DE69008963T2 - Elektronisches Schaltungssubstrat. - Google Patents

Elektronisches Schaltungssubstrat.

Info

Publication number
DE69008963T2
DE69008963T2 DE69008963T DE69008963T DE69008963T2 DE 69008963 T2 DE69008963 T2 DE 69008963T2 DE 69008963 T DE69008963 T DE 69008963T DE 69008963 T DE69008963 T DE 69008963T DE 69008963 T2 DE69008963 T2 DE 69008963T2
Authority
DE
Germany
Prior art keywords
electronic circuit
circuit substrate
substrate
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69008963T
Other languages
English (en)
Other versions
DE69008963D1 (de
Inventor
Kiyotaka Tsukada
Yukihiro Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1225951A external-priority patent/JP2803751B2/ja
Priority claimed from JP1226585A external-priority patent/JP2803752B2/ja
Priority claimed from JP1245952A external-priority patent/JP2803754B2/ja
Priority claimed from JP1247048A external-priority patent/JP2803755B2/ja
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of DE69008963D1 publication Critical patent/DE69008963D1/de
Publication of DE69008963T2 publication Critical patent/DE69008963T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
  • Non-Adjustable Resistors (AREA)
  • Laminated Bodies (AREA)
DE69008963T 1989-08-03 1990-08-02 Elektronisches Schaltungssubstrat. Expired - Lifetime DE69008963T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP1201757A JP2787953B2 (ja) 1989-08-03 1989-08-03 電子回路基板
JP1225951A JP2803751B2 (ja) 1989-08-31 1989-08-31 多層電子回路基板
JP1226585A JP2803752B2 (ja) 1989-09-01 1989-09-01 多層電子回路基板
JP1245952A JP2803754B2 (ja) 1989-09-21 1989-09-21 多層電子回路基板
JP1247048A JP2803755B2 (ja) 1989-09-22 1989-09-22 多層電子回路基板

Publications (2)

Publication Number Publication Date
DE69008963D1 DE69008963D1 (de) 1994-06-23
DE69008963T2 true DE69008963T2 (de) 1994-10-20

Family

ID=27529290

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69008963T Expired - Lifetime DE69008963T2 (de) 1989-08-03 1990-08-02 Elektronisches Schaltungssubstrat.

Country Status (5)

Country Link
US (1) US5144536A (de)
EP (1) EP0411639B1 (de)
JP (1) JP2787953B2 (de)
KR (1) KR100211852B1 (de)
DE (1) DE69008963T2 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06737A (ja) * 1991-03-29 1994-01-11 Shin Etsu Chem Co Ltd 静電チャック基板
WO1992018213A1 (en) * 1991-04-12 1992-10-29 E.I. Du Pont De Nemours And Company High dielectric constant flexible ceramic composite
JPH0829993B2 (ja) * 1991-09-23 1996-03-27 インターナショナル・ビジネス・マシーンズ・コーポレイション セラミツク複合構造及びその製造方法
EP0535711A3 (en) * 1991-10-04 1993-12-01 Matsushita Electric Ind Co Ltd Method for producing multilayered ceramic substrate
US5531945A (en) * 1992-04-13 1996-07-02 Mitsubishi Gas Chemical Company, Inc. Process for the production of base board for printed wiring
KR0155186B1 (ko) * 1992-05-26 1998-12-15 키무라 미치오 세라믹 기판과 그 제조방법 및 세라믹 흡착기판을 사용한 박판흡착장치
US5461823A (en) * 1994-03-28 1995-10-31 Composite Manufacturing & Research, Inc. Vegetation barrier
EP0697724B1 (de) * 1994-08-02 1999-03-10 Mitsubishi Gas Chemical Company, Inc. Verfahren zur Produktion einer Rohplatte für gedruckte Leiterplatten
US5686172A (en) * 1994-11-30 1997-11-11 Mitsubishi Gas Chemical Company, Inc. Metal-foil-clad composite ceramic board and process for the production thereof
US5790368A (en) * 1995-06-27 1998-08-04 Murata Manufacturing Co., Ltd. Capacitor and manufacturing method thereof
US6379781B1 (en) * 1998-05-06 2002-04-30 Ngk Insulators, Ltd. Printed circuit board material and method of manufacturing board material and intermediate block body for board material
US6171921B1 (en) * 1998-06-05 2001-01-09 Motorola, Inc. Method for forming a thick-film resistor and thick-film resistor formed thereby
JP2000239995A (ja) * 1999-02-19 2000-09-05 Matsushita Electric Ind Co Ltd 絶縁基材とプリプレグおよびそれを用いた回路基板
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
JP2001247382A (ja) * 2000-03-06 2001-09-11 Ibiden Co Ltd セラミック基板
US6417062B1 (en) * 2000-05-01 2002-07-09 General Electric Company Method of forming ruthenium oxide films
DE10221498A1 (de) 2002-05-14 2003-12-04 Basf Ag Kondensatoren hoher Energiedichte
JP3887337B2 (ja) * 2003-03-25 2007-02-28 株式会社東芝 配線部材およびその製造方法
EP1641329A4 (de) * 2003-06-30 2010-01-20 Ibiden Co Ltd Leiterplatte
WO2006054601A1 (ja) * 2004-11-19 2006-05-26 Matsushita Electric Industrial Co., Ltd. コンデンサ内蔵多層基板とその製造方法、及び冷陰極管点灯装置
JP2007096185A (ja) * 2005-09-30 2007-04-12 Sanyo Electric Co Ltd 回路基板
EP2026379B1 (de) * 2006-06-02 2012-08-15 Murata Manufacturing Co., Ltd. Mehrschichtige keramische elektronische komponente und herstellungsverfahren dafür
US20080112165A1 (en) * 2006-11-15 2008-05-15 Kyocera Corporation Light-emitting device
JP5175476B2 (ja) * 2007-02-28 2013-04-03 三洋電機株式会社 回路装置の製造方法
CN101462384A (zh) * 2007-12-21 2009-06-24 深圳富泰宏精密工业有限公司 模制品
JP5259627B2 (ja) * 2007-12-26 2013-08-07 京セラ株式会社 発光装置および照明装置
JP4581011B2 (ja) 2008-01-25 2010-11-17 株式会社東芝 電気部品とその製造方法
KR101437988B1 (ko) * 2008-04-24 2014-09-05 엘지전자 주식회사 인쇄회로기판 및 이를 제조하는 방법
US8529991B2 (en) * 2009-07-31 2013-09-10 Raytheon Canada Limited Method and apparatus for cutting a part without damaging a coating thereon
JP5679688B2 (ja) 2010-03-31 2015-03-04 キヤノン株式会社 液体吐出ヘッド及びその製造方法
US9916932B1 (en) * 2011-08-24 2018-03-13 The Boeing Company Spacer for cast capacitors
US8715391B2 (en) * 2012-04-10 2014-05-06 Milliken & Company High temperature filter
JP5961703B2 (ja) * 2012-11-28 2016-08-02 京セラ株式会社 配線基板およびその実装構造体
US9226396B2 (en) * 2013-03-12 2015-12-29 Invensas Corporation Porous alumina templates for electronic packages
US10071539B2 (en) 2014-09-30 2018-09-11 Apple Inc. Co-sintered ceramic for electronic devices
US10335979B2 (en) 2014-09-30 2019-07-02 Apple Inc. Machining features in a ceramic component for use in an electronic device
US10207387B2 (en) 2015-03-06 2019-02-19 Apple Inc. Co-finishing surfaces
US10216233B2 (en) 2015-09-02 2019-02-26 Apple Inc. Forming features in a ceramic component for an electronic device
JP6801705B2 (ja) * 2016-03-11 2020-12-16 株式会社村田製作所 複合基板及び複合基板の製造方法
CN109563004B (zh) * 2016-07-27 2022-04-05 康宁股份有限公司 陶瓷和聚合物复合物、其制造方法及其用途
WO2018163982A1 (ja) * 2017-03-09 2018-09-13 株式会社村田製作所 多層基板
US10542628B2 (en) 2017-08-02 2020-01-21 Apple Inc. Enclosure for an electronic device having a shell and internal chassis

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3652332A (en) * 1970-07-06 1972-03-28 American Can Co Manufacture of printed circuits
JPS57122592A (en) * 1981-01-23 1982-07-30 Tokyo Shibaura Electric Co Method of producing hybrid integrated circuit
JPS6135555A (ja) * 1984-07-27 1986-02-20 Nec Corp 厚膜混成集積回路装置
EP0196865B1 (de) * 1985-03-27 1990-09-12 Ibiden Co, Ltd. Substrate für elektronische Schaltungen
US4614837A (en) * 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate
JPS61281088A (ja) * 1985-05-31 1986-12-11 イビデン株式会社 機械加工性に優れたセラミツク複合体
JPH046907Y2 (de) * 1986-01-29 1992-02-25
JPS63158801A (ja) * 1986-12-23 1988-07-01 旭硝子株式会社 抵抗器
US4721831A (en) * 1987-01-28 1988-01-26 Unisys Corporation Module for packaging and electrically interconnecting integrated circuit chips on a porous substrate, and method of fabricating same
US4799983A (en) * 1987-07-20 1989-01-24 International Business Machines Corporation Multilayer ceramic substrate and process for forming therefor
JPH01189191A (ja) * 1988-01-25 1989-07-28 Toshiba Corp 回路基板
JPH02148789A (ja) * 1988-03-11 1990-06-07 Internatl Business Mach Corp <Ibm> 電子回路基板
US4940623A (en) * 1988-08-09 1990-07-10 Bosna Alexander A Printed circuit board and method using thermal spray techniques

Also Published As

Publication number Publication date
EP0411639B1 (de) 1994-05-18
JPH0364984A (ja) 1991-03-20
KR910005735A (ko) 1991-03-30
JP2787953B2 (ja) 1998-08-20
KR100211852B1 (ko) 1999-08-02
EP0411639A2 (de) 1991-02-06
DE69008963D1 (de) 1994-06-23
EP0411639A3 (en) 1991-09-25
US5144536A (en) 1992-09-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, KRAMER & PARTNER, 81245 MUENCHEN

8328 Change in the person/name/address of the agent

Representative=s name: KRAMER - BARSKE - SCHMIDTCHEN, 81245 MUENCHEN