DE69124896D1 - Elektronischer Schaltkreis - Google Patents

Elektronischer Schaltkreis

Info

Publication number
DE69124896D1
DE69124896D1 DE69124896T DE69124896T DE69124896D1 DE 69124896 D1 DE69124896 D1 DE 69124896D1 DE 69124896 T DE69124896 T DE 69124896T DE 69124896 T DE69124896 T DE 69124896T DE 69124896 D1 DE69124896 D1 DE 69124896D1
Authority
DE
Germany
Prior art keywords
electronic circuit
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69124896T
Other languages
English (en)
Other versions
DE69124896T2 (de
Inventor
Fred Crook
Michael R West
Gino P Domenella
Kevin Glasgow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Milwaukee Electric Tool Corp
Original Assignee
Milwaukee Electric Tool Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Milwaukee Electric Tool Corp filed Critical Milwaukee Electric Tool Corp
Publication of DE69124896D1 publication Critical patent/DE69124896D1/de
Application granted granted Critical
Publication of DE69124896T2 publication Critical patent/DE69124896T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0413—Large-sized flat cells or batteries for motive or stationary systems with plate-like electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/06—Lead-acid accumulators
    • H01M10/12—Construction or manufacture
    • H01M10/122—Multimode batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0445—Multimode batteries, e.g. containing auxiliary cells or electrodes switchable in parallel or series connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Battery Mounting, Suspending (AREA)
  • Secondary Cells (AREA)
  • Fuses (AREA)
DE69124896T 1990-08-28 1991-07-31 Elektronischer Schaltkreis Expired - Fee Related DE69124896T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/574,296 US5153449A (en) 1990-08-28 1990-08-28 Heatsink bus for electronic switch

Publications (2)

Publication Number Publication Date
DE69124896D1 true DE69124896D1 (de) 1997-04-10
DE69124896T2 DE69124896T2 (de) 1997-06-12

Family

ID=24295507

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69124896T Expired - Fee Related DE69124896T2 (de) 1990-08-28 1991-07-31 Elektronischer Schaltkreis

Country Status (4)

Country Link
US (1) US5153449A (de)
EP (1) EP0477502B1 (de)
CA (1) CA2047767A1 (de)
DE (1) DE69124896T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5549984A (en) * 1994-07-25 1996-08-27 Globe-Union Inc. Control and indicator circuit for a dual battery system
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
US6295201B1 (en) * 1998-08-04 2001-09-25 Stratos Lightwave, Inc. Bus bar having embedded switching device
US6508595B1 (en) * 2000-05-11 2003-01-21 International Business Machines Corporation Assembly of opto-electronic module with improved heat sink
JP2001327044A (ja) * 2000-05-16 2001-11-22 Auto Network Gijutsu Kenkyusho:Kk 車両用パワーディストリビュータ
US6587346B1 (en) 2002-01-31 2003-07-01 Visteon Global Technologies, Inc. Combination electrical power distribution and heat dissipating device
US7589500B2 (en) 2002-11-22 2009-09-15 Milwaukee Electric Tool Corporation Method and system for battery protection
US8471532B2 (en) 2002-11-22 2013-06-25 Milwaukee Electric Tool Corporation Battery pack
US7157882B2 (en) * 2002-11-22 2007-01-02 Milwaukee Electric Tool Corporation Method and system for battery protection employing a selectively-actuated switch
US7270910B2 (en) * 2003-10-03 2007-09-18 Black & Decker Inc. Thermal management systems for battery packs
US8068346B2 (en) * 2004-05-04 2011-11-29 Hamilton Sundstrand Corporation Circuit board with high density power semiconductors
KR100936262B1 (ko) * 2005-10-21 2010-01-12 주식회사 엘지화학 신규한 구조의 전기 접속용 버스 바 및 그것을 포함하고있는 전지모듈
DE102007014120A1 (de) * 2007-03-23 2008-09-25 Ferm Bv Stromversorgungspack
DE102007062167A1 (de) * 2007-12-21 2009-06-25 Robert Bosch Gmbh Leistungsschaltung
DE102008010837A1 (de) * 2008-02-23 2009-08-27 Daimler Ag Batterie mit einer in einem Batteriegehäuse angeordneten Wärmeleitplatte zum Temperieren der Batterie
US7812589B2 (en) * 2008-08-28 2010-10-12 Qualitau, Inc. Modified current source (MCS) with seamless range switching
DE102009029476B4 (de) * 2009-09-15 2012-11-08 Lisa Dräxlmaier GmbH Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe
DE102013204675A1 (de) * 2013-03-18 2014-10-02 Robert Bosch Gmbh Batteriezelle für eine Batterie sowie Verfahren zur Herstellung einer Batteriezelle
USD745383S1 (en) * 2014-09-16 2015-12-15 Kelly Peters Door lock stop device
US10052713B2 (en) * 2015-08-20 2018-08-21 Ultex Corporation Bonding method and bonded structure
FR3060845B1 (fr) * 2016-12-19 2019-05-24 Institut Vedecom Circuits electroniques de puissance equipes de bus barres formant dissipateurs thermiques et procede d’integration

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3029301A (en) * 1959-08-18 1962-04-10 Pierce W Strider Combination of 6 volt and 12 volt battery
DE2530157A1 (de) * 1975-07-05 1977-02-03 Bosch Gmbh Robert Elektronisches steuergeraet
US4314270A (en) * 1977-12-02 1982-02-02 Mitsubishi Denki Kabushiki Kaisha Hybrid thick film integrated circuit heat dissipating and grounding assembly
US4360766A (en) * 1978-09-19 1982-11-23 Bogardus Jr Carl R Multi-battery power supply for DC motors
DE2903102A1 (de) * 1979-01-27 1980-07-31 Dahlberg Reinhard Elektronisches bauelement
EP0064856B1 (de) * 1981-05-12 1986-12-30 LUCAS INDUSTRIES public limited company Multiphasen-Brückenanordnung
US4700273A (en) * 1986-06-03 1987-10-13 Kaufman Lance R Circuit assembly with semiconductor expansion matched thermal path
FR2620296B1 (fr) * 1987-09-03 1990-01-19 Bendix Electronics Sa Boitier pour circuit electronique
US4905123A (en) * 1987-10-08 1990-02-27 Navistar International Transportation Corp. Heat sink bus assembly
JPH064595Y2 (ja) * 1988-02-24 1994-02-02 日本電気株式会社 ハイブリッドｉｃ
US5039335A (en) * 1988-10-21 1991-08-13 Texas Instruments Incorporated Composite material for a circuit system and method of making
US4901201A (en) * 1988-10-25 1990-02-13 Sundstrand Corporation Plate fin/chic heat exchanger
CA2056614A1 (en) * 1989-06-12 1990-12-13 Alan J. Klebenow Switched dual battery system

Also Published As

Publication number Publication date
CA2047767A1 (en) 1992-03-01
DE69124896T2 (de) 1997-06-12
EP0477502A1 (de) 1992-04-01
EP0477502B1 (de) 1997-03-05
US5153449A (en) 1992-10-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee