DE69008963D1 - Elektronisches Schaltungssubstrat. - Google Patents
Elektronisches Schaltungssubstrat.Info
- Publication number
- DE69008963D1 DE69008963D1 DE69008963T DE69008963T DE69008963D1 DE 69008963 D1 DE69008963 D1 DE 69008963D1 DE 69008963 T DE69008963 T DE 69008963T DE 69008963 T DE69008963 T DE 69008963T DE 69008963 D1 DE69008963 D1 DE 69008963D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic circuit
- circuit substrate
- substrate
- electronic
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
- Non-Adjustable Resistors (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1201757A JP2787953B2 (ja) | 1989-08-03 | 1989-08-03 | 電子回路基板 |
JP1225951A JP2803751B2 (ja) | 1989-08-31 | 1989-08-31 | 多層電子回路基板 |
JP1226585A JP2803752B2 (ja) | 1989-09-01 | 1989-09-01 | 多層電子回路基板 |
JP1245952A JP2803754B2 (ja) | 1989-09-21 | 1989-09-21 | 多層電子回路基板 |
JP1247048A JP2803755B2 (ja) | 1989-09-22 | 1989-09-22 | 多層電子回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69008963D1 true DE69008963D1 (de) | 1994-06-23 |
DE69008963T2 DE69008963T2 (de) | 1994-10-20 |
Family
ID=27529290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69008963T Expired - Lifetime DE69008963T2 (de) | 1989-08-03 | 1990-08-02 | Elektronisches Schaltungssubstrat. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5144536A (de) |
EP (1) | EP0411639B1 (de) |
JP (1) | JP2787953B2 (de) |
KR (1) | KR100211852B1 (de) |
DE (1) | DE69008963T2 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06737A (ja) * | 1991-03-29 | 1994-01-11 | Shin Etsu Chem Co Ltd | 静電チャック基板 |
WO1992018213A1 (en) * | 1991-04-12 | 1992-10-29 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible ceramic composite |
JPH0829993B2 (ja) * | 1991-09-23 | 1996-03-27 | インターナショナル・ビジネス・マシーンズ・コーポレイション | セラミツク複合構造及びその製造方法 |
EP0535711A3 (en) * | 1991-10-04 | 1993-12-01 | Matsushita Electric Ind Co Ltd | Method for producing multilayered ceramic substrate |
US5531945A (en) * | 1992-04-13 | 1996-07-02 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of base board for printed wiring |
KR0155186B1 (ko) * | 1992-05-26 | 1998-12-15 | 키무라 미치오 | 세라믹 기판과 그 제조방법 및 세라믹 흡착기판을 사용한 박판흡착장치 |
US5461823A (en) * | 1994-03-28 | 1995-10-31 | Composite Manufacturing & Research, Inc. | Vegetation barrier |
EP0697724B1 (de) * | 1994-08-02 | 1999-03-10 | Mitsubishi Gas Chemical Company, Inc. | Verfahren zur Produktion einer Rohplatte für gedruckte Leiterplatten |
US5686172A (en) * | 1994-11-30 | 1997-11-11 | Mitsubishi Gas Chemical Company, Inc. | Metal-foil-clad composite ceramic board and process for the production thereof |
US5790368A (en) * | 1995-06-27 | 1998-08-04 | Murata Manufacturing Co., Ltd. | Capacitor and manufacturing method thereof |
US6379781B1 (en) * | 1998-05-06 | 2002-04-30 | Ngk Insulators, Ltd. | Printed circuit board material and method of manufacturing board material and intermediate block body for board material |
US6171921B1 (en) * | 1998-06-05 | 2001-01-09 | Motorola, Inc. | Method for forming a thick-film resistor and thick-film resistor formed thereby |
JP2000239995A (ja) * | 1999-02-19 | 2000-09-05 | Matsushita Electric Ind Co Ltd | 絶縁基材とプリプレグおよびそれを用いた回路基板 |
US6356455B1 (en) * | 1999-09-23 | 2002-03-12 | Morton International, Inc. | Thin integral resistor/capacitor/inductor package, method of manufacture |
JP2001247382A (ja) * | 2000-03-06 | 2001-09-11 | Ibiden Co Ltd | セラミック基板 |
US6417062B1 (en) * | 2000-05-01 | 2002-07-09 | General Electric Company | Method of forming ruthenium oxide films |
DE10221498A1 (de) | 2002-05-14 | 2003-12-04 | Basf Ag | Kondensatoren hoher Energiedichte |
JP3887337B2 (ja) * | 2003-03-25 | 2007-02-28 | 株式会社東芝 | 配線部材およびその製造方法 |
EP1641329A4 (de) * | 2003-06-30 | 2010-01-20 | Ibiden Co Ltd | Leiterplatte |
WO2006054601A1 (ja) * | 2004-11-19 | 2006-05-26 | Matsushita Electric Industrial Co., Ltd. | コンデンサ内蔵多層基板とその製造方法、及び冷陰極管点灯装置 |
JP2007096185A (ja) * | 2005-09-30 | 2007-04-12 | Sanyo Electric Co Ltd | 回路基板 |
EP2026379B1 (de) * | 2006-06-02 | 2012-08-15 | Murata Manufacturing Co., Ltd. | Mehrschichtige keramische elektronische komponente und herstellungsverfahren dafür |
US20080112165A1 (en) * | 2006-11-15 | 2008-05-15 | Kyocera Corporation | Light-emitting device |
JP5175476B2 (ja) * | 2007-02-28 | 2013-04-03 | 三洋電機株式会社 | 回路装置の製造方法 |
CN101462384A (zh) * | 2007-12-21 | 2009-06-24 | 深圳富泰宏精密工业有限公司 | 模制品 |
JP5259627B2 (ja) * | 2007-12-26 | 2013-08-07 | 京セラ株式会社 | 発光装置および照明装置 |
JP4581011B2 (ja) | 2008-01-25 | 2010-11-17 | 株式会社東芝 | 電気部品とその製造方法 |
KR101437988B1 (ko) * | 2008-04-24 | 2014-09-05 | 엘지전자 주식회사 | 인쇄회로기판 및 이를 제조하는 방법 |
US8529991B2 (en) * | 2009-07-31 | 2013-09-10 | Raytheon Canada Limited | Method and apparatus for cutting a part without damaging a coating thereon |
JP5679688B2 (ja) | 2010-03-31 | 2015-03-04 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
US9916932B1 (en) * | 2011-08-24 | 2018-03-13 | The Boeing Company | Spacer for cast capacitors |
US8715391B2 (en) * | 2012-04-10 | 2014-05-06 | Milliken & Company | High temperature filter |
JP5961703B2 (ja) * | 2012-11-28 | 2016-08-02 | 京セラ株式会社 | 配線基板およびその実装構造体 |
US9226396B2 (en) * | 2013-03-12 | 2015-12-29 | Invensas Corporation | Porous alumina templates for electronic packages |
US10071539B2 (en) | 2014-09-30 | 2018-09-11 | Apple Inc. | Co-sintered ceramic for electronic devices |
US10335979B2 (en) | 2014-09-30 | 2019-07-02 | Apple Inc. | Machining features in a ceramic component for use in an electronic device |
US10207387B2 (en) | 2015-03-06 | 2019-02-19 | Apple Inc. | Co-finishing surfaces |
US10216233B2 (en) | 2015-09-02 | 2019-02-26 | Apple Inc. | Forming features in a ceramic component for an electronic device |
JP6801705B2 (ja) * | 2016-03-11 | 2020-12-16 | 株式会社村田製作所 | 複合基板及び複合基板の製造方法 |
CN109563004B (zh) * | 2016-07-27 | 2022-04-05 | 康宁股份有限公司 | 陶瓷和聚合物复合物、其制造方法及其用途 |
WO2018163982A1 (ja) * | 2017-03-09 | 2018-09-13 | 株式会社村田製作所 | 多層基板 |
US10542628B2 (en) | 2017-08-02 | 2020-01-21 | Apple Inc. | Enclosure for an electronic device having a shell and internal chassis |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3652332A (en) * | 1970-07-06 | 1972-03-28 | American Can Co | Manufacture of printed circuits |
JPS57122592A (en) * | 1981-01-23 | 1982-07-30 | Tokyo Shibaura Electric Co | Method of producing hybrid integrated circuit |
JPS6135555A (ja) * | 1984-07-27 | 1986-02-20 | Nec Corp | 厚膜混成集積回路装置 |
EP0196865B1 (de) * | 1985-03-27 | 1990-09-12 | Ibiden Co, Ltd. | Substrate für elektronische Schaltungen |
US4614837A (en) * | 1985-04-03 | 1986-09-30 | Allied Corporation | Method for placing electrically conductive paths on a substrate |
JPS61281088A (ja) * | 1985-05-31 | 1986-12-11 | イビデン株式会社 | 機械加工性に優れたセラミツク複合体 |
JPH046907Y2 (de) * | 1986-01-29 | 1992-02-25 | ||
JPS63158801A (ja) * | 1986-12-23 | 1988-07-01 | 旭硝子株式会社 | 抵抗器 |
US4721831A (en) * | 1987-01-28 | 1988-01-26 | Unisys Corporation | Module for packaging and electrically interconnecting integrated circuit chips on a porous substrate, and method of fabricating same |
US4799983A (en) * | 1987-07-20 | 1989-01-24 | International Business Machines Corporation | Multilayer ceramic substrate and process for forming therefor |
JPH01189191A (ja) * | 1988-01-25 | 1989-07-28 | Toshiba Corp | 回路基板 |
JPH02148789A (ja) * | 1988-03-11 | 1990-06-07 | Internatl Business Mach Corp <Ibm> | 電子回路基板 |
US4940623A (en) * | 1988-08-09 | 1990-07-10 | Bosna Alexander A | Printed circuit board and method using thermal spray techniques |
-
1989
- 1989-08-03 JP JP1201757A patent/JP2787953B2/ja not_active Expired - Lifetime
-
1990
- 1990-07-24 US US07/556,521 patent/US5144536A/en not_active Expired - Lifetime
- 1990-08-01 KR KR1019900011819A patent/KR100211852B1/ko not_active IP Right Cessation
- 1990-08-02 EP EP90114875A patent/EP0411639B1/de not_active Expired - Lifetime
- 1990-08-02 DE DE69008963T patent/DE69008963T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0411639B1 (de) | 1994-05-18 |
JPH0364984A (ja) | 1991-03-20 |
DE69008963T2 (de) | 1994-10-20 |
KR910005735A (ko) | 1991-03-30 |
JP2787953B2 (ja) | 1998-08-20 |
KR100211852B1 (ko) | 1999-08-02 |
EP0411639A2 (de) | 1991-02-06 |
EP0411639A3 (en) | 1991-09-25 |
US5144536A (en) | 1992-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69008963D1 (de) | Elektronisches Schaltungssubstrat. | |
DE69016681D1 (de) | Elektronische Schaltungsvorrichtung. | |
DE68908687D1 (de) | Gedruckte Schaltungsplatte. | |
DE68901599D1 (de) | Elektronisches spielgeraet. | |
DE68922118D1 (de) | Schaltungsplatte. | |
DE69019030T2 (de) | Gedruckte Leiterplatte. | |
DE68916068D1 (de) | Hochleistungsleiterplatten. | |
DE69124896D1 (de) | Elektronischer Schaltkreis | |
BR9006653A (pt) | Complexo central de circuitos eletronicos | |
DE69100960T2 (de) | Leiterplatte. | |
DE3851118D1 (de) | Leiterplatte. | |
DE68906160D1 (de) | Gedruckte schaltungsplatte. | |
DE68922594D1 (de) | Integrierte Mikrowellenschaltung. | |
DE3850626D1 (de) | Leiterplatte. | |
DE3784192D1 (de) | Schaltungssubstrat. | |
DE69023971T2 (de) | Schaltungsmodul. | |
DE58904371D1 (de) | Elektronische schaltungsanordnung. | |
DE69023234T2 (de) | Gedruckte schaltungsplatten. | |
DE69014970T2 (de) | Elektronischer Fernsprechapparat. | |
DE69008944D1 (de) | Gedruckte Schaltungsplatte. | |
DE69023612T2 (de) | Integrierte Schaltung. | |
DE3880635D1 (de) | Substratpotentialdetektionsschaltung. | |
DE396954T1 (de) | Gedruckte schaltungsplatte. | |
DE68910707D1 (de) | Elektronische Mikroschaltung. | |
NO891765D0 (no) | Elektronisk haglpatron. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: BLUMBACH, KRAMER & PARTNER, 81245 MUENCHEN |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: KRAMER - BARSKE - SCHMIDTCHEN, 81245 MUENCHEN |