FR2801423B1 - Dispositif semi-conducteur a structure rayonnante, procede de fabrication d'un dispositif semi-conducteur et procede de fabrication d'un instrument electronique - Google Patents

Dispositif semi-conducteur a structure rayonnante, procede de fabrication d'un dispositif semi-conducteur et procede de fabrication d'un instrument electronique

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Publication number
FR2801423B1
FR2801423B1 FR0015130A FR0015130A FR2801423B1 FR 2801423 B1 FR2801423 B1 FR 2801423B1 FR 0015130 A FR0015130 A FR 0015130A FR 0015130 A FR0015130 A FR 0015130A FR 2801423 B1 FR2801423 B1 FR 2801423B1
Authority
FR
France
Prior art keywords
semiconductor device
manufacturing
electronic instrument
radiation members
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0015130A
Other languages
English (en)
Other versions
FR2801423A1 (fr
Inventor
Kuniaki Mamitsu
Yasuyoshi Hirai
Kazuhito Nomura
Yutaka Fukuda
Kazuo Kajimoto
Takeshi Miyajima
Tomoatsu Makino
Yoshimi Nakase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP33312499A external-priority patent/JP3596388B2/ja
Priority claimed from JP33311999A external-priority patent/JP3525832B2/ja
Priority claimed from JP2000088579A external-priority patent/JP3614079B2/ja
Priority claimed from JP2000097912A external-priority patent/JP3620399B2/ja
Priority claimed from JP2000097911A external-priority patent/JP3630070B2/ja
Priority claimed from JP2000305228A external-priority patent/JP3601432B2/ja
Application filed by Denso Corp filed Critical Denso Corp
Publication of FR2801423A1 publication Critical patent/FR2801423A1/fr
Application granted granted Critical
Publication of FR2801423B1 publication Critical patent/FR2801423B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR0015130A 1999-11-24 2000-11-23 Dispositif semi-conducteur a structure rayonnante, procede de fabrication d'un dispositif semi-conducteur et procede de fabrication d'un instrument electronique Expired - Lifetime FR2801423B1 (fr)

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JP33312499A JP3596388B2 (ja) 1999-11-24 1999-11-24 半導体装置
JP33311999A JP3525832B2 (ja) 1999-11-24 1999-11-24 半導体装置
JP2000088579A JP3614079B2 (ja) 2000-03-24 2000-03-24 半導体装置及びその製造方法
JP2000097912A JP3620399B2 (ja) 2000-03-30 2000-03-30 電気機器の製造方法
JP2000097911A JP3630070B2 (ja) 2000-03-30 2000-03-30 半導体チップおよび半導体装置
JP2000305228A JP3601432B2 (ja) 2000-10-04 2000-10-04 半導体装置

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US20040089940A1 (en) 2004-05-13
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US20040070072A1 (en) 2004-04-15
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DE10066445B4 (de) 2011-06-22
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US6967404B2 (en) 2005-11-22
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US6798062B2 (en) 2004-09-28
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US20040070060A1 (en) 2004-04-15
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US6998707B2 (en) 2006-02-14
US20040089925A1 (en) 2004-05-13

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