得ることができる。
As described above, since the resin molded product according to the present invention has a structure in which the metal plate and the resin portion are integrally molded, the resin molded product is high in strength and thin while maintaining the appearance of the resin-only molded product. A molded body can be obtained.

【0047】また、一体成形する金属板に貫通孔を設け
て、その貫通孔を通じて表面の樹脂部と一体的に連結し
た突設部を設けること及び金属板の端部を樹脂部にくい
込ませることにより金属板と樹脂部との結合を非常に強
固なものとすることができる。
Further, a through hole is provided in the metal plate to be integrally formed, and a projecting portion integrally connected to the resin portion on the surface is provided through the through hole, and the end portion of the metal plate is hard to be inserted into the resin portion. Thus, the connection between the metal plate and the resin portion can be made very strong.

【0048】したがって携帯用OA機器等の筐体として
使用した場合、強度の高い、薄型化され、軽量化された
筐体を容易に製作することができ、機器自体の薄型化軽
量化を実現できる。
Therefore, when it is used as a casing of a portable office automation equipment or the like, a strong, thin, and lightweight casing can be easily manufactured, and the device itself can be made thin and lightweight. ..

【0049】さらにこの樹脂成形体の成形時に表皮材を
同時に一体成形することにより、成形後の塗装加工を必
要としない美観を持った樹脂成形体を容易に製作するこ
とができる。
Further, by integrally molding the skin material at the time of molding this resin molded body, it is possible to easily manufacture a resin molded body having an aesthetic appearance that does not require coating after molding.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1実施例の斜視図である。FIG. 1 is a perspective view of a first embodiment of the present invention.

【図2】第1実施例の構成部品の斜視図である。FIG. 2 is a perspective view of components of the first embodiment.

【図3】第1実施例の要部拡大図である。FIG. 3 is an enlarged view of a main part of the first embodiment.

【図4】筐体成形時のランナを示す図である。FIG. 4 is a view showing a runner at the time of molding a casing.

【図5】筐体の強度を比較した図である。FIG. 5 is a diagram comparing the strengths of housings.

【図6】第2実施例の構造と説明方法を説明する図であ
る。
FIG. 6 is a diagram illustrating a structure and a description method of a second embodiment.

【符号の説明】[Explanation of symbols]

1 筐体 2 樹脂部 3 アルミ板 4 外枠 5 リブ 6 ボス 7,8 貫通孔 9 フィルム 11,12 金型 1 Housing 2 Resin Part 3 Aluminum Plate 4 Outer Frame 5 Rib 6 Boss 7,8 Through Hole 9 Film 11,12 Mold

───────────────────────────────────────────────────── フロントページの続き (72)発明者 村谷 孝 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (72)発明者 石塚 賢伸 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Takashi Muratani, 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa, within Fujitsu Limited

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 金属板(3)と、該金属板(3)の片側
表面を覆うように樹脂層(2)とが一体成形された構造
を特徴とする樹脂成形体。
1. A resin molded body characterized by a structure in which a metal plate (3) and a resin layer (2) are integrally molded so as to cover one surface of the metal plate (3).
【請求項2】 前記金属板(3)は貫通孔(7,8)を
有しており、前記金属板(3)の樹脂層(2)が形成さ
れた面の反対側に、前記貫通孔(7,8)で一体的に連
結した突設部(5,6)を有することを特徴とする請求
項1記載の樹脂成形体。
2. The metal plate (3) has through holes (7, 8), and the through hole is provided on the opposite side of the surface of the metal plate (3) on which the resin layer (2) is formed. The resin molding according to claim 1, which has a protruding portion (5, 6) integrally connected with (7, 8).
【請求項3】 前記樹脂層(2)は前記金属板(3)の
端部から、前記樹脂層(2)と一体的に形成された立ち
上り部(4)を有し、前記金属板(3)の外周端部(3
a)は前記立ち上り部(4)に所定寸法くい込んだ構造
としたとを特徴とする請求項1または2記載の樹脂成形
体。
3. The resin layer (2) has a rising portion (4) integrally formed with the resin layer (2) from an end portion of the metal plate (3), and the metal plate (3). ) Outer edge (3
The resin molding according to claim 1 or 2, wherein a) has a structure in which the rising portion (4) is inserted into the rising portion (4) by a predetermined size.
【請求項4】 前記突設部(5),(6)上で、前記金
属板(3)の貫通孔(7),(8)近傍に、射出成形用
金型の樹脂注入用ゲートを配して成形した構造を特徴と
する請求項3記載の樹脂成形体。
4. A resin injection gate of an injection molding die is arranged on the protrusions (5), (6) near the through holes (7), (8) of the metal plate (3). The resin molded body according to claim 3, wherein the resin molded body is formed by molding.
【請求項5】 金属板(3)と、該金属板(3)の片面
表面を覆うように樹脂層(2)と、該樹脂層(2)の前
記金属板と反対側表面を覆う表皮材(9)とが一体形成
された構造を特徴とする樹脂成形体。
5. A metal plate (3), a resin layer (2) covering one surface of the metal plate (3), and a skin material covering the surface of the resin layer (2) opposite to the metal plate. (9) A resin molded body having a structure integrally formed with.
【請求項6】 前記表皮材(9)は成形用樹脂と同材質
のフィルムとした請求項5記載の樹脂成形体。
6. The resin molding according to claim 5, wherein the skin material (9) is a film made of the same material as the molding resin.
【請求項7】 上型及び下型より構成される金型(1
1,12)の一方に前記表皮材(9)を配し、もう一方
の金型に前記金属板(3)を配する工程と、 前記金型(11,12)を組み合わせ前記表皮材(9)
と金属板(3)との間に形成された空間に成形用樹脂を
注入する工程と、 前記樹脂により一体成形された樹脂成形体を前記2つの
金型(11,12)より取り出す工程とを含むことを特
徴とする請求項5記載の成形体の製造方法。
7. A mold (1 comprising an upper mold and a lower mold.
1, 12), the step of disposing the skin material (9) on one side, and disposing the metal plate (3) on the other die, and combining the metal molds (11, 12) with the skin material (9). )
A step of injecting a molding resin into a space formed between the metal plate (3) and the metal plate (3), and a step of taking out a resin molded body integrally molded by the resin from the two molds (11, 12). The method for producing a molded article according to claim 5, further comprising:
JP29173391A 1991-11-07 1991-11-07 Resin molded form and manufacture thereof Pending JPH05124060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29173391A JPH05124060A (en) 1991-11-07 1991-11-07 Resin molded form and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29173391A JPH05124060A (en) 1991-11-07 1991-11-07 Resin molded form and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH05124060A true JPH05124060A (en) 1993-05-21

Family

ID=17772699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29173391A Pending JPH05124060A (en) 1991-11-07 1991-11-07 Resin molded form and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH05124060A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0641643A2 (en) * 1993-09-07 1995-03-08 Fujitsu Limited Method of manufacturing a casing for an electronic apparatus
EP1010495A2 (en) * 1998-12-15 2000-06-21 Diamond Machining Technology Inc. Support structure for two-sided abrasive tool and the like and method of assembling same
US6103998A (en) * 1998-06-19 2000-08-15 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Resin windows having electrically conductive terminals
US6402603B1 (en) 1998-12-15 2002-06-11 Diamond Machining Technology, Inc. Two-sided abrasive tool
FR2877601A1 (en) * 2004-11-10 2006-05-12 Plastic Omnium Cie Manufacturing process for thermoplastic component with electrically conducting layer, e.g. for motor vehicle, includes injection of molten plastic into mold containing aluminium foil layer with apertures
JP2008093012A (en) * 2006-10-06 2008-04-24 Aiwa Raito:Kk Game machine parts
JP2009090475A (en) * 2007-10-04 2009-04-30 Mitsubishi Electric Corp Method for producing box body and mold
JP2009167947A (en) * 2008-01-17 2009-07-30 Toyota Motor Corp Oil separator
JP2009220420A (en) * 2008-03-17 2009-10-01 Mitsubishi Electric Corp Manufacturing method of plate insert molding and electronic device
JP2009262530A (en) * 2008-04-28 2009-11-12 Kojun Seimitsu Kogyo Kofun Yugenkoshi Casing for electronic device, and manufacturing method thereof
JP2010125822A (en) * 2008-12-01 2010-06-10 Tigers Polymer Corp Annular resin molded article
US8520372B2 (en) 2010-05-21 2013-08-27 Kabushiki Kaisha Toshiba Electronic apparatus display housing assembly
JP2015071266A (en) * 2013-10-03 2015-04-16 三井化学株式会社 Metal/resin composite structure and production method thereof
US10059078B2 (en) * 2012-03-23 2018-08-28 Cutting Dynamics, Inc. Injection molded composite blank and guide

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0641643A2 (en) * 1993-09-07 1995-03-08 Fujitsu Limited Method of manufacturing a casing for an electronic apparatus
EP0641643A3 (en) * 1993-09-07 1997-01-29 Fujitsu Ltd Method of manufacturing a casing for an electronic apparatus.
US6103998A (en) * 1998-06-19 2000-08-15 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Resin windows having electrically conductive terminals
US6455809B1 (en) 1998-06-19 2002-09-24 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Resin windows having electrically conductive terminals
EP1010495A2 (en) * 1998-12-15 2000-06-21 Diamond Machining Technology Inc. Support structure for two-sided abrasive tool and the like and method of assembling same
EP1010495A3 (en) * 1998-12-15 2002-01-09 Diamond Machining Technology Inc. Support structure for two-sided abrasive tool and the like and method of assembling same
US6402603B1 (en) 1998-12-15 2002-06-11 Diamond Machining Technology, Inc. Two-sided abrasive tool
US6528141B1 (en) 1998-12-15 2003-03-04 Diamond Machining Technology, Inc. Support structure and method of assembling same
US7320771B2 (en) 2004-11-10 2008-01-22 Compagnie Plastic Omnium Method of making a ribbed part out of thermoplastic material covered in a conductive foil, and a ribbed part
EP1657045A1 (en) * 2004-11-10 2006-05-17 Compagnie Plastic Omnium Method of manufacturing a ribbed thermoplastic part with a conductive film, and part obtained by said method
FR2877601A1 (en) * 2004-11-10 2006-05-12 Plastic Omnium Cie Manufacturing process for thermoplastic component with electrically conducting layer, e.g. for motor vehicle, includes injection of molten plastic into mold containing aluminium foil layer with apertures
JP2008093012A (en) * 2006-10-06 2008-04-24 Aiwa Raito:Kk Game machine parts
JP2009090475A (en) * 2007-10-04 2009-04-30 Mitsubishi Electric Corp Method for producing box body and mold
JP2009167947A (en) * 2008-01-17 2009-07-30 Toyota Motor Corp Oil separator
JP2009220420A (en) * 2008-03-17 2009-10-01 Mitsubishi Electric Corp Manufacturing method of plate insert molding and electronic device
JP2009262530A (en) * 2008-04-28 2009-11-12 Kojun Seimitsu Kogyo Kofun Yugenkoshi Casing for electronic device, and manufacturing method thereof
JP2010125822A (en) * 2008-12-01 2010-06-10 Tigers Polymer Corp Annular resin molded article
US8520372B2 (en) 2010-05-21 2013-08-27 Kabushiki Kaisha Toshiba Electronic apparatus display housing assembly
US10059078B2 (en) * 2012-03-23 2018-08-28 Cutting Dynamics, Inc. Injection molded composite blank and guide
JP2015071266A (en) * 2013-10-03 2015-04-16 三井化学株式会社 Metal/resin composite structure and production method thereof

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