GB2027272B - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB2027272B
GB2027272B GB7925566A GB7925566A GB2027272B GB 2027272 B GB2027272 B GB 2027272B GB 7925566 A GB7925566 A GB 7925566A GB 7925566 A GB7925566 A GB 7925566A GB 2027272 B GB2027272 B GB 2027272B
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7925566A
Other versions
GB2027272A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9014778A external-priority patent/JPS5516482A/en
Priority claimed from JP9131678A external-priority patent/JPS5518069A/en
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of GB2027272A publication Critical patent/GB2027272A/en
Application granted granted Critical
Publication of GB2027272B publication Critical patent/GB2027272B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
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    • H01L2224/05001—Internal layers
    • H01L2224/0502—Disposition
    • H01L2224/05022—Disposition the internal layer being at least partially embedded in the surface
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    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H01L2224/05572—Disposition the external layer being disposed in a recess of the surface the external layer extending out of an opening
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    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
GB7925566A 1978-07-24 1979-07-23 Semiconductor devices Expired GB2027272B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9014778A JPS5516482A (en) 1978-07-24 1978-07-24 Mounting structure of semiconductor device
JP9131678A JPS5518069A (en) 1978-07-26 1978-07-26 Protective construction of semiconductor device

Publications (2)

Publication Number Publication Date
GB2027272A GB2027272A (en) 1980-02-13
GB2027272B true GB2027272B (en) 1983-03-23

Family

ID=26431652

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7925566A Expired GB2027272B (en) 1978-07-24 1979-07-23 Semiconductor devices

Country Status (2)

Country Link
DE (1) DE2929339A1 (en)
GB (1) GB2027272B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2569052B1 (en) * 1984-08-10 1987-05-22 Thomson Csf METHOD FOR INTERCONNECTING INTEGRATED CIRCUITS
EP0340492A3 (en) * 1988-05-02 1990-07-04 International Business Machines Corporation Conformal sealing and interplanar encapsulation of electronic device structures
FR2638935B1 (en) * 1988-11-04 1990-12-14 Thomson Csf PROTECTION METHOD FOR ENSURING THE HOLD OF STANDARD ELECTRONIC COMPONENTS AT HIGH PRESSURES AND ELECTRONIC MODULE COMPRISING COMPONENTS THUS PROTECTED
TW480636B (en) 1996-12-04 2002-03-21 Seiko Epson Corp Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
TW571373B (en) 1996-12-04 2004-01-11 Seiko Epson Corp Semiconductor device, circuit substrate, and electronic machine
EP1447844A3 (en) * 2003-02-11 2004-10-06 Axalto S.A. Reinforced semiconductor wafer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1285708A (en) * 1968-10-28 1972-08-16 Lucas Industries Ltd Semi-conductor devices
DE2401613A1 (en) * 1974-01-14 1975-07-17 Siemens Ag SEMI-CONDUCTOR DEVICE
DE2429843C3 (en) * 1974-06-21 1979-04-19 Siemens Ag, 1000 Berlin Und 8000 Muenchen MIS circuit with field effect transistors and process for their production
DE2432544C3 (en) * 1974-07-04 1978-11-23 Siemens Ag, 1000 Berlin Und 8000 Muenchen A component designed as a semiconductor circuit with a dielectric carrier and a method for its production

Also Published As

Publication number Publication date
DE2929339A1 (en) 1980-02-14
GB2027272A (en) 1980-02-13

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee