GB1136753A - Improvements relating to electrical connecting arrangements - Google Patents
Improvements relating to electrical connecting arrangementsInfo
- Publication number
- GB1136753A GB1136753A GB1490668A GB1490668A GB1136753A GB 1136753 A GB1136753 A GB 1136753A GB 1490668 A GB1490668 A GB 1490668A GB 1490668 A GB1490668 A GB 1490668A GB 1136753 A GB1136753 A GB 1136753A
- Authority
- GB
- United Kingdom
- Prior art keywords
- boards
- conductors
- sheets
- insulating layer
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
1,136,753. Electric couplings. ENGLISH ELECTRIC COMPUTERS Ltd. 4 Oct., 1966 [26 Oct., 1965], No. 14906/68. Heading H2E. [Also in Division H1] A printed circuit board assembly comprises a plurality of metal sheets each having an insulating layer on opposite surfaces thereof and a plurality of conductors on each insulating layer, the sheets being mounted together in spaced relation, and connecting means being provided between conductors on different sheets. The sheets may be made of, or coated with, A1, Mg, Ti, Be, Zr, or alloys thereof, a surface of which is oxidized, by anodization or otherwise, to form the insulating layers; alternatively, the latter may be formed by spraying or evaporating insulating material on to the metal sheets. The conductors may be of Au, Cu or A1 and may be deposited by electroless or electrolytic plating, vacuum or vapour phase deposition, spraying, silk screening, or lithography, followed as necessary by etching or electron beam scribing. Plated through holes are used to interconnect conductors on opposite surfaces of a sheet, the hole walls being coated first with insulation unless a conductive connection to the sheet is required; such conductive connection may also be provided by omitting or removing the insulating layer from selected areas of the sheet surface before depositing the conductors. Double-sided printed circuit boards of the invention are stacked, Fig. 5, not shown, adjacent boards 15, 16 having registering stand-off portions 17, 18, 20, 21 which are bonded or riveted together to provide a space 19 between the boards. Conductors on adjacent boards are interconnected where required by metal plugs 23 soldered or upset in position in registering through holes in boards; such plugs may also be used to connect the boards mechanically. Fig. 4, not shown, depicts adjacent boards held together in spaced relation by rivets which are secured in registering holes in the boards and then welded together. An edge of a circuit board may be serrated to form projections 9, Fig. 2, which are completely covered by the insulating layer and carry conductive contacts to form plug-portions of a coupling arrangement; the serrations may be omitted. Alternatively, Fig. 3, the edge of the board at which connections are to be made is bent through a rightangle, plated through holes 10 being provided in the bent-up portion which are engaged by plug pins 11. The boards may be cooled, as by water flowing through channels in or on the metal sheets.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1490668A GB1136753A (en) | 1965-10-26 | 1965-10-26 | Improvements relating to electrical connecting arrangements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1490668A GB1136753A (en) | 1965-10-26 | 1965-10-26 | Improvements relating to electrical connecting arrangements |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1136753A true GB1136753A (en) | 1968-12-18 |
Family
ID=10049636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1490668A Expired GB1136753A (en) | 1965-10-26 | 1965-10-26 | Improvements relating to electrical connecting arrangements |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1136753A (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5325864A (en) * | 1976-06-30 | 1978-03-10 | Ibm | Multilayer substrate package |
JPS55120198A (en) * | 1979-03-12 | 1980-09-16 | Fujitsu Ltd | Multilayer printed circuit board and method of fabricating same |
JPS55123195A (en) * | 1979-03-15 | 1980-09-22 | Fujitsu Ltd | Hollow coaxial structure multilayer printed board |
JPS55140296A (en) * | 1979-04-18 | 1980-11-01 | Fujitsu Ltd | Multilayer printed board |
WO1980002633A1 (en) * | 1979-05-24 | 1980-11-27 | Fujitsu Ltd | Hollow multilayer printed wiring board,and method of fabricating same |
JPS55153397A (en) * | 1979-05-18 | 1980-11-29 | Fujitsu Ltd | Method of fabricating hollow multilayer printed board |
DE3113540A1 (en) * | 1981-04-03 | 1982-10-21 | Siemens AG, 1000 Berlin und 8000 München | Edge contact for printed-circuit boards |
EP0078582A2 (en) * | 1981-11-04 | 1983-05-11 | Philips Electronics Uk Limited | Electrical circuits |
FR2541828A1 (en) * | 1983-02-28 | 1984-08-31 | Inf Milit Spatiale Aeronaut | ELECTRICAL CONNECTION DEVICE BETWEEN TWO PRINTED CIRCUIT BOARDS AND METHOD FOR CONNECTING TWO PRINTED CIRCUIT BOARDS USING SUCH A DEVICE |
DE3726170A1 (en) * | 1986-08-07 | 1988-02-18 | Sharp Kk | ELECTRONIC DEVICE WITH FLEXIBLE CIRCUIT CARD |
DE3910699A1 (en) * | 1989-04-03 | 1990-10-04 | Omt Oberflaechen Materialtech | Printed circuit board for integrated circuits |
EP0399161A2 (en) * | 1989-04-17 | 1990-11-28 | International Business Machines Corporation | Multi-level circuit card structure |
EP0478879A2 (en) * | 1990-10-01 | 1992-04-08 | Hewlett-Packard Company | A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board |
WO1998053652A1 (en) * | 1997-05-23 | 1998-11-26 | Magneti Marelli France | Electronic plate folded at 45° |
EP0936849A1 (en) * | 1998-02-17 | 1999-08-18 | Pressac Interconnect Limited | Printed circuit assembly and method of making the same |
EP1269804A1 (en) * | 2000-03-31 | 2003-01-02 | Dyconex Patente Ag | Electrical connecting element and method of fabricating the same |
-
1965
- 1965-10-26 GB GB1490668A patent/GB1136753A/en not_active Expired
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5325864A (en) * | 1976-06-30 | 1978-03-10 | Ibm | Multilayer substrate package |
JPS55120198A (en) * | 1979-03-12 | 1980-09-16 | Fujitsu Ltd | Multilayer printed circuit board and method of fabricating same |
JPS5811117B2 (en) * | 1979-03-12 | 1983-03-01 | 富士通株式会社 | Method for manufacturing multilayer printed wiring board |
JPS55123195A (en) * | 1979-03-15 | 1980-09-22 | Fujitsu Ltd | Hollow coaxial structure multilayer printed board |
JPS55140296A (en) * | 1979-04-18 | 1980-11-01 | Fujitsu Ltd | Multilayer printed board |
JPS5811119B2 (en) * | 1979-04-18 | 1983-03-01 | 富士通株式会社 | multilayer printed board |
JPS55153397A (en) * | 1979-05-18 | 1980-11-29 | Fujitsu Ltd | Method of fabricating hollow multilayer printed board |
WO1980002633A1 (en) * | 1979-05-24 | 1980-11-27 | Fujitsu Ltd | Hollow multilayer printed wiring board,and method of fabricating same |
JPS55156395A (en) * | 1979-05-24 | 1980-12-05 | Fujitsu Ltd | Method of fabricating hollow multilayer printed board |
JPS5739559B2 (en) * | 1979-05-24 | 1982-08-21 | ||
DE3113540A1 (en) * | 1981-04-03 | 1982-10-21 | Siemens AG, 1000 Berlin und 8000 München | Edge contact for printed-circuit boards |
EP0078582A3 (en) * | 1981-11-04 | 1986-01-29 | Philips Electronic And Associated Industries Limited | Electrical circuits |
EP0078582A2 (en) * | 1981-11-04 | 1983-05-11 | Philips Electronics Uk Limited | Electrical circuits |
US4912284A (en) * | 1981-11-04 | 1990-03-27 | U.S. Philips Corporation | Electrical circuits |
FR2541828A1 (en) * | 1983-02-28 | 1984-08-31 | Inf Milit Spatiale Aeronaut | ELECTRICAL CONNECTION DEVICE BETWEEN TWO PRINTED CIRCUIT BOARDS AND METHOD FOR CONNECTING TWO PRINTED CIRCUIT BOARDS USING SUCH A DEVICE |
EP0117809A1 (en) * | 1983-02-28 | 1984-09-05 | Compagnie D'informatique Militaire Spatiale Et Aeronautique | Electrical connection device for the connection of two printed circuit cards and a method of connecting two printed circuit cards with the aid of this device |
DE3726170A1 (en) * | 1986-08-07 | 1988-02-18 | Sharp Kk | ELECTRONIC DEVICE WITH FLEXIBLE CIRCUIT CARD |
US4901193A (en) * | 1986-08-07 | 1990-02-13 | Sharp Kabushiki Kaisha | Construction of fitting flexible board within electronic apparatus |
DE3910699A1 (en) * | 1989-04-03 | 1990-10-04 | Omt Oberflaechen Materialtech | Printed circuit board for integrated circuits |
EP0399161A3 (en) * | 1989-04-17 | 1991-01-16 | International Business Machines Corporation | Multi-level circuit card structure |
EP0399161A2 (en) * | 1989-04-17 | 1990-11-28 | International Business Machines Corporation | Multi-level circuit card structure |
US5786986A (en) * | 1989-04-17 | 1998-07-28 | International Business Machines Corporation | Multi-level circuit card structure |
EP0478879A2 (en) * | 1990-10-01 | 1992-04-08 | Hewlett-Packard Company | A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board |
EP0478879A3 (en) * | 1990-10-01 | 1992-07-01 | Hewlett-Packard Company | Secondary board for mounting of components having differing bonding requirements |
WO1998053652A1 (en) * | 1997-05-23 | 1998-11-26 | Magneti Marelli France | Electronic plate folded at 45° |
FR2763779A1 (en) * | 1997-05-23 | 1998-11-27 | Magneti Marelli France | ELECTRONIC PLATE FOLDED AT 45 ° |
EP0936849A1 (en) * | 1998-02-17 | 1999-08-18 | Pressac Interconnect Limited | Printed circuit assembly and method of making the same |
EP1269804A1 (en) * | 2000-03-31 | 2003-01-02 | Dyconex Patente Ag | Electrical connecting element and method of fabricating the same |
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