DE3910699A1 - Printed circuit board for integrated circuits - Google Patents

Printed circuit board for integrated circuits

Info

Publication number
DE3910699A1
DE3910699A1 DE19893910699 DE3910699A DE3910699A1 DE 3910699 A1 DE3910699 A1 DE 3910699A1 DE 19893910699 DE19893910699 DE 19893910699 DE 3910699 A DE3910699 A DE 3910699A DE 3910699 A1 DE3910699 A1 DE 3910699A1
Authority
DE
Germany
Prior art keywords
printed circuit
circuit board
plate
heat
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19893910699
Other languages
German (de)
Inventor
C Dr Repenning
Basil Yannicos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMT OBERFLAECHEN MATERIALTECH
Original Assignee
OMT OBERFLAECHEN MATERIALTECH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMT OBERFLAECHEN MATERIALTECH filed Critical OMT OBERFLAECHEN MATERIALTECH
Priority to DE19893910699 priority Critical patent/DE3910699A1/en
Publication of DE3910699A1 publication Critical patent/DE3910699A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

Known printed circuit boards consist of carrier plates which do not conduct heat and are not resistant to breaking. The object of the invention is to obtain a printed circuit board on which heat-dissipating components can be arranged close to one another, with it still being possible, however, to keep the temperature stable. At the same time, the printed circuit board is intended to be resistant to breaking. In the case of the printed circuit board, the carrier plate (1) consists of a heat-conducting metal plate (2), on the plate surface of which an electrically insulating layer (3) is located, as is diagrammatically represented in the single figure. The invention makes it possible to prepare flat components which are resistant to breaking and are stable with respect to temperature and can also be protected against radiological beams, electric fields, and the influence of moisture and the surroundings. <IMAGE>

Description

Die Erfindung betrifft eine Leiterplatte für integrierte Schaltungen aus einer Trägerplatte mit elektrischen Leiter­ bahnen.The invention relates to a printed circuit board for integrated Circuits from a carrier plate with an electrical conductor pave the way.

Integrierte Schaltungen finden in der Technik auf den ver­ schiedensten Gebieten Anwendung. Die einzelnen Bauelemente dieser Schaltungen sind auf Leiterplatten angeordnet.Integrated circuits are found in technology on the ver various areas of application. The individual components these circuits are arranged on printed circuit boards.

Letz­ tere bestehen aus einer elektrisch nicht leitenden Träger­ platte, überwiegend auf der Basis von Epoxydharz, aber auch aus Keramik. Auf die Trägerplatte wird z.B. in geeigneter Weise eine elektrisch leitende Schicht aufgebracht, aus der die gewünschten Leiterbahnen herausgearbeitet werden. Eine andere Möglichkeit besteht darin, die Leiterbahnen auf die Trägerplatte aufzudrucken. Auf die so hergestellten Leiter­ bahnen werden die einzelnen Bauelemente, z.B. Halbleiter­ elemente, aufgelötet.Last tere consist of an electrically non-conductive carrier plate, mainly based on epoxy resin, but also made of ceramic. On the carrier plate e.g. in a more appropriate Way applied an electrically conductive layer from which the desired conductor tracks are worked out. A another option is to trace the conductors To print the carrier plate. On the ladder so produced the individual components, e.g. Semiconductors elements, soldered.

Die bekannten Trägerplatten weisen den Nachteil auf, daß sie schlechte Wärmeleiter sind und deshalb Bauelemente, die Wärme erzeugen, nicht beliebig dicht nebeneinander angeord­ net werden können. Die lokale Erhitzung würde zu einer Be­ einträchtigung der Funktion der Bauelemente führen. Ein weiterer Nachteil der herkömmlichen Trägerplatten besteht darin, daß sie mechanisch nicht stark belastet werden kön­ nen. Insbesondere eine Platte aus Keramik ist sehr bruch­ empfindlich. Ferner sind integrierte Schaltungen für spe­ zielle Anwendungen ohne aufwendige Maßnahmen gegen Zerstö­ rungen durch elektrische Felder oder mechanische Einwirkun­ gen nicht schützbar.The known carrier plates have the disadvantage that they are poor heat conductors and therefore components that Generate heat, not arranged as close together as desired can be net. Local heating would become a problem impair the function of the components. A Another disadvantage of the conventional carrier plates in that they cannot be subjected to high mechanical loads nen. A ceramic plate in particular is very broken sensitive. Furthermore, integrated circuits for spe zial applications without expensive measures against destruction by electrical fields or mechanical influences cannot be protected.

Der Erfindung liegt die Aufgabe zugrunde, eine Leiterplatte zu schaffen, die die Nachteile der herkömmlichen Leiter­ platten nicht aufweist, insbesondere Schaltungen ermög­ licht, die ohne Zerstörungen elektrisch und mechanisch hoch belastbar sind, und darüber hinaus die Decodierbarkeit der Schaltungen für spezielle Aufwendungen verhindern. Ferner sollen sie einen flachen Aufbau der Schaltungen gestatten.The invention has for its object a circuit board to create the disadvantages of conventional ladders plates does not have, in particular circuits possible light that is electrically and mechanically high without destruction are resilient, and also the decodability of the Prevent circuits for special expenses. Further they should allow a flat structure of the circuits.

Erfindungsgemäß wird diese Aufgabe durch eine im Oberbe­ griff des Patentanspruches 1 angegebene Leiterplatte da­ durch gelöst, daß die Trägerplatte aus einer wärmeleitenden metallischen Platte besteht, auf deren Plattenoberfläche sich eine elektrisch isolierende Schicht befindet.According to the invention, this object is achieved by an in the Oberbe handle of claim 1 specified circuit board there solved by that the carrier plate from a heat-conducting metallic plate exists on the plate surface there is an electrically insulating layer.

Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen angegeben.Advantageous embodiments of the invention are in the Subclaims specified.

Der mit der Erfindung erzielbare Vorteil liegt zum einen darin, daß durch die Wärmeleitfähigkeit der Platte die beim Betrieb der einzelnen Bauelemente entstehende Wärme gut ab­ geführt und damit eine Temperaturstabilität der Schaltung erreicht werden kann. Vorteilhaft ist weiterhin, daß die Platten aus Metall bestehen und deshalb mechanisch hoch be­ lastbar sind. Darüber hinaus ermöglicht die Verwendung von Metallen auch eine gute Bearbeitung der Platten, die mecha­ nisch, chemisch oder plasmatechnisch erfolgen kann. Dies hat vorteilhafte Auswirkungen auf die Kosten und auf die Ausgestaltungsmöglichkeiten der Platten. Ferner hat die Verwendung von Metallen auch den Vorteil, daß die Schal­ tungen besser gegen radiologisch kurzwellige Strahlen und gegen elektrische Felder sowie gegen Feuchtigkeits- und Umwelteinflüsse geschützt werden können. Ein weiterer Vor­ teil besteht darin, daß die elektrisch isolierenden Schich­ ten gezielt mit bestimmten physikalischen Eigenschaften hergestellt werden können.The advantage that can be achieved with the invention lies on the one hand in that due to the thermal conductivity of the plate Operation of the individual components heat generated well led and thus a temperature stability of the circuit can be reached. It is also advantageous that the Panels are made of metal and therefore mechanically high are resilient. In addition, the use of Metals also work well on the plates, the mecha nisch, chemical or plasma technology can be done. This has beneficial effects on costs and on the Design options for the panels. Furthermore, the Use of metals also has the advantage that the scarf better against short wave radiological radiation and against electric fields and against moisture and Environmental influences can be protected. Another before part is that the electrically insulating layer targeted with certain physical properties can be produced.

Im folgenden wird die Erfindung anhand der einzigen Abbil­ dung beispielhaft erläutert.In the following the invention based on the only Figil example explained.

Nach der schematischen Darstellung eines vorteilhaften Aus­ führungsbeispieles der Leiterplatte besteht die Trägerplat­ te (1) aus einer wärmeleitenden metallischen Platte (2). Als Substrat für diese Platte werden bevorzugt Metalle oder Metallegierungen verwendet, die eine gute Wärmeleitfähig­ keit aufweisen. In Betracht kommen insbesondere Aluminium, Kupfer, Titan, Nickel, Kobalt oder Magnesium oder Stahl. Für bestimmte Anwendungsbereiche ist es vorteilhaft, daß die verwendeten Metalle oder Legierungen magnetisierbar sind.According to the schematic representation of an advantageous exemplary embodiment of the printed circuit board, the carrier plate ( 1 ) consists of a heat-conducting metallic plate ( 2 ). Metals or metal alloys which have a good thermal conductivity are preferably used as the substrate for this plate. Aluminum, copper, titanium, nickel, cobalt or magnesium or steel are particularly suitable. For certain areas of application, it is advantageous that the metals or alloys used can be magnetized.

Die Platte (2) weist Vertiefungen (4) auf, in denen die einzelnen Bauelemente (7) der integrierten Schaltungen an­ geordnet sind. Die Vertiefungen sind den Abmessungen der Bauelemente angepaßt, um den seitlichen Abstand zwischen den Bauelementen und den Rändern der Vertiefungen so gering wie möglich zu halten.The plate ( 2 ) has depressions ( 4 ) in which the individual components ( 7 ) of the integrated circuits are arranged. The depressions are adapted to the dimensions of the components in order to keep the lateral distance between the components and the edges of the depressions as small as possible.

Die Oberfläche der Platte (2) ist mit einer elektrisch iso­ lierenden Schicht (3) beschichtet. Diese besteht vorteil­ haft z.B. aus AlN, Al2O3, BN, BeO, Si3N4, TiZrO3 oder ZrO2.The surface of the plate ( 2 ) is coated with an electrically insulating layer ( 3 ). This advantageously consists, for example, of AlN, Al 2 O 3 , BN, BeO, Si 3 N 4 , TiZrO 3 or ZrO 2 .

Diesen Verbindungen ist gemeinsam, daß ihre Dielektrizi­ tätszahlen sehr geringe Werte aufweisen.These compounds have in common that their dielectric have very low values.

Auf der isolierenden Schicht (3) sind die Leiterbahnen (5) angeordnet. Mit der Trägerplatte (1) fest verbunden ist ei­ ne Abdeckplatte (6), die auf ihrer Innenseite mit einer elektrisch isolierenden Schicht (7) beschichtet ist. Für die Abdeckplatte (6) und die isolierende Schicht (7) gelten hinsichtlich ihrer Zusammensetzungen die Ausführungen, die vorstehend zu der Platte (2) und der isolierenden Schicht (3) gemacht worden sind. The conductor tracks ( 5 ) are arranged on the insulating layer ( 3 ). With the support plate ( 1 ) is firmly egg ne cover plate ( 6 ), which is coated on its inside with an electrically insulating layer ( 7 ). For the cover plate ( 6 ) and the insulating layer ( 7 ) with regard to their compositions, the statements made above for the plate ( 2 ) and the insulating layer ( 3 ) apply.

Mit dem beschriebenen Ausführungsbeispiel ist es möglich, flache integrierte Schaltungen herzustellen, in denen dicht nebeneinander eine Vielzahl von wärmeabgebenden Bauelemen­ ten angeordnet sein kann, deren Temperatur aber dennoch stabil gehalten werden kann. Ferner ist ein solches Bauteil mechanisch hoch belastbar und sowohl gegen radiologisch kurzwellige Strahlen als auch gegen elektrische Felder so­ wie gegen Feuchtigkeits- und Umwelteinflüsse geschützt. Enthält die Schaltung einen Festspeicher, ist es nicht mög­ lich, diesen ohne Zerstörung des Bauteiles zu decodieren. Wird das Bauteil als elektronischer Schlüssel oder Codier­ geber verwendet, ist es, falls die verwendeten Metalle oder Legierungen magnetisierbar sind, möglich, es bei falscher Verwendung durch geeignete Maßnahmen zurückzuhalten, so daß der Benutzer nicht mehr in den Besitz des Bauteiles kommen kann.With the described embodiment, it is possible to manufacture flat integrated circuits where tight a large number of heat-emitting components side by side ten can be arranged, but the temperature nevertheless can be kept stable. Furthermore, such a component mechanically highly resilient and both against radiological shortwave rays as well as against electric fields like this as protected against moisture and environmental influences. If the circuit contains a permanent memory, it is not possible Lich to decode it without destroying the component. The component is used as an electronic key or coding is used, if the metals used or Alloys are magnetizable, possible with the wrong one Restrain use through appropriate measures so that the user no longer comes into possession of the component can.

Die erfindungsgemäße Leiterplatte findet vorteilhaft Anwen­ dung für Bauteile, die leicht, aber dennoch bruchfest sein müssen. Da die Wärme, die durch bestimmte Bauelemente ent­ steht, gut abgeführt wird, ist es möglich, die Bauteile in ihren Abmessungen klein zu halten. Dies ist z.B. in der Weltraum- und Militärtechnik, für die Herstellung von Com­ putern sowie im Kraftfahrzeug- und Flugzeugbau von Bedeu­ tung.The circuit board according to the invention is advantageously used for components that are light but still break-proof have to. Because the heat generated by certain components stands, is dissipated well, it is possible to put the components in to keep their dimensions small. This is e.g. in the Space and military technology, for the production of Com turkey as well as in automobile and aircraft construction from Bedeu tung.

Weitere Verwendungsmöglichkeiten liegen z.B. in der Anwen­ dung als elektronische Schlüssel oder Codiergeber, die den Zutritt zu besonders geschützten Objekten, z.B. Kernkraft­ werken, ermöglichen, oder als Träger für Sensorengruppen im Rauhklimabereich.Other uses include e.g. in the anwen as electronic keys or encoders, which the Access to specially protected objects, e.g. Nuclear power work, enable, or as a carrier for sensor groups in the Harsh climate area.

Claims (6)

1. Leiterplatte für integrierte Schaltungen aus einer Trä­ gerplatte mit elektrischen Leiterbahnen, dadurch ge­ kennzeichnet, daß die Trägerplatte (1) aus einer wärme­ leitenden metallischen Platte (2) besteht, auf deren Plattenoberfläche sich eine elektrisch isolierende Schicht (3) befindet.1. Printed circuit board for integrated circuits from a Trä gerplatte with electrical conductor tracks, characterized in that the carrier plate ( 1 ) consists of a heat-conducting metallic plate ( 2 ), on the surface of the plate there is an electrically insulating layer ( 3 ). 2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, daß die Trägerplatte (1) Vertiefungen (4) aufweist.2. Printed circuit board according to claim 1, characterized in that the carrier plate ( 1 ) has depressions ( 4 ). 3. Leiterplatte nach Anspruch 2, dadurch gekennzeichnet, daß die Trägerplatte (1) mit einer wärmeleitenden me­ tallischen Abdeckplatte (6) fest verbunden und zwischen den Platten eine elektrisch isolierende Schicht (7) an­ geordnet ist.3. Printed circuit board according to claim 2, characterized in that the carrier plate ( 1 ) with a thermally conductive me metallic cover plate ( 6 ) and an electrically insulating layer ( 7 ) is arranged between the plates. 4. Leiterplatte nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die wärmeleitende metallische Plat­ te (2) und/oder die wärmeleitende metallische Abdeck­ platte (6) aus Aluminium, Kupfer, Titan, Nickel oder Kobalt oder aus Legierungen auf der Basis von Alumini­ um, Kupfer, Titan, Nickel, Kobalt oder Magnesium oder Stahl bestehen.4. Printed circuit board according to one of claims 1 to 3, characterized in that the thermally conductive metallic plate te ( 2 ) and / or the thermally conductive metallic cover plate ( 6 ) made of aluminum, copper, titanium, nickel or cobalt or of alloys on the basis of aluminum, copper, titanium, nickel, cobalt or magnesium or steel. 5. Leiterplatte nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die wärmeleitende metallische Plat­ te (2) und/oder die wärmeleitende Abdeckplatte (6) aus magnetisierbaren Metallen oder Metallegierungen beste­ hen. 5. Printed circuit board according to one of claims 1 to 3, characterized in that the heat-conducting metallic plate te ( 2 ) and / or the heat-conducting cover plate ( 6 ) made of magnetizable metals or metal alloys best. 6. Leiterplatte nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die isolierenden Schichten (3) und (7) aus Aluminiumnitrid (AlN), Aluminiumoxid (Al2O3), Bornitrid (BN), Berylliumoxid (BeO), Siliciumnitrid (Si3N4), Titan-Zirkonoxid (TiZrO3) oder Zirkonoxid (ZrO2) bestehen.6. Printed circuit board according to one of claims 1 to 3, characterized in that the insulating layers ( 3 ) and ( 7 ) made of aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ), boron nitride (BN), beryllium oxide (BeO), silicon nitride (Si 3 N 4 ), titanium zirconium oxide (TiZrO 3 ) or zirconium oxide (ZrO 2 ).
DE19893910699 1989-04-03 1989-04-03 Printed circuit board for integrated circuits Withdrawn DE3910699A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19893910699 DE3910699A1 (en) 1989-04-03 1989-04-03 Printed circuit board for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19893910699 DE3910699A1 (en) 1989-04-03 1989-04-03 Printed circuit board for integrated circuits

Publications (1)

Publication Number Publication Date
DE3910699A1 true DE3910699A1 (en) 1990-10-04

Family

ID=6377710

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19893910699 Withdrawn DE3910699A1 (en) 1989-04-03 1989-04-03 Printed circuit board for integrated circuits

Country Status (1)

Country Link
DE (1) DE3910699A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416403A1 (en) * 1994-05-09 1995-11-23 Schweizer Electronic Ag Cooling system for printed circuit board
EP1054445A1 (en) * 1999-05-19 2000-11-22 Sagem Sa Electronic package on circuit board and its manufacture
US6184579B1 (en) 1998-07-07 2001-02-06 R-Amtech International, Inc. Double-sided electronic device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
GB1136752A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
US3564565A (en) * 1964-05-05 1971-02-16 Texas Instruments Inc Process for adherently applying boron nitride to copper and article of manufacture
AT348018B (en) * 1975-04-16 1979-01-25 Siemens Ag Oesterreich CARRIER PLATE
EP0048406A2 (en) * 1980-09-22 1982-03-31 Siemens Aktiengesellschaft Heat dissipating printed-circuit board
DE3125518C2 (en) * 1980-06-30 1984-04-26 Sharp K.K., Osaka Method of making a thin wiring assembly - US Pat
EP0186655A2 (en) * 1984-12-27 1986-07-02 VOEST-ALPINE Aktiengesellschaft Process for making a composite circuit board
DE3604074A1 (en) * 1986-02-08 1987-08-13 Bosch Gmbh Robert IGNITION SWITCH
DE8715073U1 (en) * 1987-11-12 1988-02-25 Siemens AG, 1000 Berlin und 8000 München Electronic unit for controlling functions of a motor vehicle
DE3703088A1 (en) * 1987-02-03 1988-08-11 Vdo Schindling Housing for accommodating at least one printed circuit board
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3564565A (en) * 1964-05-05 1971-02-16 Texas Instruments Inc Process for adherently applying boron nitride to copper and article of manufacture
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
GB1136752A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
AT348018B (en) * 1975-04-16 1979-01-25 Siemens Ag Oesterreich CARRIER PLATE
DE3125518C2 (en) * 1980-06-30 1984-04-26 Sharp K.K., Osaka Method of making a thin wiring assembly - US Pat
EP0048406A2 (en) * 1980-09-22 1982-03-31 Siemens Aktiengesellschaft Heat dissipating printed-circuit board
EP0186655A2 (en) * 1984-12-27 1986-07-02 VOEST-ALPINE Aktiengesellschaft Process for making a composite circuit board
DE3447520A1 (en) * 1984-12-27 1986-08-14 Metallwerk Plansee GmbH, Reutte, Tirol COMPOUND CIRCUIT BOARD, METHOD FOR PRODUCING A COMPOUND CIRCUIT BOARD AND USE OF ALUMINUM OXIDE AS THE INSULATING LAYER OF A COMPOUND CIRCUIT BOARD
DE3604074A1 (en) * 1986-02-08 1987-08-13 Bosch Gmbh Robert IGNITION SWITCH
DE3703088A1 (en) * 1987-02-03 1988-08-11 Vdo Schindling Housing for accommodating at least one printed circuit board
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels
DE8715073U1 (en) * 1987-11-12 1988-02-25 Siemens AG, 1000 Berlin und 8000 München Electronic unit for controlling functions of a motor vehicle

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416403A1 (en) * 1994-05-09 1995-11-23 Schweizer Electronic Ag Cooling system for printed circuit board
DE4416403C2 (en) * 1994-05-09 2000-07-13 Schweizer Electronic Ag Cooling device for a printed circuit board and method for producing such a cooling device
US6184579B1 (en) 1998-07-07 2001-02-06 R-Amtech International, Inc. Double-sided electronic device
EP1054445A1 (en) * 1999-05-19 2000-11-22 Sagem Sa Electronic package on circuit board and its manufacture
FR2793990A1 (en) * 1999-05-19 2000-11-24 Sagem ELECTRONIC HOUSING ON PLATE AND METHOD FOR MANUFACTURING SUCH A HOUSING
US6212072B1 (en) 1999-05-19 2001-04-03 Sagem Sa Electronics package on a plate, and a method of making such a package

Similar Documents

Publication Publication Date Title
DE69109464T2 (en) METHOD AND DEVICE FOR THE HERMETIC ENCLOSURE OF ELECTRONIC COMPONENTS.
DE102004025609B4 (en) Arrangement in screw-type pressure contact with a power semiconductor module
DE2536316C2 (en) Circuit card for integrated semiconductor circuits
DE4218112B4 (en) Electrical apparatus, in particular switching and control apparatus for motor vehicles
DE102010001958A1 (en) Electronic control device, has heat guide element staying in thermal contact with another heat guide element and partially staying in thermal contact with cabinet, where former heat guide element is malleably formed
DE10162749A1 (en) circuitry
DE2511010A1 (en) Cooling for electronic components - involves using components embedded in heat conductive mass of metal powder in resin which has large heat transfer surface
EP2903042A1 (en) Thermoelectric module and method for producing a thermoelectric module
DE3527208A1 (en) ELECTRICAL SWITCHGEAR
DE3910699A1 (en) Printed circuit board for integrated circuits
DE10114572A1 (en) Carrier for an electrical circuit, in particular for an electrical switch
DE10065857B4 (en) Heat transfer arrangement for a plastic housing of electronic assemblies
DE102008034075A1 (en) Power semiconductor module comprises component of power electronics on substrate, where component is embedded into powder ballast in side without substrate
DE10123198A1 (en) Housing with circuit-board arrangement, has part of heat-sink extending through opening in circuit-board
DE102014218967A1 (en) circuit board
AT515440A1 (en) Electrical component arrangement
DE1243254B (en) Support body for microcircuits
DE1465736B2 (en) Function block, especially for data processing systems
DE102019127324A1 (en) Heating plate and water heater with heating plate
DE2855494A1 (en) Thermally conducting insulating discs for electronic components - comprise ceramic inserts in plastics insulating plate, extending from surface to surface
DE102019215644A1 (en) Electronic assemblies, in particular for electric vehicles or hybrid vehicles
DE102019116021A1 (en) Flexible circuit board with a thermally conductive connection to a heat sink
DE6910426U (en) ELECTRICAL ASSEMBLY.
DE19501895C2 (en) Electrical circuitry for motor vehicles
DE7740059U1 (en) Fastening device for the electrically insulated fastening of components that generate considerable heat loss

Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8139 Disposal/non-payment of the annual fee