JPS55148491A - Method of fabricating printed circuit board - Google Patents

Method of fabricating printed circuit board

Info

Publication number
JPS55148491A
JPS55148491A JP5661679A JP5661679A JPS55148491A JP S55148491 A JPS55148491 A JP S55148491A JP 5661679 A JP5661679 A JP 5661679A JP 5661679 A JP5661679 A JP 5661679A JP S55148491 A JPS55148491 A JP S55148491A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
fabricating printed
fabricating
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5661679A
Other languages
Japanese (ja)
Inventor
Kazunari Saiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Electric Manufacturing Co Ltd
Original Assignee
Meidensha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Electric Manufacturing Co Ltd filed Critical Meidensha Electric Manufacturing Co Ltd
Priority to JP5661679A priority Critical patent/JPS55148491A/en
Publication of JPS55148491A publication Critical patent/JPS55148491A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP5661679A 1979-05-09 1979-05-09 Method of fabricating printed circuit board Pending JPS55148491A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5661679A JPS55148491A (en) 1979-05-09 1979-05-09 Method of fabricating printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5661679A JPS55148491A (en) 1979-05-09 1979-05-09 Method of fabricating printed circuit board

Publications (1)

Publication Number Publication Date
JPS55148491A true JPS55148491A (en) 1980-11-19

Family

ID=13032190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5661679A Pending JPS55148491A (en) 1979-05-09 1979-05-09 Method of fabricating printed circuit board

Country Status (1)

Country Link
JP (1) JPS55148491A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0176356A2 (en) 1984-09-26 1986-04-02 Rohm And Haas Company Photosensitive polymer compositions, electrophoretic deposition processes using same, and the use of same in forming films on substrates
JPS61198795A (en) * 1985-02-28 1986-09-03 三菱電機株式会社 Manufacture of printed wiring board
JPS61247090A (en) * 1985-04-24 1986-11-04 日本ペイント株式会社 Manufacture of circuit board having solder through hole
JPS6325998A (en) * 1986-07-18 1988-02-03 宇部興産株式会社 Manufacture of through-hole plated wiring board
JPS6356987A (en) * 1986-08-27 1988-03-11 三菱電機株式会社 Manufacture of printed wiring board
JPS6356986A (en) * 1986-08-27 1988-03-11 三菱電機株式会社 Manufacture of printed wiring board
JPS63110794A (en) * 1986-10-29 1988-05-16 イビデン株式会社 Method of forming through-hole of printed wiring board
JPH01256193A (en) * 1988-04-06 1989-10-12 Oki Densen Kk Manufacture of small diameter through hole substrate
JPH06188540A (en) * 1984-03-07 1994-07-08 Ciba Geigy Ag Image forming method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS499642A (en) * 1972-05-29 1974-01-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS499642A (en) * 1972-05-29 1974-01-28

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06188540A (en) * 1984-03-07 1994-07-08 Ciba Geigy Ag Image forming method
EP0176356A2 (en) 1984-09-26 1986-04-02 Rohm And Haas Company Photosensitive polymer compositions, electrophoretic deposition processes using same, and the use of same in forming films on substrates
JPS61198795A (en) * 1985-02-28 1986-09-03 三菱電機株式会社 Manufacture of printed wiring board
JPS61247090A (en) * 1985-04-24 1986-11-04 日本ペイント株式会社 Manufacture of circuit board having solder through hole
JPS6325998A (en) * 1986-07-18 1988-02-03 宇部興産株式会社 Manufacture of through-hole plated wiring board
JPS6356987A (en) * 1986-08-27 1988-03-11 三菱電機株式会社 Manufacture of printed wiring board
JPS6356986A (en) * 1986-08-27 1988-03-11 三菱電機株式会社 Manufacture of printed wiring board
JPH0579197B2 (en) * 1986-08-27 1993-11-01 Mitsubishi Electric Corp
JPS63110794A (en) * 1986-10-29 1988-05-16 イビデン株式会社 Method of forming through-hole of printed wiring board
JPH01256193A (en) * 1988-04-06 1989-10-12 Oki Densen Kk Manufacture of small diameter through hole substrate

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