JPS55120198A - Multilayer printed circuit board and method of fabricating same - Google Patents

Multilayer printed circuit board and method of fabricating same

Info

Publication number
JPS55120198A
JPS55120198A JP2855279A JP2855279A JPS55120198A JP S55120198 A JPS55120198 A JP S55120198A JP 2855279 A JP2855279 A JP 2855279A JP 2855279 A JP2855279 A JP 2855279A JP S55120198 A JPS55120198 A JP S55120198A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
multilayer printed
fabricating same
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2855279A
Other languages
Japanese (ja)
Other versions
JPS5811117B2 (en
Inventor
Keiji Kurosawa
Mitsuo Yamashita
Kiyotaka Miyagawa
Kiyuuzou Mitsui
Takayoshi Imura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP54028552A priority Critical patent/JPS5811117B2/en
Publication of JPS55120198A publication Critical patent/JPS55120198A/en
Publication of JPS5811117B2 publication Critical patent/JPS5811117B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP54028552A 1979-03-12 1979-03-12 Method for manufacturing multilayer printed wiring board Expired JPS5811117B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54028552A JPS5811117B2 (en) 1979-03-12 1979-03-12 Method for manufacturing multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54028552A JPS5811117B2 (en) 1979-03-12 1979-03-12 Method for manufacturing multilayer printed wiring board

Publications (2)

Publication Number Publication Date
JPS55120198A true JPS55120198A (en) 1980-09-16
JPS5811117B2 JPS5811117B2 (en) 1983-03-01

Family

ID=12251810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54028552A Expired JPS5811117B2 (en) 1979-03-12 1979-03-12 Method for manufacturing multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS5811117B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6194765U (en) * 1984-11-28 1986-06-18

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
JPS5325864A (en) * 1976-06-30 1978-03-10 Ibm Multilayer substrate package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
JPS5325864A (en) * 1976-06-30 1978-03-10 Ibm Multilayer substrate package

Also Published As

Publication number Publication date
JPS5811117B2 (en) 1983-03-01

Similar Documents

Publication Publication Date Title
JPS55148491A (en) Method of fabricating printed circuit board
JPS55160489A (en) Flexible printed circuit board and method of fabricating same
JPS5612797A (en) Multilayer printed circuit board and method of manufacturing same
JPS55135000A (en) Method of fabricating printed circuit board
JPS5593287A (en) Method of fabricating printed circuit board
JPS55108798A (en) Method of fabricating multilayer printed circuit board
JPS5595395A (en) Method of fabricating printed circuit board
JPS55127096A (en) Method of fabricating printed circuit board
JPS5667982A (en) Printed circuit board and method of manufacturing same
JPS55120198A (en) Multilayer printed circuit board and method of fabricating same
JPS55118695A (en) Copperrlined laminated board and multilayer printed circuit board using same and method of fabricating same
JPS55148489A (en) Method of fabricating printed circuit board
JPS55150292A (en) Method of fabricating printed circuit board
JPS55113399A (en) Method of fabricating multilayer printed circuit board
JPS5667994A (en) Method of manufacturing multilayer printed circuit board
JPS5658297A (en) Method of manufacturing multilayer printed circuit board
JPS5618498A (en) Method of manufacturing multilayer printed circuit board
JPS5656698A (en) Method of manufacturing multilayer printed circuit board
JPS55121696A (en) Method of fabricating multilayer printed circuit board
JPS55138900A (en) Method of fabricating multilayer printed circuit board
JPS55125697A (en) Method of fabricating multilayer printed circuit board
JPS55150296A (en) Method of fabricating multilayer printed board
JPS5673488A (en) Printed circuit board and method of manufacturing same
JPS5696898A (en) Bothhside printed circuit board and method of manufacturing same
JPS5680200A (en) Method of manufacturing multilayer printed circuit board