TWI630859B - 用於電子裝置之殼體及殼體總成以及具有殼體之可攜式電子裝置 - Google Patents

用於電子裝置之殼體及殼體總成以及具有殼體之可攜式電子裝置 Download PDF

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TWI630859B
TWI630859B TW106107975A TW106107975A TWI630859B TW I630859 B TWI630859 B TW I630859B TW 106107975 A TW106107975 A TW 106107975A TW 106107975 A TW106107975 A TW 106107975A TW I630859 B TWI630859 B TW I630859B
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林修本
蔡坤城
邱建智
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惠普發展公司有限責任合夥企業
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Abstract

在一例子中，揭露一種用於電子裝置之殼體，其可包括一第一多層結構。該第一多層結構可包括一第一層及形成在該第一層上之一第二層。該第一層及該第二層之各層可包括在該第一層及該第二層之一邊緣上的複數個凸形貌體及複數個凹形貌體。一層之該等複數個凹形貌體中的至少一凹形貌體可與另一層之該等複數個凸形貌體中的至少一凸形貌體交叉。

Description

用於電子裝置之殼體及殼體總成以及具有殼體之可攜式電子裝置
本發明係有關於用於電子裝置殼體的多層結構。
電子裝置可包括用於封裝或固定各種裝置組件及電路的一殼體。殼體之特性可隨裝置不同而變化。例如，用於電腦、電話及鍵盤之殼體通常不同，且可使用不同材料及組裝技術形成。
依據本發明之一實施例，係特地提出一種用於電子裝置之殼體，其包含：一第一多層結構，其包含：一第一層；及一第二層，其一體地形成在該第一層上，其中該第一層及該第二層之各層包含在該第一層及該第二層之一邊緣上的複數個凸形貌體及複數個凹形貌體，其中一層之該等複數個凹形貌體中之至少一凹形貌體與另一層之該等複數個凸形貌體中之至少一凸形貌體交叉。
用於電腦、電話及鍵盤之殼體通常會不同，且可使用不同材料及組裝技術形成。殼體可由金屬或塑膠接合形成以節省成本及保持該等裝置較輕。在某些電子裝置中，殼體可由金屬或塑膠接合形成以容許發送/接收無線天線信號。雖然構造不同，但某些殼體可大致由固定在一起之二或二以上殼體部件形成，而由於在該等殼體部件間之材料接合力比外部負載低，這會造成一外觀美化問題(例如，接合會隨時間逐漸失效)。例如，在筆記型電腦中，由於用於在該等殼體部件間插入模塑拉鏈結構之間距較小、不同美化塗裝製程或在精加工製程中涉及之高溫，會產生該外觀美化問題。
在此所述之例子可說明一種用於電子裝置之殼體，其可包括一第一多層結構及一第二多層結構。在一例子中，該第一多層結構可包括一第一層及形成在該第一層上之一第二層。該第一層及該第二層之各層可包括在該第一多層結構之一邊緣上的複數個凸形貌體及複數個凹形貌體。在該第一層及該第二層上之凸形貌體及凹形貌體例可為「T」形、蕈形、矩形或其組合。
在一例子中，一層之該等凹形貌體中之至少一凹形貌體可與另一層之該等凸形貌體中之至少一凸形貌體交叉。例如，該第一層之至少一凹形貌體可與該第二層之至少一凸形貌體交叉。該第二多層結構可透過在該第一多層結構之該邊緣上的該等複數個凸形貌體及該等複數個凹形貌體與該第一多層結構接合，以便在x、y與z方向上提供一接合力。
該第一層及該第二層之交叉部份可有助於約束該第一層及該第二層之各層且增加在該等第一與第二多層結構間之接合力。在此所述之多層結構亦可防護抵抗外部負載且因此可減少/克服該外觀美化問題。
圖1A至1C顯示顯示一多層結構102之一殼體100例。詳而言之，圖1A係顯示一多層結構102之一殼體100例的立體圖。圖1B顯示圖1A所示之多層結構102例之一部份的俯視圖。圖1C顯示圖1A所示之多層結構102例之一部份的仰視圖。多層結構102可，例如，代表作為該電子裝置使用之一材料。殼體100可包括一第一多層結構102。第一多層結構102可包括一第一層106及形成在該第一層106上之一第二層104。例如，第一多層結構102之不同層可由不同材料(例如，不同金屬)或相同材料形成。可為殼體100之一部份的第一多層結構102可為該殼體100之一表框段、一前段及/或一後段。
第一層106可包括在第一層106之一邊緣上的多個凸形貌體112及多個凹形貌體114。第二層104可包括在第二層104之一邊緣上的多個凸形貌體108及多個凹形貌體110。在一例子中，一層(例如，第一層106)之多個凹形貌體114中的至少一凹形貌體可與另一層(例如，第二層104)之多個凸形貌體108中的至少一凸形貌體交叉(例如，如交叉部份116中所示)。在另一例子中，第一層106之多個凹形貌體114中的至少某些部份可與第二層104之多個凸形貌體108中的至少某些部份重疊。第一層106及第二層104之凸形貌體108、112及凹形貌體110、114可形成一雙層拉鏈結構。在各層中，一凹形貌體(例如，110、114)可形成在二凸形貌體(例如，108、112)之間以形成一拉鏈結構。
此外，殼體100可包括一第二多層結構(例如，如圖2所示之204)。在一例子中，第二多層結構可使用在該第一層106及第二層104之邊緣上的凸形貌體108、112及凹形貌體110、114與第一多層結構102接合。這會在圖2中詳細地說明。
以下請參閱圖2，其顯示一多層結構總成200例之立體圖。總成200可包括一第一多層結構202及可與第一多層結構202接合之一第二多層結構204。第一多層結構202可包括一第一層208及一體地形成在第一層208上之一第二層206。第一層208及第二層206可為積層在一起之金屬層。第一層208及第二層206可使用不同金屬。第一多層結構202可藉由如壓縮模製、鑄造、壓製成形、鍛造及衝壓等金屬製造方法製成。
第一層208及第二層206之各層可包括在第一多層結構202之一邊緣上的至少一凸形貌體210、214及至少一凹形貌體212、216。第一層208之凸形貌體214可實質地偏離第二層206之凸形貌體210且第一層208之凹形貌體216可實質地偏離第二層206之凹形貌體212。在一例子中，一層(例如，第一層208)之凹形貌體216可與另一層(例如，第二層206)之凸形貌體210交叉(例如，如交叉部份218中所示)。
第二多層結構204可透過在第一多層結構202之邊緣上的凸形貌體210、214及凹形貌體212、216與第一多層結構202接合以提供一接合力。在一例子中，第二多層結構204可被插入模製在第一多層結構202之邊緣上的凸形貌體210、214及凹形貌體212、216上。第一多層結構202及第二多層結構204可接合在一起且沒有間隙。例如，在插入模塑製程中，金屬多層結構(例如，202)可接受熔化塑膠多層結構(例如，204)流入凹形貌體且該塑膠可在該熔化塑膠多層結構在該等凹形貌體內時硬化，藉此使該塑膠多層結構附接在該金屬多層結構上。例如，用於附接第一與第二多層結構之例子可不限於插入模塑且可使用任何其他製程(例如，超音波接合)來附接第一與第二多層結構使得第一與第二多層結構可形成一用於電子裝置之殼體。
例如，第二多層結構204可包括第一與第二層226、228且第一與第二層226、228各具有多個凸形貌體220、224及多個凹形貌體222。第二多層結構204之凸形貌體220、224可設置在第一多層結構202之對應凹形貌體212、216內。類似地，第一多層結構202之凸形貌體210、214可設置在第二多層結構204之第一層226及第二層228的對應凹形貌體(例如，222)內。在圖2所示之例子中，可看不到內層(例如，第一層226)之凹形貌體。
第一多層結構202及第二多層結構204可由一相同材料或一不同材料形成。在一例子中，第一多層結構202可由一金屬材料形成且第二多層結構204可由一塑膠材料形成。例如，第一多層結構202可由選自於由鋁、鎂、鋰、鋅、鈦、鋁合金、鎂合金、鋰合金、鋅合金及鈦合金構成之群組的一金屬材料形成。第二多層結構204可由選自於由液晶聚合物、聚苯硫及聚對苯二甲酸丁二酯構成之群組的一塑膠材料形成。此外，第二多層結構204之材料可選擇成與第一多層結構202之材料具有一良好接合能力。例如，該塑膠部份可為與該金屬本體之一邊緣相鄰的一大致長形部份。該塑膠部份可由可與該金屬本體牢固地接合之一材料製成，例如，具有比較低收縮率及大致等於第一多層結構202之金屬材料的一直線膨脹係數的一材料。例如，由該金屬部件之邊緣的凸形貌體(例如，210、214)可容許該可模塑塑膠材料黏在該等凸形貌體上，因此，可增加容許該模塑塑膠材料與該金屬部件接合之一接合面積。雖然在圖1與2中之例子可說明該多層結構為包括二層，但該多層結構可包括二層以上。
此外，塗裝製程可在該等第一與第二多層結構202、204上實施以形成一無陰影殼體。例如，該塗裝製程可包括粉末塗裝、底塗法、及頂塗法(例如，漆料塗布)。
圖3顯示一可攜式電子裝置300例。電子裝置300可包括一底座304及一顯示器302。底座304可包括一鍵盤、觸控板及其他電子組件，例如處理器、電池、記憶體、母板等。底座304可包括配置成大致收納該等電子組件之一殼體306。電子裝置300例可包括筆記型電腦、平板電腦、行動電話、媒體播放器、個人數位助理(PDA)等。
在一例子中，殼體306可由一第一多層結構308及使用一插入模塑製程附接在第一多層結構308上之一第二多層結構310形成。第一多層結構308及第二多層結構310係配合圖1與2說明。第一多層結構308可包括一第一層，且該第一層包括在第一層之一邊緣上的至少一凸形貌體及至少一凹形貌體。第一多層結構308可包括一體地形成在第一層上的一第二層。如圖3所示，製成殼體後會看不到內層(例如，第一層)。第二層可包括在第二層之一邊緣上的至少一凸形貌體312及至少一凹形貌體314。第一層之凹形貌體可與第二層之凸形貌體312交叉/重疊。第二多層結構310可透過在第一層及第二層之該邊緣上的凸形貌體及凹形貌體與第一多層結構308附接，以便在x、y與z方向上提供一接合力。例如，該接合結構可防止第二多層結構(例如，塑膠部份)相對於第一多層結構(例如，金屬本體)沿一X軸、一Y軸及一Z軸移動。例如，在此所述之接合結構(例如，拉鏈結構)可增加在該金屬結構與該塑膠結構間之接合強度。例如，在圖3中之該多層結構(例如，透過凸形貌體312與316及凹形貌體314與318形成)可為說明而顯示且會在該殼體306上實施該塗裝製程後看不到。雖然圖3顯示在該底座之一頂部上的組裝結構/接合結構，但該組裝結構可使用於該電子裝置之任何其他部份，例如顯示器蓋、該底座之底部等。
應注意的是本解決方法之上述例子係只是用以說明。雖然該解決方法已配合一特定實施例說明過了，但在未實質地偏離在此所述標的物之教示及優點的情形下可進行多種修改。在不偏離本解決方法之精神的情形下，可進行其他替換、修改及變化。在這說明書(包括附加申請專利範圍、摘要及圖式)中揭露之所有特徵、及/或如此揭露之任何方法或製程的所有步驟可組合成任何組合，但該等特徵及/或步驟中之至少某些特徵及/或步驟互不相容的組合除外。
在此使用之該等用語「包括」、「具有」及其變化形具有與該用語「包含」或其適當變化形相同之意義。此外，在此使用之該用語「依據」表示「至少部份地依據」。因此，說明為依據某些刺激之一特徵可依據該等刺激或包括該等刺激之多個刺激的一組合。
本說明已配合前述例子顯示及說明過了。但是，應了解的是在不偏離在以下申請專利範圍中界定之本標的物的精神及範疇的情形下，可有其他形態、細節及例子。
100,306‧‧‧殼體
102‧‧‧多層結構；第一多層結構
104,206,228‧‧‧第二層
106,208,226‧‧‧第一層
108,112,210,214,220,224,312,316‧‧‧凸形貌體
110,114,212,216,222,314,318‧‧‧凹形貌體
116,218‧‧‧交叉部份
200‧‧‧多層結構總成
202,308‧‧‧第一多層結構
204,310‧‧‧第二多層結構
300‧‧‧電子裝置
302‧‧‧顯示器
304‧‧‧底座
在以下詳細說明中且參照圖式說明多個例子，其中：圖1A係顯示一多層結構之一殼體例的立體圖；
圖1B顯示圖1所示之多層結構例之一部份的俯視圖；
圖1C顯示圖1所示之多層結構例之一部份的仰視圖；
圖2顯示一多層結構總成例之立體圖；及
圖3顯示包括使用該多層結構總成形成之一殼體的一可攜式電子裝置例。

Claims (15)

  1. 一種用於電子裝置之殼體，其包含：一第一多層結構，其包含：一第一層；及一第二層，其形成在該第一層上，其中該第一層及該第二層之各層包含在該第一層及該第二層之一邊緣上的複數個凸形貌體及複數個凹形貌體，其中一層之該等複數個凹形貌體中之至少一凹形貌體與另一層之該等複數個凸形貌體中之至少一凸形貌體交叉。
  2. 如請求項1之殼體，更包含：一第二多層結構，其使用在該第一層及該第二層之該邊緣上的該等複數個凸形貌體及該等複數個凹形貌體與該第一多層結構接合。
  3. 如請求項2之殼體，其中該第一多層結構及該第二多層結構係由一相同材料或一不同材料形成。
  4. 如請求項2之殼體，其中該第二多層結構係由選自於由液晶聚合物、聚苯硫及聚對苯二甲酸丁二酯構成之群組的一塑膠材料形成。
  5. 如請求項1之殼體，其中該第一多層結構係由選自於由鋁、鎂、鋰、鋅、鈦、鋁合金、鎂合金、鋰合金、鋅合金及鈦合金構成之群組的一金屬材料形成。
  6. 如請求項1之殼體，其中該第一層及該第二層之該等複數個凸形貌體及該等複數個凹形貌體形成一雙層拉鏈結構。
  7. 一種用於電子裝置之殼體總成，其包含：一第一多層結構，其包含：一第一層；及一第二層，其一體地形成在該第一層上，其中該第一層及該第二層之各層包含在該第一多層結構之一邊緣上的至少一凸形貌體及至少一凹形貌體，其中一層之該至少一凹形貌體與另一層之該至少一凸形貌體交叉；及一第二多層結構，其透過在該第一多層結構之該邊緣上的該至少一凸形貌體及該至少一凹形貌體與該第一多層結構接合以提供一接合力。
  8. 如請求項7之殼體總成，其中該第二多層結構被插入模製在該第一多層結構之該邊緣上的該至少一凸形貌體及該至少一凹形貌體上。
  9. 如請求項7之殼體總成，其中該第一多層結構係由一金屬材料形成。
  10. 如請求項7之殼體總成，其中該第二多層結構係由一塑膠材料形成。
  11. 如請求項7之殼體總成，其中該第一層之該至少一凸形貌體係實質地偏離該第二層之該至少一凸形貌體。
  12. 如請求項7之殼體總成，其中該第一層之該至少一凹形貌體係實質地偏離該第二層之該至少一凹形貌體。
  13. 一種可攜式電子裝置，其包含：至少一電子組件；及一殼體，其配置成大致地收容該至少一電子組件，其中該殼體包含：一第一多層結構，其包含：一第一層，其包含在該第一層之一邊緣上的至少一凸形貌體及至少一凹形貌體；及一第二層，其一體地形成在該第一層上，其中該第二層包含在該第二層之一邊緣上的至少一凸形貌體及至少一凹形貌體，其中該第一層之該至少一凹形貌體與該第二層之該至少一凸形貌體交叉。
  14. 如請求項13之可攜式電子裝置，其中該殼體包含：一第二多層結構，其透過在該第一層及該第二層之該邊緣上的該至少一凸形貌體及該至少一凹形貌體與該第一多層結構附接，以便在x、y與z方向上提供一接合力。
  15. 如請求項13之可攜式電子裝置，其中該第一層之該至少一凸形貌體係實質地偏離該第二層之該至少一凸形貌體，且其中該第一層之該至少一凹形貌體係實質地偏離該第二層之該至少一凹形貌體。
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