DE69015878D1 - Mehrschichtleiterplattenstruktur. - Google Patents

Mehrschichtleiterplattenstruktur.

Info

Publication number
DE69015878D1
DE69015878D1 DE69015878T DE69015878T DE69015878D1 DE 69015878 D1 DE69015878 D1 DE 69015878D1 DE 69015878 T DE69015878 T DE 69015878T DE 69015878 T DE69015878 T DE 69015878T DE 69015878 D1 DE69015878 D1 DE 69015878D1
Authority
DE
Germany
Prior art keywords
circuit board
layer circuit
board structure
layer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69015878T
Other languages
English (en)
Other versions
DE69015878T2 (de
Inventor
Mark Fielding Bregman
Stephen Leslie Buchwalter
Karl Hermann
Caroline Ann Kovac
Paige Adams Poore
Alfred Viehbeck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69015878D1 publication Critical patent/DE69015878D1/de
Application granted granted Critical
Publication of DE69015878T2 publication Critical patent/DE69015878T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
DE69015878T 1989-04-17 1990-03-21 Mehrschichtleiterplattenstruktur. Expired - Fee Related DE69015878T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33933489A 1989-04-17 1989-04-17

Publications (2)

Publication Number Publication Date
DE69015878D1 true DE69015878D1 (de) 1995-02-23
DE69015878T2 DE69015878T2 (de) 1995-07-13

Family

ID=23328537

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69015878T Expired - Fee Related DE69015878T2 (de) 1989-04-17 1990-03-21 Mehrschichtleiterplattenstruktur.

Country Status (4)

Country Link
US (1) US5786986A (de)
EP (1) EP0399161B1 (de)
JP (1) JPH02288396A (de)
DE (1) DE69015878T2 (de)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69023382T2 (de) * 1989-04-17 1996-06-20 Ibm Laminierungsverfahren zum Überdecken der Seitenwände einer Höhlung in einem Substrat sowie zur Füllung dieser Höhlung.
US5153986A (en) * 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
DE4129835A1 (de) * 1991-09-07 1993-03-11 Bosch Gmbh Robert Leistungselektroniksubstrat und verfahren zu dessen herstellung
US5401838A (en) * 1992-06-22 1995-03-28 Eli Lilly And Company Stereoselective fusion glycosylation process for preparing 2'-deoxy-2',2'-difluoronucleosides and 2'-deoxy-2'-fluoronucleosides
FR2694139B1 (fr) * 1992-07-21 1994-10-14 Aerospatiale Substrat d'interconnexion pour composants électroniques et son procédé de fabrication.
JPH0828583B2 (ja) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
US5741729A (en) * 1994-07-11 1998-04-21 Sun Microsystems, Inc. Ball grid array package for an integrated circuit
EP0713358A3 (de) * 1994-11-21 1997-11-05 International Business Machines Corporation Leiterplatte
US5745333A (en) * 1994-11-21 1998-04-28 International Business Machines Corporation Laminar stackable circuit board structure with capacitor
KR0156622B1 (ko) * 1995-04-27 1998-10-15 문정환 반도체 패키지,리드프레임 및 제조방법
JPH0964244A (ja) * 1995-08-17 1997-03-07 Hitachi Ltd 半導体装置およびその製造方法
US5691567A (en) * 1995-09-19 1997-11-25 National Semiconductor Corporation Structure for attaching a lead frame to a heat spreader/heat slug structure
US6061251A (en) * 1997-09-08 2000-05-09 Hewlett-Packard Company Lead-frame based vertical interconnect package
JP2993494B1 (ja) * 1998-06-05 1999-12-20 株式会社移動体通信先端技術研究所 超伝導回路の実装構造
JPH11354684A (ja) * 1998-06-09 1999-12-24 Nitto Denko Corp 低熱膨張配線基板および多層配線基板
US6492201B1 (en) * 1998-07-10 2002-12-10 Tessera, Inc. Forming microelectronic connection components by electrophoretic deposition
US6154370A (en) * 1998-07-21 2000-11-28 Lucent Technologies Inc. Recessed flip-chip package
DE19950026B4 (de) * 1999-10-09 2010-11-11 Robert Bosch Gmbh Leistungshalbleitermodul
JP3981270B2 (ja) * 2000-01-28 2007-09-26 Ｔｄｋ株式会社 多層基板に内蔵された導体パターン及び導体パターンが内蔵された多層基板、並びに、多層基板の製造方法
US6734539B2 (en) * 2000-12-27 2004-05-11 Lucent Technologies Inc. Stacked module package
US6707145B2 (en) * 2000-12-29 2004-03-16 Intel Corporation Efficient multiple power and ground distribution of SMT IC packages
US6653572B2 (en) 2001-02-07 2003-11-25 The Furukawa Electric Co., Ltd. Multilayer circuit board
US7152315B1 (en) 2001-03-20 2006-12-26 Visteon Global Technologies, Inc. Method of making a printed circuit board
JP4605930B2 (ja) * 2001-03-29 2011-01-05 京セラ株式会社 高周波半導体素子収納用パッケージ
JP2003031719A (ja) * 2001-07-16 2003-01-31 Shinko Electric Ind Co Ltd 半導体パッケージ及びその製造方法並びに半導体装置
US7754976B2 (en) * 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package
US7408258B2 (en) * 2003-08-20 2008-08-05 Salmon Technologies, Llc Interconnection circuit and electronic module utilizing same
JP4448702B2 (ja) * 2004-01-30 2010-04-14 日東電工株式会社 回路付サスペンション基板の製造方法
DE102004006533A1 (de) * 2004-02-11 2005-09-01 Conti Temic Microelectronic Gmbh Elektrisch leitfähiger Kontaktstift zum Einpressen in eine Öffnung einer Leiterplatte sowie elektrische Baugruppe mit einem solchen Kontaktstift
US20050184376A1 (en) * 2004-02-19 2005-08-25 Salmon Peter C. System in package
US7427809B2 (en) * 2004-12-16 2008-09-23 Salmon Technologies, Llc Repairable three-dimensional semiconductor subsystem
US20070007983A1 (en) * 2005-01-06 2007-01-11 Salmon Peter C Semiconductor wafer tester
US20070023923A1 (en) * 2005-08-01 2007-02-01 Salmon Peter C Flip chip interface including a mixed array of heat bumps and signal bumps
US7586747B2 (en) * 2005-08-01 2009-09-08 Salmon Technologies, Llc. Scalable subsystem architecture having integrated cooling channels
US20070023889A1 (en) * 2005-08-01 2007-02-01 Salmon Peter C Copper substrate with feedthroughs and interconnection circuits
US20070023904A1 (en) * 2005-08-01 2007-02-01 Salmon Peter C Electro-optic interconnection apparatus and method
US7765691B2 (en) * 2005-12-28 2010-08-03 Intel Corporation Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate
US7304860B2 (en) * 2006-01-17 2007-12-04 Huo-Lu Tsai Printed circuit board with thin film switches for a keyboard
US7280369B2 (en) * 2006-01-17 2007-10-09 Huo-Lu Tsai Multi-layer printed circuit board for a keyboard
DE102006004322A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung
US7629680B2 (en) * 2006-03-22 2009-12-08 Intel Corporation Direct power delivery into an electronic package
US7557049B2 (en) * 2006-10-30 2009-07-07 Nitto Denko Corporation Producing method of wired circuit board
TWI342172B (en) * 2007-01-02 2011-05-11 Advanced Semiconductor Eng Circuit board and method for manufacturing the same
TW200833202A (en) * 2007-01-26 2008-08-01 Advanced Semiconductor Eng Method for manufacturing a circuit board
US7800916B2 (en) * 2007-04-09 2010-09-21 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same
US8498125B2 (en) * 2008-06-09 2013-07-30 Schlumberger Technology Corporation Instrumentation package in a downhole tool string component
KR20100125805A (ko) * 2009-05-21 2010-12-01 삼성전기주식회사 방열기판 및 그 제조방법
KR101077359B1 (ko) * 2009-09-23 2011-10-26 삼성전기주식회사 방열회로기판 및 그 제조방법
CN107069274B (zh) 2010-05-07 2020-08-18 安费诺有限公司 高性能线缆连接器
FR2969897B1 (fr) * 2010-12-23 2013-02-08 Thales Sa Circuit imprime multicouches et procede d'etablissement d'interconnexions dans ledit circuit
US9084382B2 (en) * 2012-10-18 2015-07-14 Infineon Technologies Austria Ag Method of embedding an electronic component into an aperture of a substrate
DE102016125348B4 (de) * 2016-12-22 2020-06-25 Rogers Germany Gmbh Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines Trägersubstrats
CN208862209U (zh) 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
EP3868183A1 (de) * 2018-10-17 2021-08-25 Lumileds Holding B.V. Schaltungsanordnung
US10555424B1 (en) * 2019-02-26 2020-02-04 Taiwan Semiconductor Manufacturing Co., Ltd. Circuit board, semiconductor device including the same, and manufacturing method thereof

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3165672A (en) * 1959-06-15 1965-01-12 Burroughs Corp Printed circuit baseboard
US3436819A (en) * 1965-09-22 1969-04-08 Litton Systems Inc Multilayer laminate
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
US3606677A (en) * 1967-12-26 1971-09-21 Rca Corp Multilayer circuit board techniques
US3514538A (en) * 1968-11-01 1970-05-26 Intern Electronics Research Co Thermal dissipating metal core printed circuit board
US3705332A (en) * 1970-06-25 1972-12-05 Howard L Parks Electrical circuit packaging structure and method of fabrication thereof
US3795047A (en) * 1972-06-15 1974-03-05 Ibm Electrical interconnect structuring for laminate assemblies and fabricating methods therefor
AT332926B (de) * 1973-02-21 1976-10-25 Electrovac Anordnung zur verbindung von einander gegenuberliegenden elektrischen leitern und verfahren zu deren herstellung
US4076356A (en) * 1976-10-18 1978-02-28 Bell Telephone Laboratories, Incorporated Interconnection pin for multilayer printed circuit boards
US4249302A (en) * 1978-12-28 1981-02-10 Ncr Corporation Multilayer printed circuit board
US4283754A (en) * 1979-03-26 1981-08-11 Bunker Ramo Corporation Cooling system for multiwafer high density circuit
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
JPS5828759B2 (ja) * 1979-08-22 1983-06-17 富士通株式会社 多層プリント板
JPS5650598A (en) * 1979-10-01 1981-05-07 Hitachi Ltd Multilayer board connected with molten solder
US4496793A (en) * 1980-06-25 1985-01-29 General Electric Company Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion
JPS58143559A (ja) * 1982-02-19 1983-08-26 Matsushita Electric Ind Co Ltd 多層構造半導体集積回路装置およびその製造方法
JPS598396A (ja) * 1982-07-07 1984-01-17 株式会社日立製作所 多層配線基板
DE3301197A1 (de) * 1983-01-15 1984-07-19 Akzo Gmbh, 5600 Wuppertal Polyimid-laminate mit hoher schaelfestigkeit
GB2137422B (en) * 1983-03-30 1986-10-29 Ferranti Plc Printed circuit board
US4739448A (en) * 1984-06-25 1988-04-19 Magnavox Government And Industrial Electronics Company Microwave multiport multilayered integrated circuit chip carrier
DE3429588A1 (de) * 1984-08-10 1986-02-13 Endress U. Hauser Gmbh U. Co, 7867 Maulburg Ueberzug zur elektrischen isolierung von metallsubstraten und verfahren zu seiner herstellung
JPS6158297A (ja) * 1984-08-29 1986-03-25 沖電気工業株式会社 多層印刷配線板
US4591220A (en) * 1984-10-12 1986-05-27 Rollin Mettler Injection molded multi-layer circuit board and method of making same
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
DE3685647T2 (de) * 1985-07-16 1993-01-07 Nippon Telegraph & Telephone Verbindungskontakte zwischen substraten und verfahren zur herstellung derselben.
US4711822A (en) * 1986-01-15 1987-12-08 Westinghouse Electric Corp. Metal core printed circuit boards
US4803450A (en) * 1987-12-14 1989-02-07 General Electric Company Multilayer circuit board fabricated from silicon

Also Published As

Publication number Publication date
EP0399161A3 (de) 1991-01-16
JPH02288396A (ja) 1990-11-28
DE69015878T2 (de) 1995-07-13
US5786986A (en) 1998-07-28
EP0399161B1 (de) 1995-01-11
EP0399161A2 (de) 1990-11-28

Similar Documents

Publication Publication Date Title
DE69015878D1 (de) Mehrschichtleiterplattenstruktur.
DE69007452D1 (de) Mehrlagenschaltungsstruktur.
DE69103999D1 (de) Mehrlagige Leiterplatte.
DE68922118D1 (de) Schaltungsplatte.
DE68908687D1 (de) Gedruckte Schaltungsplatte.
DE69019030D1 (de) Gedruckte Leiterplatte.
NO176079C (no) Integrert kretskort
DE3881973D1 (de) Mehrschichtschaltungsplatte.
DE69302296D1 (de) Leiterplatte
DE69008963D1 (de) Elektronisches Schaltungssubstrat.
DE3484700D1 (de) Gedruckte schaltungsplatte.
DE68916068D1 (de) Hochleistungsleiterplatten.
FI890607A (fi) Kopplingsanordning.
DE69020204D1 (de) Mehrschichtige gedruckte Leiterplatte.
DE69017601D1 (de) Schaltungsanordnung.
KR900702760A (ko) 인쇄회로기판
DE69008464D1 (de) Schaltungsanordnung.
DE3771707D1 (de) Gedruckte leiterplatte.
DE69100960D1 (de) Leiterplatte.
DE3851118D1 (de) Leiterplatte.
DE3679627D1 (de) Mehrschichtige gedruckte schaltungsplatte.
DE68906160D1 (de) Gedruckte schaltungsplatte.
DE3850626D1 (de) Leiterplatte.
NO902854D0 (no) Styreline-feste.
DE3872865D1 (de) Gedruckte leiterkarte.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee