JPS5518069A - Protective construction of semiconductor device - Google Patents
Protective construction of semiconductor deviceInfo
- Publication number
- JPS5518069A JPS5518069A JP9131678A JP9131678A JPS5518069A JP S5518069 A JPS5518069 A JP S5518069A JP 9131678 A JP9131678 A JP 9131678A JP 9131678 A JP9131678 A JP 9131678A JP S5518069 A JPS5518069 A JP S5518069A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- film
- layers
- coated
- opened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: To simplify the mounting process of an MOS-type semiconductor device having projection electrodes and wiring layers and obtain a strong protective construction, by coating both the sides of the semiconductor device with protective resin films.
CONSTITUTION: Before the projection electrodes 15 and the wiring metal layers 12 are provided on the MOS-type semiconductor device 11, a prescribed wiring aluminium pattern 12 is made first on the device 11. The total surface of the pattern 12 is coated with a PSG passivation film 13. Holes are opened in bonding pad portions. The entire surface of the passivation film 13 is coated with one protective resin film 16. Holes corresponding to the formers are opened in the film 16. CrCuAu layers 14 are provided on the opened portions of the film 16. The projection electrodes 15 of solder are then fixed on the layers 14 so that the electrodes are connected to the wiring metal layers 12. The reverse side of the semiconductor device 11 is coated with another protective resin film 16. Thus, the mounting process is simplified and the protective construction is strengthened to prevent cracks etc.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9131678A JPS5518069A (en) | 1978-07-26 | 1978-07-26 | Protective construction of semiconductor device |
DE19792929339 DE2929339A1 (en) | 1978-07-24 | 1979-07-20 | SEMICONDUCTOR ARRANGEMENT |
GB7925566A GB2027272B (en) | 1978-07-24 | 1979-07-23 | Semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9131678A JPS5518069A (en) | 1978-07-26 | 1978-07-26 | Protective construction of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5518069A true JPS5518069A (en) | 1980-02-07 |
Family
ID=14023049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9131678A Pending JPS5518069A (en) | 1978-07-24 | 1978-07-26 | Protective construction of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5518069A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59188949A (en) * | 1983-04-11 | 1984-10-26 | Hitachi Ltd | Semiconductor device |
KR100239695B1 (en) * | 1996-09-11 | 2000-01-15 | 김영환 | Chip size semiconductor package and its manufacturing method |
KR100248682B1 (en) * | 1995-04-27 | 2000-03-15 | 가네꼬 히사시 | Semiconductor device and installing method of semiconductor chip |
EP1447844A3 (en) * | 2003-02-11 | 2004-10-06 | Axalto S.A. | Reinforced semiconductor wafer |
US7470979B2 (en) | 1996-12-04 | 2008-12-30 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
US7521796B2 (en) | 1996-12-04 | 2009-04-21 | Seiko Epson Corporation | Method of making the semiconductor device, circuit board, and electronic instrument |
JP2010093295A (en) * | 2010-01-25 | 2010-04-22 | Rohm Co Ltd | Semiconductor device |
-
1978
- 1978-07-26 JP JP9131678A patent/JPS5518069A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59188949A (en) * | 1983-04-11 | 1984-10-26 | Hitachi Ltd | Semiconductor device |
KR100248682B1 (en) * | 1995-04-27 | 2000-03-15 | 가네꼬 히사시 | Semiconductor device and installing method of semiconductor chip |
KR100239695B1 (en) * | 1996-09-11 | 2000-01-15 | 김영환 | Chip size semiconductor package and its manufacturing method |
US7470979B2 (en) | 1996-12-04 | 2008-12-30 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
US7511362B2 (en) | 1996-12-04 | 2009-03-31 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
US7521796B2 (en) | 1996-12-04 | 2009-04-21 | Seiko Epson Corporation | Method of making the semiconductor device, circuit board, and electronic instrument |
US7842598B2 (en) | 1996-12-04 | 2010-11-30 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
US7888260B2 (en) | 1996-12-04 | 2011-02-15 | Seiko Epson Corporation | Method of making electronic device |
US8115284B2 (en) | 1996-12-04 | 2012-02-14 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument |
US8384213B2 (en) | 1996-12-04 | 2013-02-26 | Seiko Epson Corporation | Semiconductor device, circuit board, and electronic instrument |
EP1447844A3 (en) * | 2003-02-11 | 2004-10-06 | Axalto S.A. | Reinforced semiconductor wafer |
JP2010093295A (en) * | 2010-01-25 | 2010-04-22 | Rohm Co Ltd | Semiconductor device |
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