DE3910699A1 - Printed circuit board for integrated circuits - Google Patents
Printed circuit board for integrated circuitsInfo
- Publication number
- DE3910699A1 DE3910699A1 DE19893910699 DE3910699A DE3910699A1 DE 3910699 A1 DE3910699 A1 DE 3910699A1 DE 19893910699 DE19893910699 DE 19893910699 DE 3910699 A DE3910699 A DE 3910699A DE 3910699 A1 DE3910699 A1 DE 3910699A1
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- circuit board
- plate
- heat
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Die Erfindung betrifft eine Leiterplatte für integrierte Schaltungen aus einer Trägerplatte mit elektrischen Leiter bahnen.The invention relates to a printed circuit board for integrated Circuits from a carrier plate with an electrical conductor pave the way.
Integrierte Schaltungen finden in der Technik auf den ver schiedensten Gebieten Anwendung. Die einzelnen Bauelemente dieser Schaltungen sind auf Leiterplatten angeordnet.Integrated circuits are found in technology on the ver various areas of application. The individual components these circuits are arranged on printed circuit boards.
Letz tere bestehen aus einer elektrisch nicht leitenden Träger platte, überwiegend auf der Basis von Epoxydharz, aber auch aus Keramik. Auf die Trägerplatte wird z.B. in geeigneter Weise eine elektrisch leitende Schicht aufgebracht, aus der die gewünschten Leiterbahnen herausgearbeitet werden. Eine andere Möglichkeit besteht darin, die Leiterbahnen auf die Trägerplatte aufzudrucken. Auf die so hergestellten Leiter bahnen werden die einzelnen Bauelemente, z.B. Halbleiter elemente, aufgelötet.Last tere consist of an electrically non-conductive carrier plate, mainly based on epoxy resin, but also made of ceramic. On the carrier plate e.g. in a more appropriate Way applied an electrically conductive layer from which the desired conductor tracks are worked out. A another option is to trace the conductors To print the carrier plate. On the ladder so produced the individual components, e.g. Semiconductors elements, soldered.
Die bekannten Trägerplatten weisen den Nachteil auf, daß sie schlechte Wärmeleiter sind und deshalb Bauelemente, die Wärme erzeugen, nicht beliebig dicht nebeneinander angeord net werden können. Die lokale Erhitzung würde zu einer Be einträchtigung der Funktion der Bauelemente führen. Ein weiterer Nachteil der herkömmlichen Trägerplatten besteht darin, daß sie mechanisch nicht stark belastet werden kön nen. Insbesondere eine Platte aus Keramik ist sehr bruch empfindlich. Ferner sind integrierte Schaltungen für spe zielle Anwendungen ohne aufwendige Maßnahmen gegen Zerstö rungen durch elektrische Felder oder mechanische Einwirkun gen nicht schützbar.The known carrier plates have the disadvantage that they are poor heat conductors and therefore components that Generate heat, not arranged as close together as desired can be net. Local heating would become a problem impair the function of the components. A Another disadvantage of the conventional carrier plates in that they cannot be subjected to high mechanical loads nen. A ceramic plate in particular is very broken sensitive. Furthermore, integrated circuits for spe zial applications without expensive measures against destruction by electrical fields or mechanical influences cannot be protected.
Der Erfindung liegt die Aufgabe zugrunde, eine Leiterplatte zu schaffen, die die Nachteile der herkömmlichen Leiter platten nicht aufweist, insbesondere Schaltungen ermög licht, die ohne Zerstörungen elektrisch und mechanisch hoch belastbar sind, und darüber hinaus die Decodierbarkeit der Schaltungen für spezielle Aufwendungen verhindern. Ferner sollen sie einen flachen Aufbau der Schaltungen gestatten.The invention has for its object a circuit board to create the disadvantages of conventional ladders plates does not have, in particular circuits possible light that is electrically and mechanically high without destruction are resilient, and also the decodability of the Prevent circuits for special expenses. Further they should allow a flat structure of the circuits.
Erfindungsgemäß wird diese Aufgabe durch eine im Oberbe griff des Patentanspruches 1 angegebene Leiterplatte da durch gelöst, daß die Trägerplatte aus einer wärmeleitenden metallischen Platte besteht, auf deren Plattenoberfläche sich eine elektrisch isolierende Schicht befindet.According to the invention, this object is achieved by an in the Oberbe handle of claim 1 specified circuit board there solved by that the carrier plate from a heat-conducting metallic plate exists on the plate surface there is an electrically insulating layer.
Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen angegeben.Advantageous embodiments of the invention are in the Subclaims specified.
Der mit der Erfindung erzielbare Vorteil liegt zum einen darin, daß durch die Wärmeleitfähigkeit der Platte die beim Betrieb der einzelnen Bauelemente entstehende Wärme gut ab geführt und damit eine Temperaturstabilität der Schaltung erreicht werden kann. Vorteilhaft ist weiterhin, daß die Platten aus Metall bestehen und deshalb mechanisch hoch be lastbar sind. Darüber hinaus ermöglicht die Verwendung von Metallen auch eine gute Bearbeitung der Platten, die mecha nisch, chemisch oder plasmatechnisch erfolgen kann. Dies hat vorteilhafte Auswirkungen auf die Kosten und auf die Ausgestaltungsmöglichkeiten der Platten. Ferner hat die Verwendung von Metallen auch den Vorteil, daß die Schal tungen besser gegen radiologisch kurzwellige Strahlen und gegen elektrische Felder sowie gegen Feuchtigkeits- und Umwelteinflüsse geschützt werden können. Ein weiterer Vor teil besteht darin, daß die elektrisch isolierenden Schich ten gezielt mit bestimmten physikalischen Eigenschaften hergestellt werden können.The advantage that can be achieved with the invention lies on the one hand in that due to the thermal conductivity of the plate Operation of the individual components heat generated well led and thus a temperature stability of the circuit can be reached. It is also advantageous that the Panels are made of metal and therefore mechanically high are resilient. In addition, the use of Metals also work well on the plates, the mecha nisch, chemical or plasma technology can be done. This has beneficial effects on costs and on the Design options for the panels. Furthermore, the Use of metals also has the advantage that the scarf better against short wave radiological radiation and against electric fields and against moisture and Environmental influences can be protected. Another before part is that the electrically insulating layer targeted with certain physical properties can be produced.
Im folgenden wird die Erfindung anhand der einzigen Abbil dung beispielhaft erläutert.In the following the invention based on the only Figil example explained.
Nach der schematischen Darstellung eines vorteilhaften Aus führungsbeispieles der Leiterplatte besteht die Trägerplat te (1) aus einer wärmeleitenden metallischen Platte (2). Als Substrat für diese Platte werden bevorzugt Metalle oder Metallegierungen verwendet, die eine gute Wärmeleitfähig keit aufweisen. In Betracht kommen insbesondere Aluminium, Kupfer, Titan, Nickel, Kobalt oder Magnesium oder Stahl. Für bestimmte Anwendungsbereiche ist es vorteilhaft, daß die verwendeten Metalle oder Legierungen magnetisierbar sind.According to the schematic representation of an advantageous exemplary embodiment of the printed circuit board, the carrier plate ( 1 ) consists of a heat-conducting metallic plate ( 2 ). Metals or metal alloys which have a good thermal conductivity are preferably used as the substrate for this plate. Aluminum, copper, titanium, nickel, cobalt or magnesium or steel are particularly suitable. For certain areas of application, it is advantageous that the metals or alloys used can be magnetized.
Die Platte (2) weist Vertiefungen (4) auf, in denen die einzelnen Bauelemente (7) der integrierten Schaltungen an geordnet sind. Die Vertiefungen sind den Abmessungen der Bauelemente angepaßt, um den seitlichen Abstand zwischen den Bauelementen und den Rändern der Vertiefungen so gering wie möglich zu halten.The plate ( 2 ) has depressions ( 4 ) in which the individual components ( 7 ) of the integrated circuits are arranged. The depressions are adapted to the dimensions of the components in order to keep the lateral distance between the components and the edges of the depressions as small as possible.
Die Oberfläche der Platte (2) ist mit einer elektrisch iso lierenden Schicht (3) beschichtet. Diese besteht vorteil haft z.B. aus AlN, Al2O3, BN, BeO, Si3N4, TiZrO3 oder ZrO2.The surface of the plate ( 2 ) is coated with an electrically insulating layer ( 3 ). This advantageously consists, for example, of AlN, Al 2 O 3 , BN, BeO, Si 3 N 4 , TiZrO 3 or ZrO 2 .
Diesen Verbindungen ist gemeinsam, daß ihre Dielektrizi tätszahlen sehr geringe Werte aufweisen.These compounds have in common that their dielectric have very low values.
Auf der isolierenden Schicht (3) sind die Leiterbahnen (5) angeordnet. Mit der Trägerplatte (1) fest verbunden ist ei ne Abdeckplatte (6), die auf ihrer Innenseite mit einer elektrisch isolierenden Schicht (7) beschichtet ist. Für die Abdeckplatte (6) und die isolierende Schicht (7) gelten hinsichtlich ihrer Zusammensetzungen die Ausführungen, die vorstehend zu der Platte (2) und der isolierenden Schicht (3) gemacht worden sind. The conductor tracks ( 5 ) are arranged on the insulating layer ( 3 ). With the support plate ( 1 ) is firmly egg ne cover plate ( 6 ), which is coated on its inside with an electrically insulating layer ( 7 ). For the cover plate ( 6 ) and the insulating layer ( 7 ) with regard to their compositions, the statements made above for the plate ( 2 ) and the insulating layer ( 3 ) apply.
Mit dem beschriebenen Ausführungsbeispiel ist es möglich, flache integrierte Schaltungen herzustellen, in denen dicht nebeneinander eine Vielzahl von wärmeabgebenden Bauelemen ten angeordnet sein kann, deren Temperatur aber dennoch stabil gehalten werden kann. Ferner ist ein solches Bauteil mechanisch hoch belastbar und sowohl gegen radiologisch kurzwellige Strahlen als auch gegen elektrische Felder so wie gegen Feuchtigkeits- und Umwelteinflüsse geschützt. Enthält die Schaltung einen Festspeicher, ist es nicht mög lich, diesen ohne Zerstörung des Bauteiles zu decodieren. Wird das Bauteil als elektronischer Schlüssel oder Codier geber verwendet, ist es, falls die verwendeten Metalle oder Legierungen magnetisierbar sind, möglich, es bei falscher Verwendung durch geeignete Maßnahmen zurückzuhalten, so daß der Benutzer nicht mehr in den Besitz des Bauteiles kommen kann.With the described embodiment, it is possible to manufacture flat integrated circuits where tight a large number of heat-emitting components side by side ten can be arranged, but the temperature nevertheless can be kept stable. Furthermore, such a component mechanically highly resilient and both against radiological shortwave rays as well as against electric fields like this as protected against moisture and environmental influences. If the circuit contains a permanent memory, it is not possible Lich to decode it without destroying the component. The component is used as an electronic key or coding is used, if the metals used or Alloys are magnetizable, possible with the wrong one Restrain use through appropriate measures so that the user no longer comes into possession of the component can.
Die erfindungsgemäße Leiterplatte findet vorteilhaft Anwen dung für Bauteile, die leicht, aber dennoch bruchfest sein müssen. Da die Wärme, die durch bestimmte Bauelemente ent steht, gut abgeführt wird, ist es möglich, die Bauteile in ihren Abmessungen klein zu halten. Dies ist z.B. in der Weltraum- und Militärtechnik, für die Herstellung von Com putern sowie im Kraftfahrzeug- und Flugzeugbau von Bedeu tung.The circuit board according to the invention is advantageously used for components that are light but still break-proof have to. Because the heat generated by certain components stands, is dissipated well, it is possible to put the components in to keep their dimensions small. This is e.g. in the Space and military technology, for the production of Com turkey as well as in automobile and aircraft construction from Bedeu tung.
Weitere Verwendungsmöglichkeiten liegen z.B. in der Anwen dung als elektronische Schlüssel oder Codiergeber, die den Zutritt zu besonders geschützten Objekten, z.B. Kernkraft werken, ermöglichen, oder als Träger für Sensorengruppen im Rauhklimabereich.Other uses include e.g. in the anwen as electronic keys or encoders, which the Access to specially protected objects, e.g. Nuclear power work, enable, or as a carrier for sensor groups in the Harsh climate area.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19893910699 DE3910699A1 (en) | 1989-04-03 | 1989-04-03 | Printed circuit board for integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19893910699 DE3910699A1 (en) | 1989-04-03 | 1989-04-03 | Printed circuit board for integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3910699A1 true DE3910699A1 (en) | 1990-10-04 |
Family
ID=6377710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19893910699 Withdrawn DE3910699A1 (en) | 1989-04-03 | 1989-04-03 | Printed circuit board for integrated circuits |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3910699A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4416403A1 (en) * | 1994-05-09 | 1995-11-23 | Schweizer Electronic Ag | Cooling system for printed circuit board |
EP1054445A1 (en) * | 1999-05-19 | 2000-11-22 | Sagem Sa | Electronic package on circuit board and its manufacture |
US6184579B1 (en) | 1998-07-07 | 2001-02-06 | R-Amtech International, Inc. | Double-sided electronic device |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1136753A (en) * | 1965-10-26 | 1968-12-18 | English Electric Computers Ltd | Improvements relating to electrical connecting arrangements |
GB1136752A (en) * | 1965-10-26 | 1968-12-18 | English Electric Computers Ltd | Improvements relating to electrical connecting arrangements |
US3564565A (en) * | 1964-05-05 | 1971-02-16 | Texas Instruments Inc | Process for adherently applying boron nitride to copper and article of manufacture |
AT348018B (en) * | 1975-04-16 | 1979-01-25 | Siemens Ag Oesterreich | CARRIER PLATE |
EP0048406A2 (en) * | 1980-09-22 | 1982-03-31 | Siemens Aktiengesellschaft | Heat dissipating printed-circuit board |
DE3125518C2 (en) * | 1980-06-30 | 1984-04-26 | Sharp K.K., Osaka | Method of making a thin wiring assembly - US Pat |
EP0186655A2 (en) * | 1984-12-27 | 1986-07-02 | VOEST-ALPINE Aktiengesellschaft | Process for making a composite circuit board |
DE3604074A1 (en) * | 1986-02-08 | 1987-08-13 | Bosch Gmbh Robert | IGNITION SWITCH |
DE8715073U1 (en) * | 1987-11-12 | 1988-02-25 | Siemens AG, 1000 Berlin und 8000 München | Electronic unit for controlling functions of a motor vehicle |
DE3703088A1 (en) * | 1987-02-03 | 1988-08-11 | Vdo Schindling | Housing for accommodating at least one printed circuit board |
GB2206451A (en) * | 1987-04-09 | 1989-01-05 | Reginald John Glass | Substrates for circuit panels |
-
1989
- 1989-04-03 DE DE19893910699 patent/DE3910699A1/en not_active Withdrawn
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3564565A (en) * | 1964-05-05 | 1971-02-16 | Texas Instruments Inc | Process for adherently applying boron nitride to copper and article of manufacture |
GB1136753A (en) * | 1965-10-26 | 1968-12-18 | English Electric Computers Ltd | Improvements relating to electrical connecting arrangements |
GB1136752A (en) * | 1965-10-26 | 1968-12-18 | English Electric Computers Ltd | Improvements relating to electrical connecting arrangements |
AT348018B (en) * | 1975-04-16 | 1979-01-25 | Siemens Ag Oesterreich | CARRIER PLATE |
DE3125518C2 (en) * | 1980-06-30 | 1984-04-26 | Sharp K.K., Osaka | Method of making a thin wiring assembly - US Pat |
EP0048406A2 (en) * | 1980-09-22 | 1982-03-31 | Siemens Aktiengesellschaft | Heat dissipating printed-circuit board |
EP0186655A2 (en) * | 1984-12-27 | 1986-07-02 | VOEST-ALPINE Aktiengesellschaft | Process for making a composite circuit board |
DE3447520A1 (en) * | 1984-12-27 | 1986-08-14 | Metallwerk Plansee GmbH, Reutte, Tirol | COMPOUND CIRCUIT BOARD, METHOD FOR PRODUCING A COMPOUND CIRCUIT BOARD AND USE OF ALUMINUM OXIDE AS THE INSULATING LAYER OF A COMPOUND CIRCUIT BOARD |
DE3604074A1 (en) * | 1986-02-08 | 1987-08-13 | Bosch Gmbh Robert | IGNITION SWITCH |
DE3703088A1 (en) * | 1987-02-03 | 1988-08-11 | Vdo Schindling | Housing for accommodating at least one printed circuit board |
GB2206451A (en) * | 1987-04-09 | 1989-01-05 | Reginald John Glass | Substrates for circuit panels |
DE8715073U1 (en) * | 1987-11-12 | 1988-02-25 | Siemens AG, 1000 Berlin und 8000 München | Electronic unit for controlling functions of a motor vehicle |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4416403A1 (en) * | 1994-05-09 | 1995-11-23 | Schweizer Electronic Ag | Cooling system for printed circuit board |
DE4416403C2 (en) * | 1994-05-09 | 2000-07-13 | Schweizer Electronic Ag | Cooling device for a printed circuit board and method for producing such a cooling device |
US6184579B1 (en) | 1998-07-07 | 2001-02-06 | R-Amtech International, Inc. | Double-sided electronic device |
EP1054445A1 (en) * | 1999-05-19 | 2000-11-22 | Sagem Sa | Electronic package on circuit board and its manufacture |
FR2793990A1 (en) * | 1999-05-19 | 2000-11-24 | Sagem | ELECTRONIC HOUSING ON PLATE AND METHOD FOR MANUFACTURING SUCH A HOUSING |
US6212072B1 (en) | 1999-05-19 | 2001-04-03 | Sagem Sa | Electronics package on a plate, and a method of making such a package |
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Legal Events
Date | Code | Title | Description |
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OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8139 | Disposal/non-payment of the annual fee |