GB1136753A - Improvements relating to electrical connecting arrangements - Google Patents

Improvements relating to electrical connecting arrangements

Info

Publication number
GB1136753A
GB1136753A GB1490668A GB1490668A GB1136753A GB 1136753 A GB1136753 A GB 1136753A GB 1490668 A GB1490668 A GB 1490668A GB 1490668 A GB1490668 A GB 1490668A GB 1136753 A GB1136753 A GB 1136753A
Authority
GB
United Kingdom
Prior art keywords
boards
conductors
sheets
insulating layer
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1490668A
Inventor
John Denis Lole
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
English Electric Computers Ltd
Original Assignee
English Electric Computers Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by English Electric Computers Ltd filed Critical English Electric Computers Ltd
Priority to GB1490668A priority Critical patent/GB1136753A/en
Publication of GB1136753A publication Critical patent/GB1136753A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0272Adaptations for fluid transport, e.g. channels, holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09172Notches between edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/096Vertically aligned vias, holes or stacked vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025Abrading, e.g. grinding or sand blasting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0315Oxidising metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

Abstract

1,136,753. Electric couplings. ENGLISH ELECTRIC COMPUTERS Ltd. 4 Oct., 1966 [26 Oct., 1965], No. 14906/68. Heading H2E. [Also in Division H1] A printed circuit board assembly comprises a plurality of metal sheets each having an insulating layer on opposite surfaces thereof and a plurality of conductors on each insulating layer, the sheets being mounted together in spaced relation, and connecting means being provided between conductors on different sheets. The sheets may be made of, or coated with, A1, Mg, Ti, Be, Zr, or alloys thereof, a surface of which is oxidized, by anodization or otherwise, to form the insulating layers; alternatively, the latter may be formed by spraying or evaporating insulating material on to the metal sheets. The conductors may be of Au, Cu or A1 and may be deposited by electroless or electrolytic plating, vacuum or vapour phase deposition, spraying, silk screening, or lithography, followed as necessary by etching or electron beam scribing. Plated through holes are used to interconnect conductors on opposite surfaces of a sheet, the hole walls being coated first with insulation unless a conductive connection to the sheet is required; such conductive connection may also be provided by omitting or removing the insulating layer from selected areas of the sheet surface before depositing the conductors. Double-sided printed circuit boards of the invention are stacked, Fig. 5, not shown, adjacent boards 15, 16 having registering stand-off portions 17, 18, 20, 21 which are bonded or riveted together to provide a space 19 between the boards. Conductors on adjacent boards are interconnected where required by metal plugs 23 soldered or upset in position in registering through holes in boards; such plugs may also be used to connect the boards mechanically. Fig. 4, not shown, depicts adjacent boards held together in spaced relation by rivets which are secured in registering holes in the boards and then welded together. An edge of a circuit board may be serrated to form projections 9, Fig. 2, which are completely covered by the insulating layer and carry conductive contacts to form plug-portions of a coupling arrangement; the serrations may be omitted. Alternatively, Fig. 3, the edge of the board at which connections are to be made is bent through a rightangle, plated through holes 10 being provided in the bent-up portion which are engaged by plug pins 11. The boards may be cooled, as by water flowing through channels in or on the metal sheets.
GB1490668A 1965-10-26 1965-10-26 Improvements relating to electrical connecting arrangements Expired GB1136753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1490668A GB1136753A (en) 1965-10-26 1965-10-26 Improvements relating to electrical connecting arrangements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1490668A GB1136753A (en) 1965-10-26 1965-10-26 Improvements relating to electrical connecting arrangements

Publications (1)

Publication Number Publication Date
GB1136753A true GB1136753A (en) 1968-12-18

Family

ID=10049636

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1490668A Expired GB1136753A (en) 1965-10-26 1965-10-26 Improvements relating to electrical connecting arrangements

Country Status (1)

Country Link
GB (1) GB1136753A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5325864A (en) * 1976-06-30 1978-03-10 Ibm Multilayer substrate package
JPS55120198A (en) * 1979-03-12 1980-09-16 Fujitsu Ltd Multilayer printed circuit board and method of fabricating same
JPS55123195A (en) * 1979-03-15 1980-09-22 Fujitsu Ltd Hollow coaxial structure multilayer printed board
JPS55140296A (en) * 1979-04-18 1980-11-01 Fujitsu Ltd Multilayer printed board
WO1980002633A1 (en) * 1979-05-24 1980-11-27 Fujitsu Ltd Hollow multilayer printed wiring board,and method of fabricating same
JPS55153397A (en) * 1979-05-18 1980-11-29 Fujitsu Ltd Method of fabricating hollow multilayer printed board
DE3113540A1 (en) * 1981-04-03 1982-10-21 Siemens AG, 1000 Berlin und 8000 München Edge contact for printed-circuit boards
EP0078582A2 (en) * 1981-11-04 1983-05-11 Philips Electronics Uk Limited Electrical circuits
FR2541828A1 (en) * 1983-02-28 1984-08-31 Inf Milit Spatiale Aeronaut ELECTRICAL CONNECTION DEVICE BETWEEN TWO PRINTED CIRCUIT BOARDS AND METHOD FOR CONNECTING TWO PRINTED CIRCUIT BOARDS USING SUCH A DEVICE
DE3726170A1 (en) * 1986-08-07 1988-02-18 Sharp Kk ELECTRONIC DEVICE WITH FLEXIBLE CIRCUIT CARD
DE3910699A1 (en) * 1989-04-03 1990-10-04 Omt Oberflaechen Materialtech Printed circuit board for integrated circuits
EP0399161A2 (en) * 1989-04-17 1990-11-28 International Business Machines Corporation Multi-level circuit card structure
EP0478879A2 (en) * 1990-10-01 1992-04-08 Hewlett-Packard Company A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board
WO1998053652A1 (en) * 1997-05-23 1998-11-26 Magneti Marelli France Electronic plate folded at 45°
EP0936849A1 (en) * 1998-02-17 1999-08-18 Pressac Interconnect Limited Printed circuit assembly and method of making the same
EP1269804A1 (en) * 2000-03-31 2003-01-02 Dyconex Patente Ag Electrical connecting element and method of fabricating the same

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5325864A (en) * 1976-06-30 1978-03-10 Ibm Multilayer substrate package
JPS55120198A (en) * 1979-03-12 1980-09-16 Fujitsu Ltd Multilayer printed circuit board and method of fabricating same
JPS5811117B2 (en) * 1979-03-12 1983-03-01 富士通株式会社 Method for manufacturing multilayer printed wiring board
JPS55123195A (en) * 1979-03-15 1980-09-22 Fujitsu Ltd Hollow coaxial structure multilayer printed board
JPS55140296A (en) * 1979-04-18 1980-11-01 Fujitsu Ltd Multilayer printed board
JPS5811119B2 (en) * 1979-04-18 1983-03-01 富士通株式会社 multilayer printed board
JPS55153397A (en) * 1979-05-18 1980-11-29 Fujitsu Ltd Method of fabricating hollow multilayer printed board
WO1980002633A1 (en) * 1979-05-24 1980-11-27 Fujitsu Ltd Hollow multilayer printed wiring board,and method of fabricating same
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
JPS5739559B2 (en) * 1979-05-24 1982-08-21
DE3113540A1 (en) * 1981-04-03 1982-10-21 Siemens AG, 1000 Berlin und 8000 München Edge contact for printed-circuit boards
EP0078582A3 (en) * 1981-11-04 1986-01-29 Philips Electronic And Associated Industries Limited Electrical circuits
EP0078582A2 (en) * 1981-11-04 1983-05-11 Philips Electronics Uk Limited Electrical circuits
US4912284A (en) * 1981-11-04 1990-03-27 U.S. Philips Corporation Electrical circuits
FR2541828A1 (en) * 1983-02-28 1984-08-31 Inf Milit Spatiale Aeronaut ELECTRICAL CONNECTION DEVICE BETWEEN TWO PRINTED CIRCUIT BOARDS AND METHOD FOR CONNECTING TWO PRINTED CIRCUIT BOARDS USING SUCH A DEVICE
EP0117809A1 (en) * 1983-02-28 1984-09-05 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electrical connection device for the connection of two printed circuit cards and a method of connecting two printed circuit cards with the aid of this device
DE3726170A1 (en) * 1986-08-07 1988-02-18 Sharp Kk ELECTRONIC DEVICE WITH FLEXIBLE CIRCUIT CARD
US4901193A (en) * 1986-08-07 1990-02-13 Sharp Kabushiki Kaisha Construction of fitting flexible board within electronic apparatus
DE3910699A1 (en) * 1989-04-03 1990-10-04 Omt Oberflaechen Materialtech Printed circuit board for integrated circuits
EP0399161A3 (en) * 1989-04-17 1991-01-16 International Business Machines Corporation Multi-level circuit card structure
EP0399161A2 (en) * 1989-04-17 1990-11-28 International Business Machines Corporation Multi-level circuit card structure
US5786986A (en) * 1989-04-17 1998-07-28 International Business Machines Corporation Multi-level circuit card structure
EP0478879A2 (en) * 1990-10-01 1992-04-08 Hewlett-Packard Company A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board
EP0478879A3 (en) * 1990-10-01 1992-07-01 Hewlett-Packard Company Secondary board for mounting of components having differing bonding requirements
WO1998053652A1 (en) * 1997-05-23 1998-11-26 Magneti Marelli France Electronic plate folded at 45°
FR2763779A1 (en) * 1997-05-23 1998-11-27 Magneti Marelli France ELECTRONIC PLATE FOLDED AT 45 °
EP0936849A1 (en) * 1998-02-17 1999-08-18 Pressac Interconnect Limited Printed circuit assembly and method of making the same
EP1269804A1 (en) * 2000-03-31 2003-01-02 Dyconex Patente Ag Electrical connecting element and method of fabricating the same

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