TW571373B - Semiconductor device, circuit substrate, and electronic machine - Google Patents

Semiconductor device, circuit substrate, and electronic machine Download PDF

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Publication number
TW571373B
TW571373B TW090100512A TW90100512A TW571373B TW 571373 B TW571373 B TW 571373B TW 090100512 A TW090100512 A TW 090100512A TW 90100512 A TW90100512 A TW 90100512A TW 571373 B TW571373 B TW 571373B
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TW
Taiwan
Prior art keywords
layer
wiring
semiconductor device
electrode
solder
Prior art date
Application number
TW090100512A
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English (en)
Chinese (zh)
Inventor
Nobuaki Hashimoto
Original Assignee
Seiko Epson Corp
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Publication of TW571373B publication Critical patent/TW571373B/zh

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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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JP5445732B2 (ja) 2014-03-19
US8384213B2 (en) 2013-02-26
US6255737B1 (en) 2001-07-03
US20060249843A1 (en) 2006-11-09
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WO1998025298A1 (fr) 1998-06-11
KR100501662B1 (ko) 2005-11-14
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JP3981710B2 (ja) 2007-09-26
US20030213981A1 (en) 2003-11-20
US7521796B2 (en) 2009-04-21
JP5278716B2 (ja) 2013-09-04
CN100380612C (zh) 2008-04-09
TW459323B (en) 2001-10-11
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US7183189B2 (en) 2007-02-27
US6608389B1 (en) 2003-08-19

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