DE3674034D1 - Substrate fuer elektronische schaltungen. - Google Patents

Substrate fuer elektronische schaltungen.

Info

Publication number
DE3674034D1
DE3674034D1 DE8686302202T DE3674034T DE3674034D1 DE 3674034 D1 DE3674034 D1 DE 3674034D1 DE 8686302202 T DE8686302202 T DE 8686302202T DE 3674034 T DE3674034 T DE 3674034T DE 3674034 D1 DE3674034 D1 DE 3674034D1
Authority
DE
Germany
Prior art keywords
substrates
electronic circuits
circuits
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686302202T
Other languages
English (en)
Inventor
Yasuyuki Sato
Shinji Saito
Hidetoshi Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60064598A external-priority patent/JPS61222193A/ja
Priority claimed from JP16618585A external-priority patent/JPS6226886A/ja
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of DE3674034D1 publication Critical patent/DE3674034D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C12/00—Powdered glass; Bead compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
    • C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
    • C04B41/48—Macromolecular compounds
    • C04B41/4853—Epoxides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/82—Coating or impregnation with organic materials
    • C04B41/83—Macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
    • C03C2217/465—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase having a specific shape
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249956—Void-containing component is inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Laminated Bodies (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
DE8686302202T 1985-03-27 1986-03-25 Substrate fuer elektronische schaltungen. Expired - Fee Related DE3674034D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60064598A JPS61222193A (ja) 1985-03-27 1985-03-27 電子回路用基板
JP16618585A JPS6226886A (ja) 1985-07-26 1985-07-26 セラミツクス質複合体からなる電子回路用基板

Publications (1)

Publication Number Publication Date
DE3674034D1 true DE3674034D1 (de) 1990-10-18

Family

ID=26405694

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686302202T Expired - Fee Related DE3674034D1 (de) 1985-03-27 1986-03-25 Substrate fuer elektronische schaltungen.

Country Status (3)

Country Link
US (1) US4882455A (de)
EP (1) EP0196865B1 (de)
DE (1) DE3674034D1 (de)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989007834A1 (en) * 1988-02-22 1989-08-24 Unisys Corporation Module for electrically interconnecting integrated circuit chips
EP0284820A3 (de) * 1987-03-04 1989-03-08 Canon Kabushiki Kaisha Elektrisches Verbindungsteil und elektrisches Schaltungsteil und elektrische Schaltungsanordnung mit dem Verbindungsteil
JPH02148789A (ja) * 1988-03-11 1990-06-07 Internatl Business Mach Corp <Ibm> 電子回路基板
USRE35064E (en) * 1988-08-01 1995-10-17 Circuit Components, Incorporated Multilayer printed wiring board
JP2787953B2 (ja) * 1989-08-03 1998-08-20 イビデン株式会社 電子回路基板
JPH03177376A (ja) * 1989-12-04 1991-08-01 Japan Gore Tex Inc セラミック基板
DE4100145A1 (de) * 1990-01-10 1991-07-11 Murata Manufacturing Co Substrat fuer die montage von integrierten schaltkreisen und es umfassendes elektronisches bauteil
WO1992018213A1 (en) * 1991-04-12 1992-10-29 E.I. Du Pont De Nemours And Company High dielectric constant flexible ceramic composite
US5162977A (en) * 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
JPH0829993B2 (ja) * 1991-09-23 1996-03-27 インターナショナル・ビジネス・マシーンズ・コーポレイション セラミツク複合構造及びその製造方法
US5531945A (en) * 1992-04-13 1996-07-02 Mitsubishi Gas Chemical Company, Inc. Process for the production of base board for printed wiring
KR100225431B1 (en) * 1992-04-13 1999-10-15 Mitsubishi Gas Chemical Co Process for the production of substrate for printed wiring
EP0665591A1 (de) * 1992-11-06 1995-08-02 Motorola, Inc. Verfahren zur herstellung einer Verpackung für Leistungsschaltungen
EP0697724B1 (de) * 1994-08-02 1999-03-10 Mitsubishi Gas Chemical Company, Inc. Verfahren zur Produktion einer Rohplatte für gedruckte Leiterplatten
US5997940A (en) * 1994-08-30 1999-12-07 Thomson-Csf Method for protecting porous components subjected to large potential differences and components thus produced
US5686172A (en) * 1994-11-30 1997-11-11 Mitsubishi Gas Chemical Company, Inc. Metal-foil-clad composite ceramic board and process for the production thereof
DE4444680A1 (de) * 1994-12-15 1996-06-27 Schulz Harder Juergen Mehrfachsubstrat für elektrische Bauelemente, insbesondere für Leistungs-Bauelemente
US5919546A (en) * 1995-06-22 1999-07-06 Shinko Electric Industries Co. Ltd. Porous ceramic impregnated wiring body
DE19529627C1 (de) * 1995-08-11 1997-01-16 Siemens Ag Thermisch leitende, elektrisch isolierende Verbindung und Verfahren zu seiner Herstellung
JPH10100320A (ja) * 1996-09-30 1998-04-21 Mitsubishi Gas Chem Co Inc 複合セラミックス板およびその製造法
ID19337A (id) 1996-12-26 1998-07-02 Ajinomoto Kk Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini
US6608760B2 (en) 1998-05-04 2003-08-19 Tpl, Inc. Dielectric material including particulate filler
US20040109298A1 (en) * 1998-05-04 2004-06-10 Hartman William F. Dielectric material including particulate filler
US6616794B2 (en) 1998-05-04 2003-09-09 Tpl, Inc. Integral capacitance for printed circuit board using dielectric nanopowders
US6274939B1 (en) 1998-09-11 2001-08-14 American Electronic Components Resin ceramic compositions having magnetic properties
JP2001156321A (ja) * 1999-03-09 2001-06-08 Fuji Xerox Co Ltd 半導体装置およびその製造方法
DE19961842B4 (de) * 1999-12-21 2008-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mehrschichtleiterplatte
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
US20030183954A1 (en) * 2002-03-15 2003-10-02 Wolf Ronald J. Magnetic resin composition and method of processing
JP3858221B2 (ja) * 2002-06-12 2006-12-13 財団法人国際超電導産業技術研究センター 高温超電導バルク材製超電導磁石及びその製造方法
US20040075528A1 (en) * 2002-10-22 2004-04-22 Oak-Mitsui, Inc. Printed circuit heaters with ultrathin low resistivity materials
US20060074164A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Structured composite dielectrics
US20060074166A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Title And Interest In An Application Moldable high dielectric constant nano-composites
US20080128961A1 (en) * 2003-12-19 2008-06-05 Tpl, Inc. Moldable high dielectric constant nano-composites
DE102004055900A1 (de) * 2004-11-19 2006-05-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung keramischer Formkörper mit erhöhter Festigkeit bei niedrigen Temperaturen, danach hergestellte Formkörper und deren Verwendung
JP5309316B2 (ja) * 2006-02-06 2013-10-09 国立大学法人東北大学 チップ素子
WO2007135489A1 (en) * 2006-05-22 2007-11-29 Prysmian S.P.A. Cable and process for manufacturing the same
JP2011501473A (ja) * 2007-10-26 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 多層チップキャリアおよび製造方法
CN103052501B (zh) * 2010-07-30 2015-08-26 京瓷株式会社 绝缘片、其制造方法及采用了该绝缘片的结构体的制造方法
JP2014167053A (ja) * 2013-02-28 2014-09-11 3M Innovative Properties Co 高熱伝導性プリプレグ、プリプレグを用いた配線板および多層配線板、ならびに多層配線板を用いた半導体装置
US9516741B2 (en) 2013-08-14 2016-12-06 Denka Company Limited Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
JP7042495B2 (ja) 2016-06-23 2022-03-28 アダマンド並木精密宝石株式会社 セラミックス複合体及びそのセラミックス複合体の製造方法
EP3490958A1 (de) 2016-07-27 2019-06-05 Corning Incorporated Keramik- und polymerverbundstoff, verfahren zur herstellung und verwendungen davon
EP3504171A1 (de) * 2016-08-26 2019-07-03 SABIC Global Technologies B.V. Anhand eines kaltsinterverfahrens mit einem reaktiven monomerverfahren hergestellte keramik-polymer-verbundstoffe
WO2018163982A1 (ja) 2017-03-09 2018-09-13 株式会社村田製作所 多層基板
US20210198158A1 (en) * 2017-10-27 2021-07-01 Corning Incorporated Polymer and porous inorganic composite article and methods thereof

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2421652A (en) * 1943-08-02 1947-06-03 Sprague Electric Co Electrical conductor
US2778762A (en) * 1948-11-11 1957-01-22 Technograph Printed Circuits L Electric capacitor and method of making same
GB810509A (en) * 1955-07-22 1959-03-18 Siemens Planiawerke Ag Improvements in or relating to the production of impregnated porous bodies
US3325303A (en) * 1959-04-08 1967-06-13 Norton Co Protective flame sprayed coatings
FR1327145A (fr) * 1961-04-06 1963-05-17 Owens Corning Fiberglass Corp Panneaux diélectriques
US3202591A (en) * 1961-11-24 1965-08-24 Electralab Printed Electronics Method of making an electric circuit structure
US3838204A (en) * 1966-03-30 1974-09-24 Ibm Multilayer circuits
US3817781A (en) * 1967-06-01 1974-06-18 Kaman Sciences Corp Ceramic treating process and product produced thereby
US3825468A (en) * 1969-07-25 1974-07-23 Owens Illinois Inc Sintered ceramic
US3791863A (en) * 1972-05-25 1974-02-12 Stackpole Carbon Co Method of making electrical resistance devices and articles made thereby
US4353957A (en) * 1973-09-24 1982-10-12 Tam Ceramics Inc. Ceramic matrices for electronic devices and process for forming same
US3900940A (en) * 1974-03-20 1975-08-26 Impco Inc Method of impregnating a sintered porous metal article to make the article liquid-tight
GB1485569A (en) * 1974-09-10 1977-09-14 Siemens Ag Multi-layer wired substrates for multi-chip circuits
US4104345A (en) * 1975-06-23 1978-08-01 International Business Machines Corporation Ceramic dielectrics
DE2748271C3 (de) * 1977-10-27 1981-07-16 Wilhelm Ruf KG, 8000 München Gedruckte Leiterplatte und Verfahren zur Herstellung derselben
JPS5515147A (en) * 1978-07-20 1980-02-02 Aikoh Co Structure material for sound equipment
JPS57122592A (en) * 1981-01-23 1982-07-30 Tokyo Shibaura Electric Co Method of producing hybrid integrated circuit
CA1212073A (en) * 1981-02-02 1986-09-30 Seizo Murayama Impregnating anodic oxide film with polymerizable compound and polymerizing and resulting wiring board
FR2525849B1 (fr) * 1982-04-26 1985-08-09 Hutchinson Substrat de circuit imprime
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
US4528212A (en) * 1982-07-22 1985-07-09 International Business Machines Corporation Coated ceramic substrates for mounting integrated circuits
US4540621A (en) * 1983-07-29 1985-09-10 Eggerding Carl L Dielectric substrates comprising cordierite and method of forming the same
JPS60136294A (ja) * 1983-12-23 1985-07-19 株式会社日立製作所 セラミック多層配線回路板
US4689262A (en) * 1984-05-21 1987-08-25 Cts Corporation Electrically insulating substrate

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EP0196865B1 (de) 1990-09-12
US4882455A (en) 1989-11-21
EP0196865A2 (de) 1986-10-08
EP0196865A3 (en) 1987-05-13

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