DE69103999D1 - Mehrlagige Leiterplatte. - Google Patents

Mehrlagige Leiterplatte.

Info

Publication number
DE69103999D1
DE69103999D1 DE69103999T DE69103999T DE69103999D1 DE 69103999 D1 DE69103999 D1 DE 69103999D1 DE 69103999 T DE69103999 T DE 69103999T DE 69103999 T DE69103999 T DE 69103999T DE 69103999 D1 DE69103999 D1 DE 69103999D1
Authority
DE
Germany
Prior art keywords
circuit board
layer circuit
layer
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69103999T
Other languages
English (en)
Other versions
DE69103999T2 (de
Inventor
Kishio Yokouchi
Hiroshi Kamezaki
Masato Wakamura
Nobuo Kamehara
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69103999D1 publication Critical patent/DE69103999D1/de
Application granted granted Critical
Publication of DE69103999T2 publication Critical patent/DE69103999T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2996—Glass particles or spheres

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
  • Laminated Bodies (AREA)
DE69103999T 1990-09-20 1991-09-18 Mehrlagige Leiterplatte. Expired - Fee Related DE69103999T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2252500A JP2906282B2 (ja) 1990-09-20 1990-09-20 ガラスセラミック・グリーンシートと多層基板、及び、その製造方法

Publications (2)

Publication Number Publication Date
DE69103999D1 true DE69103999D1 (de) 1994-10-20
DE69103999T2 DE69103999T2 (de) 1995-01-19

Family

ID=17238239

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69103999T Expired - Fee Related DE69103999T2 (de) 1990-09-20 1991-09-18 Mehrlagige Leiterplatte.

Country Status (6)

Country Link
US (2) US5275889A (de)
EP (1) EP0477004B1 (de)
JP (1) JP2906282B2 (de)
KR (1) KR950002963B1 (de)
CA (1) CA2051606C (de)
DE (1) DE69103999T2 (de)

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US5434896A (en) * 1990-09-04 1995-07-18 Combustion Engineering, Inc. Wear resistant coating for components of fuel assemblies and control assemblies, and method of enhancing wear resistance of fuel assembly and control assembly components using wear-resistant coating
JPH04314394A (ja) * 1991-04-12 1992-11-05 Fujitsu Ltd ガラスセラミック回路基板とその製造方法
JP2610375B2 (ja) * 1992-02-27 1997-05-14 富士通株式会社 多層セラミック基板の製造方法
JPH0645759A (ja) * 1992-07-22 1994-02-18 Fujitsu Ltd 多層セラミック回路基板の製造方法
JP2756075B2 (ja) * 1993-08-06 1998-05-25 三菱電機株式会社 金属ベース基板およびそれを用いた電子機器
US5470802A (en) * 1994-05-20 1995-11-28 Texas Instruments Incorporated Method of making a semiconductor device using a low dielectric constant material
US6147870A (en) * 1996-01-05 2000-11-14 Honeywell International Inc. Printed circuit assembly having locally enhanced wiring density
US5839188A (en) 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly
US6214746B1 (en) * 1999-05-07 2001-04-10 Honeywell International Inc. Nanoporous material fabricated using a dissolvable reagent
US6171687B1 (en) 1999-10-18 2001-01-09 Honeywell International Inc. Infiltrated nanoporous materials and methods of producing same
JP3414342B2 (ja) * 1999-11-25 2003-06-09 日本電気株式会社 集積回路チップの実装構造および実装方法
US20040176488A1 (en) * 2000-06-06 2004-09-09 Shyama Mukherjee Low dielectric materials and methods of producing same
US6444715B1 (en) 2000-06-06 2002-09-03 Honeywell International Inc. Low dielectric materials and methods of producing same
US6627669B2 (en) 2000-06-06 2003-09-30 Honeywell International Inc. Low dielectric materials and methods of producing same
US7056468B2 (en) * 2000-06-15 2006-06-06 Paratek Microwave, Inc. Method for producing low-loss tunable ceramic composites with improved breakdown strengths
EP1290753A1 (de) 2000-06-16 2003-03-12 Paratek Microwave, Inc. Elektronisch abstimmbare dielektrische verbund-dickschichten
US6423811B1 (en) 2000-07-19 2002-07-23 Honeywell International Inc. Low dielectric constant materials with polymeric networks
JP3785903B2 (ja) * 2000-07-21 2006-06-14 株式会社村田製作所 多層基板及びその製造方法
DE10042653A1 (de) * 2000-08-31 2002-03-28 Bosch Gmbh Robert Keramische Mehrlagenschaltung
US20040102584A1 (en) * 2001-12-03 2004-05-27 Lau Kreisler S. Low dielectric constant materials with polymeric networks
JP3847628B2 (ja) * 2002-01-09 2006-11-22 株式会社ワコム 低電圧駆動回路及び方法
JP4426805B2 (ja) * 2002-11-11 2010-03-03 日本特殊陶業株式会社 配線基板およびその製造方法
JP4554330B2 (ja) * 2004-10-21 2010-09-29 株式会社リコー 高耐久性を有する断熱スタンパ構造
US7435625B2 (en) * 2005-10-24 2008-10-14 Freescale Semiconductor, Inc. Semiconductor device with reduced package cross-talk and loss
US7432133B2 (en) * 2005-10-24 2008-10-07 Freescale Semiconductor, Inc. Plastic packaged device with die interface layer
US20070090545A1 (en) * 2005-10-24 2007-04-26 Condie Brian W Semiconductor device with improved encapsulation
US20090026924A1 (en) * 2007-07-23 2009-01-29 Leung Roger Y Methods of making low-refractive index and/or low-k organosilicate coatings
US7988412B2 (en) * 2007-08-24 2011-08-02 General Electric Company Structures for damping of turbine components
CN101869008B (zh) * 2007-12-26 2012-08-29 松下电器产业株式会社 半导体装置和多层配线基板
US8076587B2 (en) * 2008-09-26 2011-12-13 Siemens Energy, Inc. Printed circuit board for harsh environments
CN102484023A (zh) * 2010-07-22 2012-05-30 松下电器产业株式会社 等离子显示面板用玻璃糊剂及等离子显示面板
DE102012004708A1 (de) * 2012-03-07 2013-09-12 Manfred Jaeckel Verfahren zur Herstellung eines offenporigen keramischen Formkörpers
JP5426803B1 (ja) * 2012-03-30 2014-02-26 日本碍子株式会社 微構造解析方法、そのプログラム及び微構造解析装置
WO2015013129A1 (en) * 2013-07-23 2015-01-29 Rogers Corporation Circuit materials, circuit laminates, and methods of manufacture thereof
DE102016119031A1 (de) 2016-10-07 2018-04-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wärmeisoliertes Mikrosystem
EP3995463A4 (de) * 2019-07-05 2023-07-26 Nippon Electric Glass Co., Ltd. Keramische 3d-druckpaste und verfahren zur herstellung eines dreidimensionalen objektes
JPWO2023157739A1 (de) * 2022-02-16 2023-08-24
KR102700847B1 (ko) 2023-10-23 2024-08-29 한국세라믹기술원 High-Q 적층 세라믹 커패시터의 제조방법

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Also Published As

Publication number Publication date
KR950002963B1 (ko) 1995-03-28
JP2906282B2 (ja) 1999-06-14
EP0477004A2 (de) 1992-03-25
US5275889A (en) 1994-01-04
EP0477004A3 (en) 1993-02-24
DE69103999T2 (de) 1995-01-19
CA2051606C (en) 1996-08-27
CA2051606A1 (en) 1992-03-21
JPH04130072A (ja) 1992-05-01
KR920007158A (ko) 1992-04-28
EP0477004B1 (de) 1994-09-14
US5593526A (en) 1997-01-14

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee